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MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
19-5518; Rev 0; 9/10
Typical Application Circuit
General Description
The MAX2667/MAX2669 high-gain, low-noise amplifiers
(LNAs) are designed for GPS L1, Galileo, and GLONASS
applications. Designed in Maxim’s advanced SiGe pro-
cess, the devices achieve a high gain and our lowest
noise figure, while maximizing the input-referred 1dB
compression point and the 3rd-order intercept point.
The devices operate from a +1.6V to +3.3V single sup-
ply. The MAX2667 is optimized for low current. The
MAX2669 is optimized for high linearity. The shutdown
feature in the device reduces the supply current to be
less than 10μA. The devices are available in a very small,
lead-free, RoHS-compliant, 0.86mm x 1.26mm x 0.65mm
wafer-level package (WLP).
Applications
Automotive Navigation
Location-Enabled Mobile Devices
Telematics (Asset Tracking and Management)
Personal Navigation Devices (PNDs)
Cellular Phones with GPS
Notebook PCs/Ultra-Mobile PCs
Recreational, Marine Navigation
Avionics
Watches
Features
S 19dB High-Power Gain (MAX2667)
S Ultra-Low Noise Figure: 0.65dB
S Integrated 50Ω Output Matching Circuit
S Low 4.1mA Supply Current (MAX2667)
S Wide 1.6V to 3.3V Supply Voltage Range
S Low Bill of Materials: Two Inductors, Three
Capacitors, and One Resistor
S Small Footprint: 0.86mm x 1.26mm
S Thin Profile: 0.65mm
S 0.4mm-Pitch Wafer-Level Package (WLP)
Ordering Information
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
EVALUATION KIT
AVAILABLE
B2
RFIN
+
RFOUT
VCC
SHDN
RF OUTPUT
GNDDC
RF INPUT
BIAS
L1 = 6.2nH (MAX2667)
C1 = 100nF (MAX2667)
C2 = 39pF
L2 = 100nH
C3 = 39pF
L1 = 3.3nH (MAX2669)
C1 = 100nF (MAX2669)
L1
L2
C1
C2
VCC
C3
B1
A2
BIAS
A1
C2
GNDAC C1
MAX2667
MAX2669
25kΩ
PART TEMP RANGE PIN-PACKAGE
MAX2667EWT+T -40°C to +85°C 6 WLP
MAX2669EWT+T -40°C to +85°C 6 WLP
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
VCC to GND_ ........................................................-0.3V to +3.6V
RFOUT and BIAS to GND_ ..... -0.3V to (Operating VCC + 0.3V)
Maximum RF Input Power ............................................... +5dBm
Continuous Power Dissipation (TA = +70°C)
WLP (derates 10.5mW/°C above +70°C) ....................840mW
Maximum Current into RF Input .........................................10mA
Operating Temperature Range .......................... -40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................ -65°C to +160°C
Soldering Temperature (reflow) (Note 1) ........................+260°C
DC ELECTRICAL CHARACTERISTICS
(MAX2667/MAX2669 EV kit. VCC = 1.6V to 3.3V, no RF signals are applied, TA = -40°C to +85°C. Typical values are at VCC = 2.85V
and TA = +25°C, unless otherwise noted.) (Note 2)
AC ELECTRICAL CHARACTERISTICS
(MAX2667/MAX2669 EV kit. VCC = 1.6V to 3.3V, fRFIN = 1575.42MHz, TA = -40°C to +85°C. Typical values are at VCC = 2.85V and
TA = +25°C, unless otherwise noted.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Refer to Application Note 1891: Wafer-level packaging (WLP) and its applications.
