ERJS02F22R1X - Panasonic - Datasheet.Directory

Anti-Sulfurated Thick Film Chip Resistors

Design and speciﬁ cations are each subject to change without notice. Ask factory for the current technical speciﬁ cations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Thick Film

Chip Resistors

Product Code Size, Power Rating

Type: inches

S02 : 0402

S03 : 0603

S06 : 0805

S08 : 1206

S14 : 1210

S12 : 1812

S1D : 2010

S1T : 2512

0.063 W

0.1 W

0.125 W

0.25 W

0.5 W

Power R.

Resistance Tolerance

Code

Tolerance

±1%

±5%

Jumper

The first two or three digits are significant figures of resistance

and the third or 4th one denotes number of zeros following.

Jumper is expressed by R00.

Example: 1002촞10 k액

Resistance Value

Packaging Methods

Code Packaging Type

Punched Carrier Taping

2mmpitch

Punched Carrier Taping

4mmpitch

Embossed Carrier Taping

4mmpitch

ERJS02

ERJS03

ERJS06

ERJS08

ERJS14

ERJS12

ERJS1D

ERJS1T

Anti-Sulfurated Thick Film Chip Resistors

0402, 0603, 0805, 1206, 1210,

1812, 2010, 2512

Type: ERJ S02, S03, S06, S08, S14

S12, S1D, S1T

■Features

● Special construction to avoid open failure due to the presence of sulfur

● High reliability

Metal glaze thick ﬁ lm resistive element and three layers of electrodes

● Suitable for both reﬂ ow and ﬂ ow soldering

● Reference Standard

IEC 60115-8, JIS C5201-8

■Explanation of Part Numbers

Mar. 2008

Anti-Sulfurated Thick Film Chip Resistors

Design and speciﬁ cations are each subject to change without notice. Ask factory for the current technical speciﬁ cations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

–40 –20 0 20 40 60 80 100 120 140 160

0180–60

70 °C

Ambient Temperature (°C)

100

Rated Load (%)

–55 °C

155 °C

■Construction ■Dimensions in mm (not to scale)

Power Derating Curve

For resistors operated in ambient temperatures above

70 °C, power rating shall be derated in accordance

with the ﬁ gure below.

(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating ҂ Resistance Values, or Limiting Element Voltage

(max. RCWV) listed above, whichever less.

(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 ҂ Power Rating or max. Overload Voltage listed

above whichever less.

앀

Type

(inches)

Rated Current

(A)

Maximum Overload Current

(A)

ERJS02

(0402) 12

ERJS03

(0603)

ERJS06

(0805)

ERJS08

(1206)

ERJS14

(1210)

ERJS12

(1812)

ERJS1D

(2012)

ERJS1T

(2512)

■Ratings

Type

(inches)

PowerRating

at 70 °C

(W)

Limiting Element

Voltage (Maximum

RCWV)

(1) (V)

Maximum Over-

load Voltage

(2)

(V)

Resistance

Tolerance

(%)

Resistance

Range

(액)

T.C.R.

[

10-6/°C

(ppm/°C)]

Category Temperature

Range (Operating

Temperature Range)

(°C)

ERJS02

(0402) 0.063 50 100 ±1 10 to 1 M (E24, E96) ±200 -55 to +155

±5 1 to 3.3 M (E24)

ERJS03

(0603) 0.1 50 100 ±1 10 to 1 M (E24, E96) ±100 - 55 to +155

±5 1 to 10 M (E24)

ERJS06

(0805) 0.125 150 200 ±1 10 to 1 M (E24, E96) ±100 - 55 to +155

±5 1 to 10 M (E24)

ERJS08

(1206) 0.25 200 400 ±1 10 to 1 M (E24, E96) ±100 - 55 to +155

±5 1 to 10 M (E24)

ERJS14

(1210) 0.25 200 400 ±1 10 to 1 M (E24, E96) ±100 - 55 to +155

±5 1 to 10 M (E24)

ERJS12

(1812) 0.5 200 400 ±1 10 to 1 M (E24, E96) ±100 - 55 to +155

±5 1 to 10 M (E24)

ERJS1D

(2010) 0.5 200 400 ±1 10 to 1 M (E24, E96) ±10 0 - 55 to +155

±5 1 to 10 M (E24)

ERJS1T

(2512) 1.0 200 400 ±1 10 to 1 M (E24, E96) ±10 0 - 55 to +155

±5 1 to 10 M (E24)

Type

(inches)

Dimensions (mm)

Mass (Weight)

[g/1000 pcs.]

