DMN2016LHAB
Document number: DS36133 Rev. 5 - 2
1 of 6
www.diodes.com
July 2014
© Diodes Incorporated
DMN2016LHAB
ADVANCE INFORMATION
NEW PRODUCT
D1
S1
G1
Gate Protection
Diode
D2
S2
G2
Gate Protection
Diode
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V(BR)DSS R
DS(on)max ID
T
A
= +25°C
20V
15.5mΩ @ VGS = 4.5V 7.5A
16.5mΩ @ VGS = 4.0V 7.3A
19mΩ @ VGS = 3.1V 6.9A
20mΩ @ VGS = 2.5V 6.7A
30mΩ @ VGS = 1.8V 5.4A
Description
This new generation MOSFET has been designed to minimize the on-
state resistance (RDS(ON)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
Applications
Power Management Functions
Battery Pack
Load Switch
Features
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
ESD Protected Gate
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data
Case: U-DFN2030-6
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.012 grams (approximate)
Ordering Information (Note 4)
Part Number Case Packaging
DMN2016LHAB-7 U-DFN2030-6 3,000 / Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
ESD PROTECTED TO 2kV
26W = Product Type Marking Code
YYWW = Date Code Marking
YY = Last digit of year (ex: 12 for 2012)
WW = Week code (01 to 53)
Top View
Pin Configuration
G2 S2 S2
G1 S1 S1
Bottom Drain Contact
D1/D2
26W
YYWW
Bottom View
S1
S1
G2
G1
S2
S2
D1/D2
U-DFN2030-6
e4
DMN2016LHAB
Document number: DS36133 Rev. 5 - 2
2 of 6
www.diodes.com
July 2014
© Diodes Incorporated
DMN2016LHAB
ADVANCE INFORMATION
NEW PRODUCT
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Drain-Source Voltage VDSS 20 V
Gate-Source Voltage VGSS ±12 V
Continuous Drain Current (Note 6) VGS = 4.5V
Steady
State
TA = +25°C
TA = +70°C ID 7.5
5.8 A
t < 10s TA = +25°C
TA = +70°C ID 7.7
6.0 A
Pulsed Drain Current (10μs pulse, duty cycle = 1% ) IDM 45 A
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) TA = +25°C PD 1.2 W
TA = +70°C 0.75
Thermal Resistance, Junction to Ambient (Note 5) Steady State RθJA 106 °C/W
t < 10s 100
Total Power Dissipation (Note 6) TA = +25°C PD 1.65 W
TA = +70°C 1
Thermal Resistance, Junction to Ambient (Note 6) Steady State RθJA 78
°C/W
t < 10s 72
Thermal Resistance, Junction to Case RθJC 11.4
Operating and Storage Temperature Range TJ, TSTG -55 to 150 °C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage BVDSS 20 — V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current TJ = +25°C IDSS — — 1.0 μA VDS = 20V, VGS = 0V
Gate-Source Leakage IGSS — — ±10 μA VGS = ±8V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage VGS
(
th
)
0.5 0.71 1.1 V
VDS = VGS, ID = 250μA
Static Drain-Source On-Resistance RDS(ON)
13 15.5
mΩ
VGS = 4.5V, ID = 4.0A
13.5 16.5 VGS = 4.0V, ID = 4.0A
14 19 VGS = 3.1V, ID = 4.0A
15 20 VGS = 2.5V, ID = 4.0A
21 30 VGS = 1.8V, ID = 3.5A
Forward Transfer Admittance |Yfs| — 25 — S
VDS = 5V, ID = 6A
Diode Forward Voltage VSD — 0.75 1.0 V
VGS = 0V, IS = 1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance Ciss — 1550 — pF VDS = 10V, VGS = 0V,
f = 1.0MHz
Output Capacitance Coss — 166 — pF
Reverse Transfer Capacitance Crss — 145 — pF
Gate Resistance R
g
— 1.37 — Ω V
DS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (VGS = 2.5V) Q
g
— 8.4 — nC
VDS = 10V, ID = 6A
Total Gate Charge (VGS = 4.5V) Q
g
— 16 — nC
Gate-Source Charge Q
g
s — 2.3 — nC
Gate-Drain Charge Q
g
d — 2.5 — nC
Turn-On Delay Time tD
(
on
)
— 6.9 — ns
VDD = 10V, RL = 1.7Ω,
VGS = 5.0V, RG = 3Ω
Turn-On Rise Time t
r
— 15.5 — ns
Turn-Off Delay Time tD
(
off
)
— 40.9 — ns
Turn-Off Fall Time tf — 12 — ns
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad
7. Repetitive rating, pulse width limited by junction temperature
8. Guaranteed by design. Not subject to product testing
DMN2016LHAB
Document number: DS36133 Rev. 5 - 2
3 of 6
www.diodes.com
July 2014
