1. Product profile
1.1 General description
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic
packages.
BAS40 series;
1PSxxSB4x series
General-purpose Schottky diodes
Rev. 9 — 18 March 2015 Product data sheet
Table 1. Product overview
Type number Package Configuration
NXP JEITA
1PS70SB40 SOT323 SC-70 single diode
1PS76SB40 SOD323 SC-76 single diode
1PS79SB40 SOD523 SC-79 single diode
BAS40 SOT23 - single diode
BAS40H SOD123F - single diode
BAS40L SOD882 - single diode
BAS40W SOT323 SC-70 single diode
1PS70SB44 SOT323 SC-70 dual series
BAS40-04 SOT23 - dual series
BAS40-04W SOT323 SC-70 dual series
1PS70SB45 SOT323 SC-70 dual common cathode
1PS75SB45 SOT416 SC-75 dual common cathode
BAS40-05 SOT23 - dual common cathode
BAS40-05W SOT323 SC-70 dual common cathode
1PS70SB46 SOT323 SC-70 dual common anode
BAS40-06 SOT23 - dual common anode
BAS40-06W SOT323 SC-70 dual common anode
BAS40-07 SOT143B - dual isolated
BAS40-07V SOT666 - dual isolated
BAS40-05V SOT666 - quadruple commo n cathode/
common cathode
1PS88SB48 SOT363 SC-88 quadruple common cathode/
common cathode
BAS40XY SOT363 SC-88 quadruple; 2 series
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 2 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
[1] Pulse test: tp300 s; 0.02.
2. Pinning information
High switching speed Low leakage current
High breakdo wn vo ltage Low capacitance
AEC-Q101 qualified
Ultra high-speed switching Voltag e clamping
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per diode
IFforward current - - 120 mA
VFforward voltage IF=1mA [1] --380mV
VRreverse voltage - - 40 V
Table 3. Pinning
Pin Description Simplified outline Symbol
BAS40H; 1PS76SB40; 1PS79SB40
1 cathode [1]
2 anode
BAS40L
1 cathode [1]
2 anode
BAS40; BAS40W; 1PS70SB40
1 anode
2 not connected
3 cathode
001aab540
12
sym001
12
21
Transparent
top view
sym001
12
006aaa144
12
3
006aaa436
1
3
2
n.c.
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 3 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
BAS40-04; BAS40-04W; 1PS70SB44
1 anode (diode 1)
2 cathode (diode 2)
3 cathode (diode 1),
anode (diode 2)
BAS40-05; BAS40-05W; 1PS70SB45; 1PS75SB45
1 anode (diode 1)
2 anode (diode 2)
3 cathode (diode 1),
cathode (diode 2)
BAS40-06; BAS40-06W; 1PS70SB46
1 cathode (diode 1)
2 cathode (diode 2)
3 anode (diode 1),
anode (diode 2)
BAS40-07
1 cathode (diode 1)
2 cathode (diode 2)
3 anode (diode 2)
4 anode (diode 1)
BAS40-07V
1 anode (diode 1)
2 not connected
3 cathode (diode 2)
4 anode (diode 2)
5 not connected
6 cathode (diode 1)
Table 3. Pinning …continued
Pin Description Simplified outline Symbol
006aaa144
12
3
006aaa437
12
3
006aaa144
12
3
006aaa438
12
3
006aaa144
12
3
006aaa439
12
3
006aaa434
2
34
1
123
456
006aaa440
654
123
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 4 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
[1] The marking bar indicates the cathode.
