Precision Thick Film Chip Resistors
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Precision Thick Film Chip Resistors
ERJ G: 0201
ERJ R: 0402, 0603, 0805
ERJ E : 0603, 0805, 1206,
1210, 1812, 2010, 2512
Type: ERJ 1G
ERJ 2R, 3R, 6R
ERJ 3E, 6E, 8E, 14, 12, 1T
nFeatures
lSmall size and lightweight
For PCB size reduction and lightweight products
lHigh reliability
Metal glaze thick film resistive element and three
layered electrode results in high reliability.
lMatching with placement machines
Bulk, Taping and magazine packagings for
automatic placement machines
lSolderability
Suitable for both reflow soldering and flow soldering
nExplanation of Part Numbers
lLow Resistance Tolerance
ERJ1G, 2R, 3E, 6E, 8E, 14, 12, 1T Series ...
±
1%
ERJ2R, 3R, 6R Series ............................
±
0.5%
lReference Standards
IEC 60115-8, JIS C 5201-8
E
1
R
2
J
3
3
4
R
5
B
6
D
7
1
8
0
9
2
10
V
11 12
Product Code
Thick Film
Chip Resistors
Size, Power Rating
Type: inches
2R : 0402
3R : 0603
6R : 0805
Power R.
0.063 W
0.063 W
0.1 W
T.C.R. Marking
T.C.R.Code
H
B
K
E
±
50
´
10
Ð6
/ûC(ppm/ûC)
(2R)
±
50
´
10
Ð6
/ûC(ppm/ûC)
(3R, 6R)
±
100
´
10
Ð6
/ûC(ppm/ûC)
(2R)
±
100
´
10
Ð6
/ûC(ppm/ûC)
(3R, 6R)
Resistance Value
Resistance Tolerance
Code
D
Tolerance
±
0.5 %
Packaging Methods
Code
X
V
Punched Carrier Taping
2 mm pitch (2R)
Punched Carrier Taping
(3R, 6R)
Packaging
The first two or three digits are significant figures of resistance
and the last one denotes number of zeros following.
Example: 103
®
10 k
W
1002
®
10 k
W
l ERJ2R, 3R, 6R Series, ±0.5 % type
Precision Thick Film Chip Resistors
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
R
2
J
3
8
4
E
5
N
6
F
7
1
8
0
9
0
10
2
11
V
12
Product Code
Thick Film
Chip Resistors
Size, Power Rating
Type: inches
2R : 0402
3E : 0603
6E : 0805
8E : 1206
14 : 1210
12 : 1812
12 : 2010
1T : 2512
Power R.
0.063 W
0.1 W
0.125 W
0.25 W
0.25 W
0.5 W
0.5 W
1W
Marking
MarkingCode
K
N
S
No marking
(2R, 3E)
4 digit marking
(6E, 8E, 14, 12, 1T)
4 digit marking
[12(2010 inches)]
The first three digits are significant figures of resistance
and the 4th one denotes number of zeros following.
Resistance Value
Resistance Tolerance
Code
F
Tolerance
±1 %
Packaging Methods
Code
X
V
U
Punched Carrier Taping
2 mm pitch (2R)
Punched Carrier Taping
(3E, 6E, 8E)
Embossed Carrier Taping
(14, 12, 1T)
Packaging
l ERJ2R, 3E, 6E, 8E, 14, 12, 1T Series, ±1 % type
lERJ1G Series, ±1 % type
E
1
R
2
J
3
1
4
G
5
E
6 7
F
8
1
9
00
10
2
11 12
C
Thick Film
Chip Resistors
Product Code Size, Power Rating
1GE : 0201 0.05 W
Power R.
Resistance Tolerance
Code
F
Tolerance
±
1%
Resistance Value Packaging Methods
Code
C
Packaging
Pressed Carrier Taping
2 mm pitch, 15000 pcs.
Type : inches The first two or three digits are significant
figures of resistance and the last one
denotes number of zeros following.
ERJ1G 0.60±0.03 0.30±0.03 0.10±0.05 0.15±0.05 0.23±0.03 0.15
(0201)
ERJ2R11.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05 0.8
(0402)
ERJ3R11.60±0.15 0.80+0.15 0.30±0.20 0.30±0.15 0.45±0.10 2
(0603)
ERJ6R12.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4
(0805)
ERJ3EK 1.60±0.15 0.80+0.15 0.30±0.20 0.30±0.15 0.45±0.10 2
(0603)
ERJ6EN 2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4
(0805)
ERJ8EN 3.20+0.05 1.60+0.05 0.50±0.20 0.50±0.20 0.60±0.10 10
(1206)
ERJ14N 3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10 16
(1210)
ERJ12N 4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10 27
(1812)
ERJ12S 5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10 27
(2010)
ERJ1TN 6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10 45
(2512)
nConstruction nDimensions in mm (not to scale)
Dimensions (mm)
LWa b t
Mass (Weight)
[g/1000 pcs.]