CAUTION! ESD SENSITIVE DEVICE
PARAMETER CONDITIONS MIN TYP MAX UNITS
Supply Voltage 1.6 2.85 3.3 V
Supply Current SHDN = high MAX2667 4.1 mA
MAX2669 7.7
Shutdown mode, SHDN = low 10 FA
Digital Input Logic-High TA = +25°C 1.2 V
Digital Input Logic-Low TA = +25°C 0.45 V
PARAMETER CONDITIONS MIN TYP MAX UNITS
RF Frequency L1 band 1575.42 MHz
Power Gain
VCC = 2.85V MAX2667 15.0 19.5
dB
MAX2669 14.6 17.7
VCC = 1.6V MAX2667 14.8 19.4
MAX2669 14.3 17.6
Noise Figure VCC = 1.8V 0.65 dB
VCC = 3.3V 0.65
In-Band 3rd-Order Input
Intercept Point (Note 3) MAX2667 -3.5 dBm
MAX2669 +4.5
Out-of-Band 3rd-Order Input
Intercept Point (Note 4) MAX2667 +2.5 dBm
MAX2669 +8
Input 1dB Compression Point (Note 5) MAX2667 -12.5 dBm
MAX2669 -10
Input Return Loss 10 dB
Output Return Loss 15 dB
Reverse Isolation 30 dB
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
3
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX2667/MAX2669 EV kit. VCC = 1.6V to 3.3V, fRFIN = 1575.42MHz, TA = -40°C to +85°C. Typical values are at VCC = 2.85V and
TA = +25°C, unless otherwise noted.) (Note 2)
Note 2: Min and max limits guaranteed by test at TA = +25°C and guaranteed by design and characterization at TA = -40°C and
TA = +85°C.
Note 3: Measured with the two tones located at 1MHz and 2MHz offset from the center of the GPS band with -30dBm/tone for
MAX2667 and -27dBm/tone for MAX2669.
Note 4: Measured with input tones at 1713MHz (-25dBm) and 1851MHz (-49dBm).
Note 5: Measured with a tone located at 5MHz offset from the center of the GPS band.
Typical Operating Characteristics
(MAX2667/MAX2669 EV kit. Typical values are at VCC = 2.85V, fRFIN = 1575.42MHz, TA = +25°C, unless otherwise noted.)
INPUT RETURN LOSS vs. FREQUENCY
MAX2667 toc01
FREQUENCY (MHz)
|S11| (dB)
200015001000
-30
-25
-20
-15
-10
-5
0
-35
500 2500
MAX2669
MAX2667
GAIN vs. FREQUENCY
MAX2667 toc02
FREQUENCY (MHz)
GAIN (dB)
200015001000
-5
0
5
10
15
20
25
-10
500 2500
MAX2669
MAX2667
REVERSE ISOLATION vs. FREQUENCY
MAX2667 toc03
FREQUENCY (MHz)
|S12| (dB)
200015001000
-60
-50
-40
-30
-20
-70
500 2500
MAX2669
MAX2667
OUTPUT RETURN LOSS vs. FREQUENCY
MAX2667 toc04
FREQUENCY (MHz)
|S22| (dB)
200015001000
-20
-15
-10
-5
0
-25
500 2500
MAX2669
MAX2667
MAX2667 IN-BAND IIP3 vs.
SUPPLY VOLTAGE AND TEMPERATURE
(TWO TONES LOCATED AT 1MHz AND
2MHz OFFSET WITH -35dBm/TONE)
MAX2667 toc05
SUPPLY VOLTAGE (V)
IIP3 (dBm)
3.02.82.62.42.22.01.8
-4
-3
-2
-1
0
-5
1.6 3.2
-40NC
+85NC
+25NC
MAX2669 IN-BAND IIP3 vs.
SUPPLY VOLTAGE AND TEMPERATURE
(TWO TONES LOCATED AT 1MHz AND
2MHz OFFSET WITH -30dBm/TONE)
MAX2667 toc06
SUPPLY VOLTAGE (V)
IIP3 (dBm)
3.02.82.62.42.22.01.8
2
4
6
8
0
1.6
-40NC
+85NC
+25NC
3.2
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
4
Typical Operating Characteristics (continued)
(MAX2667/MAX2669 EV kit. Typical values are at VCC = 2.85V, fRFIN = 1575.42MHz, TA = +25°C, unless otherwise noted.)
MAX2669 INPUT P1dB COMPRESSION vs.
SUPPLY VOLTAGE AND TEMPERATURE
MAX2667 toc10
SUPPLY VOLTAGE (V)
INPUT P1dB (dBm)
3.02.82.62.42.22.01.8
-13
-12
-11
-10
-9
-14
1.6 3.2
-40NC
+85NC
+25NC
SUPPLY VOLTAGE (V)
3.02.82.62.42.22.01.81.6 3.2
MAX2667 toc09
MAX2667 INPUT P1dB COMPRESSION
vs. SUPPLY VOLTAGE AND TEMPERATURE
INPUT P1dB (dBm)
-17
-16
-15
-14
-13
-12
-11
-18
-40NC
+85NC
+25NC
IIP3 (dBm)
SUPPLY VOLTAGE (V)
3.02.82.62.42.22.01.81.6 3.2
MAX2669 OUT-OF-BAND IIP3 vs.
