SN54HC138, SN74HC138
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DTargeted Specifically for High-Speed
Memory Decoders and Data-Transmission
Systems
DWide Operating Voltage Range of 2 V to 6 V
DOutputs Can Drive Up To 10 LSTTL Loads
DLow Power Consumption, 80-μA Max ICC
DTypical tpd = 15 ns
D±4-mA Output Drive at 5 V
DLow Input Current of 1 μA Max
DIncorporate Three Enable Inputs to Simplify
Cascading and/or Data Reception
description/ordering information
The ’HC138 devices are designed to be used in
high-performance memory-decoding or data-
routing applications requiring very short
propagation delay times. In high-performance
memory systems, these decoders can be used to
minimize the effects of system decoding. When
employed with high-speed memories utilizing a
fast enable circuit, the delay times of these
decoders and the enable time of the memory are
usually less than the typical access time of the
memory. This means that the effective system
delay introduced by the decoders is negligible.
ORDERING INFORMATION
TAPACKAGEORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP − N Tube of 25 SN74HC138N SN74HC138N
Tube of 40 SN74HC138D
SOIC − D Reel of 2500 SN74HC138DR HC138
SOIC
D
Reel of 250 SN74HC138DT
HC138
−40°C to 85°CSOP − NS Reel of 2000 SN74HC138NSR HC138
40 C
to
85 C
SSOP − DB Reel of 2000 SN74HC138DBR HC138
Tube of 90 SN74HC138PW
TSSOP − PW Reel of 2000 SN74HC138PWR HC138
TSSOP
PW
Reel of 250 SN74HC138PWT
HC138
CDIP − J Tube of 25 SNJ54HC138J SNJ54HC138J
−55°C to 125°CCFP − W Tube of 150 SNJ54HC138W SNJ54HC138W
55 C
to
125 C
LCCC − FK Tube of 55 SNJ54HC138FK SNJ54HC138FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
3212019
910111213
4
5
6
7
8
18
17
16
15
14
Y1
Y2
NC
Y3
Y4
C
G2A
NC
G2B
G1
B
A
NC
Y6
Y5
V
Y0
Y7
GND
NC
SN54HC138 . . . FK PACKAGE
(TOP VIEW)
CC
NC − No internal connection
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A
B
C
G2A
G2B
G1
Y7
GND
VCC
Y0
Y1
Y2
Y3
Y4
Y5
Y6
SN54HC138 ...J OR W PACKAGE
SN74HC138 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
Copyright © 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54HC138, SN74HC138
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
description/ordering information (continued)
The conditions at the binary-select inputs at the three enable inputs select one of eight output lines. Two
active-low and one active-high enable inputs reduce the need for external gates or inverters when expanding.
A 24-line decoder can be implemented without external inverters, and a 32-line decoder requires only one
inverter. An enable input can be used as a data input for demultiplexing applications.
FUNCTION TABLE
INPUTS
OUTPUTS
ENABLE SELECT OUTPUTS
G1 G2A G2B C B A Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
X H X X X X H H H H H H H H
XXHXXXHHHHHHHH
LXXXXXHHHHHHHH
HLLLLLLHHHHHHH
HLLLLHHLHHHHHH
HLLLHLHHLHHHHH
HLLLHHHHHLHHHH
HLLHLLHHHHLHHH
HLLHLHHHHHHLHH
HLLHHLHHHHHHLH
H L L H H H H H H H H H H L
SN54HC138, SN74HC138
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
logic diagram (positive logic)
A
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
B
C
G1
G2A
G2B
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
1
2
3
6
4
5
15
14
13
12
11
10
9
7
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 82°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 108°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
SN54HC138, SN74HC138
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
SN54HC138 SN74HC138
UNIT
MIN NOM MAX MIN NOM MAX UNIT
VCC Supply voltage 2 5 6 2 5 6 V
VCC = 2 V 1.5 1.5
VIH High-level input voltage VCC = 4.5 V 3.15 3.15 V
VIH
High level
input
voltage
VCC = 6 V 4.2 4.2
V
VCC = 2 V 0.5 0.5
VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 V
VIL
Low level
input
voltage
VCC = 6 V 1.8 1.8
V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V 1000 1000
Δt/ΔvInput transition rise/fall time VCC = 4.5 V 500 500 ns
Δt/Δv
Input
transition
rise/fall
time
VCC = 6 V 400 400
ns
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
V
TA = 25°C SN54HC138 SN74HC138
UNIT
PARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX MIN MAX UNIT
2 V 1.9 1.998 1.9 1.9
IOH = −20 μA4.5 V 4.4 4.499 4.4 4.4
VOH VI = VIH or VIL
IOH
20
μA
6 V 5.9 5.999 5.9 5.9 V
VOH
VI
VIH
or
VIL
IOH = −4 mA 4.5 V 3.98 4.3 3.7 3.84
V
IOH = −5.2 mA 6 V 5.48 5.8 5.2 5.34
2 V 0.002 0.1 0.1 0.1
IOL = 20 μA4.5 V 0.001 0.1 0.1 0.1
VOL VI = VIH or VIL
IOL
20
μA
6 V 0.001 0.1 0.1 0.1 V
VOL
VI
VIH
or
VIL
IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33
V
IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33
IIVI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
ICC VI = VCC or 0, IO = 0 6 V 8 160 80 μA
Ci2 V to 6 V 3 10 10 10 pF
SN54HC138, SN74HC138
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO
TA = 25°C SN54HC138 SN74HC138
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT) VCC MIN TYP MAX MIN MAX MIN MAX UNIT
2 V 67 180 270 225
A, B, or C Any Y 4.5 V 18 36 54 45
t
A,
B,
or
C
Any
Y
6 V 15 31 46 38
ns
tpd 2 V 66 155 235 195 ns
Enable Any Y 4.5 V 18 31 47 39
Enable
Any
Y
6 V 15 26 40 33
2 V 38 75 110 95
ttAny 4.5 V 8 15 22 19 ns
t
y
6 V 6 13 19 16
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load 85 pF
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
50%50% 10%10%
90% 90% VCC
0 V
trtf
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50% 10%10%
90% 90%
VCC
VOH
VOL
0 V
trtf
Input
In-Phase
Output
50%
tPLH tPHL
50% 50%
10% 10%
90%90% VOH
VOL
tr
tf
tPHL tPLH
Out-of-Phase
Output
Test
Point
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 3-May-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
5962-8406201VEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8406201VE
A
SNV54HC138J
5962-8406201VFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8406201VF
A
SNV54HC138W
84062012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI -55 to 125 84062012A
SNJ54HC
138FK
8406201EA ACTIVE CDIP J 16 1 TBD Call TI Call TI -55 to 125 8406201EA
SNJ54HC138J
8406201FA ACTIVE CFP W 16 1 TBD Call TI Call TI -55 to 125 8406201FA
SNJ54HC138W
JM38510/65802B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
65802B2A
JM38510/65802BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65802BEA
JM38510/65802BFA NRND CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65802BFA
M38510/65802B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
65802B2A
M38510/65802BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65802BEA
M38510/65802BFA NRND CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65802BFA
SN54HC138J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC138J
SN74HC138D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DBR ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
PACKAGE OPTION ADDENDUM
www.ti.com 3-May-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
SN74HC138DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DRG3 PREVIEW SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DTE4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DTG4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC138N
SN74HC138N3 OBSOLETE PDIP N 16 TBD Call TI Call TI -40 to 85
SN74HC138NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC138N
SN74HC138NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138NSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138PW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138PWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI -40 to 85
SN74HC138PWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
PACKAGE OPTION ADDENDUM
www.ti.com 3-May-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
SN74HC138PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138PWT ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SNJ54HC138FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84062012A
SNJ54HC
138FK
SNJ54HC138J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8406201EA
SNJ54HC138J
SNJ54HC138W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8406201FA
SNJ54HC138W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 3-May-2013
Addendum-Page 4
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC138, SN54HC138-SP, SN74HC138 :
Catalog: SN74HC138, SN54HC138
Automotive: SN74HC138-Q1, SN74HC138-Q1
Military: SN54HC138
Space: SN54HC138-SP
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Military - QML certified for Military and Defense Applications
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC138DBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74HC138DRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HC138PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC138PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC138DBR SSOP DB 16 2000 367.0 367.0 38.0
SN74HC138DRG4 SOIC D 16 2500 333.2 345.9 28.6
SN74HC138PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN74HC138PWT TSSOP PW 16 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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