Anti-Sulfurated Thick Film Chip Resistors Anti-Sulfurated Thick Film Chip Resistors 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512 Type: ERJ S02, S03, S06, S08, S14 S12, S1D, S1T Features Special construction to avoid open failure due to the presence of sulfur High reliability Metal glaze thick film resistive element and three layers of electrodes Suitable for both reflow and flow soldering Reference Standard IEC 60115-8, JIS C5201-8 Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E R J S 0 6 F 1 0 0 2 V Product Code Thick Film Chip Resistors Size, Power Rating Type: inches Power R. S02 : 0402 0.063 W S03 : 0603 0.1 W S06 : 0805 0.125 W S08 : 1206 0.25 W S14 : 1210 0.25 W S12 : 1812 0.5 W S1D : 2010 0.5 W S1T : 2512 1W Resistance Tolerance Code F J 0 Tolerance 1% 5% Jumper Code X Packaging Methods Packaging Punched Carrier Taping 2 mm pitch V Punched Carrier Taping 4 mm pitch U Embossed Carrier Taping 4 mm pitch Type ERJS02 ERJS03 ERJS06 ERJS08 ERJS14 ERJS12 ERJS1D ERJS1T Resistance Value The first two or three digits are significant figures of resistance and the third or 4th one denotes number of zeros following. Jumper is expressed by R00. Example: 100210 k Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Mar. 2008 Anti-Sulfurated Thick Film Chip Resistors Construction Dimensions in mm (not to scale) L a Protective coating W Electrode (Inner) Alumina substrate t b Type (inches) Electrode (Between) Dimensions (mm) L Electrode (Outer) a b Mass (Weight) [g/1000 pcs.] t ERJS02(0402) 1.00 0.05 0.50 0.05 0.20 0.10 0.25 0.10 0.35 0.05 0.8 0.20 ERJS03(0603) 1.60 0.15 0.80 +0.15 0.30 0.15 0.45 0.10 -0.05 0.30 2 0.10 4 +0.05 ERJS08(1206) 3.20 +0.05 0.50 0.20 0.50 0.20 0.60 0.10 -0.20 1.60 10 ERJS06(0805) 2.00 Thick film resistive element W 0.20 1.25 0.10 -0.15 0.40 0.20 0.40 0.20 0.60 ERJS14(1210) 3.20 0.20 2.50 0.20 0.50 0.20 0.50 0.20 0.60 0.10 16 ERJS12(1812) 4.50 0.20 3.20 0.20 0.50 0.20 0.50 0.20 0.60 0.10 27 ERJS1D(2010) 5.00 0.20 2.50 0.20 0.60 0.20 0.60 0.20 0.60 0.10 27 ERJS1T(2512) 6.40 0.20 3.20 0.20 0.65 0.20 0.60 0.20 0.60 0.10 45 Ratings <For Resistor> Type (inches) PowerRating Limiting Element Maximum Overat 70 C Voltage (Maximum load Voltage (2) (W) RCWV) (1) (V) (V) ERJS02 (0402) 0.063 50 100 ERJS03 (0603) 0.1 50 100 ERJS06 (0805) 0.125 150 200 ERJS08 (1206) 0.25 200 400 0.25 200 400 0.5 200 400 0.5 200 400 1.0 200 400 ERJS14 (1210) ERJS12 (1812) ERJS1D (2010) ERJS1T (2512) Resistance Tolerance (%) 1 5 1 5 1 5 1 5 1 5 1 5 1 5 1 5 Resistance Range () 10 to 1 M (E24, 1 to 3.3 M (E24) 10 to 1 M (E24, 1 to 10 M (E24) 10 to 1 M (E24, 1 to 10 M (E24) 10 to 1 M (E24, 1 to 10 M (E24) 10 to 1 M (E24, 1 to 10 M (E24) 10 to 1 M (E24, 1 to 10 M (E24) 10 to 1 M (E24, 1 to 10 M (E24) 10 to 1 M (E24, 1 to 10 M (E24) T.C.R. [10 -6 /C (ppm/C)] Category Temperature Range (Operating Temperature Range) (C) 200 -55 to +155 100 -55 to +155 100 -55 to +155 100 -55 to +155 100 -55 to +155 100 -55 to +155 100 -55 to +155 100 -55 to +155 E96) E96) E96) E96) E96) E96) E96) E96) (1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=Power Rating Resistance Values, or Limiting Element Voltage (max. RCWV) listed above, whichever less. (2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 Power Rating or max. Overload Voltage listed above whichever less. <For Jumper> Type (inches) ERJS02 (0402) ERJS03 Rated Current (A) Maximum Overload Current (A) 1 2 Power Derating Curve For resistors operated in ambient temperatures above 70 C, power rating shall be derated in accordance with the figure below. (0603) ERJS06 ERJS14 ERJS12 (1812) ERJS1D (2012) ERJS1T (2512) 2 4 Rated Load (%) ERJS08 (1206) (1210) 70 C -55 C 100 (0805) 80 60 40 20 0 -60 -40 -20 0 20 40 60 155 C 80 100 120 140 160 180 Ambient Temperature (C) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Mar. 2008 Anti-Sulfurated Thick Film Chip Resistors Packaging Methods (Taping) Standard Quantity Type ERJS02 ERJS03 ERJS06 