© Diodes Incorporated
DMN2016LHAB
ADVANCE INFORMATION
NEW PRODUCT
10
15
20
25
30
0 0.5 1.0 1.5 2.0
0
5
V , DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristic
DS
I, D
AI
E
(A)
D
V= 1.2V
GS
V= 1.5V
GS
V= 1.8V
GS
V= 2.5V
GS
V = 3.0V
V = 3.5V
V = 4.0V
V = 4.5V
V = 10V
GS
GS
GS
GS
GS
10
12
14
16
18
20
0 0.5 1.0 1.5 2.0
0
2
4
6
8
V , GATE-SOURCE VOLTAGE (V)
GS
Figure 2 Typical Transfer Characteristics
I, D
AI
E
(A)
D
V = 5.0V
DS
T = 150°C
A
T = 125°C
A
T = 85°C
A
T = 25°C
A
T = -55°C
A
0.004
0.006
0.008
0.012
0.014
0.016
0.018
0 5 10 15 20 25 30
0.010
I , DRAIN-SOURCE CURRENT (A)
D
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
, D
AIN-S
U
CE
N-
ESISTANCE ( )
DS(ON)
Ω
V = 2.5V
GS
V = 4.5V
GS
0.005
0.015
0 5 10 15 20
0
0.010
0.020
I , DRAIN CURRENT (A)
D
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
R
, D
R
AIN-S
O
U
R
CE
O
N-
R
ESISTANCE ( )
DS(ON)
Ω
T = -55°C
A
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
V = 4.5V
GS
0.6
0.8
1.0
1.2
1.4
1.8
R
, D
R
AI
N
-S
O
U
R
C
E
ON-RESISTANCE (NORMALIZED)
DS(ON)
1.6
-50-25 0 255075100125150
T , JUNCTION TEMPERATURE ( C)
Figure 5 On-Resistance Variation with Temperature
J
°
V=.5V
I= 1A
GS
D
2
V= V
I= 3A
GS
D
3.6
V= V
I= 5A
GS
D
4.5
0.004
0.006
0.008
0.012
0.014
0.016
0.018
0.010
0.020
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE ( C)
Figure 6 On-Resistance Variation with Temperature
J
°
, D
AIN-S
E
N-
ESIS
AN
E ( )
DS(ON)
Ω
V= V
I= 1A
GS
D
2.5
V= V
I= 3A
GS
D
3.6
V = 4.5V
I= 5A
GS
D
DMN2016LHAB
Document number: DS36133 Rev. 5 - 2
4 of 6
www.diodes.com
July 2014
© Diodes Incorporated
DMN2016LHAB
ADVANCE INFORMATION
NEW PRODUCT
0 2 4 6 8 10 1214 161820
1,000
C
, J
U
N
C
T
I
O
N
C
A
P
A
C
I
T
AN
C
E (p
F
)
T
100
10
1,000
V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 7 Typical Junction Capacitance
C
iss
C
oss
C
rss
f = 1MHz
0 5 10 15 20 25 30 35 40
Q(nC)
g
, TOTAL GATE CHARGE
Figure 8 Gate Charge
0
2
4
6
8
V
G
A
T
E
T
H
R
ES
H
O
LD V
O
L
T
A
G
E (V)
GS
10
V= 10V
I=A
DS
D
6
0.1 1 10 100
V , DRAIN-SOURCE VOLTAGE (V)
Figure 9 SOA, Safe Operation Area
DS
100
I, D
R
AI
N
C
U
R
R
E
N
T
(A)
D
10
1
0.1
0.01
R
Limited
DS(on)
T = 15C
T = 25°C
J(max)
A
V = 12V
Single Pulse
GS
DUT on 1 * MRP Board
DC
P = 10s
W
P = 1s
W
P = 100ms
W
P = 10ms
W
P = 1ms
W
P = 100µs
W
0.1 1 10 100
V , DRAIN-SOURCE VOLTAGE (V)
Figure 10 SOA, Safe Operation Area
DS
100
I, D
R
AI
N
C
U
R
R
E
N
T
(A)
D
10
1
0.1
0.01
R
Limited
DS(on)
T = 15C
T = 60°C
J(max)
A
V = 12V
Single Pulse
GS
DUT on 1 * MRP Board
DC
P = 10s
W
P = 1s
W
P = 100ms
W
P = 10ms
W
P = 1ms
W
P = 100µs
W
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000
t1, PULSE DURATION TIME (sec)
Figure 11 Transient Thermal Resistance
0.001
r(t),
T
R
ANSIEN
T
T
H
E
R
MAL
R
ESIS
T
AN
C
E
0.01
0.1
1
R (t) = r(t) * R
R = 100°C/W
Duty Cycle, D = t1/ t2
θθ
θ
JA JA
JA
D = 0.5
D = 0.7
D = 0.9
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
DMN2016LHAB
Document number: DS36133 Rev. 5 - 2
5 of 6
www.diodes.com
July 2014
© Diodes Incorporated
DMN2016LHAB
ADVANCE INFORMATION
NEW PRODUCT
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
U-DFN2030-6
Type B
Dim Min Max Typ
A 0.55 0.65 0.60
A1 0 0.05 0.02
A3 - - 0.15
b 0.25 0.35 0.30
D 1.95 2.05 2.00
D2 1.40 1.60 1.50
E 2.95 3.05 3.00
E2 1.74 1.94 1.84
e - - 0.65
L 0.28 0.38 0.33
Z - - 0.20
All Dimensions in mm
Dimensions Value
(in mm)
C 0.650
G 0.150
X 0.400
X1 1.600
X2 1.700
Y 0.530
Y1 1.940
Y2 3.300
CX
Y
X1
Y1
G
X2
Y2
D
E
e
b
L
A
A1 A3
(Pin #1 ID)
Seating Plane
D2
E2
Z (4x)
DMN2016LHAB
Document number: DS36133 Rev. 5 - 2
6 of 6
www.diodes.com
July 2014
© Diodes Incorporated
DMN2016LHAB
ADVANCE INFORMATION
NEW PRODUCT
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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