TMCP
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Solid Tantalum Surface Mount Chip Capacitors,
Molded Case, 0805 Size
PERFORMANCE / ELECTRICAL
CHARACTERISTICS
Operating Temperature: -55 °C to +125 °C
(above +85 °C, voltage derating is required)
Capacitance Range: 0.1 μF to 47 μF
Capacitance Tolerance: ± 10 %, ± 20 %
Voltage Rating: 2.5 VDC to 25 VDC
FEATURES
• Small size, suitable for high-density packaging
• Terminations: 100 % matte tin
• Qualified to EIA-717
• Compatible with “high volume” automatic pick
and place equipment
• Moisture sensitivity level 1
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Industrial
• Audio and visual equipment
• General purpose
Available
Available
ORDERING INFORMATION
TMC P 0J 107 M TR (2) F
TYPE CASE
CODE
DC VOLTAGE
RATING AT +85 °C
CAPACITANCE
(μF)
CAPACITANCE
TOLERANCE
PACKAGING
POLARITY
OPTIONAL TERMINAL
CODE
See
Ratings
and
Case
Codes
table.
0E = 2.5 V
0G = 4.0 V
0J = 6.3 V
1A = 10 V
1C = 16 V
1D = 20 V
1E = 25 V
This is expressed
in picofarads.
The first two
digits are the
significant
figures. The third
is the number of
zeros to follow.
K = ± 10 %
M = ± 20 %
TR = 7" reel,
cathodes close
to perforation
side
Halogen-free
(special order)
F =
lead (Pb)-free
terminations
DIMENSIONS in inches [millimeters]
CASE CODE EIA SIZE L W H l a
P 2012-12 0.080 ± 0.008
[2.0 ± 0.2]
0.049 ± 0.008
[1.25 ± 0.2]
0.047 max.
[1.2 max.]
0.020 ± 0.008
[0.5 ± 0.2]
0.035 ± 0.004
[0.9 ± 0.1]
Anode indication belt mark
L
W
W
H
a
ll
TMCP
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RATINGS AND CASE CODES
μF 2.5 V 4.0 V 6.3 V 10 V 16 V 20 V 25 V
0.10 PP
0.15 P
0.22 P
0.33 P
0.47 PP
0.68 P
1.0 PPP
1.5 P P P
2.2 P P P
3.3 P P
4.7 P P P
6.8 P P
10 P P
15PPP
22PPP
33 P P
47 P P
MARKING
SIMPLIFIED VOLTAGE AND CAP CODES
μF 2.5 4.0 6.3 10 16 20 25
0.10 DA EA
0.15 DE
0.22 DJ
0.33 DN
0.47 DS ES
0.68 DW
1.0 CA DA EA
1.5 AE CE DE
2.2 AJ CJ DJ
3.3 AN CN
4.7 JS AS CS
6.8 JW AW
10 JA aA
15 eE GE jE
22 eJ gJ jJ
33 eN gN
47 eS GS
DA
Simplied code of rated
voltage (D: 20 V)
Simplied code of nominal
capacitance (A: 0.1 μF)
A
node indication belt mark
TMCP
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STANDARD RATINGS
CAPACITANCE
(μF) CASE CODE PART NUMBER
MAX. DCL
AT 25 °C
(μA)
MAX. DF
AT 25 °C, 120 Hz
(%)
MAX. ESR
AT +25 °C, 100 kHz
()
MAX. RIPPLE,
100 kHz IRMS
(A)
2.5 VDC AT +85 °C; 1.6 VDC AT +125 °C
15 P TMCP0E156(1)TRF 0.5 8 4.0 0.126
22 P TMCP0E226(1)TRF 0.6 10 4.0 0.126
33 P TMCP0E336(1)TRF 0.8 20 4.0 0.126
47 P TMCP0E476MTRF 11.8 30 6.0 0.103
4 VDC AT +85 °C; 2.5 VDC AT +125 °C
15 P TMCP0G156(1)TRF 0.6 8 4.0 0.126
22 P TMCP0G226(1)TRF 0.9 10 4.0 0.126
33 P TMCP0G336(1)TRF 13.2 30 5.9 0.104
47 P TMCP0G476MTRF 18.8 30 6.0 0.103
6.3 VDC AT +85 °C; 4 VDC AT +125 °C
4.7 P TMCP0J475(1)TRF 0.5 8 4.0 0.126
6.8 P TMCP0J685(1)TRF 0.5 8 4.0 0.126
10 P TMCP0J106(1)TRF 0.7 8 5.3 0.110
15 P TMCP0J156(1)TRF 1.0 12 5.9 0.104
