SuperFET FCA20N60S 600V N-Channel MOSFET Features Description * 650V @TJ = 150C SuperFETTM is, Farichild's proprietary, new generation of high voltage MOSFET family that is utilizing an advanced charge balance mechanism for outstanding low on-resistance and lower gate charge performance. This advanced technology has been tailored to minimize conduction loss, provide superior switching performance, and withstand extreme dv/dt rate and higher avalanche energy. Consequently, SuperFET is very suitable for various AC/DC power conversion in switching mode operation for system miniaturization and higher efficiency. * Typ. Rds(on)=0.22 * Ultra low gate charge (typ. Qg=55nC) * Low effective output capacitance (typ. Coss.eff=110pF) * 100% avalanche tested D G G DS TO-3P FCA Series S Absolute Maximum Ratings Symbol Parameter FCA20N60S Unit 600 V 20 12.7 A A 60 A VDSS Drain-Source Voltage ID Drain Current - Continuous (TC = 25C) - Continuous (TC = 100C) IDM Drain Current - Pulsed VGSS Gate-Source voltage 30 V EAS Single Pulsed Avalanche Energy (Note 2) 450 mJ IAR Avalanche Current (Note 1) 20 A EAR Repetitive Avalanche Energy (Note 1) 26 mJ dv/dt Peak Diode Recovery dv/dt (Note 3) PD Power Dissipation TJ, TSTG Operating and Storage Temperature Range TL Maximum Lead Temperature for Soldering Purpose, 1/8" from Case for 5 Seconds (Note 1) (TC = 25C) - Derate above 25C 4.5 V/ns 260 2.1 W W/C -55 to +150 C 300 C *Drain current limited by maximum junction temperature Thermal Characteristics Symbol Parameter FCA20N60S Unit RJC Thermal Resistance, Junction-to-Case 0.48 C/W RJA Thermal Resistance, Junction-to-Ambient 41.7 C/W (c)2006 Fairchild Semiconductor Corporation FCA20N60S REV. A1 1 www.fairchildsemi.com FCA20N60S 600V N-Channel MOSFET September 2006 TM Device Marking Device Package Reel Size Tape Width Quantity FCA20N60S FCA20N60S TO-3P - - 30 FCA20N60S FCA20N60S_F109 TO-3PN - - 30 Electrical Characteristics Symbol TC = 25C unless otherwise noted Parameter Conditions Min Typ Max Units Off Characteristics BVDSS Drain-Source Breakdown Voltage VGS = 0V, ID = 250A, TJ = 25C 600 -- -- V VGS = 0V, ID = 250A, TJ = 150C -- 650 -- V ID = 250A, Referenced to 25C -- 0.6 -- V/C BVDSS / TJ Breakdown Voltage Temperature Coefficient BVDS Drain-Source Avalanche Breakdown Voltage VGS = 0V, ID = 20A -- 700 -- V IDSS Zero Gate Voltage Drain Current VDS = 600V, VGS = 0V VDS = 480V, TC = 125C --- --- 1 10 A A IGSSF Gate-Body Leakage Current, Forward VGS = 30V, VDS = 0V -- -- 100 nA IGSSR Gate-Body Leakage Current, Reverse VGS = -30V, VDS = 0V -- -- -100 nA 3.0 -- 5.0 V -- 0.22 0.26 -- 11.5 -- S -- 1730 2250 pF -- 960 1150 pF On Characteristics VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250A RDS(on) Static Drain-Source On-Resistance VGS = 10V, ID = 10A gFS Forward Transconductance VDS = 40V, ID = 10A (Note 4) Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance VDS = 25V, VGS = 0V, f = 1.0MHz Crss Reverse Transfer Capacitance -- 85 -- pF Coss Output Capacitance VDS = 480V, VGS = 0V, f = 1.0MHz -- 45 60 pF Coss eff. Effective Output Capacitance VDS = 0V to 400V, VGS = 0V -- 110 -- pF VDD = 300V, ID = 20A RG = 25 -- 46 90 ns -- 140 280 ns -- 175 350 ns -- 100 200 ns -- 57 72 nC -- 11.5 14 nC -- 28 -- nC 20 A Switching Characteristics td(on) Turn-On Delay Time tr Turn-On Rise Time td(off) Turn-Off Delay Time tf Turn-Off Fall Time Qg Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain Charge (Note 4, 5) VDS = 480V, ID = 20A VGS = 10V (Note 4, 5) Drain-Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain-Source Diode Forward Current -- -- ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- 60 A VSD Drain-Source Diode Forward Voltage VGS = 0V, IS = 20A -- -- 1.4 V trr Reverse Recovery Time 450 -- ns Reverse Recovery Charge VGS = 0V, IS = 20A dIF/dt =100A/s -- Qrr -- 8.2 -- C (Note 4) NOTES: 1. Repetitive Rating: Pulse width limited by maximum junction temperature 2. IAS = 8A, VDD = 50V, RG = 25, Starting TJ = 25C 3. ISD 20A, di/dt 200A/s, VDD BVDSS, Starting TJ = 25C 4. Pulse Test: Pulse width 300s, Duty Cycle 2% 5. Essentially Independent of Operating Temperature Typical Characteristics FCA20N60S REV. A1 2 www.fairchildsemi.com FCA20N60S 600V N-Channel MOSFET Package Marking and Ordering Information Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics 2 2 10 10 VGS 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V Bottom : 5.5 V 1 10 ID , Drain Current [A] ID, Drain Current [A] Top : 0 10 * Notes : 1. 