PIC16C621A-40/SO - Microchip Technology

 2004 Microchip Technology Inc. DS80101D-page 1

PIC16C62X

The PIC16C62X (Rev. A) parts you have received

conform functionally to the Device Data Sheet

(DS30235J for PIC16C62XA and PIC16CR62XA, or

DS40182C for PIC16CE62X), e xcept for the ano malies

des cribed below.

All the problems listed here will be addressed in future

revisions of the PIC16C62X silicon.

FIGURE 1: PIC16LC62XA VOLTAGE-FREQUENCY GRAPH, -40°C ≤ TA ≤ 0°C

6.0

2.5

4.0

3.0

3.5

4.5

5.0

5.5

410

Frequency (MHz)

VDD

(Volts)

2.0

Note 1: The shaded region indicates the permissible combinations of voltage and frequency.

2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.

Please reference the Product Identification System section for the maximum rated speed of the parts.

2.7

Note: As with any windowed EPROM device, please cover the window at all times, except when erasing.

PIC16C62XA/CR62XA/CE62XA Rev. A Silicon/Data Sheet Errata

PIC16C62X

DS80101D-page 2  2004 Microchip Technology Inc.

FIGURE 2: PIC16LC62XA VOLTAGE-FREQUENCY GRAPH, 0°C ≤ TA ≤ +70°C

6.0

2.5

4.0

3.0

3.5

4.5

5.0

5.5

410

Frequency (MHz)

VDD

(Volts)

2.0

Note 1: The shaded region indicates the permissible combinations of voltage and frequency.

2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.

Please reference the Product Identification System section for the maximum rated speed of the parts.

 2004 Microchip Technology Inc. DS80101D-page 3

PIC16C62X

FIGURE 3: PIC16LC62XA VOLTAGE-FREQUENCY GRAPH, +70°C ≤ TA ≤ +125°C

6.0

2.5

4.0

3.0

3.5

4.5

5.0

5.5

410

Frequency (MHz)

VDD

(Volts)

2.0

Note 1: The shaded region indicates the permissible combinations of voltage and frequency.

2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.

Please reference the Product Identification System section for the maximum rated speed of the parts.

PIC16C62X

DS80101D-page 4  2004 Microchip Technology Inc.

FIGURE 4: PIC16LCR62XA VOLTAGE-FREQUENCY GRAPH, -40°C ≤ TA ≤ +125°C

6.0

2.5

4.0

3.0

3.5

4.5

5.0

5.5

410

Frequency (MHz)

VDD

(VOLTS)

2.0

Note 1: The shaded region indicates the permissible combinations of voltage and frequency.

2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.

Please reference the Product Identification System section for the maximum rated speed of the parts.

 2004 Microchip Technology Inc. DS80101D-page 5

PIC16C62X

1. Module: RESET

The minimum specification for the MCLR must be met

in order to reset the PIC16CXXX. If a MCLR pulse

occurs that is less than the minimum specification

(param eter #30), imp roper device o peration can oc cur .

If the minimum specification cannot be met, then an

external circuit must be used to insure that any pulse

width, less than the specification, will be filtered before

it reaches the MCLR pin.

Work around

A possible circuit is shown in Figure 1. Proper design

validation needs to be done to ensure desired opera-

tion over the applications operating conditions.

FIGURE 1: MCLR EXTERNAL CIRCUIT

VDD

MCLR

PIC16CXXX

4.7 KΩ< R1 < 10 KΩ

0.01 µF<

C1 < 0.1 µF

R2 = 100Ω

PIC16C62X

DS80101D-page 6  2004 Microchip Technology Inc.

2. Module: Oscillator

The Oscillator Start-up Timer (TOST) delay may not

occur when the device wakes up from SLEEP.

Figure 2 shows the start-up of the crystal after the

event that causes the device to wake-up from SLEEP

mode (as specified in the Device Data Sheet). The

start - up time (TOST) may not oc cur.

The events that wake-up the device from SLEEP are:

• An interrupt

• A WD T overflow (wake-up)

• A Brown-out Reset

• A MCLR

Rese t

FIGURE 2: WAKE-UP FROM SLEEP

In applications where time-based measurements are

started immediately after wake-up from SLEEP, the

suggested work around should be implemented.

