1
Product Family Data Sheet Rev. 2.4 2018. 10.1
High Voltage LED Series
Chip on Board
LC026D – Gen.1
High efficacy COB LED package
well-suited for use in spotlight applications
Featur
es & Benefits
Chip on Board (COB) solution makes it easy to design in
Simple assembly reduces manufacturing cost
Low thermal resistance
InGaN/GaN MQW LED with long time reliability
Applications
Spotlight / Downlight
LED Retrofit Bulbs
Outdoor Illumination
2
Table of Contents
1.
Characteristics
-----------------------
3
2.
Product Code Information
-----------------------
5
3.
Typical Characteristics Graphs
-----------------------
9
4.
Outline Drawing & Dimension
-----------------------
12
5.
Reliability Test Items & Conditions
-----------------------
13
6.
Label Structure
-----------------------
14
7.
Packing Structure
-----------------------
15
8.
Precautions in Handling & Use
-----------------------
17
3
1. Characteristics
a) Absolute Maximum Rating
Item
Symbol
Rating
Condition
Ambient / Operating Temperature
Ta
-40 ~ +105
-
Storage Temperature
Tstg
-40 ~ +120
-
LED Junction Temperature
TJ
140
-
Case Temperature
Tc
105
Forward Current
IF
1840
-
Power Dissipation
PD
69
-
ESD (HBM)
-
±2
-
ESD (MM)
-
±0.5
-
b) Electro-optical Characteristics (IF = 720 mA, TJ = 85 ºC)
Item
Unit
Rank
Min.
Typ.
Max.
Forward Voltage (VF)
V
YZ
31.8
34.6
37.5
Color Rendering Index (Ra)
-
5
80
-
-
7
90
Thermal Resistance (junction to chip point)
ºC/W
-
1.0
-
Beam Angle
º
-
115
-
Nominal Power
W
24.9
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = Ta = 85 °C)
2) Samsung maintains measurement tolerance of: forward voltage = ±5 %, CRI = ±1
3) Refer to the derating curve, ‘3. Typical Characteristics Graph’ designed within the range.
4
c) Luminous Flux Characteristics (IF = 720 mA)
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux @ Tc = 85 °C (lm)
Min.
Typ.
Max.
80
2700
K0
3064
3225
-
D1
3225
3386
-
3000
K2
3220
3389
-
D1
3389
3558
-
3500
K3
3314
3488
-
D1
3488
3663
-
4000
K3
3380
3558
-
D1
3558
3736
-
5000
K4
3409
3588
-
D1
3588
3767
-
5700
K4
3409
3588
-
D1
3588
3767
-
6500
K3
3380
3558
-
D1
3558
3736
-
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux @ Tc = 85 °C (lm)
Min.
Typ.
Max.
90
2700
J6
2622
2760
-
D1
2760
2898
-
3000
J7
2758
2903
-
D1
2903
3048
-
3500
J8
2840
2990
-
D1
2990
3139
-
4000
J8
2899
3051
-
D1
3051
3204
-
5000
J8
2923
3077
-
D1
3077
3231
-
Notes:
1) The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature
(TJ = TC = 85 °C).
2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1
5
2. Product Code Information
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
S
P
H
W
H
A
H
D
N
G
2
5
Y
Z
W
3
K
0
Digit
PKG Information
Code
Specification
1 2 3
Samsung Package High Power
SPH
4 5
Color
WH
White
6
Product Version
A
7 8
Form Factor
HD
COB
9
Lens Type
N
No lens
10
Wattage or Model
G
LC026D
11
Internal Code
2
12
CRI & Sorting Temperature
5
Min. 80 (85℃)
7
Min. 90 (85℃)
13 14
Forward Voltage (V)
YZ
31.8~37.5
15
CCT (K)
W
2700K
V
3000K
U
3500K
T
4000K
R
5000K
Q
5700K
P
6500K
16
MacAdam Step
2
MacAdam 2-step
3
MacAdam 3-step
17 18
Luminous Flux
J6
Min. 2600
J7
Min. 2700
J8
Min. 2800
K0
Min. 3000
K2
Min.3200
K3
Min. 3300
K4
D1
Min. 3400
Add rank
6
a) Binning Structure (IF = 720 mA, TJ = 85 ºC)
CRI (Ra)
Min.