22 P TMCP0J226MTRF 13.9 30 5.9 0.104
10 VDC AT +85 °C; 6.3 VDC AT +125 °C
1.5 P TMCP1A155(1)TRF 0.5 8 11.0 0.076
2.2 P TMCP1A225(1)TRF 0.5 8 8.8 0.085
3.3 P TMCP1A335(1)TRF 0.5 8 7.7 0.091
4.7 P TMCP1A475(1)TRF 0.5 8 4.0 0.126
6.8 P TMCP1A685(1)TRF 0.7 20 4.0 0.126
10 P TMCP1A106(1)TRF 10.0 20 5.9 0.104
16 VDC AT +85 °C; 10 VDC AT +125 °C
1.0 P TMCP1C105(1)TRF 0.5 6 9.9 0.080
1.5 P TMCP1C155(1)TRF 0.5 8 11.0 0.076
2.2 P TMCP1C225(1)TRF 0.5 8 8.8 0.085
3.3 P TMCP1C335(1)TRF 0.6 8 8.8 0.085
4.7 P TMCP1C475MTRF 0.8 8 8.8 0.085
20 VDC AT +85 °C; 13 VDC AT +125 °C
0.10 P TMCP1D104(1)TRF 0.5 6 33.0 0.044
0.15 P TMCP1D154(1)TRF 0.5 6 27.5 0.048
0.22 P TMCP1D224(1)TRF 0.5 6 27.5 0.048
0.33 P TMCP1D334(1)TRF 0.5 6 22.0 0.054
0.47 P TMCP1D474(1)TRF 0.5 6 22.0 0.054
0.68 P TMCP1D684(1)TRF 0.5 6 16.5 0.062
1.0 P TMCP1D105(1)TRF 0.5 6 11.0 0.076
1.5 P TMCP1D155(1)TRF 0.5 8 11.0 0.076
2.2 P TMCP1D225MTRF 0.5 8 8.8 0.085
25 VDC AT +85 °C; 16 VDC AT +125 °C
0.10 P TMCP1E104(1)TRF 0.5 6 33.0 0.044
0.47 P TMCP1E474(1)TRF 0.5 6 22.0 0.054
1.0 P TMCP1E105(1)TRF 0.5 6 11.0 0.076
Note
• Part number definition:
(1) Tolerance: For 10 % tolerance, specify “K”; for 20 % tolerance, change to “M”
RECOMMENDED VOLTAGE DERATING GUIDELINES (for temperature below +85 °C)
CAPACITOR VOLTAGE RATING OPERATING VOLTAGE
2.5 1.2
4.0 2.0
6.3 3.1
10 5.0
16 8.0
20 10.0
25 12.5
TMCP
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Note
• Test conditions per JIS C5101-1
POWER DISSIPATION
CASE CODE MAXIMUM PERMISSIBLE POWER DISSIPATION AT +25 °C (W) IN FREE AIR
P 0.064
STANDARD PACKAGING QUANTITY
CASE CODE UNITS PER 7" REEL
P 3000
PERFORMANCE CHARACTERISTICS
ITEM CONDITION POST TEST PERFORMANCE
Temperature
characteristics
Measure the specified characteristics in
each stage
Specified
initial value -55 °C +85 °C +125 °C
Capacitance
change - -20 % to 0 % 0 % to +20 % 0 % to +20 %
Dissipation
factor (%)
610 8 10
812 10 12
10 14 12 14
12 16 14 16
20 24 22 24
30 60 30 40
Leakage
current
Refer to
Standard
Ratings
table
-
1000 %
specified
intial value
or less
1250 %
specified
intial value
or less
Solder heat
resistance
Solder dip:
260 °C ± 5 °C 10 s ± 1 s
Reflow:
260 °C 10 s ± 1 s
Capacitance change Within ± 20 % of initial value
Dissipation factor Initial specified value or less
Leakage current Initial specified value or less
Moisture
resistance
no load
Leave at 40 °C and
90 % to 95 % RH for 500 h
Capacitance change Within ± 20 % of initial value
Dissipation factor Shall not exceed 150 % of initial specified value
Leakage current Initial specified value or less
High
temperature
load
85 °C. The rated voltage is applied for
2000 h
Capacitance change Within ± 20 % of initial value
Dissipation factor Initial specified value or less
Leakage current Shall not exceed 200 % of initial specified value
Thermal shock
Leave at -55 °C, normal temperature,
125 °C, and normal temperature for
30 min, 3 min, 30 min, and 3 min.