BAS40-05V; 1PS88SB48
1 anode (diode 1)
2 anode (diode 2)
3 cathode (diode 3),
cathode (diode 4)
4 anode (diode 3)
5 anode (diode 4)
6 cathode (diode 1),
cathode (diode 2)
BAS40XY
1 anode (diode 1)
2 cathode (diode 2)
3 anode (diode 3),
cathode (diode 4)
4 anode (diode 4)
5 cathode (diode 3)
6 cathode (diode 1),
anode (diode 2)
Table 3. Pinning …continued
Pin Description Simplified outline Symbol
001aab555
6 45
1 32
006aaa446
654
123
132
4
56
006aaa256
654
123
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 5 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
3. Ordering information
Tabl e 4. Ordering i nformation
Type number Package
Name Description Version
1PS70SB40 SC-70 plastic surface-mounted package; 3 leads SOT323
1PS76SB40 SC-76 plastic surface-mounted package; 2 leads SOD323
1PS79SB40 SC-79 plastic surface-mounted package; 2 leads SOD523
BAS40 - plastic surface-mounted package; 3 leads SOT23
BAS40H - plastic surface-mounted package; 2 leads SOD12 3F
BAS40L - leadless ultra small plastic package; 2 terminals;
body 1.0 0.6 0.5 mm SOD882
BAS40W SC-70 plastic surface-mounted package; 3 leads SOT323
1PS70SB44 SC-70 plastic surface-mounted package; 3 leads SOT323
BAS40-04 - plastic surface-mounted package; 3 leads SOT2 3
BAS40-04W SC-70 plastic surface-mounted package; 3 leads SOT323
1PS70SB45 SC-70 plastic surface-mounted package; 3 leads SOT323
1PS75SB45 SC-75 plastic surface-mounted package; 3 leads SOT416
BAS40-05 - plastic surface-mounted package; 3 leads SOT2 3
BAS40-05W SC-70 plastic surface-mounted package; 3 leads SOT323
1PS70SB46 SC-70 plastic surface-mounted package; 3 leads SOT323
BAS40-06 - plastic surface-mounted package; 3 leads SOT2 3
BAS40-06W SC-70 plastic surface-mounted package; 3 leads SOT323
BAS40-07 - plastic surface-mounted package; 4 leads SOT1 43B
BAS40-07V - plastic surface-mounted package; 6 leads SOT666
BAS40-05V - plastic surface-mounted package; 6 leads SOT666
1PS88SB48 SC-88 plastic surface-mounted package; 6 leads SOT363
BAS40XY SC-88 plastic surface-mounted package; 6 leads SOT363
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 6 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
[1] Tj=25C prior to surge.
Table 5. Marking codes
Type number Marking code[1] Type number Marking code[1]
1PS70SB40 6*3 1PS75SB45 45
1PS76SB40 S4 BAS40-05 45*
1PS79SB40 T BAS40-05W 65*
BAS40 43* 1PS70SB46 6*6
BAS40H AJ BAS40-06 46*
BAS40L S6 BAS40-06W 66*
BAS40W 63* BAS40-07 47*
1PS70SB44 6*4 BAS40-07V 67
BAS40-04 44* BAS40-05V 65
BAS40-04W 64* 1PS88SB48 8*5
1PS70SB45 6*5 BAS40XY 40*
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRreverse voltage - 40 V
IFforward current - 120 mA
IFRM repetitive peak forward
current tp1s; 0.5 - 120 mA
IFSM non-repetitive peak forward
current tp10 ms [1] -200mA
Tjjunction temperature - 150 C
Tamb ambient temperature 65 +150 C
Tstg storage temperature 65 +150 C
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 7 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
6. Thermal characteristics
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
[1] Pulse test: tp300 s; 0.02.
Table 7. Thermal characteris tics
Symbol Parameter Conditions Min Typ Max Unit
Per device
Rth(j-a) thermal resistance from
junction to ambient in free air [1]
SOT23 - - 500 K/W
SOT143B - - 500 K/W
SOT363 (1PS88SB48) - - 416 K/W
SOT416 - - 833 K/W
SOT666 (BAS40-05V) [2] --225K/W
SOT666 (BAS40-07V) [2] --416K/W
SOD123F [2] --330K/W
SOD323 - - 450 K/W
SOD523 [2] --450K/W
SOD882 [2] --500K/W
SOT323 - - 625 K/W
Rth(j-sp) thermal resistance from
junction to solder point
SOT363 (BAS40XY) [3] --260K/W
Table 8. Characteristics
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VFforward voltage [1]
IF= 1 mA - - 380 mV
IF= 10 mA - - 500 mV
IF=40mA - - 1 V
IRreverse current VR=30V - - 1 A
VR=40V - - 10 A
Cddiode capacitance VR=0V; f=1MHz - - 5 pF
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 8 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
(1) Tamb = 125 C
(2) Tamb =85C
(3) Tamb =25C
(4) Tamb =40 C
(1) Tamb = 125 C
(2) Tamb =85C
(3) Tamb =25C
Fig 1. Forward current as a function of forward
voltage; typical values Fig 2. Reverse current as a function of reverse
voltage; typical values
f=10kHz T
amb =25C; f = 1 MHz
Fig 3. Differential resist an c e as a function of forward
current; typical values Fig 4. Dio de ca pacitance as a function of reverse
voltage; typical values
102
101
102
10
1
0
mlc361
0.6 0.80.40.2 1
VF (V)
IF
(mA)
(1) (2) (3) (4)
103
102
101
102
10
1
0
mlc362
2010 4030 VR (V)
IR
(μA) (1)
(2)
(3)
mlc364
1
103
101102
110
102
10
rdif
(Ω)
IF (mA)
01020 4030
5
0
4
mlc363
3
2
1
VR (V)
Cd
(pF)
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 9 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in auto motive applications.