Nominal
CCT (K)
Product Code
VF
Rank
Color
Rank
Flux
Rank
Flux Range
(Φv, lm)
80
2700
SPHWHAHDNG25YZW2K0
YZ
W2
K0
3064 ~
SPHWHAHDNG25YZW3K0
W3
SPHWHAHDNG25YZW2D1
W2
D1
3225 ~
SPHWHAHDNG25YZW3D1
W3
3000
SPHWHAHDNG25YZV2K2
YZ
V2
K2
3220 ~
SPHWHAHDNG25YZV3K2
V3
SPHWHAHDNG25YZV2D1
V2
D1
3389~
SPHWHAHDNG25YZV3D1
V3
3500
SPHWHAHDNG25YZU2K3
YZ
U2
K3
3314 ~
SPHWHAHDNG25YZU3K3
U3
SPHWHAHDNG25YZU2D1
U2
D1
3488 ~
SPHWHAHDNG25YZU3D1
U3
4000
SPHWHAHDNG25YZT2K3
YZ
T2
K3
3380 ~
SPHWHAHDNG25YZT3K3
T3
SPHWHAHDNG25YZT2D1
T2
D1
3588 ~
SPHWHAHDNG25YZT3D1
T3
5000
SPHWHAHDNG25YZR3K4
YZ
R3
K4
3409 ~
SPHWHAHDNG25YZR3D1
D1
3588 ~
5700
SPHWHAHDNG25YZQ3K4
YZ
Q3
K4
3409 ~
SPHWHAHDNG25YZQ3D1
D1
3588 ~
6500
SPHWHAHDNG25YZP3K3
YZ
P3
K3
3380 ~
SPHWHAHDNG25YZP3D1
D1
3558 ~
7
CRI (Ra)
Min.
Nominal
CCT (K)
Product Code
VF
Rank
Color
Rank
Flux
Rank
Flux Range
(Φv, lm)
90
2700
SPHWHAHDNG27YZW2J6
YZ
W2
J6
2622 ~
SPHWHAHDNG27YZW3J6
W3
SPHWHAHDNG27YZW2D1
W2
D1
2760 ~
SPHWHAHDNG27YZW3D1
W3
3000
`
SPHWHAHDNG27YZV2J7
YZ
V2
J7
2758 ~
SPHWHAHDNG27YZV3J7
V3
SPHWHAHDNG27YZV2D1
V2
D1
2903 ~
SPHWHAHDNG27YZV3D1
V3
3500
SPHWHAHDNG27YZU2J8
YZ
U2
J8
2840 ~
SPHWHAHDNG27YZU3J8
U3
SPHWHAHDNG27YZU2D1
U2
D1
2990 ~
SPHWHAHDNG27YZU3D1
U3
4000
SPHWHAHDNG27YZT2J8
YZ
T2
J8
2899 ~
SPHWHAHDNG27YZT3J8
T3
SPHWHAHDNG27YZT2D1
T2
D1
3051 ~
SPHWHAHDNG27YZT3D1
T3
5000
SPHWHAHDNG27YZR3J8
YZ
R3
J8
2923 ~
SPHWHAHDNG27YZR3D1
R3
D1
3077 ~
8
b) Chromaticity Region & Coordinates (IF = 720 mA, TJ = 85 ºC)
MacAdam Ellipse (W2, W3)
MacAdam Ellipse (V2, V3)
Step
CIE x
CIE y
a
b
Step
CIE x
CIE y
a
b
2-step
0.4578
0.4101
53.70
0.0054
0.0028
2-step
0.4338
0.403
53.22
0.0056
0.0027
3-step
0.4578
0.4101
53.70
0.0081
0.0042
3-step
0.4338
0.4030
53.22
0.0083
0.0041
MacAdam Ellipse (U2, U3)
MacAdam Ellipse (T2, T3)
Step
CIE x
CIE y
a
b
Step
CIE x
CIE y
a
b
2-step
0.4073
0.3917
54.00
0.0062
0.0028
2-step
0.3818
0.3797
53.72
0.0063
0.0027
3-step
0.4073
0.3917
54.00
0.0093
0.0041
3-step
0.3818
0.3797
53.72
0.0094
0.0040
MacAdam Ellipse (R3)
MacAdam Ellipse (Q3)
Step
CIE x
CIE y
a
b
Step
CIE x
CIE y
a
b
3-step
0.3447
0.3553
59.62
0.0082
0.0035
