DATA1_Out
CLK_Out
DATA2_Out
NC VCC
DATA2_In
CLK_In
DATA1_In
2.1-mm x 1.6-mm DPV (0.5-mm Pitch)
1.7-mm x 1.35-mm DQD (0.4-mm Pitch)
GND
1
2
3
45
6
7
8
VCC
Reset
CLK
NC
VPP
I/O
NC
GND
VCC
Reset
CLK
NC
VPP
I/O
NC
GND
GNDGND
SIM Controller
1
2
3
45
6
7
8
TPD3F303
www.ti.com
SLVSAM5 –JANUARY 2011
EMI FILTER WITH INTEGRATED V
CC
CLAMP FOR SIM CARD INTERFACE
Check for Samples: TPD3F303
1FEATURES TPD3F303 PACKAGE
(TOP VIEW)
•Bidirectional EMI/RFI Filtering and Line
Termination with Integrated ESD Protection
•Robust ESD Protection Exceeds IEC 61000-4-2
(Level 4)
– ±15-kV Human-Body Model (HBM)
– ±15-kV IEC 61000-4-2 (Contact Discharge)
– ±15-kV IEC 61000-4-2 (Air-Gap Discharge)
•Breakdown voltage 6-V
•Low Noise C-R-C Filter Topology
•Integrated VCC Clamp Eliminates the Need for
External ESD Protection
•Space Saving DPV (0.5-mm Pitch), DQD
Packages (0.4-mm Pitch)
APPLICATIONS
•Mobile handsets
•PDAs
•Video Consoles
•Portable Computers Figure 1. Board Layout with TPD3F303 at the SIM
Card Interface
DESCRIPTION/ORDERING INFORMATION
The TPD3F303 is a 3-ch integrated EMI filter for SIM interface. This device integrates a VCC clamp to provide
system level ESD protection at the VCC line. Termination resistor value of 47 Ωis included on the CLK line, while
a 100 Ωtermination is employed at the DATA and RST line.
The low-pass filter arrays reduce EMI emissions and provide system level ESD protection. Because of its small
package and easy-to-use pin assignments, the TPD3F303 filter is suitable for a wide array of applications such
as mobile handsets, PDAs, video consoles, notebook computers, etc.
The TPD3F303 is designed to suppress EMI/RFI noise in systems subjected to electromagnetic interferences.
These filter series include an ESD protection circuitry which prevents damage to the application when subjected
to ESD stress far exceeding IEC 61000-4-2 (Level 4). The TPD3F303 is specified for –40°C to 85°C operation.
ORDERING INFORMATION
TAPACKAGE(1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING
8–DPV Tape and reel TPD3F303DPVR 6SS
–40°C to 85°C8–DQD Tape and reel TPD3F303DQDR 6SS
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright ©2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Pin 5
GND
Schematic for VCC
Pin 2
45 Ω
Pin 7
GND
Schematic for CLK Line
100 Ω
Pin 6,8
GND
Schematic for DATA1, DATA2 Lines
Pin 1,3
TPD3F303
SLVSAM5 –JANUARY 2011
www.ti.com
CIRCUIT DIAGRAMS
TERMINAL FUNCTIONS
TERMINAL TYPE DESCRIPTION
DPV/DQD
NAME PIN NO.
Data and Rest signals Input, Output pins. The DATA1 and DATA2 are symmetric circuits.
DATAx_IN, Input, Output
1, 3, 6, 8 They can be used interchangeably for either DATA or RESET pins based off board layout
DATAx_OUT Pins scheme.
CLK_OUT, Input, Output
2, 7 Clock Input and Output signals.
CLK_IN V Pins
VCC 5 Power Clamp ESD Clamp circuit for the VCC pin.
NC 4 No Connect Not connected to any internal circuit. Leave this pin floating.
