VOLTAGE Electrical characteristics at 25C unless otherwise specified. NOMINAL | ZENER MAXIMUM MAXIMUM TYPICAL REG U LAT R MICROSEMI ZENER | TEST ZENER IMPEDANCE REVERSE TEMP. COEFF. TYPE NO. VOLTAGE | CURRENT (Note 3) CURRENT OF (Note 1&5) | Vz @ ber ler Tk @ Ve ZENER VOLTAGE PLAN AR (Note 2) tn @ tn Zn @ tn Note 4) NZ VOLTS mA OHMS | OHMS | mA uA | VOLTS %/PC DIODE CHIPS CH4728 3.3 | 76 10 400 | 1.0 | 100 1 -.066 CH4729 3.6 | 69 10 400 | 1.0 | 100 1 -.058 CH4730 3.9 | 64 9 400 | 1.0 50 1 -.046 HIGH POWER CH4731 a3 | 58 9 goo} 10 | 10 | 4 -.033 . CH4732 4.71 53 8 500 | 1.0 10 1 -.015 3.3-100 VOLTS CH4733 5.1 | a9 7 550 | 1.0 10 1 #010 CHa734 5.6 | 45 5 600 | 1.0 10 2 +930 . . H4735 6.2 | 41 2 700 | 1.0 10 3 +.049 Frecericaly similar to CH4736 6.8 | 37 3.5 | 700 | 1.0 10 4 +.053 the JEDE CH4737 7.5) 34 4.0 700 | 0.5 10 5 +.057 1N4728 - 1N4764 CH4738 8.2 | 31 4.5 700 | 0.5 10 6 +.060 CH4739 9.1 | 28 5.0 700 | 0.5 10 7 +.061 CH4740 10 25 7 700 |} 0.25| 10 7.6 +.062 CH4741 11 23 8 700 | 0.25 5 8.4 +.060 CH4742 12 21 9 700 | 0.25 5 9.1 +.065 CH4743 13 19 10 700 | 0.25 5 9.9 +.065 CH4744 15 17 14 700 | 0.25 5 11.4 +.070 CH4745 16 15.5 16 700 | 0.25 5 12.2 +.070 CH4746 18 14 20 750 | 0.25 5 13.7 +.075 CH4747 20 12.5 22 750 | 0.25 5 15.2 +.075 CH4748 22 11.5 23 750 | 0.25 5 16.7 +.080 CH4749 24 10.5 25 750 | 0.25 5 18.2 +.080 CH4750 27 9.5 35 750 | 0.25 5 20.6 +.085 CH4751 30 8.5 40 1000 | 0.25 5 22.8 +.085 CH4752 33 7.5 45 1000 | 0.25 5 25.1 +.085 CH4753 36 7.0 50 1000 | 0.25 5 27.4 +.085 CH4754 39 6.5 60 1000 | 0.25 5 29.7 +.090 CH4755 43 6.0 70 1500 | 0.25 5 32.7 +.090 CH4756 47 5.5 80 1500 | 0.25 5 35.8 +.090 CH4757 51 5.0 95 1500 | 0.25 5 38.8 +,090 . . . CH4758 56 4.5 | 110 2000 | 0.25 5 42.6 +.090 Compatible with ultrasonic CH4759 62 4.0 | 125 2000 | 0.25 5 47.1 +.090 and thermocompression CH4760 68 3.7 150 2000 | 0.25 5 51.7 +.090 lead bonding, scrub and z anes aT : CH4761 75 3.3 | 175 2000 | 0.25 5 56.0 +.090 eutectic preform die bonding. CH4762 82 3.0 | 200 | 3000] 0.25 5 | 622 +090 CH4763 91 2.8 | 250 3000 | 0.25 5 69.2 +.090 Junction surfaces are CH4764 100 2.5 350 3000 | 0.25 5 76.0 +.090 protected from ambient environments by the Maximum forward voltage is 1.5 V at 200 mA. Microsemi TOP process. NOTE 1: All devices have a standard voltage tolerance of +5%. MAXIMUM RATINGS NOTE 2: V, is measured with the chip mounted on an infinite heat sink 20 seconds after the test current is applied. Operating junction and NOTE 3: Zener impedance is derived by superimposing on I,; or Iz, a 60 Hz rms a.c. storage temperature: 200C. current equal to 10% of 12; or Tex. : i i chip j i i ient light. Power rating: 1 Watt with NOTE 4: I, is measured with the chip junction shielded from ambien ig suitable heat sinking. NOTE 5: For ordering 28 mil size die add suffix -28, or for 37 mil die, -37 to type number. Depends on substrate and package used. 212