3-step
0.3287
0.3417
59.0950
0.0075
0.0032
MacAdam Ellipse (P3)
Step
CIE x
CIE y
a
b
3-step
0.3123
0.3282
58.5700
0.0067
0.0029
Note:
Samsung maintains measurement tolerance of: Cx, Cy = ±0.005
CIE x,y
9
3. Typical Characteristics Graphs
a) Spectrum Distribution (IF = 720 mA, TJ = 85 ºC)
CCT: 2700 K (80 CRI) CCT: 3000 K (80 CRI)
CCT: 3500 K (80 CRI) CCT: 4000 K (80 CRI)
CCT: 5000 K (80 CRI) CCT: 5700 K (80 CRI)
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength(nm)
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
10
CCT: 6500 K (80 CRI)
b) Forward Current Characteristics (TJ = 85 ºC)
C) Temperature Characteristics (IF = 720mA)
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
50
100
150
200
250
0 0.3 0.6 0.9 1.2 1.5 1.8
Relative Luminous Flux(%)
Forward Current(A)
Relative luminous Flux vs. Forward Current
30
32
34
36
38
40
0 0.3 0.6 0.9 1.2 1.5 1.8
Forward Voltage(%)
Forward Current(A)
Forward Voltage vs. Forward Current
90
95
100
105
110
115
120
20 35 50 65 80 95 110
Relative Luminous Flux(%)
Tc(℃)
Relative Luminous Flux vs. Temperature
34.0
34.5
35.0
35.5
36.0
20 40 60 80 100
Forward Voltage(V)
Tc(℃)
Forward Voltage vs. Temperature
11
d) Color Shift Characteristics (TJ = 85 ºC, IF = 720mA, CRI80+)
e) Beam Angle Characteristics (IF = 720 mA, TJ = 85 ºC)
f) Derating Characteristics
-0.05
-0.04
-0.03
-0.02
-0.01
0
0.00 0.30 0.60 0.90 1.20 1.50 1.80
△CIE x,△ CIE y
Forward Current(A)
△CIE x,△CIE y vs. Forward Current
△CIE x
△ CIE y
-0.05
-0.04
-0.03
-0.02
-0.01
0
20 40 60 80 100
△CIE x,△ CIE y
Tc(℃)
△CIEx,△CIEy vs. Temperature
ΔCIE x
ΔCIE y
0
0.2
0.4
0.6
0.8
1
1.2
-100 -80 -60 -40 -20 0 20 40 60 80 100
Relative Luminous Intensity
Angle(°)
0
500
1000
1500
2000
020 40 60 80 100 120
If [ mA ]
Tc [ ℃ ]
Derating Curve
12
4. Outline Drawing & Dimension
Item
Dimension
Tolerance
Unit
Length
19.0
±0.15
mm
Width
19.0
±0.15
mm
Height
1.50
±0.30
mm
Light Emitting Surface (LES) Diameter
14.5
±0.30
mm
Note: Denoted product information above is only an example
( LC026D18030 : LC026D, CRI80+, 3000K )
1. Unit: mm
2. Tolerance: ± 0.3 mm
TC
XXX.....XXXX
LOT No.