250s Pulse Test 1 10 o 150 C o 25 C o -55 C 0 10 * Note: 1. VDS = 40V o 2. TC = 25 C -1 0 10 2. 250s Pulse Test 1 10 10 2 4 VDS, Drain-Source Voltage [V] Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage 2 0.5 VGS = 10V 0.4 0.3 VGS = 20V 0.2 0.1 1 10 o 0 150 C 10 o 25 C Notes : 1. VGS = 0V 2. 250 s Pulse Test * Note: TJ = 25 0.0 0 5 10 15 20 25 30 35 40 45 50 0.2 0.4 0.6 Figure 5. Capacitance Characteristics VGS, Gate-Source Voltage [V] 5000 Coss * Notes : 1. VGS = 0 V Ciss 2. f = 1 MHz 2000 1000 0 -1 10 Crss 0 10 10 1.6 1 10 VDS = 250V VDS = 480V 8 6 4 2 * Note : ID = 20A 0 0 10 20 30 40 50 60 QG, Total Gate Charge [nC] VDS, Drain-Source Voltage [V] FCA20N60S REV. A1 1.4 VDS = 100V Crss = Cgd 4000 1.2 12 Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd 6000 1.0 Figure 6. Gate Charge Characteristics 7000 3000 0.8 VSD , Source-Drain Voltage [V] ID, Drain Current [A] Capacitance [pF] 10 10 IDR , Reverse Drain Current [A] RDS(ON) [], 8 Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue 0.6 Drain-Source On-Resistance 6 VGS , Gate-Source Voltage [V] 3 www.fairchildsemi.com FCA20N60S 600V N-Channel MOSFET Typical Performance Characteristics FCA20N60S 600V N-Channel MOSFET Typical Performance Characteristics (Continued) Figure 7. Breakdown Voltage Variation vs. Temperature Figure 8. On-Resistance Variation vs. Temperature 3.0 RDS(ON), (Normalized) 1.1 1.0 * Notes : 1. VGS = 0 V 0.9 2. ID = 250 A Drain-Source On-Resistance BVDSS, (Normalized) Drain-Source Breakdown Voltage 1.2 2.5 2.0 1.5 1.0 * Notes : 1. VGS = 10 V 0.5 2. ID = 10 A 0.8 -100 -50 0 50 100 150 0.0 -100 200 -50 0 o TJ, Junction Temperature [ C] 50 100 150 200 o TJ, Junction Temperature [ C] Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs. Case Temperature 25 Operation in This Area is Limited by R DS(on) 2 10 us 100 us 20 ID, Drain Current [A] ID, Drain Current [A] 10 1 ms 10 ms 1 10 DC 0 10 * Notes : o 1. TC = 25 C -1 10 15 10 5 o 2. TJ = 150 C 3. Single Pulse -2 10 0 10 1 2 10 0 25 3 10 10 50 75 100 125 150 o VDS, Drain-Source Voltage [V] TC, Case Temperature [ C] Figure 11. Transient Thermal Response Curve ZJC(t), Thermal Response 10 0 D = 0 .5 10 * N o te s : 0 .2 -1 o 1 . Z JC (t) = 0 .4 8 C /W M a x . 2 . D u ty F a c to r, D = t 1 /t 2 0 .1 3 . T J M - T C = P D M * Z JC (t) 0 .0 5 PDM 0 .0 2 0 .0 1 10 t1 -2 10 t2 s in g le p u ls e -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t 1 , S q u a re W a v e P u ls e D u ra tio n [s e c ] FCA20N60S REV. A1 4 www.fairchildsemi.com FCA20N60S 600V N-Channel MOSFET Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveforms Unclamped Inductive Switching Test Circuit & Waveforms FCA20N60S REV. A1 5 www.fairchildsemi.com FCA20N60S 600V N-Channel MOSFET Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT + V DS _ I SD L D r iv e r R V V GS ( D r iv e r ) G S G S am e T ype as DUT V DD * d v / d t c o n t r o lle d b y R G * I S D c o n t r o lle d b y p u ls e p e r io d G a t e P u ls e W id th D = -------------------------G a te P u ls e P e r io d 10V I F M , B o d y D io d e F o r w a r d C u r r e n t I SD ( DUT ) d i/ d t IR M B o d y D io d e R e v e r s e C u r r e n t V DS ( DUT ) B o d y D io d e R e c o v e r y d v / d t V SD V DD B o d y D io d e F o r w a r d V o lt a g e D r o p FCA20N60S REV. A1 6 www.fairchildsemi.com FCA20N60S 600V N-Channel MOSFET TO-3P 15.60 0.20 3.00 0.20 3.80 0.20 +0.15 1.00 0.20 18.70 0.20 23.40 0.20 19.90 0.20 1.50 -0.05 16.50 0.30 2.00 0.20 9.60 0.20 4.80 0.20 3.50 0.20 13.90 0.20 o3.20 0.10 12.76 0.20 13.60 0.20 1.40 0.20 +0.15 5.45TYP [5.45 0.30] 5.45TYP [5.45 0.30] 0.60 -0.05 Dimensions in Millimeters FCA20N60S REV. A1 7 www.fairchildsemi.com FCA20N60S 600V N-Channel MOSFET Mechanical Dimensions (continued) TO-3PN Dimensions in Millimeters FCA20N60S REV. A1 8 www.fairchildsemi.com FCA20N60S 600V N-Channel MOSFET TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet SeriesTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM Across the board. 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A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I20 9 FCA20N60S REV. A1 www.fairchildsemi.com