Type
(inches)
Ð0.15
Ð0.05
Ð0.20
Ð0.05
Protective coating
Alumina substrate Electrode (Inner)
Electrode
(Between)
Thick film
resistive element Electrode (Outer)
a
b
t
W
L
Precision Thick Film Chip Resistors
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating ´ Resistance Values, or Limiting Element Voltage
(max. RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 ´Power Rating or max. Overload Voltage listed above
whichever less.
Ö
ERJ2RH 0.063 50 100 ±0.5 100 to 100 K ±50 -55 to +125
(0402) (E24, E96)
10 to 97.6
ERJ2RK 0.063 50 100 ±0.5 102 k to 1 M ±100 -55 to +125
(0402) (E24, E96)
ERJ3RB 0.063 50 100 ±0.5 100 to 100 K ±50 -55 to +125
(0603) (E24, E96)
10 to 97.6
ERJ3RE 0.063 50 100 ±0.5 102 k to 1 M ±100 -55 to +125
(0603) (E24, E96)
ERJ6RB 0.1 150 200 ±0.5 100 to 100 K ±50 -55 to +125
(0805) (E24, E96)
10 to 97.6
ERJ6RE 0.1 150 200 ±0.5 102 k to 1 M ±100 -55 to +125
(0805) (E24, E96)
ERJ1G 0.05 15 30 ±1 10 to 1 M ±200 -55 to +125
(0201) (E24, E96)
ERJ2RK 0.063 50 100 ±1 10 to 1 M ±100 -55 to +125
(0402) (E24, E96)
ERJ3EK 0.1 50 100 ±1 10 to 1 M ±100 -55 to +155
(0603) (E24, E96)
ERJ6EN 0.125 150 200 ±1 10 to 2.2 M ±100 -55 to +155
(0805) (E24, E96)
ERJ8EN 0.25 200 400 ±1 10 to 2.2 M ±100 -55 to +155
(1206) (E24, E96)
ERJ14N 0.25 200 400 ±1 10 to 1 M ±100 -55 to +125
(1210) (E24, E96)
ERJ12N 0.5 200 400 ±1 10 to 1 M ±100 -55 to +125
(1812) (E24, E96)
ERJ12S 0.5 200 400 ±1 10 to 1 M ±100 -55 to +125
(2010) (E24, E96)
ERJ1TN 1 200 400 ±1 10 to 1 M ±100 -55 to +125
(2512) (E24, E96)
<±1 %>
Type
(inches)
Limiting Element
Voltage (Maximum
RCWV)
(1)
(V)
Maximum Overload
Voltage
(2)
(V)
Resistance
Tolerance (%)
Resistance
Ranges
(W)
T.C.R.
[´10
-6
/ûC
(ppm/ûC)]
Power Rating
at 70 ¡C (W)
Category Temperature
Range (Operating
Temperature Range)
(
¡C
)
Type
(inches)
Limiting Element
Voltage (Maximum
RCWV)
(1)
(V)
Maximum Overload
Voltage
(2)
(V)
Resistance
Tolerance (%)
Resistance
Ranges
(W)
T.C.R.
[´10
-6
/ûC
(ppm/ûC)]
Power Rating
at 70 ¡C (W)
Category Temperature
Range (Operating
Temperature Range)
(
¡C
)
nRatings
<±0.5 %>
Power Derating Curve
For resistors operated in ambient temperatures above
70 ¡C, power rating shall be derated in accordance
with the right figure.
Ð40
Ð20 0 20 40 60 80 100 120 140 160
0180
Ð60
70 ¡C
Ð55 ¡C
Ambient Temperature (¡C)
20
40
60
80
100
Rated Load (%)
125 ¡C 155 ¡C
1G, 2R, 3R, 6R
14, 12, 1T
3E, 6E, 8E
Precision Thick Film Chip Resistors
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
ERJ1G Pressed Carrier Taping 15000 pcs./reel
ERJ2RH, ERJ2RK 2 mm 10000 pcs./reel
ERJ3R1, ERJ3EK Punched Carrier Taping
ERJ6R1, ERJ6EN
ERJ8EN 5000 pcs./reel
ERJ14N 4 mm
ERJ12N Embossed Carrier Taping
ERJ12S
ERJ1TN 4000 pcs./reel
Type A B W F E P1P2P0fD0TfD1
ERJ1G
0.38
±0.05
0.68
±0.05
2.00
±0.10
0.42
±0.05
_
ERJ2RH, ERJ2RK
0.70
±0.05
1.20
±0.05
0.52
±0.05
_
ERJ3R1, ERJ3EK
1.10
±0.10
1.90
±0.10
8.00
±0.20
0.70
±0.05
_
ERJ6R1, ERJ6EN
1.65
±0.15
2.50
±0.20
3.50
±0.05
0.84
±0.05
_
ERJ8EN
2.00
±0.15
3.60
±0.20
1.75
±0.10
2.00
±0.05
4.00
±0.10
1.50
+0.10
_
ERJ14N
2.80
±0.20
3.50
±0.20
8.00
±0.30
4.00
±0.10
1.0
+0.10
ERJ12N
3.50
±0.20
4.80
±0.20
1.00
±0.10
ERJ12S
2.80
±0.20
5.30
±0.20
12.00
±0.30
5.50
±0.20
1.5 min.