SUPPLY VOLTAGE AND TEMPERATURE
(TONE 1 AT 1713MHz, -25dBm;
TONE 2 AT 1851MHz, -49dBm)
MAX2667 toc08
5
6
7
8
9
10
4
-40NC
+85NC
+25NC
MAX2667 OUT-OF-BAND IIP3 vs.
SUPPLY VOLTAGE AND TEMPERATURE
(TONE 1 AT 1713MHz, -25dBm;
TONE 2 AT 1851MHz, -49dBm)
MAX2667 toc07
SUPPLY VOLTAGE (V)
IIP3 (dBm)
3.02.82.62.42.22.01.8
0
1
2
3
-1
1.6
-40NC
+85NC+25NC
3.2
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
5
Bump Description
Bump Configuration
Detailed Description
The MAX2667/MAX2669 are LNAs designed for GPS
L1, Galileo, and GLONASS applications. The devices
feature a power-shutdown control mode to eliminate the
need for an external supply switch. The devices achieve
a high gain and an ultra-low noise figure.
Input and Output Matching
The devices require an off-chip input matching. Only
an inductor in series with a DC-blocking capacitor is
needed to form the input matching circuit. The Typical
Application Circuit shows the recommended input-
matching network. These values are optimized for the
best simultaneous gain, noise figure, and return loss
performance. Tables 1 and 2 list typical device S param-
eters and Kf values. The devices integrate an on-chip
output matching to 50Ω at the output, eliminating the
need for external matching components. The value of the
input coupling capacitor affects IIP3. A smaller coupling
capacitor results in lower IIP3.
WLP
TOP VIEW
BUMP SIDE DOWN
+
1 2
BIAS RFOUT/
SHDN
RFIN VCC
GNDAC
A
B
C GNDDC
MAX2667/MAX2669
BUMP NAME FUNCTION
A1 BIAS Provides Bias for LNA Input. Connect to B1 (RFIN) through a high-value inductor (100nH),
and bypass to ground close to the pin.
A2 RFOUT/SHDN RF Output and SHDN Logic Input. RFOUT is internally matched to 50I and has an internal
DC-blocking capacitor. The SHDN logic input is coupled through a 25kI resistor.
B1 RFIN RF Input. Connect to A1 through bias choke, and connect matching network and DC-
blocking capacitor.
B2 VCC Supply Voltage. Bypass to ground with a capacitor close to the IC.
C1 GNDAC Ground of the RF Path. Connect to the 2nd-layer PCB ground plane with a via next to the pin
pad.
C2 GNDDC Ground of Bias Circuit. Connect to the 2nd-layer PCB ground plane with a separate via from
pin C1. Sharing a ground via with pin C1 might cause stability problems.
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
6
Table 1. MAX2667 Typical Device S-Parameter Values and K-Factor
Table 2. MAX2669 Typical Device S-Parameter Values and K-Factor
Shutdown
The devices include a shutdown feature to turn off the
entire chip. Apply a logic-high to the SHDN pin to place
the part in the active mode, and a logic-low to place the
part in the shutdown mode.
Applications Information
A properly designed PCB is essential to any RF micro-
wave circuit. Use controlled-impedance lines on all
high-frequency inputs and outputs. Bypass VCC with
decoupling capacitors located close to the device. For
long VCC lines, it may be necessary to add decoupling
capacitors. Locate these additional capacitors further
away from the device package. Proper grounding of
the GND_ pins is essential. If the PCB uses a topside
RF ground, connect it directly to the GND_ pins. For a
board where the ground is not on the component layer,
connect the GND_ pins to the board with multiple vias
close to the package.
FREQ.