Repeat this operation 5 times running
Capacitance change Within ± 20 % of initial value
Dissipation factor Initial specified value or less
Leakage current Initial specified value or less
Moisture
resistance
load
Leave at 40 °C and 90 % to 95 % RH
The rated voltage is applied for 500 h
Capacitance change Within ± 20 % of initial value or less
Dissipation factor Shall not exceed 150 % of initial specified value
Leakage current Shall not exceed 200 % of initial specified value
Failure rate 85 °C. The rated voltage is applied
through a protective resistor of 1 /V. 1 % / 1000 h
Molded Guide
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Guide for Tantalum and Niobium
Solid Electrolyte Chip Capacitors
INTRODUCTION
Tantalum electrolytic capacitors are the preferred choice in
applications where volumetric efficiency, stable electrical
parameters, high reliability, and long service life are primary
considerations. The stability and resistance to elevated
temperatures of the tantalum / tantalum oxide / manganese
dioxide system make solid tantalum capacitors an
appropriate choice for today's surface mount assembly
technology.
Vishay Sprague has been a pioneer and leader in this field,
producing a large variety of tantalum capacitor types for
consumer, industrial, automotive, military, and aerospace
electronic applications.
Tantalum is not found in its pure state. Rather, it is
commonly found in a number of oxide minerals, often in
combination with Columbium ore. This combination is
known as “tantalite” when its contents are more than
one-half tantalum. Important sources of tantalite include
Australia, Brazil, Canada, China, and several African
countries. Synthetic tantalite concentrates produced from
tin slags in Thailand, Malaysia, and Brazil are also a
significant raw material for tantalum production.
Electronic applications, and particularly capacitors,
consume the largest share of world tantalum production.
Other important applications for tantalum include cutting
tools (tantalum carbide), high temperature super alloys,
chemical processing equipment, medical implants, and
military ordnance.
Vishay Sprague is a major user of tantalum materials in the
form of powder and wire for capacitor elements and rod and
sheet for high temperature vacuum processing.
THE BASICS OF TANTALUM CAPACITORS
Most metals form crystalline oxides which are
non-protecting, such as rust on iron or black oxide on
copper. A few metals form dense, stable, tightly adhering,
electrically insulating oxides. These are the so-called “valve”
metals and include titanium, zirconium, niobium, tantalum,
hafnium, and aluminum. Only a few of these permit the
accurate control of oxide thickness by electrochemical
means. Of these, the most valuable for the electronics
industry are aluminum and tantalum.
Capacitors are basic to all kinds of electrical equipment,
from radios and television sets to missile controls and
automobile ignitions. Their function is to store an electrical
charge for later use.
Capacitors consist of two conducting surfaces, usually
metal plates, whose function is to conduct electricity. They
are separated by an insulating material or dielectric. The
dielectric used in all tantalum electrolytic capacitors is
tantalum pentoxide.
Tantalum pentoxide compound possesses high-dielectric
strength and a high-dielectric constant. As capacitors are
being manufactured, a film of tantalum pentoxide is applied
to their electrodes by means of an electrolytic process. The
film is applied in various thicknesses and at various voltages
and although transparent to begin with, it takes on different
colors as light refracts through it. This coloring occurs on the
tantalum electrodes of all types of tantalum capacitors.