Work around

After the SLEEP instruction, do a software delay of 25 6

TCY (same as 10 24 TOSC). At the RESET and Interrupt

vector addresses, test to see if the device woke from

SLEEP (the TO and PD bit s), and if the device did wake

from SLEEP, ensure that the total cycle delay is 256

TCY.

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

OSC1

CLKOUT

(4)

INSTRUCTION FLOW

Instruction

Fetched

Instruction

Executed

PC PC+1 —

Inst(PC) =

SLEEP

Inst(PC - 1)

Inst(PC + 1)

SLEEP

TOST(2)

Note 1: For TOST delay to be enabled, the XT, HS, or LP Oscillator mode must be selected.

2: TOST = 1024TOSC, This delay may not occur, and every valid clock edge will generate internal device clocks.

3: CLKOUT is not available in these OSC modes, but shown here for timing reference.

Wake -up Event Occurs

 2004 Microchip Technology Inc. DS80101D-page 7

PIC16C62X

Clarifications/Corrections to the Data

Sheets:

In the Device Data Sheets (DS30235J for 16C62XA

and 16CR62XA, or DS40182C for 16CE62X), the

following clarifications and corrections should be

noted.

1. Module: Electrical Specifications

Figures 1 through 5 have been added.

FIGURE 1: PIC16LC6 20A/LC621A /LC622 A/L CE 623 /LCE6 24/L CE 62 5-04

VOLTAGE-FREQUENCY GRAPH, -40°C ≤ TA ≤ 0°C

6.0

2.5

4.0

3.0

3.5

4.5

5.0

5.5

410

Frequency (MHz)

VDD

(Volts)

2.0

Note 1: The shaded region indicates the permissible combinations of voltage and frequency.

2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.

Please reference the Product Identification System section for the maximum rated speed of the parts.

2.7

PIC16C62X

DS80101D-page 8  2004 Microchip Technology Inc.

FIGURE 2: PIC16LC6 20A/LC621A /LC622 A/L CE 623 /LCE6 24/L CE 62 5-04

VOLTAGE-FREQUENCY GRAPH, 0°C ≤ TA ≤ +125°C

6.0

2.5

4.0

3.0

3.5

4.5

5.0

5.5

410

Frequency (MHz)

VDD

(Volts)

2.0

Note 1: The shaded region indicates the permissible combinations of voltage and frequency.

2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.

Please reference the Product Identification System section for the maximum rated speed of the parts.

 2004 Microchip Technology Inc. DS80101D-page 9

PIC16C62X

FIGURE 3: PIC16LCR620A-04 VOLTAGE-FREQUENCY GRAPH, -40°C ≤ TA ≤ +125°C

6.0

2.5

4.0

3.0

3.5

4.5

5.0

5.5

410

Frequency (MHz)

VDD

(VOLTS)

2.0

Note 1: The shaded region indicates the permissible combinations of voltage and frequency.

2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.

Please reference the Product Identification System section for the maximum rated speed of the parts.

PIC16C62X

DS80101D-page 10  2004 Microchip Technology Inc.

FIGURE 4: PIC16C620A/C621A/C622A/CR620A - 40

VOLTAGE-FREQUENCY GRAPH, 0°C ≤ TA ≤ +70°C

6.0

2.5

4.0

3.0

3.5

4.5

5.0

5.5

410

Frequency (MHz)

VDD

(Volts)

Note 1: The shaded region indicates the permissible combinations of voltage and frequency.

2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.

Please reference the Product Identification System section for the maximum rated speed of the parts.

3: Operation between 20 to 40 MHz requires the following:

• V

DD between 4.5V. and 5.5V

• OSC1 externally driven

• OSC2 not connected

• HS mode

• Commercial temperatures

Devices qualified for 40 MHz operation have -40 designation (ex: PIC16C620A-40/P).

 2004 Microchip Technology Inc. DS80101D-page 11

PIC16C62X

FIGURE 5: PIC16CE 62 3/CE 624 /CE625- 30

VOLTAGE-FREQUENCY GRAPH, 0°C ≤ TA ≤ +70°C

6.0

2.5

4.0

3.0

3.5

4.5

5.0

5.5

410

Frequency (MHz)

VDD

(Volts)

Note 1: The shaded region indicates the permissible combinations of voltage and frequency.

2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.

