PIC16C62X PIC16C62XA/CR62XA/CE62XA Rev. A Silicon/Data Sheet Errata The PIC16C62X (Rev. A) parts you have received conform functionally to the Device Data Sheet (DS30235J for PIC16C62XA and PIC16CR62XA, or DS40182C for PIC16CE62X), except for the anomalies described below. All the problems listed here will be addressed in future revisions of the PIC16C62X silicon. FIGURE 1: PIC16LC62XA VOLTAGE-FREQUENCY GRAPH, -40C TA 0C 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.7 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. Note: As with any windowed EPROM device, please cover the window at all times, except when erasing. 2004 Microchip Technology Inc. DS80101D-page 1 PIC16C62X PIC16LC62XA VOLTAGE-FREQUENCY GRAPH, 0C TA +70C FIGURE 2: 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. DS80101D-page 2 2004 Microchip Technology Inc. PIC16C62X FIGURE 3: PIC16LC62XA VOLTAGE-FREQUENCY GRAPH, +70C TA +125C 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. 2004 Microchip Technology Inc. DS80101D-page 3 PIC16C62X PIC16LCR62XA VOLTAGE-FREQUENCY GRAPH, -40C TA +125C FIGURE 4: 6.0 5.5 5.0 VDD (VOLTS) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. DS80101D-page 4 2004 Microchip Technology Inc. PIC16C62X 1. Module: RESET Work around The minimum specification for the MCLR must be met in order to reset the PIC16CXXX. If a MCLR pulse occurs that is less than the minimum specification (parameter #30), improper device operation can occur. A possible circuit is shown in Figure 1. Proper design validation needs to be done to ensure desired operation over the applications operating conditions. If the minimum specification cannot be met, then an external circuit must be used to insure that any pulse width, less than the specification, will be filtered before it reaches the MCLR pin. FIGURE 1: MCLR EXTERNAL CIRCUIT VDD R1 R2 MCLR C1 PIC16CXXX 4.7 K < R1 < 10 K 0.01 F < C1 < 0.1 F R2 = 100 2004 Microchip Technology Inc. DS80101D-page 5 PIC16C62X 2. Module: Oscillator The events that wake-up the device from SLEEP are: The Oscillator Start-up Timer (TOST) delay may not occur when the device wakes up from SLEEP. * * * * Figure 2 shows the start-up of the crystal after the event that causes the device to wake-up from SLEEP mode (as specified in the Device Data Sheet). The start-up time (TOST) may not occur. FIGURE 2: An interrupt A WDT overflow (wake-up) A Brown-out Reset A MCLR Reset WAKE-UP FROM SLEEP Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 TOST(2) CLKOUT(4) Wake-up Event Occurs INSTRUCTION FLOW PC Instruction Fetched Instruction Executed Note 1: PC Inst(PC) = SLEEP Inst(PC - 1) PC+1 -- TCY TCY TCY TCY Inst(PC + 1) SLEEP For TOST delay to be enabled, the XT, HS, or LP Oscillator mode must be selected. 2: TOST = 1024TOSC, This delay may not occur, and every valid clock edge will generate internal device clocks. 3: CLKOUT is not available in these OSC modes, but shown here for timing reference. In applications where time-based measurements are started immediately after wake-up from SLEEP, the suggested work around should be implemented. DS80101D-page 6 Work around After the SLEEP instruction, do a software delay of 256 TCY (same as 1024 TOSC). At the RESET and Interrupt vector addresses, test to see if the device woke from SLEEP (the TO and PD bits), and if the device did wake from SLEEP, ensure that the total cycle delay is 256 TCY. 2004 Microchip Technology Inc. PIC16C62X Clarifications/Corrections to the Data Sheets: In the Device Data Sheets (DS30235J for 16C62XA and 16CR62XA, or DS40182C for 16CE62X), the following clarifications and corrections should be noted. 