LWa b t

ERJS02(0402)

1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.10 0.35±0.05 0.8

ERJS03(0603)

1.60±0.15 0.80+0.15 0.30±0.20 0.30±0.15 0.45±0.10 2

ERJS06(0805)

2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4

ERJS08(1206)

3.20+0.05 1.60+0.05 0.50±0.20 0.50±0.20 0.60±0.10 10

ERJS14(1210)

3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10 16

ERJS12(1812)

4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10 27

ERJS1D(2010)

5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10 27

ERJS1T(2512)

6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10 45

Thick ﬁ lm

resistive element

Electrode (Inner)

Electrode (Outer)

Electrode

(Between)

Alumina substrate

Protective coating

–0.05

–0.15

–0.20

Mar. 2008

Anti-Sulfurated Thick Film Chip Resistors

Design and speciﬁ cations are each subject to change without notice. Ask factory for the current technical speciﬁ cations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Chip Resistor

φB

φA

φC

TTA

φD0

φD1(Only Emboss)

(2 mm pitch)

● Carrier Tape

■Packaging Methods (Taping)

● Standard Quantity

Type

(inches)

Dimensions (mm)

abc

ERJS02(0402)

0.5 to 0.6 1.4 to 1.6 0.4 to 0.6

ERJS03(0603)

0.7 to 0.9 2 to 2.2 0.8 to 1

ERJS06(0805)

1 to 1.4 3.2 to 3.8 0.9 to 1.4

ERJS08(1206)

2 to 2.4 4.4 to 5 1.2 to 1.8

ERJS14(1210)

2 to 2.4 4.4 to 5 1.8 to 2.8

ERJS12(1812)

3.3 to 3.7 5.7 to 6.5 2.3 to 3.5

ERJS1D(2010)

3.6 to 4 6.2 to 7 1.8 to 2.8

ERJS1T(2512)

5 to 5.4 7.6 to 8.6 2.3 to 3.5

Punched Carrier Embossed Carrier

(Unit : mm)

Type Kind of Taping Pitch (P1) Quantity

ERJS02

Punched Carrier Taping

2 mm 10000 pcs./reel

ERJS03

4 mm 5000 pcs./reel

ERJS06

ERJS08

ERJS14

Embossed Carrier Taping

ERJS12

ERJS1D

ERJS1T 4000 pcs./reel

● Taping Reel

Type A B W F E P1P2P0φD0TφD1

ERJS02 0.70±0.05 1.20±0.05

8.00±0.20

3.50±0.05

1.75±0.10

2.00±0.10

2.00±0.05 4.00±0.10 1.50+0.10

0.52±0.05 —

ERJS03 1.10±0.10 1.90±0.10

4.00±0.10

0.70±0.05 —

ERJS06 1.65±0.15 2.50±0.20 0.84±0.05 —

ERJS08 2.00±0.15 3.60±0.20

1.00±0.10

—

ERJS14 2.80±0.20 3.50±0.20 8.00±0.30

1.0+0.10

ERJS12 3.50±0.20 4.80±0.20

12.00±0.30 5.50±0.20

ERJS1D 2.80±0.20 5.30±0.20

1.5 min.

ERJS1T 3.60±0.20 6.90±0.20

−0

Type φAφBφCW T

ERJS02

180.0–3.0 60 min. 13.0±1.0

9.0±1.0 11.4 ±1.0

ERJS03

ERJS06

ERJS08

ERJS14

ERJS12

ERJS1D 13.0±1.0 15.4±2.0

ERJS1T

(Unit : mm)

−0

■Recommended Land Pattern

In case of ﬂ ow soldering, the land width must be smaller than the Chip Resistor width to control the sol der amount properly.

Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reﬂ ow soldering, solder

amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).

Feb. 2006

Anti-Sulfurated Thick Film Chip Resistors

Design and speciﬁ cations are each subject to change without notice. Ask factory for the current technical speciﬁ cations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Preheating

Peak

Heating

Temperature

Time

■Recommended Soldering Conditions

Recommendations and precautions are described below.

