© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 8
1Publication Order Number:
MC74AC05/D
MC74AC05, MC74ACT05
Hex Inverter with
Open−Drain Outputs
The MC74AC/ACT05 is identical in pinout to the LS05. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with TTL outputs.
Features
•Outputs Source/Sink 24 mA
•′ACT05 Has TTL Compatible Inputs
•Pb−Free Packages are Available
GND
Figure 1. Pinout: 14-Lead Packages
1314 12 11 10 9 8
21 34567
VCC A6Y6A5Y5A4Y4
A1Y1A2Y2A3Y3
Top View
Figure 2. Logic Diagram
Y*
2, 4, 6, 8, 10, 12
1, 3, 5, 9, 11, 13
A
PIN 14 = VCC
PIN 7 = GND
* DENOTES OPEN-DRAIN OUTPUTS
1
See general marking information in the device marking
section on page 6 of this data sheet.
DEVICE MARKING INFORMATION
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
TSSOP−14
DT SUFFIX
CASE 948G
1
SOEIAJ−14
M SUFFIX
CASE 965
SOIC−14
D SUFFIX
CASE 751A
1
1
PDIP−14
N SUFFIX
CASE 646
FUNCTION TABLE
Input A
L
H
Output Y
Z
L
NOTE: Z = High Impedance
MC74AC05, MC74ACT05
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2
MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V
Vin DC Input Voltage (Referenced to GND) −0.5 to VCC + 0.5 V
Vout DC Output Voltage (Referenced to GND) −0.5 to VCC + 0.5 V
Iin DC Input Current, per Pin ±20 mA
Iout DC Output Sink/Source Current, per Pin ±50 mA
ICC DC VCC or GND Current per Output Pin ±50 mA
Tstg Storage Temperature −65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Min Unit
VCC Supply Voltage
′AC 2.0 5.0 6.0
V
′ACT 4.5 5.0 5.5
VREG DC Regulated Power Voltage (Ref. to GND) 0−VCC V
tr, tf
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
VCC @ 3.0 V −150 −
VCC @ 4.5 V −40 −ns/V
VCC @ 5.5 V −25 −
tr, tf
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
VCC @ 4.5 V −10 −
ns/V
VCC @ 5.5 V −8.0 −
TJJunction Temperature (PDIP) − − 140 °C
TAOperating Ambient Temperature Range −40 25 85 °C
IOH Output Current − HIGH − − −24 mA
IOL Output Current − LOW − − 24 mA
1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
MC74AC05, MC74ACT05
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3
DC CHARACTERISTICS
Symbol Parameter VCC
(V)
74AC 74AC
Unit Conditions
TA = +25°C TA = −40°C to +85°C
Typ Guaranteed Limits
VIH Minimum High Level Input Voltage 3.0 1.5 2.1 2.1 VOUT = 0.1 V
4.5 2.25 3.15 3.15 V or VCC − 0.1 V
5.5 2.75 3.85 3.85
VIL Maximum Low Level Input Voltage 3.0 1.5 0.9 0.9 VOUT = 0.1 V
4.5 2.25 1.35 1.35 V or VCC − 0.1 V
5.5 2.75 1.65 1.65
VOL Maximum Low Level Output Voltage 3.0 0.002 0.1 0.1 IOUT = 50 mA
4.5 0.001 0.1 0.1 V
5.5 0.001 0.1 0.1
V
*VIN = VIL or VIH
3.0 −0.36 0.44 12 mA
4.5 −0.36 0.44 IOL 24 mA
5.5 −0.36 0.44 24 mA
IIN Maximum Input Leakage Current 5.5 −±0.1 ±1.0 mAVI = VCC, GND
IOLD †Minimum Dynamic
Output Current
5.5 − − 75 mA VOLD = 1.65 V Max
IOHD 5.5 − − −75 mA VOHD = 3.85 V Min
ICC Maximum Quiescent Supply Current 5.5 −4.0 40 mAVIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V.