Please reference the Product Identification System section for the maximum rated speed of the parts.

3: Operation between 20 to 30 MHz requires the following:

• V

DD between 4.5V. and 5.5V

• OSC1 externally driven

• OSC2 not connected

• HS mode

• Commercia l temp era tures

Devices qualified for 30 MHz operation have -30 designation (ex: PIC16CE623-30/P).

PIC16C62X

DS80101D-page 12  2004 Microchip Technology Inc.

2. Module: Electrical Specifications

Tables 1, 2, and 3 have been changed.

TABLE 1: DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(7) (Commercial)

PIC16CR620A-40(7) (Commercial)

PIC16CE62X-30(8) (Commercial)

DC CHARACTERISTICS

Standard Operatin g Conditions (unless otherwise stated)

Operating temperature –40°C≤ TA ≤ +85°C for industrial and

0°C ≤ TA ≤ +70°C for commercial and

–40°C≤ TA ≤ +1 25°C for extended

Param

No. Sym Characteristic Min Typ† Max Units Conditions

D001 VDD Supply Voltage 3.0 – 5.5 V FOSC = DC to 20 MHz

D002 VDR RAM Data Retention Voltage

(Note 1) – 1.5* – V Device in SLEEP mode

D003 VPOR VDD start voltage to ensure

Power-on Reset –VSS – V See section on Power-on Reset for details

D004 SVDD VDD rise rate to ensure Power-on

Reset 0.05

*– – V/ms See section on Power-on Reset for details

D005 VBOR Brown-out Detect Voltage 3.65 4.0 4.35 V BOREN configuration bit is cleared

D010 IDD Supply Current (Notes 2, 4) –

–

1.2

0.4

1.0

4.0

2.0

1.2

2.0

6.0

7.0

µA

FOSC = 4 MHz, VDD = 5.5V, WDT disabled,

XT OSC mode, (Note 4)*

FOSC = 4 MHz, VDD = 3.0V, WDT disabled,

XT OSC mode, (Note 4)

FOSC = 10 MHz, VDD = 3.0V, WDT disabled,

HS OSC mode, (Note 6)

FOSC = 20 MHz, VDD = 4.5V, WDT disabled,

HS OSC mode

FOSC = 20 MHz, VDD = 5. 5V, WDT disabled*,

HS OSC mode

FOSC = 32 kHz, VDD = 3.0V, WD T disabled,

LP OSC mode

D020 IPD Power Down Current (Note 3) –

–

2.2

5.0

9.0

µA

VDD = 3.0V

VDD = 4.5V*

VDD = 5.5V

VDD = 5.5V Extended

* These parameters are characterized but not tested.

† Data in "Typ" column is at 5.0V, 25°C, unless otherwise stated. These paramet ers are for design guidance only and are

not tested.

Note 1: This is the limit to which VDD can be lower ed in SLEEP mode without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and

switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current

consumption.

The test conditions for all IDD measurem ents in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD, MCL R = VDD; WDT enabled/disabled

as specified.

3: The power-down current in SLEEP mode does not depend on the osc illator type. Power-down curren t is measured with

the part in SLE EP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.

4: For RC OSC configuration, current through REXT is not included. The current through the resistor can be estimated by the

formula Ir = VDD/2REXT (mA) with REXT in k Ω.

5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the

base IDD or IPD measurement.

6: Commercial temperature range only.

7: See Table 3 and Table 4 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 MHz for valid modified

characteristics.

8: See Table 5 and Table 6 for 16CE62X devices for operation between 20 MHz and 30 MHz for valid modified characteristics.

 2004 Microchip Technology Inc. DS80101D-page 13

PIC16C62X

D022

D022A

D023

D023A

∆IWDT

∆IBOR

∆ICOMP

∆IVREF

WDT Current (Note 5)

Brown-out Reset Current (Note 5)

Comparator Current for each

Comparator (Note 5)

VREF Current (Note 5)

–

6.0

125

135

µA

VDD = 4.0V

(125°C)

BOD enabled, VDD = 5.0V

VDD = 4.0V

∆IEE Write

∆IEE Read

∆IEE

Operating Current

S tandby Current

–

100

µA

VCC = 5.5V, SCL = 400 kHz

VCC = 3.0V, EE VDD = VCC

1A FOSC LP Oscillator Operating Fr equency

RC Oscillator Operating Frequency

XT Oscillator Operating Frequency

HS Oscillator Operating Frequency

–

200

kHz

MHz

All temperatures

TABLE 1: DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(7) (Commercial)