● Recommended soldering conditions for reﬂ ow

● Recommended soldering conditions for ﬂ ow

For soldering For lead-free soldering

Temperature Time Temperature Time

Preheating 140 °C to 160 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s

Soldering 245±5 °C 20 s to 30 s max. 260 °C max. 10 s

For soldering (Example : Sn/Pb)

For lead-free soldering (Example : Sn/Ag/Cu)

Temperature Time

Preheating 140 °C to 160 °C 60 s to 120 s

Main heating Above 200 °C 30 s to 40 s

Peak 235 ± 5 °C max. 10 s

Temperature Time

Preheating 150 °C to 180 °C 60 s to 120 s

Main heating Above 230 °C 30 s to 40 s

Peak max. 260 °C max. 10 s

· Reﬂ ow soldering shall be performed a maximum of

two times.

· Please contact us for additional information when

used in conditions other than those speciﬁ ed.

· Please measure the temperature of the terminals

and study every kind of solder and printed circuit

board for solderability be fore ac tu al use.

Safety Precautions

The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors

shown on page ER3 of this catalog.

1. Take measures against mechanical stress during and after mounting of Anti-Sulfurated Thick Film Chip Resistors

(here af ter called the resistors) so as not to damage their electrodes and protective coatings.

2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations

of the resistors when installed in your products before use.

Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.

3. Do not use halogen-based or other high-activity ﬂ ux. Otherwise, the residue may impair the resistors' per for mance

and/or reliability.

4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a

soldering iron with a high temperature tip, ﬁ nish soldering as quickly as possible (within three seconds at 350 °C max.).

5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing

problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.

6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors'

protective coatings and bodies may be chipped, affecting their performance.

7. Avo id exc e ss ive be n d ing of printed circuit boards in order to protect the resistors from abnormal stress.

Feb. 2006

– ER3 –

Safety Precautions

(Common precautions for Fixed Resistors)

•When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement

on the speciﬁ cations with us in advance. The design and speciﬁ cations in this catalog are subject to change without

prior notice.

• Do not use the products beyond the speciﬁ cations described in this catalog.

•This catalog explains the quality and performance of the products as individual components. Before use, check and

evaluate their operations when installed in your products.

•Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment

where a defect in these products may cause the loss of human life or other signiﬁ cant damage, such as damage to

vehicles (automobile, train, vessel), trafﬁ c lights, medical equipment, aerospace equipment, electric heating applianc es,

combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.

✽ Systems equipped with a protection circuit and a protection device

✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault

(1) Precautions for use

•These products are designed and manufactured for general and standard use in general electronic

equipment (e.g. AV equipment, home electric appliances, ofﬁ ce equipment, information and communication

equipment)

•These products are not intended for use in the following special conditions. Before using the products, carefully check

the effects on their quality and performance, and determine whether or not they can be used.

1. In liquid, such as water, oil, chemicals, or organic solvent

2. In direct sunlight, outdoors, or in dust

3. In salty air or air with a high concentration of corrosive gas, such as Cl2, NH3, or NO2

4. Electric Static Discharge (ESD) Environment

These components are sensitive to static electricity and can be damaged under static shock (ESD).

Please take measures to avoid any of these environments.

Smaller components are more sensitive to ESD environment.

5. Electromagnetic Environment

Avoid any environment where strong electromagnetic waves exist.

6. In an environment where these products cause dew condensation

7. S e alin g o r c oating of these products or a printed circuit board on which these products are mounted, with resin

or other materials

• These products generate Joule heat when energized. Carefully position these products so that their heat will not

affect the other components.

• Carefully position these products so that their temperatures will not exceed the category temperature range due

to the effects of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or

inﬂ ammables, such as vinyl-coated wires, near these products .

• Note that non- cleaning solder, halogen-based highly active ﬂ ux, or water-soluble ﬂ ux may deteriorate the

performance or reliability of the products.

• Carefully select a ﬂ ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the

performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave

water res i dues. Otherwise, the insulation performance may be deteriorated.

(2) Precautions for storage

The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your

company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °C

and a relative humidity of 45 % to 85 %.

Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their

electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)

may be deformed or deteriorated, resulting in mounting failures.

1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, NH3, or NO2

2. In direct sunlight

Package markings include the product number, quantity, and country of origin.

In principle, the country of origin should be indicated in English.

Feb. 2006