Rating for rating, tantalum capacitors tend to have as much
as three times better capacitance / volume efficiency than
aluminum electrolytic capacitors. An approximation of the
capacitance / volume efficiency of other types of capacitors
may be inferred from the following table, which shows the
dielectric constant ranges of the various materials used in
each type. Note that tantalum pentoxide has a dielectric
constant of 26, some three times greater than that of
aluminum oxide. This, in addition to the fact that extremely
thin films can be deposited during the electrolytic process
mentioned earlier, makes the tantalum capacitor extremely
efficient with respect to the number of microfarads available
per unit volume. The capacitance of any capacitor is
determined by the surface area of the two conducting
plates, the distance between the plates, and the dielectric
constant of the insulating material between the plates.
In the tantalum electrolytic capacitor, the distance between
the plates is very small since it is only the thickness of the
tantalum pentoxide film. As the dielectric constant of the
tantalum pentoxide is high, the capacitance of a tantalum
capacitor is high if the area of the plates is large:
where
C = capacitance
e = dielectric constant
A = surface area of the dielectric
t = thickness of the dielectric
Tantalum capacitors contain either liquid or solid
electrolytes. In solid electrolyte capacitors, a dry material
(manganese dioxide) forms the cathode plate. A tantalum
lead is embedded in or welded to the pellet, which is in turn
connected to a termination or lead wire. The drawings show
the construction details of the surface mount types of
tantalum capacitors shown in this catalog.
COMPARISON OF CAPACITOR
DIELECTRIC CONSTANTS
DIELECTRIC e
DIELECTRIC CONSTANT
Air or vacuum 1.0
Paper 2.0 to 6.0
Plastic 2.1 to 6.0
Mineral oil 2.2 to 2.3
Silicone oil 2.7 to 2.8
Quartz 3.8 to 4.4
Glass 4.8 to 8.0
Porcelain 5.1 to 5.9
Mica 5.4 to 8.7
Aluminum oxide 8.4
Tantalum pentoxide 26
Ceramic 12 to 400K
CeA
t
-------
=
Molded Guide
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SOLID ELECTROLYTE TANTALUM CAPACITORS
Solid electrolyte capacitors contain manganese dioxide,
which is formed on the tantalum pentoxide dielectric layer
by impregnating the pellet with a solution of manganous
nitrate. The pellet is then heated in an oven, and the
manganous nitrate is converted to manganese dioxide.
The pellet is next coated with graphite, followed by a layer
of metallic silver, which provides a conductive surface
between the pellet and the leadframe.
Molded chip tantalum capacitor encases the element in
plastic resins, such as epoxy materials. After assembly, the
capacitors are tested and inspected to assure long life and
reliability. It offers excellent reliability and high stability for
consumer and commercial electronics with the added
feature of low cost.
Surface mount designs of “Solid Tantalum” capacitors use
lead frames as shown in the accompanying drawings.
TANTALUM CAPACITORS FOR ALL DESIGN
CONSIDERATIONS
Solid electrolyte designs are the least expensive for a given
rating and are used in many applications where their very
small size for a given unit of capacitance is of importance.
Also important are their good low temperature performance
characteristics and freedom from corrosive electrolytes.
Datasheets covering the various types and styles of
capacitors for consumer and entertainment electronics and
industry applications are available where detailed
performance characteristics must be specified.