PIC16CR620A-40(7) (Commercial)

PIC16CE62X-30(8) (Commer cia l) (CONTINUED)

DC CHARACTERISTICS

Standard Operatin g Conditions (unless otherwise stated)

Operating temperature –40°C≤ TA ≤ +85°C for industrial and

0°C ≤ TA ≤ +70°C for commercial and

–40°C≤ TA ≤ +125°C for extended

Param

No. Sym Characteristic Min Typ† Max Units Conditions

* These parameters are characterized but not tested.

† Data in "Typ" column is at 5.0V, 25°C, unless otherwise stated. These par ameters are for design guidance only and are

not tested.

Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and

switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current

consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD, MCL R = VDD; WDT enabled/disabled

as specified.

3: The power-down current in SLEEP mode does not depend on the osc illator type. Power-down curren t is measured with

the part in SLE EP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.

4: For RC OSC configuration, current through REXT is not included. The current through the resistor can be estimated by the

formula Ir = VDD/2REXT (mA) with REXT in k Ω.

5: The ∆ current is the additional curr ent consumed when this peripheral is enabled. This current should be adde d to the

base IDD or IPD measurement.

6: Commercial temperature range only.

7: See Table 3 and Table 4 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 MHz for valid modified

characteristics.

8: See Table 5 and Table 6 for 16CE62X devices for operation between 20 MHz and 30 MHz for valid modified characteristics.

PIC16C62X

DS80101D-page 14  2004 Microchip Technology Inc.

TABLE 2: DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(4) (Commercial)

PIC16CR620A-40(4) (Commercial)

PIC16CE62X-30(5) (Commercial)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature –40°C≤ TA ≤ +85°C for industrial and

0°C ≤ TA ≤ +70°C for commercial and

–40°C≤ TA ≤ +125°C for extended

Parm

No. Sym Characteristic Min Typ† Max Unit Conditions

VIL Input Low Voltage

I/O ports

D030 with TTL buff er VSS –0.8V

0.15VDD VVDD = 4.5V to 5.5V, otherwise

D031 with Schmitt Trigger input VSS 0.2VDD V

D032 MCLR, RA4/T0CKI, OSC1

(in RC mode) VSS –0.2VDD V(Note 1)

D033 OSC1 (in XT and HS)

OSC1 (in LP) VSS

VSS –

–0.3VDD

0.6VDD - 1.0 V

VIH Input High Voltage

I/O ports

D040 with TTL buff er 2.0V

.25 VDD + 0.8 –V

VDD VVDD = 4.5V to 5.5V, otherwise

D041 with Schmitt Trigger input 0.8VDD VDD

D042 MCLR RA4/T0CKI 0.8VDD –VDD V

D043

D043A OSC1 (XT, HS and LP)

OSC1 (in RC mode) 0.7VDD

0.9VDD –VDD V(Note 1)

D070 IPURB PORTB Weak Pull-up Current 50 200 400 µAVDD = 5.0V, VPIN = VSS

IIL Input Leakage Current

(Notes 2, 3)

I/O ports (except PORTA) ±1.0 µAV

SS ≤ VPIN ≤ VDD, pin at hi-impedance

D060 PORTA – – ±0.5 µA Vss ≤ VPIN ≤ VDD, pin at hi-impedance

D061 RA4/T0CKI – – ±1.0 µA Vss ≤ VPIN ≤ VDD

D063 OSC1, MCLR ––±5.0 µA Vss ≤ VPIN ≤ VDD, XT, HS and LP OSC

configuration

VOL Output Low Voltage

D080 I/O ports – – 0.6 V IOL=8.5 mA, VDD=4.5 V, -40 ° to + 8 5 °C

––0.6VI

OL=7.0 mA, VDD=4.5V, +125 °C

D083 OSC2/CLKOUT (RC only) – – 0.6 V IOL=1.6 mA, VDD=4.5 V, -40 ° to + 8 5 °C

––0.6VI

OL=1.2 mA, VDD=4.5V, +125 °C

VOH Output High Voltage (Note 3)