AC CHARACTERISTICS
Symbol Parameter VCC*
(V)
74AC 74AC
Unit
TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF
Min Typ Max Min Max
tPZL Propagation Delay Output Enable 3.3 1.5 −8.0 1.0 9.0 ns
5.0 1.5 −6.0 1.0 6.5
tPLZ Propagation Delay Output Enable 3.3 1.5 −8.0 1.0 9.0 ns
5.0 1.5 −6.0 1.0 6.5
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
MC74AC05, MC74ACT05
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4
DC CHARACTERISTICS
Symbol Parameter VCC
(V)
74ACT 74ACT
Unit Conditions
TA = +25°C TA = −40°C to +85°C
Typ Guaranteed Limits
VIH Minimum High Level Input Voltage 4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0 VVOUT = 0.1 V
or VCC − 0.1 V
VIL Maximum Low Level Input Voltage 4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8 VVOUT = 0.1 V
or VCC − 0.1 V
VOL Maximum Low Level Output Voltage 4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1 VIOUT = 50 mA
4.5
5.5
−
−
0.36
0.36
0.44
0.44
0.44 *VIN = VIL or VIH
IOH 24 mA
IIN Maximum Input Leakage Current 5.5 −±0.1 ±1.0 mAVI = VCC, GND
DICCT Additional Max. ICC/Input 5.5 0.6 −1.5 mA VI = VCC −2.1 V
IOLD
IOHD
†Minimum Dynamic Output Current 5.5
5.5
−
−
−
−
75
−75
mA
mA
VOLD = 1.65 V Max
VOHD = 3.85 V Min
ICC Maximum Quiescent Supply Current 5.5 −4.0 40 mAVIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS
Symbol Parameter VCC*
(V)
74ACT 74ACT
Unit
TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF
Min Typ Max Min Max
tPZL Propagation Delay Output Enable 5.0 1.5 −8.0 1.0 8.5 ns
tPLZ Propagation Delay Output Enable 5.0 1.5 −8.5 1.0 9.0 ns
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol Parameter Value Typ Unit Test Conditions
CIN Input Capacitance 4.5 pF VCC = 5.0 V
CPD Power Dissipation Capacitance 30 pF VCC = 5.0 V
MC74AC05, MC74ACT05
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5
ORDERING INFORMATION
Device Package Shipping†
MC74AC05N PDIP−14
25 Units / Rail
MC74AC05NG PDIP−14
(Pb−Free)
MC74AC05D SOIC−14
55 Units / Rail
MC74AC05DG SOIC−14
(Pb−Free)
MC74AC05DR2 SOIC−14
2500 / Tape & Reel
MC74AC05DR2G SOIC−14
(Pb−Free)
MC74AC05MEL SOEIAJ−14
2000 / Tape & Reel
MC74AC05MELG SOEIAJ−14
(Pb−Free)
MC74ACT05N PDIP−14
25 Units / Rail
MC74ACT05NG PDIP−14
(Pb−Free)
MC74ACT05D SOIC−14
55 Units / Rail
MC74ACT05DG SOIC−14
(Pb−Free)
MC74ACT05DR2 SOIC−14
2500 / Tape & Reel
MC74ACT05DR2G SOIC−14
(Pb−Free)
MC74ACT05DTR2 TSSOP−14*
MC74ACT05DTR2G TSSOP−14*
MC74ACT05MEL SOEIAJ−14
2000 / Tape & Reel
MC74ACT05MELG SOEIAJ−14
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
MC74AC05, MC74ACT05
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6
MARKING DIAGRAMS
PDIP−14 SOIC−14 TSSOP−14 SOEIAJ−14
1
14
74ACT05
ALYWG
AC05G
AWLYWW
1
14
ACT
05
ALYWG
G
1
14
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G= Pb−Free Package
(Note: Microdot may be in either location)
ACT05G
AWLYWW
1
14
1
14
74AC05
ALYWG
MC74AC05N
AWLYYWWG
1
14
MC74ACT05N
AWLYYWWG
1
14
MC74AC05, MC74ACT05
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7
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE P
17
14 8
B
ADIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.715 0.770 18.16 19.56
B0.240 0.260 6.10 6.60
C0.145 0.185 3.69 4.69
D0.015 0.021 0.38 0.53
F0.040 0.070 1.02 1.78
G0.100 BSC 2.54 BSC
H0.052 0.095 1.32 2.41
J0.008 0.015 0.20 0.38
K0.115 0.135 2.92 3.43
L
M−−− 10 −−− 10
N0.015 0.039 0.38 1.01
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
F
HG D
K
C
SEATING
PLANE
N
−T−
14 PL
M
0.13 (0.005)
L
M
J
0.290 0.310 7.37 7.87
MC74AC05, MC74ACT05
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8
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
−B−
G
P7 PL
14 8
7
1
M
0.25 (0.010) B M
S
B
M
0.25 (0.010) A S
T
−T−
F
RX 45
SEATING
PLANE D14 PL K
C
J
M
_DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A8.55 8.75 0.337 0.344
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.228 0.244
R0.25 0.50 0.010 0.019
__ __
7.04
14X
0.58
14X
1.52
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
7X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC74AC05, MC74ACT05
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9
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
L−U−
SEATING
PLANE
0.10 (0.004)
−T−
ÇÇÇ
ÇÇÇ
ÇÇÇ
SECTION N−N
DETAIL E
J J1
K
K1
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
−W−
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
−V−
14X REFK
N
N
MC74AC05, MC74ACT05
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10
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE A
HE
A1
DIM MIN MAX MIN MAX
INCHES
−−− 2.05 −−− 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.10 0.20 0.004 0.008
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
−−− 1.42 −−− 0.056
A1
HE
Q1
LE
_10
_0
_10
_
LE
Q1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005) M0.10 (0.004)
D
Z
E
1
14 8
7
eA
b
VIEW P
c
L
DETAIL P
M
A
b
c
D
E
e
0.50
M
Z
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
MC74AC05/D
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