MOLDED CHIP CAPACITOR, ALL TYPES EXCEPT TMCTX / TMCJ / NMC
MOLDED CHIP CAPACITOR WITH BUILT-IN FUSE, TYPE TMCTX
MOLDED CHIP CAPACITOR 0603 SIZE, TYPE TMCJ
Sintered tantalumMnO2
Carbon / silver coating
Epoxy encapsulation
Tantalum wire
Supporter
Silver adhesive
Solderable cathode termination Solderable anode termination
Leadframe
Tantalum wire
Epoxy encapsulation
Leadframe
Solderable anode terminationSolderable cathode termination
Fusible ribbon
Carbon / silver coating
Sintered tantalum Supporter
Silver adhesiveMnO2
Epoxy encapsulation
Solderable anode termination
Solderable cathode termination
Leadframe
Silver adhesive
Sintered tantalumMnO2
Carbon / silver coating
Tantalum wire
Molded Guide
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MOLDED CHIP CAPACITOR NIOBIUM, TYPE NMC
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES TMCS TMCM TMCR TMCU TMCP TMCJ
PRODUCT
IMAGE
TYPE Solid tantalum surface mount chip capacitors, molded case
FEATURES Standard
industrial grade
Standard
industrial grade
extended range
Low ESR Low profile 0805 size 0603 size
TEMPERATURE
RANGE -55 °C to +125 °C
CAPACITANCE
RANGE 0.1 µF to 68 µF 0.47 µF to 470 µF 10 µF to 330 µF 0.1 µF to 220 µF 0.1 µF to 47 µF 0.68 µF to 22 µF
VOLTAGE
RANGE 4 V to 35 V 2.5 V to 35 V 7 V to 35 V 2.5 V to 35 V 2.5 V to 25 V 2.5 V to 20 V
CAPACITANCE
TOLERANCE ± 10 %, ± 20 % ± 20 %
LEAKAGE
CURRENT 0.01 CV or 0.5 A, whichever is greater
DISSIPATION
FACTOR 4 % to 6 % 4 % to 30 % 6 % to 30 % 4 % to 30 % 6 % to 30 % 20 %
CASE SIZES A, B, C, E A, B, C, E B, C, E UA, UB P J
TERMINATION
FINISH 100 % tin Case UA: 100 % tin
Case UB: Ni / Pd / Au 100 % tin
Sintered niobiumCarbon / silver coating MnO2
Solderable anode terminationSolderable cathode termination
Leadframe
Silver adhesive Epoxy encapsulation
Tantalum wire
Supporter
Molded Guide
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SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES TMCTX TMCH THC
PRODUCT IMAGE
TYPE Solid tantalum surface mount chip capacitors, molded case
FEATURES Built-in fuse High reliability High reliability,
high temperature +150 °C
TEMPERATURE RANGE -55 °C to +125 °C -55 °C to +150 °C
CAPACITANCE RANGE 1.0 µF to 68 µF 0.1 µF to 100 µF 0.33 µF to 47 µF
VOLTAGE RANGE 10 V to 35 V 4 V to 35 V 10 V to 35 V
CAPACITANCE TOLERANCE ± 10 %, ± 20 %
LEAKAGE CURRENT 0.01 CV or 0.5 A,
whichever is greater 0.005 CV or 0.25 A, whichever is greater
DISSIPATION FACTOR 4 % to 6 % 4 % to 8 % 4 % to 6 %
CASE SIZES B, C, E, F A, B, C, E, P A, B, C, E
TERMINATION FINISH 100 % tin
SOLID NIOBIUM CAPACITORS - MOLDED CASE
SERIES NMC NMCU
PRODUCT IMAGE
TYPE Solid niobium surface mount chip capacitors, molded case
FEATURES Flame retardant Flame retardant, low profile
TEMPERATURE RANGE -55 °C to +105 °C
CAPACITANCE RANGE 10 µF to 470 µF 4.7 µF to 47 µF
VOLTAGE RANGE 2.5 V to 10 V
CAPACITANCE TOLERANCE ± 20 %
LEAKAGE CURRENT 0.02 CV or less
DISSIPATION FACTOR 8 % to 30 % 30 %
CASE SIZES A, B, C, E UA, UB
TERMINATION FINISH
100 % tin
Case UA: 100 % tin
Case UB: Ni / Pd / Au
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PLASTIC TAPE AND REEL PACKAGING DIMENSIONS in millimeters
CASE CODE J, P, A, UA, B, UB C, E, F
TAPE WIDTH 8 12
A + 0 / - 3 Ø 180
B + 1 / 0 Ø 60
C ± 0.2 Ø 13
D ± 0.5 Ø 21
E ± 0.5 2.0
W ± 0.3 9.0 13.0
TAPE SIZE in millimeters
CASE CODE A ± 0.2 B ± 0.2 W ± 0.3 F ± 0.1 E ± 0.1 P1 ± 0.1 tmax.