ERJ1TN
3.60
±0.20
6.90
±0.20
-0
Type fAfBfCW T
ERJ1G
ERJ2RH, ERJ2RK
ERJ3R1, ERJ3EK
9.0
±1.0
11.4
±1.0
ERJ6R1, ERJ6EN
ERJ
8EN 180.0
+0
60 min. 13.0
±1.0
ERJ14N
ERJ12N
ERJ12S
13.0
±1.0
15.4
±2.0
ERJ1TN
-3.0
nPackaging Methods (Taping)
lStandard Quantity
Type Kind of Taping Pitch (P1) Quantity
(Unit : mm)
l Taping Reel
lCarrier Tape (Unit : mm)
TT TA
P
0
P
2
P
1
P
1
f
D
0
f
D
1
(Only Emboss)
B
F
W
E
(2 mm pitch)
f
B
W
T
f
A
f
C
Pressed Carrier Punched Carrier Embossed Carrier
-0
Precision Thick Film Chip Resistors
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Cautions for Safety
In the case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount
properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In the case of reflow soldering,
solder amount can be adjusted, therefor the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Chip Resistor
c
a
b
Type (inches) Dimensions (mm)
ab c
nRecommended Land Pattern
Preheating
Peak
Heating
Temperature
Time
nRecommended Soldering Conditions
Recommendations and precautions are described below.
lRecommended soldering conditions for reflow
áReflow soldering shall be two times maximum.
áPlease contact us for additional information when you
use in conditions other than those specified.
áPlease measure a temperature of terminations and study
solderability every kind of solder and board, before actual
use.
Temperature Time
Preheating 140 ¡C to 160 ¡C 60 s to 120 s
Main heating Above 200 ¡C 30 s to 40 s
Peak 235 ± 5 ¡C max. 10 s
Temperature Time
Preheating 150 ¡C to 180 ¡C 60 s to 120 s
Main heating Above 230 ¡C 30 s to 40 s
Peak max. 260 ¡C max. 10 s
For solder (Example : Sn/Pb)
For lead-free solder (Example : Sn/Ag/Cu)
lRecommended soldering conditions for flow
For solder For lead-free solder
Temperature Time Temperature Time
Preheating 140 ¡C to 160 ¡C 60 s to 120 s 150 ¡C to 180 ¡C 60 s to 120 s
Soldering 245±5 ¡C 20 s to 30 s max. 260 ¡C max. 10 s
ERJ1G (0201)
0.3 to 0.4 0.8 to 0.9 0.25 to 0.35
ERJ2R (0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
ERJ3R, 3EK (0603) 0.7 to 0.9 2 to 2.2 0.8 to 1
ERJ6R, 6EN (0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4
ERJ8EN (1206) 2 to 2.4 4.4 to 5 1.2 to 1.8
ERJ14N (1210) 2 to 2.4 4.4 to 5 1.8 to 2.8
ERJ12N (1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5
ERJ12S (2010) 3.6 to 4 6.2 to 7 1.8 to 2.8
ERJ1TN (2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Take measures against mechanical stress during and after mounting of Precision Thick Film Chip Resistors (hereafter
called the Resistors) so as not to damage their electrodes and protective coatings.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the Resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the Resistors may be impaired.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the Resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the Resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish the soldering as quickly as possible (within three seconds at 350 ¡C
max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the Resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply a shock to the Resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the Resistors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bend of printed circuit boards in order to protect the Resistors from abnormal stress.
– ER3 –
Caution for Safety
(Common precautions for Fixed Resistors)
¥ When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
¥ Do not use the products beyond the specifications described in this catalog.
¥ This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
¥ Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
] Systems equipped with a protection circuit and a protection device
] Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
¥ These products are designed and manufactured for general purpose and standard use in general electronic
equip ment (e.g. AV equipment, home electric appliances, office equipment, information and communication
equipment)
¥ These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. In an environment where strong static electricity or electromagnetic waves exist
5. In an environment where these products cause dew condensation
6. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
¥ These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
¥ Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products .
¥ Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
perfor mance or reliability of the products.
¥ Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 ¡C to 35 ¡C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