9. Package outline
Fig 5. Pac kage outline SOD323 (SC-76) Fig 6. Package outline SOD523 (SC -7 9)
Fig 7. Pac kage outline SOT23 (TO-236AB) Fig 8. Package outline SOD123F
03-12-17Dimensions in mm
0.25
0.10
0.45
0.15
2.7
2.3 1.8
1.6
0.40
0.25
1.1
0.8
1.35
1.15
1
2
02-12-13Dimensions in mm
1.65
1.55 1.25
1.15
0.17
0.11
0.34
0.26
0.65
0.58
0.85
0.75
1
2
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1 1.4
1.2
0.48
0.38 0.15
0.09
12
3
04-11-29Dimensions in mm
1.2
1.0
0.25
0.10
3.6
3.4 2.7
2.5
0.55
0.35
0.70
0.55
1.7
1.5
1
2
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 10 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
Fig 9. Pac kage outline SOD882 Fig 10. Package outline SOT323 (SC-70)
03-04-17Dimensions in mm
0.55
0.47
0.65
0.62
0.55 0.50
0.46
cathode marking on top side (if applicable)
1.02
0.95
0.30
0.22
0.30
0.22
2
1
04-11-04Dimensions in mm
0.45
0.15
1.1
0.8
2.2
1.8
2.2
2.0 1.35
1.15
1.3
0.4
0.3 0.25
0.10
12
3
Fig 11. Package outline SOT143B Fig 12. Package outline SOT363 (SC-88)
Fig 13. Package outline SOT416 (SC-75) Fig 14. Package outline SOT666
04-11-16Dimensions in mm
3.0
2.8 1.1
0.9
2.5
2.1 1.4
1.2
1.7
1.9
0.48
0.38 0.15
0.09
0.45
0.15
0.88
0.78
21
34
0.25
0.10
0.3
0.2
pin 1
index
1.3
0.65
2.2
2.0 1.35
1.15
2.2
1.8 1.1
0.8
0.45
0.15
132
465
14-10-03Dimensions in mm
04-11-04Dimensions in mm
0.95
0.60
1.8
1.4
1.75
1.45 0.9
0.7
0.25
0.10
1
0.30
0.15
12
30.45
0.15
Dimensions in mm 04-11-08
1.7
1.5
1.7
1.5
1.3
1.1
1
0.18
0.08
0.27
0.17
0.5
pin 1 index
123
456
0.6
0.5
0.3
0.1
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 11 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
[2] T1: normal taping
[3] T2: reverse taping
Table 9. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 4000 8000 10000
1PS70SB40 SOT323 4 mm pitch, 8 m m tape and reel -115 - - -135
1PS76SB40 SOD323 4 mm pitch, 8 m m tape and re el -115 - - -135
1PS79SB40 SOD523 2 mm pitch, 8 m m tape and re el - - -315 -
4 mm pitch, 8 m m tape and reel -115 - - -135
BAS40 SOT23 4 mm pitch, 8 m m tape and re el -215 - - -235
BAS40H SOD123F 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS40L SOD882 2 mm pitch, 8 mm tape and reel - - - -315
BAS40W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
1PS70SB44 SOT323 4 mm pitch, 8 m m tape and reel -115 - - -135
BAS40-04 SOT23 4 mm pitch, 8 m m tape and re el -215 - - -235
BAS40-04W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
1PS70SB45 SOT323 4 mm pitch, 8 m m tape and reel -115 - - -135
1PS75SB45 SOT416 4 mm pitch, 8 m m tape and reel -115 - - -135
BAS40-05 SOT23 4 mm pitch, 8 m m tape and re el -215 - - -235
BAS40-05W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
1PS70SB46 SOT323 4 mm pitch, 8 m m tape and reel -115 - - -135
BAS40-06 SOT23 4 mm pitch, 8 m m tape and re el -215 - - -235
BAS40-06W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS40-07 SOT143B 4 mm pitch, 8 m m tape and re el -215 - - -235
BAS40-07V SOT666 2 mm pitch , 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - -
BAS40-05V SOT666 2 mm pitch , 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - -
1PS88SB48 SOT363 4 mm pitch, 8 m m tape and re el; T1 [2] -115---135
4 mm pitch, 8 m m tape and reel; T2 [3] -125 - - -165
BAS40XY SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115---135
