LITE-ON DCC
RELEASE
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
SMD LED
Product Data Sheet
LTST-C170AKT
Spec No.: DS-22-96-0291
Effective Date: 12/11/2004
Revision: C
BNS-OD-FC001/A4
BNS-OD-FC001/A4
BNS-OD-FC001/A4
BNS-OD-FC001/A4
Features
* Meet ROHS, Green Product.
* Package In 8mm Tape On 7" Diameter Reels.
* Compatible With Automatic Placement Equipment.
* Compatible With Infrared And Vapor Phase Reflow Solder Process.
* EIA STD package.
* I.C. compatible.
Package Dimensions
Part No.
Lens
Source Color
LTST-C170AKT
Water Clear
GaAsP on GaP Orange
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.
Part No. : LTST-C170AKT
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BNS-OD-C131/A4
Absolute Maximum Ratings At Ta=25℃
Parameter
LTST-C170AKT
Unit
Power Dissipation
100
mW
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
120
mA
DC Forward Current
30
mA
Derating Linear From 50°C
0.6
mA/°C
Reverse Voltage
5
V
Operating Temperature Range
-55°C to + 85°C
Storage Temperature Range
-55°C to + 85°C
Wave Soldering Condition
260°C For 5 Seconds
Infrared Soldering Condition
260°C For 5 Seconds
Vapor Phase Soldering Condition
215°C For 3 Minutes
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BNS-OD-C131/A4
Suggestion Profile:
(1) Suggestion IR Reflow Profile For Normal Process
(2) Suggestion IR Reflow Profile For Pb Free Process
R e c o m m en d e d P ro file B e tw e e n A s s e m b le A n d H e a t-R e sis ta n c e L in e
T h e P ro file is a v a ila b le tha t m us t to u s e S n A g C u s o ld e r p a s te
Part No. : LTST-C170AKT
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BNS-OD-C131/A4
Electrical Optical Characteristics At Ta=25℃
Parameter
Symbol
Part No.
LTST-
Min.
Typ.
Max.
Unit
Test Condition
Luminous Intensity
IV
C170AKT
1.12
2.5
mcd
IF = 10mA
Note 1
Viewing Angle
2θ1/2
C170AKT
130
deg
Note 2 (Fig.6)
Peak Emission Wavelength
λP
C170AKT
610
nm
Measurement
@Peak (Fig.1)
Dominant Wavelength
λd
C170AKT
602
nm
Note 3
Spectral Line Half-Width
Δλ
C170AKT
35
nm
Forward Voltage
VF
C170AKT
2.1
2.6
V
IF = 20mA
Reverse Current
IR
C170AKT
10
μA
VR = 5V
Capacitance
C
C170AKT
15
PF
VF = 0
f = 1MHZ
Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the
CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the
single wavelength which defines the color of the device.
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BNS-OD-C131/A4
Bin Code List
Part No. : LTST-C170AKT
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BNS-OD-C131/A4
Luminous Intensity Unit : mcd @10mA
Bin Code
Min.
Max.
F
1.12
1.80
G
1.80
2.80
H
2.80
4.50
J
4.50
7.10
K
7.10
11.2
Tolerance on each Intensity bin is +/-15%
Typical Electrical / Optical Characteristics Curves
(25 C Ambient Temperature Unless Otherwise Noted)
Part No. : LTST-C170AKT
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BNS-OD-C131/A4
Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package.
If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature for
less one minute.
Suggest Soldering Pad Dimensions
Package Dimensions Of Tape And Reel
Notes:
1. All dimensions are in millimeters (inches).
Part No. : LTST-C170AKT
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BNS-OD-C131/A4
Notes:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel-3000 pieces per reel.
3. Minimum packing quantity is 500 pcs for remainders.
4. The maximum number of consecutive missing lamps is two.
5. In accordance with ANSI/EIA 481-1-A-1994 specifications.
Part No. : LTST-C170AKT
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BNS-OD-C131/A4
Part No. : LTST-C170AKT
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BNS-OD-C131/A4
CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C
for at least 24 hours before solder assembly.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
4. Soldering
Recommended soldering conditions:
Reflow soldering
Wave Soldering
Soldering iron
Pre-heat
Pre-heat time
Peak temperature
Soldering time
120~150°C
120 sec. Max.
240°C Max.
10 sec. Max.
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.
Temperature
Soldering time
300°C Max.
3 sec. Max.
(one time only)
5. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be incorporated
in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A Circuit model B
LED
LED
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
6. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
All devices, equipment, and machinery must be properly grounded.
Work tables, storage racks, etc. should be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LED’s
plastic lens as a result of friction between LEDs during storage and handling.
Part No. : LTST-C170AKT
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BNS-OD-C131/A4
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward
voltage, or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.
7. Reliability Test
Classification
Test Item
Test Condition
Reference Standard
Endurance
Test
Operation Life
Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90～95%
*Test Time= 240HRS±2HRS
MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)
High Temperature
Storage
Ta= 105±5℃
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Low Temperature
Storage
Ta= -55±5℃
*Test Time=1000HRS (-24HRS,+72H RS)
JIS C 7021:B-12 (1982)
Environmental
Test
Temperature
Cycling
105℃ ～ 25℃ ～ -55℃ ～ 25℃
30mins 5mins 30mins 5mins
10 Cycles
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)
Thermal
Shock
IR-Reflow In-Board, 2 Times
85 ± 5℃ ～ -40℃ ± 5℃
10mins 10mins 10 Cycles
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Solder
Resistance
T.sol= 260 ± 5℃
Dwell Time= 10 ± 1secs
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021:A-1(1982)
IR-Reflow
Normal Process
Ramp-up rate(183℃ to Peak) +3℃/ second max
Temp. maintain at 125(±25)℃ 120 seconds max
Temp. maintain above 183℃ 60-150 seconds
Peak temperature range 235℃+5/-0℃
Time within 5°C of actual Peak Temperature (tp)
10-30 seconds
Ramp-down rate +6℃/second max
MIL-STD-750D:2031.2(1995)
J-STD-020(1999)
IR-Reflow
Pb Free Process
Ramp-up rate(217℃ to Peak) +3℃/ second max
Temp. maintain at 175(±25)℃ 180 seconds max
Temp. maintain above 217℃ 60-150 seconds
Peak temperature range 260℃+0/-5℃
Time within 5°C of actual Peak Temperature (tp)
20-40 seconds
Ramp-down rate +6℃/second max
MIL-STD-750D:2031.2(1995)
J-STD-020(1999)
Solderability
T.sol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Coverage ≧95% of the dipped surface
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
IEC 68 Part 2-20
JIS C 7021:A-2(1982)
8. Others
The appearance and specifications of the product may be modified for improvement without prior notice.