1. Module: Electrical Specifications Figures 1 through 5 have been added. FIGURE 1: PIC16LC620A/LC621A/LC622A/LCE623/LCE624/LCE625-04 VOLTAGE-FREQUENCY GRAPH, -40C TA 0C 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.7 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. 2004 Microchip Technology Inc. DS80101D-page 7 PIC16C62X FIGURE 2: PIC16LC620A/LC621A/LC622A/LCE623/LCE624/LCE625-04 VOLTAGE-FREQUENCY GRAPH, 0C TA +125C 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. DS80101D-page 8 2004 Microchip Technology Inc. PIC16C62X FIGURE 3: PIC16LCR620A-04 VOLTAGE-FREQUENCY GRAPH, -40C TA +125C 6.0 5.5 5.0 VDD (VOLTS) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. 2004 Microchip Technology Inc. DS80101D-page 9 PIC16C62X FIGURE 4: PIC16C620A/C621A/C622A/CR620A - 40 VOLTAGE-FREQUENCY GRAPH, 0C TA +70C 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 0 4 10 20 25 40 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. 3: Operation between 20 to 40 MHz requires the following: * VDD between 4.5V. and 5.5V * OSC1 externally driven * OSC2 not connected * HS mode * Commercial temperatures Devices qualified for 40 MHz operation have -40 designation (ex: PIC16C620A-40/P). DS80101D-page 10 2004 Microchip Technology Inc. PIC16C62X FIGURE 5: PIC16CE623/CE624/CE625-30 VOLTAGE-FREQUENCY GRAPH, 0C TA +70C 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 0 4 10 20 25 30 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. 3: Operation between 20 to 30 MHz requires the following: * VDD between 4.5V. and 5.5V * OSC1 externally driven * OSC2 not connected * HS mode * Commercial temperatures Devices qualified for 30 MHz operation have -30 designation (ex: PIC16CE623-30/P). 2004 Microchip Technology Inc. DS80101D-page 11 PIC16C62X 2. Module: Electrical Specifications Tables 1, 2, and 3 have been changed. DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(7) (Commercial) PIC16CR620A-40(7) (Commercial) PIC16CE62X-30(8) (Commercial) TABLE 1: Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended DC CHARACTERISTICS Param No. Sym Characteristic Min Typ Max Units Conditions D001 VDD Supply Voltage 3.0 - 5.5 V FOSC = DC to 20 MHz D002 VDR RAM Data Retention Voltage (Note 1) - 1.5* - V Device in SLEEP mode D003 VPOR VDD start voltage to ensure Power-on Reset - VSS - V See section on Power-on Reset for details D004 SVDD VDD rise rate to ensure Power-on Reset 0.05 * - - D005 VBOR Brown-out Detect Voltage 3.65 4.0 4.35 V D010 IDD Supply Current (Notes 2, 4) - 1.2 2.0 mA - 0.4 1.2 mA - 1.0 2.0 mA - 4.0 6.0 mA - 4.0 7.0 mA - 35 70 A - - - - - - - - 2.2 5.0 9.0 15 A A A A D020 IPD Power Down Current (Note 3) V/ms See section on Power-on Reset for details BOREN configuration bit is cleared FOSC = 4 MHz, VDD = 5.5V, WDT disabled, XT OSC mode, (Note 4)* FOSC = 4 MHz, VDD = 3.0V, WDT disabled, XT OSC mode, (Note 4) FOSC = 10 MHz, VDD = 3.0V, WDT disabled, HS OSC mode, (Note 6) FOSC = 20 MHz, VDD = 4.5V, WDT disabled, HS OSC mode FOSC = 20 MHz, VDD = 5.5V, WDT disabled*, HS OSC mode FOSC = 32 kHz, VDD = 3.0V, WDT disabled, LP OSC mode VDD = 3.0V VDD = 4.5V* VDD = 5.5V VDD = 5.5V Extended * These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C, unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified. 3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. 4: For RC OSC configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in k. 5: The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. 6: Commercial temperature range only. 7: See Table 3 and Table 4 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 MHz for valid modified characteristics. 