MJD47, NJVMJD47T4G, MJD50 High Voltage Power Transistors DPAK For Surface Mount Applications Designed for line operated audio output amplifier, switchmode supply drivers and other switching applications. Features Lead Formed for Surface Mount Applications in Plastic Sleeves (No Suffix) Electrically Similar to Popular TIP47, and TIP50 250 and 400 V (Min) - VCEO(sus) 1 A Rated Collector Current Epoxy Meets UL 94 V-0 @ 0.125 in ESD Ratings: Human Body Model, 3B > 8000 V Machine Model, C > 400 V NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable These are Pb-Free Packages* http://onsemi.com NPN SILICON POWER TRANSISTORS 1 AMPERE 250, 400 VOLTS, 15 WATTS DPAK CASE 369C STYLE 1 MARKING DIAGRAM AYWW JxxG MAXIMUM RATINGS Rating Symbol Collector-Emitter Voltage MJD47, NJVMJD47T4G MJD50 VCEO Collector-Base Voltage MJD47, NJVMJD47T4G MJD50 VCB Emitter-Base Voltage VEB Collector Current Continuous Peak IC Base Current IB Total Power Dissipation @ TC = 25C Derate above 25C PD Total Power Dissipation (Note 1) @ TA = 25C Derate above 25C PD Operating and Storage Junction Temperature Range TJ, Tstg Max Unit Vdc 250 400 A Y WW Jxx Vdc 350 500 5 G Vdc Adc 1 2 0.6 Adc 15 0.12 W W/C 1.56 0.0125 W W/C -65 to +150 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. These ratings are applicable when surface mounted on the minimum pad sizes recommended. = Assembly Location = Year = Work Week = Device Code xx = 47 or 50 = Pb-Free Package ORDERING INFORMATION Package Shipping MJD47G 369C (Pb-Free) 75 Units/Rail MJD47T4G 369C (Pb-Free) 2,500/Tape & Reel NJVMJD47T4G 369C (Pb-Free) 2,500/Tape & Reel MJD50G 369C (Pb-Free) 75 Units/Rail MJD50T4G 369C (Pb-Free) 2,500/Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 February, 2012 - Rev. 13 1 Publication Order Number: MJD47/D MJD47, NJVMJD47T4G, MJD50 THERMAL CHARACTERISTICS Symbol Max Unit Thermal Resistance Junction-to-Case Characteristic RqJC 8.33 C/W Thermal Resistance Junction-to-Ambient (Note 2) RqJA 80 C/W TL 260 C Lead Temperature for Soldering Purpose 2. These ratings are applicable when surface mounted on the minimum pad sizes recommended. IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIII IIII IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIII IIII IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII IIIIIIII IIIIIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIII IIII IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII IIIIIIII IIIIIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted) Characteristic Symbol Min Max 250 400 - Unit OFF CHARACTERISTICS Collector-Emitter Sustaining Voltage (Note 3) (IC = 30 mAdc, IB = 0) MJD47, NJVMJD47T4G MJD50 Collector Cutoff Current (VCE = 150 Vdc, IB = 0) (VCE = 300 Vdc, IB = 0) MJD47, NJVMJD47T4G MJD50 Collector Cutoff Current (VCE = 350 Vdc, VBE = 0) (VCE = 500 Vdc, VBE = 0) MJD47, NJVMJD47T4G MJD50 Emitter Cutoff Current (VBE = 5 Vdc, IC = 0) VCEO(sus) ICEO ICES IEBO - mAdc - 0.2 0.2 - - 0.1 0.1 - 1 30 10 150 - - 1 - 1.5 10 - 25 - - Vdc mAdc mAdc ON CHARACTERISTICS (Note 3) DC Current Gain (IC = 0.3 Adc, VCE = 10 Vdc) (IC = 1 Adc, VCE = 10 Vdc) hFE Collector-Emitter Saturation Voltage (IC = 1 Adc, IB = 0.2 Adc) VCE(sat) Base-Emitter On Voltage (IC = 1 Adc, VCE = 10 Vdc) VBE(on) - Vdc Vdc DYNAMIC CHARACTERISTICS Current Gain -- Bandwidth Product (IC = 0.2 Adc, VCE = 10 Vdc, f = 2 MHz) fT Small-Signal Current Gain (IC = 0.2 Adc, VCE = 10 Vdc, f = 1 kHz) hfe 3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%. http://onsemi.com 2 MHz - MJD47, NJVMJD47T4G, MJD50 TYPICAL CHARACTERISTICS PD, POWER DISSIPATION (WATTS) TA TC 2.5 25 2 20 Vin 0 VEB(off) 1.5 15 0 50 75 100 125 Figure 2. Switching Time Equivalent Circuit 1.4 VCE = 10 V 1.2 100 TJ = 150C V, VOLTAGE (VOLTS) hFE , DC CURRENT GAIN RB and RC VARIED TO OBTAIN DESIRED CURRENT LEVELS. TURN-OFF PULSE 200 60 40 DUTY CYCLE 2% APPROX -9 V t2 Figure 1. Power Derating 25C 20 -55C 10 1 VBE(sat) @ IC/IB = 5 0.8 VBE(on) @ VCE = 4 V 0.6 TJ = 25C 0.4 6 4 2 0.02 0.2 0.2 0.4 0.6 0.04 0.06 0.1 IC, COLLECTOR CURRENT (AMPS) 2 1 0 0.02 VCE(sat) @ IC/IB = 5 0.1 0.2 0.4 0.6 0.04 0.06 IC, COLLECTOR CURRENT (AMPS) Figure 3. DC Current Gain 1 0.7 0.5 Figure 4. "On" Voltages 0.1 RqJC(t) = r(t) RqJC RqJC = 8.33C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) qJC(t) 0.05 0.02 0.01 SINGLE PULSE 0.02 0.01 0.01 2 0.2 0.2 0.03 1 D = 0.5 0.3 0.1 0.07 0.05 -4 V t1 7 ns 10 < t2 < 500 ms t3 < 15 ns 150 T, TEMPERATURE (C) r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) Cjd << Ceb Vin 25 RB t1 APPROX +11 V 5 0 SCOPE Vin t3 TC 1 10 RC 51 TA (SURFACE MOUNT) 0.5 VCC TURN-ON PULSE APPROX +11 V 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1 2 3 5 t, TIME (ms) 10 Figure 5. Thermal Response http://onsemi.com 3 20 30 P(pk) t1 t2 DUTY CYCLE, D = t1/t2 50 100 200 300 500 1k MJD47, NJVMJD47T4G, MJD50 IC, COLLECTOR CURRENT (AMP) 5 2 1ms 1 500ms 0.5 There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate IC - VCE limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate. The data of Figure 6 is based on TJ(pk) = 150_C; TC is variable depending on conditions. Second breakdown pulse limits are valid for duty cycles to 10% provided TJ(pk) v 150_C. TJ(pk) may be calculated from the data in Figure 5. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown. 100ms dc TC 25C 0.2 0.1 SECOND BREAKDOWN LIMIT THERMAL LIMIT @ 25C WIRE BOND LIMIT MJD47 CURVES APPLY BELOW MJD50 RATED VCEO 0.05 0.02 0.01 0.005 5 10 20 50 100 200 300 VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS) 500 Figure 6. Active Region Safe Operating Area 5 1 TJ = 25C VCC = 200 V IC/IB = 5 ts 2 tr 0.2 1 t, TIME (s) t, TIME (s) 0.5 td 0.1 0.05 0.5 tf 0.2 0.1 0.02 0.01 0.02 TJ = 25C VCC = 200 V IC/IB = 5 0.05 0.1 0.2 0.5 IC, COLLECTOR CURRENT (AMPS) 1 0.05 0.02 2 Figure 7. Turn-On Time 0.05 0.1 0.2 0.5 IC, COLLECTOR CURRENT (AMPS) Figure 8. Turn-Off Time http://onsemi.com 4 1 2 MJD47, NJVMJD47T4G, MJD50 PACKAGE DIMENSIONS DPAK CASE 369C ISSUE D A E b3 c2 B Z D 1 L4 A 4 L3 b2 e 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. C H DETAIL A 3 c b 0.005 (0.13) M H C L2 GAUGE PLANE C L SEATING PLANE A1 L1 DETAIL A ROTATED 905 CW SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.101 5.80 0.228 INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 --- 0.040 0.155 --- MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 --- 1.01 3.93 --- STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR 3.0 0.118 1.6 0.063 DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z 6.172 0.243 SCALE 3:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5817-1050 http://onsemi.com 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MJD47/D