Central ground Ground connection for the EMI filter. It is very important to connect the device GND to the
GND Ground
Pad printed circuit board ground plane through Vias directly under the package.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
IO voltage tolerance IO pins 5.5 V
TAOperating free-air temperature range –40 85 °C
Tstg Storage temperature range –55 155 °C
IEC 61000-4-2 Contact Discharge IO pins ±15 KV
IEC 61000-4-2 Air-gap Discharge IO pins ±15 KV
Human Body Model ESD IO pins ±15 KV
(1) Stresses beyond those listed under "ABSOLUTE MAXIMUM RATINGS"may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of
the specifications is not implied. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Vclamp Clamp voltage IIO =±2 A IO pin to ground ±10 V
IILeakage current RPU = Open IO pin to ground 0.1 µA
RCLK CLK series resistors 40 47 55 Ω
RDAT_RST Data/RST series resistors 85 100 115 Ω
CTotal IO Capacitance VIO = 0 V IO Pins to GND 16 20 24 pF
VBR Break-down Voltage IIO = 1 mA 6 V
ZSOURCE = 50 Ω
F–3dB –3 dB BW for DATA/RESET line 294 MHz
ZLOAD = 50 Ω
2Submit Documentation Feedback Copyright ©2011, Texas Instruments Incorporated
Product Folder Link(s): TPD3F303
TPD3F303
www.ti.com
SLVSAM5 –JANUARY 2011
ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ZSOURCE = 50 Ω
F–3dB –3 dB BW for CLK line 308 MHz
ZLOAD = 50 Ω
Copyright ©2011, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TPD3F303
0
10
20
30
40
50
60
70
80
90
100
I - Input Offset Current - pA
IO
-40 -15 10 35 60 85
T - Free-Air Temperature - °C
A
V = 2.5 V
IO
I - Input Offset Current - mA
IO
V - Input Offset Voltage - V
IO
0 1 2 3 4 5 6 7 8-1-2
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.6
0.8
1.0
0.4
t = 25°C
A
1.0E+05 1.0E+06 1.0E+07 1.0E+08 1.0E+09 1.0E+10
f - Frequency - Hz
Loss - dB
CLK_IN to DATA2_OUT
DATA1_IN to CLK_OUT
DATA1_IN to DATA2_OUT
-140
-130
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
-10
-20
-0
1.0E+05 1.0E+06 1.0E+07 1.0E+08 1.0E+09 1.0E+10
f - Frequency - Hz
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
Loss - dB
CLK
0 V Bias
DATA
TPD3F303
SLVSAM5 –JANUARY 2011
www.ti.com
TYPICAL OPERATING CHARACTERISTICS
Figure 2. IIO vs Temperature, VIO = 2.5V Figure 3. IIO vs VIO
Figure 4. Frequency Response Data (0 V Bias) Figure 5. Channel-to-Channel Crosstalk
4Submit Documentation Feedback Copyright ©2011, Texas Instruments Incorporated
Product Folder Link(s): TPD3F303
-220
-200
-180
-160
-140
-120
-100
-80
-60
-40
-20
0
20
40
60
80
0 25 50 75 100 125 150 175 200
t - Time - nS
DATA_In
DATA_Out
Amplitude - V
Capacitance - pF
0
5
10
15
20
25
30
35
VCC
Data
CLK
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
V - V
BIAS
T = 25°C
A
0 25 50 75 100 125 150 175 200
t - Time - nS
Amplitude - V
-80
-60
-40
-20
0
20
40
60
80
100
120
140
160
180
200
220
DATA_In
DATA_Out
-220
-200
-180
-160
-140
-120
-100
-80
-60
-40
-20
0
20
40
60
80
0 25 50 75 100 125 150 175 200
t - Time - nS
Amplitude - V
DATA_In
DATA_Out
TPD3F303
www.ti.com
SLVSAM5 –JANUARY 2011
TYPICAL OPERATING CHARACTERISTICS (continued)
Figure 6. Capacitance vs VBIAS, tA= 25°C Figure 7. IEC Clamping Waveforms
–15 kV Contact, DATA1_In Stressed
Figure 8. IEC Clamping Waveforms Figure 9. IEC Clamping Waveforms
+15 kV Contact, DATA1_In Stressed –15 kV Contact, CLK_In Stressed
Copyright ©2011, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TPD3F303
0 25 50 75 100 125 150 175 200
t - Time - nS
Amplitude - V
-80
-60
-40
-20
0
20
40
60
80
100
120
140
160
180
200
220
DATA_In
DATA_Out
TPD3F303
SLVSAM5 –JANUARY 2011
www.ti.com
TYPICAL OPERATING CHARACTERISTICS (continued)
Figure 10. IEC Clamping Waveforms
+15 kV Contact, CLK_In Stressed
6Submit Documentation Feedback Copyright ©2011, Texas Instruments Incorporated
Product Folder Link(s): TPD3F303
PACKAGE OPTION ADDENDUM
www.ti.com 3-Mar-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPD3F303DPVR ACTIVE USON DPV 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPD3F303DQDR ACTIVE WSON DQD 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPD3F303DPVR USON DPV 8 3000 180.0 8.4 1.84 2.32 0.78 4.0 8.0 Q1
TPD3F303DQDR WSON DQD 8 3000 180.0 8.4 1.65 2.0 0.95 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Jan-2011
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPD3F303DPVR USON DPV 8 3000 202.0 201.0 28.0
TPD3F303DQDR WSON DQD 8 3000 202.0 201.0 28.0
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Jan-2011
Pack Materials-Page 2
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