8: See Table 5 and Table 6 for 16CE62X devices for operation between 20 MHz and 30 MHz for valid modified characteristics. DS80101D-page 12 2004 Microchip Technology Inc. PIC16C62X DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(7) (Commercial) PIC16CR620A-40(7) (Commercial) PIC16CE62X-30(8) (Commercial) (CONTINUED) TABLE 1: Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended DC CHARACTERISTICS Param No. D022 Sym Min Typ WDT Current (Note 5) - 6.0 Brown-out Reset Current (Note 5) Comparator Current for each Comparator (Note 5) VREF Current (Note 5) - - 75 30 10 12 125 60 - 80 IEE Write IEE Read IEE IEE Operating Current Operating Current Standby Current Standby Current - - - - FOSC LP Oscillator Operating Frequency RC Oscillator Operating Frequency XT Oscillator Operating Frequency HS Oscillator Operating Frequency 0 0 0 0 IWDT D022A IBOR ICOMP D023 D023A IVREF 1A Characteristic - - - - Max Units Conditions A A A A VDD = 4.0V (125C) BOD enabled, VDD = 5.0V VDD = 4.0V 135 A VDD = 4.0V 3 1 30 100 mA mA A A VCC = 5.5V, SCL = 400 kHz VCC = 3.0V, EE VDD = VCC VCC = 3.0V, EE VDD = VCC 200 4 4 20 kHz MHz MHz MHz All temperatures All temperatures All temperatures All temperatures * These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C, unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified. 3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. 4: For RC OSC configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in k. 5: The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. 6: Commercial temperature range only. 7: See Table 3 and Table 4 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 MHz for valid modified characteristics. 8: See Table 5 and Table 6 for 16CE62X devices for operation between 20 MHz and 30 MHz for valid modified characteristics. 2004 Microchip Technology Inc. DS80101D-page 13 PIC16C62X TABLE 2: DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(4) (Commercial) PIC16CR620A-40(4) (Commercial) PIC16CE62X-30(5) (Commercial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended DC CHARACTERISTICS Parm No. Sym VIL D030 D031 D032 D033 VIH D040 D041 D042 D043 D043A D070 IPURB IIL D060 D061 D063 VOL Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger input MCLR, RA4/T0CKI, OSC1 (in RC mode) OSC1 (in XT and HS) OSC1 (in LP) Input High Voltage I/O ports with TTL buffer with Schmitt Trigger input MCLR RA4/T0CKI OSC1 (XT, HS and LP) OSC1 (in RC mode) PORTB Weak Pull-up Current Input Leakage Current (Notes 2, 3) I/O ports (except PORTA) PORTA RA4/T0CKI OSC1, MCLR D080 Output Low Voltage I/O ports D083 OSC2/CLKOUT (RC only) D090 Output High Voltage (Note 3) I/O ports (except RA4) D092 OSC2/CLKOUT (RC only) VOH Min Typ Max Unit Conditions VSS - V VDD = 4.5V to 5.5V, otherwise VSS VSS - 0.8V 0.15VDD 0.2VDD 0.2VDD V V (Note 1) VSS VSS - - 0.3VDD 0.6VDD - 1.0 V V 2.0V .25VDD + 0.8 0.8VDD 0.8VDD 0.7VDD 0.9VDD 50 - V - - VDD VDD VDD VDD VDD 200 400 (Note 1) A VDD = 5.0V, VPIN = VSS - - - - - - 1.0 0.5 1.0 5.0 A A A A VSS VPIN VDD, pin at hi-impedance Vss VPIN VDD, pin at hi-impedance Vss VPIN VDD Vss VPIN VDD, XT, HS and LP OSC configuration - - - - - - - - 0.6 0.6 0.6 0.6 V V V V IOL=8.5 mA, VDD=4.5V, IOL=7.0 mA, VDD=4.5V, IOL=1.6 mA, VDD=4.5V, IOL=1.2 mA, VDD=4.5V, VDD-0.7 VDD-0.7 VDD-0.7 VDD-0.7 - - - - - - - - 8.5 V V V V V IOH=-3.0 mA, VDD=4.5V, IOH=-2.5 mA, VDD=4.5V, IOH=-1.3 mA, VDD=4.5V, IOH=-1.0 mA, VDD=4.5V, RA4 pin VDD = 4.5V to 5.5V, otherwise V V -40 to +85C +125C -40 to +85C +125C -40 to +85C +125C -40 to +85C +125C *D150 VOD Open Drain High Voltage * These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1 pin is a Schmitt Trigger input. It is not recommended that the PIC16CE62X be driven with external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as coming out of the pin. 4: See Table 3 and Table 4 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 MHz for valid modified characteristics. 