SAMSUNG
Model
Description
LC026D18030
Internal Code
13
5. Reliability Test Items & Conditions
a) Test Items
Test Item
Test Condition
Test Hour / Cycle
High Temperature
Humidity Life Test
60 ºC, 90 % RH,, DC Derating, IF
1000 h
High Temperature
Life Test
85 ºC, DC Derating, IF
1000 h
Low Temperature
Life Test
-40 ºC, DC , IF = 1290 mA
1000 h
Pulsed Operating Life Test
55 ℃, Pulse width 100 ㎲, duty cycle 3 %
1000 h
High Temperature
Storage
120 ºC
1000 h
Low Temperature
Storage
-40 ºC
1000 h
Temperature Humidity
Storage
60 ºC, 90% RH
1000h
Thermal Cycle
-45 ºC / 15 min ↔ 125 ºC / 15 min
temperature change in 5 min
500 cycles
Temperature Cycle
On/Off Test
-40 ºC / 85 ºC each 20 min, 30 min transfer
power on/off each 5 min, DC Derating, IF = max
100 cycles
ESD (HBM)
R1: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
V: ±2 kV
5 times
ESD (MM)
R1: 10 MΩ
R2: 0 kΩ
C: 200 pF
V: ±0.2 kV
5 times
Vibration Test
20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
min. frequency ↔ max. frequency 4 min transfer
4 times
Mechanical Shock Test
1500 g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides)
5 times
Sulfur Resistance
25 °C, 75%, H2S 15 ppm
504h
b) Criteria for Judging the Damage
Item
Symbol
Test Condition
(Tc = 25 ºC)
Limit
Min.
Max.
Forward Voltage
VF
IF = 720 mA
L.S.L. * 0.9
U.S.L. * 1.1
Luminous Flux
Φv
IF = 720 mA
L.S.L * 0.7
U.S.L * 1.3
14
Bin Code
Lot Number
Product Code
YZW3K0
SPHWHAHDNG25YZW3K0 YZW3K0 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
G4AZC4001 / 1001 / xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
YZW3K0
SPHWHAHDNG25YZW3K0 YZW3K0 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑨
/1ⓐⓑⓒ/ xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
6. Label Structure
a) Label Structure
Note: Denoted bin code and product code above is only an example (see description on page 5)
Bin Code:
ⓐⓑ: Forward Voltage bin (refer to page 11)
ⓒⓓ: Chromaticity bin (refer to page 9-10)
ⓔⓕ: Luminous Flux bin (refer to page 6)
b) Lot Number
The lot number is composed of the following characters:
① ③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / xxxx pcs
①
: Production site (S: Giheung, Korea, G: Tianjin, China)
②
: 4 (LED)
③
: Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
④
: Year (Z: 2015, A: 2016, B: 2017…)
⑤
: Month (1~9, A, B, C)
⑥⑦⑧⑨
: Day (1~9, A, B~V)
ⓐⓑⓒ
: Product serial number (001 ~ 999)
ⓐⓑⓒⓓⓔⓕ
LC026D RA80 2700K
LC026D RA80 2700K
15
7. Packing Structure
Packing material
Max. quantity
in pcs of COB
Dimension(mm)
Length
Width
Height
Tolerance
Tray
20
160
180
10
1.0
Aluminum Bag
40(2 trays)
210
241
10
Inner Box
160
230
84
260
2
Outer Box
1600
476
445
272
5
a) Packing Structure
Label
Label
16
b) Tray
① Cover ② Body
c) Aluminum Vinyl Packing Bag
17
8. Precautions in Handling & Use
1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA
is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at
temperature 0~40 ºC, 0~90 % RH).
3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may
cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as
increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8) The thermal management is one of the most critical factors for the LED lighting system. Especially the LED junction
temperature should not exceed the absolute maximum rating while operation of LED lighting system.
For more information, please refer to Application Note ‘Mechanical & Thermal Guide for COB’.
9) In case of driving LEDs around the minimum current level (If_min), chips might exhibit different brightness due to the
variation in I-V characteristics of each one. This is normal and does not adversely affect the performance of product.
10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
11) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
Legal and additional information.
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Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved.
Samsung is a registered trademark of Samsung Electronics Co., Ltd.
Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand,
product, service names and logos are trademarks and/or registered trademarks
of their respective owners and are hereby recognized and acknowledged.
Samsung Electronics Co., Ltd.
95, Samsung 2-ro
Giheung-gu
Yongin-si, Gyeonggi-do, 446-711
KOREA
www.samsungled.com