RS3A - RS3M Taiwan Semiconductor 3A, 50V - 1000V Surface Mount Fast Recovery Rectifier FEATURES KEY PARAMETERS Glass passivated chip junction Ideal for automated placement Fast switching for high efficiency High surge current capability Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC Halogen-free according to IEC 61249-2-21 APPLICATIONS PARAMETER VALUE UNIT IF(AV) 3 A VRRM 50 - 1000 V IFSM 100 A TJ MAX 150 C Package DO-214AB (SMC) Configuration Single die Switching mode power supply (SMPS) Adapters Lighting application Converter MECHANICAL DATA Case: DO-214AB (SMC) Molding compound meets UL 94V-0 flammability rating Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Moisture sensitivity level: level 1, per J-STD-020 Terminal: Matte tin plated leads, solderable per J-STD-002 DO-214AB (SMC) Meet JESD 201 class 2 whisker test Polarity: As marked Weight: 0.21 g (approximately) ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise noted) PARAMETER SYMBOL RS3A RS3B RS3D RS3G RS3J RS3K RS3M UNIT Marking code on the device RS3A RS3B RS3D RS3G RS3J RS3K RS3M Repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Reverse voltage, total rms value VR(RMS) 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Forward current Surge peak forward current, 8.3 ms single half sine-wave superimposed on rated load per diode Junction temperature IF(AV) 3 A IFSM 100 A TJ - 55 to +150 C Storage temperature TSTG - 55 to +150 C 1 Version:J1708 RS3A - RS3M Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL LIMIT UNIT Junction-to-lead thermal resistance per diode RJL 15 C/W Junction-to-ambient thermal resistance per diode RJA 50 C/W ELECTRICAL SPECIFICATIONS (TA = 25C unless otherwise noted) PARAMETER Forward voltage per diode CONDITIONS (1) IF = 3A, TJ = 25C Reverse current @ rated VR per diode Reverse recovery time (2) RS3A RS3B RS3D RS3G RS3J RS3K RS3M TJ = 25C SYMBOL TYP. MAX. UNIT VF - 1.3 V - 10 A - 250 A - 150 ns - 250 ns - 500 ns IR TJ = 125C IF=0.5A , IR=1.0A IRR=0.25A trr Notes: 1. Pulse test with PW=0.3 ms 2. Pulse test with PW=30 ms 2 Version:J1708 RS3A - RS3M Taiwan Semiconductor ORDERING INFORMATION PART NO. PART NO. SUFFIX RS3x (Note 1) PACKING CODE PACKING CODE SUFFIX PACKAGE PACKING R7 SMC 850 / 7" Plastic reel R6 SMC 3,000 / 13" Paper reel SMC 3,000 / 13" Plastic reel V7 Matrix SMC 850 / 7" Plastic reel V6 Matrix SMC 3,000 / 13" Plastic reel M6 H G Note : 1. "x" defines voltage from 50V (RS3A) to 1000V (RS3M) EXAMPLE EXAMPLE P/N PART NO. PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX DESCRIPTION RS3AHR7G RS3A H R7 G AEC-Q101 qualified Green compound 3 Version:J1708 RS3A - RS3M Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 100 3 2.5 CAPACITANCE (pF) AVERAGE FORWARD CURRENT (A) 3.5 2 1.5 1 0.5 RESISTIVE OR INDUCTIVE LOAD f=1.0MHz Vsig=50mVp-p 10 0 0 25 50 75 100 125 1 150 10 REVERSE VOLTAGE (V) LEAD TEMPERATURE (C) Fig.4 Typical Forward Characteristics TJ=125oC TJ=75oC 1 TJ=25oC 0.1 0 20 40 60 80 100 120 140 100 10 UF1DLW 1 TJ=125oC TJ=125C 10 TJ=25C 0.1 10.01 TJ=25oC 0.3 0.1 Pulse width TJ=40oC 0.001 0.4 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Pulse width=300s 1% duty cycle (A) 100 INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (A) Fig.3 Typical Reverse Characteristics 10 100 0.4 0.6 0.5 0.8 0.6 1 0.7 1.2 0.8 1.4 0.9 1 1.6 1.8 1.1 2 FORWARD VOLTAGE (V) 4 Version:J1708 1.2 RS3A - RS3M Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25C unless otherwise noted) PEAK FORWARD SURGE CURRENT (A) Fig.5 Maximum Non-repetitive Forward Surge Current 150 8.3ms Single Half Sine Wave 125 100 75 50 25 0 1 10 100 NUMBER OF CYCLES AT 60 Hz Fig.6 Reverse Recovery Time Characteristic And Test Circuit Diagram 5 Version:J1708 RS3A - RS3M Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AB (SMC) Unit (mm) DIM. Unit (inch) Min. Max. Min. Max. A 2.90 3.20 0.114 0.126 B 6.60 7.11 0.260 0.280 C 5.59 6.22 0.220 0.245 D 2.00 2.62 0.079 0.103 E 1.00 1.60 0.039 0.063 F 7.75 8.13 0.305 0.320 G 0.10 0.20 0.004 0.008 H 0.15 0.31 0.006 0.012 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 3.30 0.130 B 2.50 0.098 C 6.80 0.268 D 4.40 0.173 E 9.40 0.370 MARKING DIAGRAM P/N =Marking Code G =Green Compound YW =Date Code F =Factory Code 6 Version:J1708 RS3A - RS3M Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 7 Version:J1708