(MHz)
S11 MAG
(dB)
S11
PHASE
(Degrees)
S21 MAG
(dB)
S21
PHASE
(Degrees)
S12 MAG
(dB)
S12
PHASE
(Degrees)
S22 MAG
(dB)
S22
PHASE
(Degrees)
Kf
1000 -2.0 -47.7 6.0 -100.0 -47.5 -148.0 -1.0 -55.0 5.1
1100 -2.1 -48.6 7.4 -100.6 -45.7 -150.0 -1.0 -58.1 3.8
1200 -2.2 -51.6 9.6 -107.3 -42.9 -153.5 -1.4 -65.4 3.1
1300 -2.4 -55.0 12.0 -117.2 -39.6 -160.2 -2.1 -74.1 2.5
1400 -2.7 -58.6 14.0 -129.5 -37.0 -168.5 -3.6 -85.5 2.3
1500 -6.5 -61.9 16.2 -146.5 -34.1 178.5 -7.4 -100.0 2.8
1575 -4.3 -62.3 17.1 -164.2 -32.9 162.8 -15.3 -100.8 2.1
1600 -4.6 -61.6 17.3 -170.6 -32.8 156.6 -20.6 -78.9 2.0
1700 -5.4 -55.3 17.1 165.5 -32.5 136.5 -9.5 10.0 1.8
1800 -5.2 -49.8 15.7 145.8 -33.8 121.6 -4.5 -2.4 1.6
1900 -4.8 -47.3 13.9 135.2 -35.2 113.8 -2.7 -13.2 1.6
2000 -4.5 -46.7 12.7 127.3 -36.7 109.6 -1.8 -21.2 1.5
FREQ.
(MHz)
S11 MAG
(dB)
S11
PHASE
(Degrees)
S21 MAG
(dB)
S21
PHASE
(Degrees)
S12 MAG
(dB)
S12
PHASE
(Degrees)
S22 MAG
(dB)
S22
PHASE
(Degrees)
Kf
1000 -3.0 -57.0 10.8 -120.0 -43.0 -154.0 -1.3 -65.0 3.2
1100 -3.3 -58.2 11.6 -124.5 -42.1 -155.0 -1.6 -70.2 3.3
1200 -3.5 -60.0 13.4 -134.6 -39.3 -160.5 -2.4 -79.6 2.8
1300 -3.8 -62.3 14.9 -148.0 -37.2 -168.3 -4.0 -90.0 2.7
1400 -4.3 -63.3 15.9 -162.3 -35.4 -178.2 -7.3 -101.0 2.7
1500 -4.9 -62.0 16.6 -178.9 -33.9 171.0 -14.5 -100.6 2.6
1575 -5.3 -59.7 16.6 168.0 -33.5 161.7 -19.6 -26.0 2.5
1600 -5.4 -58.5 16.5 163.9 -33.6 157.5 -16.7 -6.0 2.5
1700 -5.5 -53.7 15.8 149.3 -33.6 148.3 -9.0 3.6 2.3
1800 -5.3 -50.3 14.7 136.8 -34.2 142.5 -5.7 -2.8 2.2
1900 -5.1 -48.0 13.4 130.0 -35.1 139.6 -4.0 -9.6 2.3
2000 -4.9 -46.3 12.7 123.9 -35.8 138.6 -3.0 -15.0 2.1
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
7
Table 3. MAX2667 Typical Noise Parameters (VCC = 2.85V, TA = +25°C)
Table 4. MAX2669 Typical Noise Parameters (VCC = 2.85V, TA = +25°C)
Chip Information
PROCESS: SiGe BiCMOS
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
6 WLP W61B1+1 21-0217 —
FREQUENCY (MHz) FMIN (dB) |GOPT| |GOPT| ANGLE RN (I)
1550 0.54 0.48 39.9 8.43
1560 0.55 0.48 40.2 8.42
1570 0.55 0.48 40.5 8.41
1575 0.55 0.48 40.7 8.41
1580 0.55 0.48 40.9 8.40
1590 0.55 0.48 41.2 8.39
1600 0.55 0.48 41.5 8.38
FREQUENCY (MHz) FMIN (dB) |GOPT| |GOPT| ANGLE RN (I)
1550 0.57 0.29 76.1 4.53
1560 0.57 0.29 76.6 4.53
1570 0.57 0.29 77.0 4.53
1575 0.57 0.29 77.3 4.52
1580 0.57 0.29 77.5 4.52
1590 0.57 0.29 78.0 4.52
1600 0.57 0.29 78.5 4.52
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time.
8 Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2010 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
MAX2667/MAX2669
GPS/GNSS Ultra-Low-Noise-Figure LNAs
Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 9/10 Initial release —