5: See Table 5 and Table 6 for 16CE62X devices for operation between 20 MHz and 30 MHz for valid modified characteristics. DS80101D-page 14 2004 Microchip Technology Inc. PIC16C62X TABLE 2: DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(4) (Commercial) PIC16CR620A-40(4) (Commercial) PIC16CE62X-30(5) (Commercial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended DC CHARACTERISTICS Parm No. D100 Sym Characteristic Capacitive Loading Specs on Output Pins COSC2 OSC2 pin D101 Min Typ Max 15 Unit Conditions pF In XT, HS and LP modes when external clock used to drive OSC1. pF CIO All I/O pins/OSC2 (in RC mode) 50 * These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1 pin is a Schmitt Trigger input. It is not recommended that the PIC16CE62X be driven with external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as coming out of the pin. 4: See Table 3 and Table 4 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 MHz for valid modified characteristics. 5: See Table 5 and Table 6 for 16CE62X devices for operation between 20 MHz and 30 MHz for valid modified characteristics. 2004 Microchip Technology Inc. DS80101D-page 15 PIC16C62X TABLE 3: DC CHARACTERISTICS: DC Characteristics Power Supply Pins PIC16C620A/C621A/C622A-40(3) (Commercial) PIC16CR620A-40(3) (Commercial) Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) Sym Min Typ(1) Max Units VDD 4.5 -- 5.5 V IDD -- -- 5.5 7.7 11.5 16 mA mA HS Oscillator Operating Frequency FOSC 20 -- 40 Input Low Voltage OSC1 VIL VSS -- 0.2VDD V HS mode, OSC1 externally driven Input High Voltage OSC1 VIH 0.8VDD -- VDD V HS mode, OSC1 externally driven Characteristic Supply Voltage (2) Supply Current Conditions HS Option from 20 - 40 MHz FOSC = 40 MHz, VDD = 4.5V, HS mode FOSC = 40 MHz, VDD = 5.5V, HS mode MHz OSC1 pin is externally driven, OSC2 pin not connected * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT disabled, HS mode with OSC2 not connected. 3: For device operation between DC and 20 MHz, see Table 1 and Table 2. 3. Module: Electrical Specifications Tables 4, 5, and 6 have been added. TABLE 4: AC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(2) (Commercial) PIC16CR620A-40(2) (Commercial) DC Characteristics All Pins Except Power Supply Pins Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) Sym Min Typ(1) External CLKIN Frequency FOSC 20 -- 40 External CLKIN Period TOSC 25 -- 50 ns HS mode (40),OSC1 externally driven Clock in (OSC1) Low or High Time TOSL, TOSH 6 -- -- ns HS mode,OSC1 externally driven Clock in (OSC1) Rise or Fall Time TOSR, TOSF -- -- 6.5 ns HS mode, OSC1 externally driven OSC1 (Q1 cycle) to Port out valid TOSH2IOV -- -- 100 ns -- OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) TOSH2IOI 50 -- -- ns -- Characteristic Max Units Conditions MHz HS mode, OSC1 externally driven Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: For device operation between DC and 20 MHz, see Table 1 and Table 2. DS80101D-page 16 2004 Microchip Technology Inc. PIC16C62X TABLE 5: DC CHARACTERISTICS: PIC16CE623A/CE624/CE625-30(3) (Commercial) DC Characteristics Power Supply Pins Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) Sym Min Typ(1) Max Units VDD 4.5 -- 5.5 V IDD -- -- 4.4 5.8 9.1 12.0 mA mA HS Oscillator Operating Frequency FOSC 20 -- 30 Input Low Voltage OSC1 VIL VSS -- 0.2VDD V HS mode, OSC1 externally driven Input High Voltage OSC1 VIH 0.8VDD -- VDD V HS mode, OSC1 externally driven Characteristic Supply Voltage (2) Supply Current Conditions HS option from 20 - 30 MHz FOSC = 30 MHz, VDD = 4.5V, HS mode FOSC = 30 MHz, VDD = 5.5V, HS mode MHz OSC1 pin is externally driven, OSC2 pin not connected * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT disabled, HS mode with OSC2 not connected. 