D090 I/O ports (except RA4) VDD-0.7 – – V IOH=-3.0 mA, VDD=4 .5 V, -40° to +8 5 °C

VDD-0.7 – – V IOH=-2.5 mA, VDD= 4 .5 V, +125 °C

D092 OSC2/CLKOUT (RC only) VDD-0.7 – – V IOH=-1.3 mA, VDD= 4 .5 V, -40 ° to + 8 5 °C

VDD-0.7 – – V IOH=-1.0 mA, VDD= 4 .5 V, +125 °C

*D150 VOD Open Drain High Volt age 8.5 V RA4 pin

* These parameters are characterized but not tested.

† Data in “Typ” column is at 5.0V, 25°C unles s ot he rw ise st ated. Thes e paramet ers are fo r de sig n g uid an ce on l y and are no t te ste d.

Note 1: In RC oscillator configuration, the OSC1 pin is a Schmitt Tr igger input. It is not recommended that the PIC16CE62X be driven

with external clock in RC mode.

2: The leakage current on the MCLR pin is strongly dependent on applied voltage level. The sp ecified levels represent normal

operating conditions. Higher leakage current may be measured at different input voltages.

3: Negative current is defined as coming out of the pin.

4: See Table 3 and Table 4 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 M Hz for valid

modified characteristics.

5: See Table 5 and Table 6 for 16CE62X devices for operation be tween 20 MH z and 30 MHz for valid modified characteristics.

 2004 Microchip Technology Inc. DS80101D-page 15

PIC16C62X

Capacitive Loading Specs on

Output Pins

D100 COSC2 OSC2 pin 15 pF In XT, HS and LP modes when external

clock used to drive OSC1.

D101 CIO All I/O pins/OSC2 (in RC mode) 50 pF

TABLE 2: DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(4) (Commercial)

PIC16CR620A-40(4) (Commercial)

PIC16CE62X-30(5) (Commercial)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature –40°C≤ TA ≤ +85°C for industrial and

0°C ≤ TA ≤ +70°C for commercial and

–40°C≤ TA ≤ +125°C for extended

Parm

No. Sym Characteristic Min Typ† Max Unit Conditions

* These parameters are characterized but not tested.

† Data in “Typ” column is at 5.0V, 25°C unles s ot he rw ise st ated. Thes e paramet ers are fo r de sig n g uid an ce on l y and are no t te ste d.

Note 1: In RC oscillator configuration, the OSC1 pin is a Schmitt Trigger input. It is not recommended that the PIC16CE6 2X be driven

with external clock in RC mode.

2: The leakage current on the MCLR pin is strongly dependent on applied voltage level. The sp ecified levels represent normal

operating conditions. Higher leakage current may be measured at different input voltages.

3: Negative current is defined as coming out of the pin.

4: See Table 3 and Table 4 for 16C62X and 16CR62X devices for operation b etween 20 MHz and 40 MHz for valid

modified characteristics.

5: See Table 5 and Table 6 for 16CE62X devices for operation be tween 20 MH z and 30 MHz for valid modified characteristics.

PIC16C62X

DS80101D-page 16  2004 Microchip Technology Inc.

TABLE 3: DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(3) (Commercial)

PIC16CR620A-40(3) (Commercial)

3. Module: Electrical Specifications

Tables 4, 5, and 6 have been added.

TABLE 4: AC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(2) (Commercial)

PIC16CR620A-40(2) (Commercial)

DC Character ist ics

Power Supply Pins Standard Operating Conditions (unless otherwise specified)

Operating Temperature 0°C ≤ TA ≤ +70°C (commercial)

Characteristic Sym Min Typ(1) Max Units Conditions

Supply Voltage VDD 4.5 — 5.5 V HS Optio n from 20 - 40 MHz

Supply Current(2) IDD —

—5.5

7.7 11.5

16 mA

mA FOSC = 40 MHz, VDD = 4.5V, HS mode

FOSC = 40 MHz, VDD = 5.5V, HS mode

HS Oscillator Operating

Frequency FOSC 20 — 40 MHz OSC1 pin is externally driven,

OSC2 pin not connected

Input Low Voltage OSC1 VIL VSS —0.2VDD V HS mode, OSC1 externall y driven

Input High Vo ltage OSC1 VIH 0.8VDD —VDD V HS mo de, OSC1 externally driven

* These parameters are characterized but not tested.