ERJS08 ERJS14 ERJS12 ERJS1D ERJS1T Kind of Taping Pitch (P1) 2 mm Quantity 10000 pcs./reel Punched Carrier Taping 5000 pcs./reel 4 mm Embossed Carrier Taping 4000 pcs./reel Carrier Tape (Unit : mm) Embossed Carrier P1 D0 P2 P0 B W F E Punched Carrier P1 (2 mm pitch) A T T D1 (Only Emboss) Type ERJS02 ERJS03 ERJS06 ERJS08 ERJS14 ERJS12 ERJS1D ERJS1T A 0.700.05 1.100.10 1.650.15 2.000.15 2.800.20 3.500.20 2.800.20 3.600.20 B 1.200.05 1.900.10 2.500.20 3.600.20 3.500.20 4.800.20 5.300.20 6.900.20 W F 8.000.20 E P2 P0 D0 2.000.05 4.000.10 +0.10 1.50-0 P1 2.000.10 3.500.05 1.750.10 8.000.30 4.000.10 D1 -- -- -- -- T 0.520.05 0.700.05 0.840.05 1.0+0.10 -0 1.000.10 12.000.30 5.500.20 1.5 min. Taping Reel (Unit : mm) T B C A Type ERJS02 ERJS03 ERJS06 ERJS08 ERJS14 ERJS12 ERJS1D ERJS1T A 180.0 B +0 -3.0 C 60 min. 13.0 W T 9.0 1.0 11.41.0 1.0 13.0 1.0 15.42.0 W Recommended Land Pattern In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reflow soldering, solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W). Type (inches) c Chip Resistor Dimensions (mm) b c 1.4 to 1.6 0.4 to 0.6 ERJS02(0402) a 0.5 to 0.6 ERJS03(0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 ERJS06(0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4 ERJS08(1206) 2 to 2.4 4.4 to 5 1.2 to 1.8 a ERJS14(1210) 2 to 2.4 4.4 to 5 1.8 to 2.8 b ERJS12(1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5 ERJS1D(2010) 3.6 to 4 6.2 to 7 1.8 to 2.8 ERJS1T(2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Anti-Sulfurated Thick Film Chip Resistors Recommended Soldering Conditions Recommendations and precautions are described below. Recommended soldering conditions for reflow * Reflow soldering shall be performed a maximum of two times. * Please contact us for additional information when used in conditions other than those specified. * Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. For soldering (Example : Sn/Pb) Time 140 C to 160 C 60 s to 120 s Main heating Above 200 C 30 s to 40 s Peak 235 5 C max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Peak Temperature Temperature Preheating Temperature Time Preheating 150 C to 180 C 60 s to 120 s Main heating Above 230 C 30 s to 40 s Peak max. 260 C max. 10 s Preheating Heating Time Recommended soldering conditions for flow For soldering For lead-free soldering Temperature Time Temperature Time Preheating 140 C to 160 C 60 s to 120 s 150 C to 180 C 60 s to 120 s Soldering 2455 C 20 s to 30 s max. 260 C max. 10 s Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER3 of this catalog. 1. Take measures against mechanical stress during and after mounting of Anti-Sulfurated Thick Film Chip Resistors (hereafter called the resistors) so as not to damage their electrodes and protective coatings. 2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance and/or reliability. 4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Safety Precautions (Common precautions for Fixed Resistors) * When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. * Do not use the products beyond the specifications described in this catalog. * This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. * Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use * These products are designed and manufactured for general and standard use in general electronic equipment (e.g. AV equipment, home electric appliances, offi ce equipment, information and communication equipment) * These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, NH3, or NO2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials * These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. * Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products . * Note that non- cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. * Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 C to 35 C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, NH3, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Feb. 2006 - ER3 -