3: For device operation between DC and 20 MHz, see Table 1 and Table 2. TABLE 6: AC CHARACTERISTICS: PIC16CE623/CE624/CE625-30(2) (Commercial) DC Characteristics All Pins Except Power Supply Pins Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) Sym Min Typ(1) External CLKIN Frequency FOSC 20 -- 30 External CLKIN Period TOSC Characteristic Max Units Conditions MHz HS mode, OSC1 externally driven 33 -- 50 ns HS mode (30), OSC1 externally driven Clock in (OSC1) Low or High Time TOSL, TOSH 6 -- -- ns HS mode, OSC1 externally driven Clock in (OSC1) Rise or Fall Time TOSR, TOSF -- -- 10.5 ns HS mode, OSC1 externally driven OSC1 (Q1 cycle) to Port out valid TOSH2IOV -- -- 132 ns -- OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) TOSH2IOI 66 -- -- ns -- Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: For device operation between DC and 20 MHz, see Table 1 and Table 2. 2004 Microchip Technology Inc. DS80101D-page 17 PIC16C62X 4. RC Oscillator In the RC Oscillator, Section 9.2.4., page 48, the text and figure should be as follows: For applications where precise timing is not a requirement, the RC oscillator option is available. The operation and functionality of the RC oscillator is dependent upon a number of variables. The RC oscillator frequency is a function of: * Supply voltage * Resistor (REXT) and capacitor (CEXT) values * Operating temperature. The oscillator frequency will vary from unit to unit due to normal process parameter variation. The difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low CEXT values. The user also needs to account for the tolerance of the external R and C components. Figure 9-5 shows how the R/C combination is connected. Two options are available for this oscillator mode which allow RA4 to be used as a general purpose I/O or to output FOSC/4. FIGURE 9-5: RC OSCILLATOR MODE VDD PIC16C62X REXT RA5/OSC1/ CLKIN Internal Clock CEXT VSS FOSC/4 or I/O RA4/OSC2/CLKOUT DS80101D-page 18 2004 Microchip Technology Inc. PIC16C62X APPENDIX A: REVISION HISTORY Rev A Document (3/2001) First revision of this document. Rev B Document (5/2001) Under Clarifications/Corrections to the Data Sheets, Figures 1 through 5 were added (pages 3 through 7). Changes were made to Tables 1, 2, and 3 (pages 8 through 11). Table 4, 5 and 6 were added (pages 11 and 12). Rev C Document (10/2001) Under Clarifications/Corrections to the Data Sheets, Item 2, Table 1, Parameter number D005, under the "Min" column, "3.7" was changed to "3.65" (page 12). Rev D Document (04/2004) Under Clarifications/Corrections to the Data Sheets, Added Module 4: Corrections to Figure 9-5: RC Oscillator Mode diagram. Obsoleted DS80065B PIC16C62XA Rev. A Silicion Errata and incorporated into this document. 2004 Microchip Technology Inc. DS80101D-page 19 PIC16C62X NOTES: DS80101D-page 20 2004 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart and rfPIC are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartShunt and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, Select Mode, SmartSensor, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2004 Microchip Technology Inc. DS80101D-page 21 WORLDWIDE SALES AND SERVICE AMERICAS China - Beijing Korea Corporate Office Unit 706B Wan Tai Bei Hai Bldg. No. 6 Chaoyangmen Bei Str. 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