Note 1: Data in th e Typical (“Typ”) column is based on characterization results at 25°C. This data is for design

guidance only and is not tested.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus

loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on

the current cons ump tio n.

a) The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS,

T0CKI = VDD, MCLR = VDD; WDT disabled, HS mode with OSC2 not connected.

3: For device operation between DC and 20 MHz, see Table 1 and Table 2.

DC Character ist ics

All Pins Except Power Supply Pins Standard Operating Conditions (unless otherwise specified)

Operating Temperature 0°C ≤ TA ≤ +70°C (commercial)

Characteristic Sym Min Typ(1) Max Units Conditions

External CLKIN Frequency FOSC 20 — 40 MHz HS mode, OSC1 externally driven

External CLKIN Period TOSC 25 — 50 ns HS mode (40),OSC1 externally driven

Clock in (OSC1) Low or High Time TOSL, TOSH 6 — — ns HS mode,OSC1 externally driven

Clock in (OSC1) Rise or Fall Time TOSR, TOSF — — 6.5 ns HS mode, OSC1 externally driven

OSC1↑ (Q1 cycle) to Port out valid TOSH2IOV— —100ns—

OSC1↑ (Q2 cycle) to Port input

invalid (I/O in hold time) TOSH2IOI50 — —ns—

Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design

guidance only and are not tested.

2: For device operation between DC and 20 MHz, see Table 1 and Table 2.

 2004 Microchip Technology Inc. DS80101D-page 17

PIC16C62X

TABLE 5: DC CHARACTERISTICS: PIC16CE623A/CE624/CE625-30(3) (Commercial)

TABLE 6: AC CHARACTERISTICS: PIC16CE623/CE624/CE625-30(2) (Commercial)

DC Character ist ics

Power Supply Pins Standard Operating Conditions (unless otherwise specified)

Operating Temperature 0°C ≤ TA ≤ +70°C (commercial)

Characteristic Sym Min Typ(1) Max Units Conditions

Supply Voltage VDD 4.5 — 5.5 V HS option from 20 - 30 MHz

Supply Current(2) IDD —

—4.4

5.8 9.1

12.0 mA

mA FOSC = 30 MHz, VDD = 4.5V, HS mode

FOSC = 30 MHz, VDD = 5.5V, HS mode

HS Oscillator Operating

Frequency FOSC 20 — 30 MHz OSC1 pin is externally driven,

OSC2 pin not connected

Input Low Voltage OSC1 VIL VSS —0.2VDD V HS mode, OSC1 externall y driven

Input High Vo ltage OSC1 VIH 0.8VDD —VDD V HS mo de, OSC1 externally driven

* These parameters are characterized but not tested.

Note 1: Data in th e Typical (“Typ”) column is based on characterization results at 25°C. This data is for design

guidance only and is not tested.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus

loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on

the current cons ump tio n .

a) The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS,

T0CKI = VDD, MCLR = VDD; WDT disabled, HS mode with OSC2 not connected.

3: For device operation between DC and 20 MHz, see Table 1 and Table 2.

DC Character ist ics

All Pins Except Power Supply Pins Standard Operating Conditions (unless otherwise specified)

Operating Temperature 0°C ≤ TA ≤ +70°C (commercial)

Characteristic Sym Min Typ(1) Max Units Conditions

External CLKIN Frequency FOSC 20 — 30 MHz HS mode, OSC1 externally driven

External CLKIN Period TOSC 33 — 5 0 ns HS mode (30), OSC1 externally driven

Clock in (OSC1) Low or High Time TOSL, TOSH 6 — — ns HS mode, OSC1 externally driven

Clock in (OSC1) Rise or Fall Time TOSR, TOSF — — 10.5 ns HS mode, OSC1 externally driven

OSC1↑ (Q1 cycle) to Port out valid TOSH2IOV — — 132 ns —

OSC1↑ (Q2 cycle) to Port input

invalid (I/O in hold time) TOSH2IOI66 — —ns—

Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design

guidance only and are not tested.

2: For device operation between DC and 20 MHz, see Table 1 and Table 2.

PIC16C62X

DS80101D-page 18  2004 Microchip Technology Inc.