4 mm pitch, 8 m m tape and reel; T2 [3] -125 - - -165
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 12 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
11. Soldering
Dimensions in mm
Fig 15. Reflow soldering footprint SOD323 (SC-76)
Dimensions in mm
Fig 16. Wave soldering footprint SOD323 (SC-76)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 17. Reflow soldering footprint SOD523 (SC-79)
msa433
1.65
0.50
(2×)
2.10
1.60
2.80
0.60
3.05
0.500.95
solder lands
solder resist
occupied area
solder paste
msa415
1.40
4.40
5.00
1.202.75
preferred transport direction during soldering
solder lands
solder resist
occupied area
mgs343
1.80
1.90
0.30
0.40
0.50
1.20 0.60
2.15
solder lands
solder resist
occupied area
solder paste
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 13 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
Dimensions in mm
Fig 18. Reflow soldering footprint SOT23 (TO-236AB)
Dimensions in mm
Fig 19. Wave soldering footprint SOT23 (TO-236AB)
MSA439
1.00
0.60
(3x)
1.30
12
3
2.50
3.00 0.85 2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85
solder lands
solder resist
occupied area
solder paste
MSA427
4.00
4.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
solder lands
solder resist
occupied area
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 14 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD123F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 21. Reflow soldering foo tprin t SOD882
1.6
1.6
2.9
4
4.4
1.1 1.22.1
1.1
(2×)
solder lands
solder resist
occupied area
solder paste
mbl872
1.30
0.30R = 0.05 (8×) R = 0.05 (8×)
0.60
(2×)0.70
(2×)0.80
(2×)
0.90
0.30
(2×)
0.40
(2×)
0.50
(2×)
solder lands
solder resist
occupied area
solder paste
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 15 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
Fig 22. Reflow soldering footprint SOT323 (SC-70)
Fig 23. W ave soldering footprint SOT323 (SC-70)
msa429
0.852.35
0.55
(3×)
1.3250.75
2.40
2.65
1.30
3
2
1
0.60
(3×)
0.50
(3×)1.90
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
msa419
4.00
4.60
2.103.65
1.15
2.70
3
2
1
0.90
(2×)
preferred transport direction during soldering
solder lands
solder resist
occupied area
Dimensions in mm
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 16 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
Dimensions in mm
Fig 24. Reflow soldering footprint SOT143B
Fig 25. Wave soldering footprint SOT143B
msa441
0.60
(4x)
1.30
2.50
3.00
2.70
0.50 (3x)
0.60 (3x)
3.25
43
21
0.90
1.00
solder lands
solder resist
occupied area
solder paste
msa422
4.00 4.60
1.20 (3×)
4.45
12
34
1.15
3.40 1.00 preferred transport direction during soldering
solder lands
solder resist
occupied area
Dimensions in mm
BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 9 — 18 March 2015 17 of 22
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
Fig 26. Reflow soldering footprint SOT363 (SC-88)
Fig 27. W ave soldering footprint SOT363 (SC-88)
solder lands
solder resist
occupied area
solder paste
sot363_fr
2.65
2.35 0.4 (2×)
0.6
(2×)
0.5
(4×)
0.5
(4×)
0.6
(4×)
0.6
(4×)
1.5
1.8
Dimensions in mm
sot363_fw
solder lands
solder resist
occupied area
preferred transport
direction during soldering
5.3
1.3 1.3
1.5
0.3
1.5
4.5
2.45
2.5
Dimensions in mm