Ver. 201207
FEATURES
APPLICATION
DIMENSION
Type Dimension [mm]
L W t d
21 2.0±0.2 1.25±0.2 0.9±0.2 0.5+0.2
-0.3
DESCRIPTION
Chip
ChipChip
Chip Bead
BeadBead
Bead
For
ForFor
For High
HighHigh
High Current
CurrentCurrent
Current
RECOMMENDED LAND PATTERN
CIC21 Series (2012/ EIA 0805)
Part no. Thickness
(mm) Impedance
(Ω)±25%@100MHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIC21P110 0.90±0.2 11 0.05 6000
CIC21P300 0.90±0.2 30 0.015 3000
CIC21P600 0.90±0.2 60 0.025 3000
CIC21P800 0.90±0.2 80 0.025 2500
CIC21P101 0.90±0.2 100 0.02 2000
CIC21P121 0.90±0.2 120 0.05 2000
CIC21P221 0.90±0.2 220 0.035 3200
CIC21P331 0.85±0.2 330 0.05 2000
CIC21P601 0.90±0.2 600 0.15 1000
CIC21J600 0.90±0.2 60 0.03 3800
CIC21J121 0.90±0.2 120 0.05 2500
CIC21J221 0.90±0.2 220 0.05 1500
CIC21J301 0.90±0.2 300 0.10 1500
CIC21J471 0.90±0.2 470 0.08 1500
CIC21J601 0.90±0.2 600 0.15 1000
Noise Suppression in power line
CIC series is used for high current. )
0.6~1.2mm 0.6~1.2mm
0.8~1.2mm
0.9~1.6mm
Ver. 201207
CHARACTERISTIC DATA
Ver. 201207
CI C 21 P 110 N E
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads (2) For High current(C:~3A)
(3) Dimension (4) Material Code
(5) Nominal impedance (110:11Ω, 221:220Ω)
(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
PACKAGING
Packaging Style Quantity(pcs/reel)
Embossed Taping 4000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
REFLOW SOLDERING FLOW SOLDERING