4. RC Oscillator

In the RC Oscillator, Section 9.2.4., page 48, the text

and figure should be as follows:

For applications where precise timing is not a

requirement, the RC oscillator option is available.

The opera tion and f unctionality of the RC oscil lator

is depe ndent upon a nu mb er o f variables. T he RC

oscillator frequency is a function of:

• Supply voltage

•Resistor (R

EXT) and capacitor (CEXT) values

• Operating temperature.

The oscillator frequency will vary from unit to unit

due to normal process parameter variation. The

difference in lead frame capacitance between

package types will also affect the oscillation fre-

quency, especially for low CEXT values. The user

also needs to account for the tolerance of the

external R and C components. Figure 9-5 shows

how the R/C combination is connected.

Two options are available for this oscillator mode

which allow RA4 to be used as a general purpose

I/O or to output FOSC/4.

FIGU RE 9- 5 : R C OS CI LLATOR MO D E

RA4/OSC2/CLKOUT

CEXT

VDD

REXT

VSS

PIC16C62X

RA5/OSC1/

FOSC/4 or I/ O

Internal

Clock

CLKIN

 2004 Microchip Technology Inc. DS80101D-page 19

PIC16C62X

APPENDIX A: REVISION HISTORY

Rev A Document (3/2001)

First revision of this document.

Rev B Document (5/2001)

Under Clarifications/Corrections to the Data Sheets,

Figures 1 through 5 were added (pages 3 through 7).

Changes were made to Tables 1, 2, and 3 (pages 8

through 11).

Table 4, 5 and 6 were added (pages 11 and 12).

Rev C Document (10/2001)

Under Clarifications/Corrections to the Data Sheets,

Item 2, Table 1, Parameter number D005, under the

“Min” column, “3.7” was changed to “3.65” (page 12).

Rev D Document (04/2004)

Under Clarifications/Corrections to the Data Sheets,

Added Module 4: Corrections to Figure 9-5: RC

Oscillator Mode diagram.

Obsoleted DS80065B PIC16C62XA Rev. A Silicion

Errata and incorporated into this document.

PIC16C62X

DS80101D-page 20  2004 Microchip Technology Inc.

NOTES:

 2004 Microchip Technology Inc. DS80101D-page 21

Information contained in this publication regarding device

applications and the like is intended through sug gestion only

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

No representation or warranty is given and no liability is

assumed by Microc hip Technology Inc orporated with respect

to the accuracy or use of such inf orm ation, or inf ringement of

patents or other intellectual property rights arising from such

use or otherwise. Use of Microchip’s products as critical

components in life support systems is not authorized except

with express written approval by Microchip. No licenses are

conveyed, implicitly or otherwise, under any intellectual

property rights.

Trademarks

The Microchip name and logo, the Microchip logo, A ccur on,

dsPIC, KEELOQ, MPLAB, PIC, PI C m ic ro, PI C STA RT,

PRO MAT E, Pow e rSm art and rfPIC are registered

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

AmpLab, FilterLab, microID, MXDE V, MXLAB, PICMAS TER,

SEEVAL, SmartShunt and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Application Maestro, dsPICDEM, dsPICDE M. net,

dsPICwo rks, ECAN, ECONOMONIT OR, Fa n Sense,

FlexROM, fuzzyLAB , In-C ircuit Serial Programm ing, ICSP,

ICEPIC, Migratable Memory, MPASM, MPLIB, MPLIN K,

MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal,

PowerInfo, PowerMate , PowerTool, rfLAB, Select Mode,

SmartSensor , SmartTel and Total Endurance are trademarks

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Serialized Quick Turn Programming (SQTP) is a service mark

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All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data

Sheets. Most likely, the person doing so is engaged in theft of intellec tual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously impro ving the cod e protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Mic ro chi p re cei v e d IS O/T S - 16 949 : 20 02 qu ality syst e m c ert i f ic at io n f or

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and T empe, Arizona and Mountain View, California in October

2003. The Company’s quality system processes and procedur es are for

its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial

EEPROMs, microperipherals, nonvolatile memory and analog

products. In addition, Microchip’s quality system for the design and

manufacture of development systems is ISO 9001:2000 certified.

DS80101D-page 22  2004 Microchip Technology Inc.

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