J 1.0 1.8 8.0 3.5 1.75 4.0 1.3
P 1.4 2.2 8.0 3.5 1.75 4.0 1.6
A 1.9 3.5 8.0 3.5 1.75 4.0 2.5
UA 1.9 3.5 8.0 3.5 1.75 4.0 1.7
B 3.1 3.8 8.0 3.5 1.75 4.0 2.5
UB 3.1 3.8 8.0 3.5 1.75 4.0 1.7
C 3.7 6.3 12.0 5.5 1.75 8.0 3.1
E 4.8 7.7 12.0 5.5 1.75 8.0 3.4
F 6.2 7.5 12.0 5.5 1.75 8.0 4.1
Label
DE
W
B
A
C
Perforation
Direction of tape flow
Inserting direction
t
A
F
P1
W
B
E
Ø 1.5
Pocket
+ 0.1
0
4.0 ± 0.1
2.0 ± 0.1
Perforation
Symbol: R
Marking side (upper)
Mounting terminal side (lower)
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RECOMMENDED REFLOW PROFILES
Capacitors should withstand reflow profile as per J-STD-020 standard
PROFILE FEATURE LEAD (Pb)-FREE ASSEMBLY
Preheat / soak
Temperature min. (Ts min.)130 °C
Temperature max. (Ts max.)160 °C
Time (ts) from (Ts min. to Ts max.) 60 s to 120 s
Ramp-up
Ramp-up rate (TL to Tp)3 °C/s max.
Liquidus temperature (TL)200 °C
Time (tL) maintained above TL50 s max.
Peak package body temperature (Tp) max. Depends on case size - see table below
Time (tp) within 5 °C of the peak maximum temperature 10 s max.
Ramp-down rate (Tp to TL)6 °C/s max.
Time from 25 °C to peak temperature 8 min max.
PEAK PACKAGE BODY TEMPERATURE (Tp)
CASE CODE PEAK PACKAGE BODY TEMPERATURE (Tp)
LEAD (Pb)-FREE PROCESS
J, P, UA, A, UB, B, C 260 °C
E, F 250 °C
PAD DIMENSIONS in millimeters
CASE /
DIMENSIONS
CAPACITOR SIZE PAD DIMENSIONS
L W G (max.) Z (min.) X (min.) Y (Ref.)
J 1.6 0.8 0.7 2.5 1.0 0.9
P 2.0 1.25 0.5 2.6 1.2 1.05
UA, A 3.2 1.6 1.1 3.8 1.5 1.35
UB, B 3.5 2.8 1.4 4.1 2.7 1.35
C 5.8 3.2 2.9 6.9 2.7 2.0
E 7.3 4.3 4.1 8.2 2.9 2.05
F 7.3 5.8 4.1 8.2 4.0 2.05
25
TEMPERATURE (°C)
TIME (s)
ts
tL
Time 25 °C to peak
TL
TpTC - 5 °C
tp
Ts max.
Ts min.
Preheat area
Max. ramp-up rate = 3 °C/s
Max. ramp-down rate = 6 °C/s
Capacitor
Pattern
L
Y
Z
G
XW
Molded Guide
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GUIDE TO APPLICATION
1. AC Ripple Current: the maximum allowable ripple
current shall be determined from the formula:
where,
P = power dissipation in W at +25 °C as given in
the tables in the product datasheets.
RESR = the capacitor equivalent series resistance at
the specified frequency.
2. AC Ripple Voltage: the maximum allowable ripple
voltage shall be determined from the formula:
or, from the formula:
where,
P = power dissipation in W at +25 °C as given in
the tables in the product datasheets.
RESR = The capacitor equivalent series resistance at
the specified frequency.
Z = The capacitor impedance at the specified
frequency.
2.1 The tantalum capacitors must be used in such a
condition that the sum of the working voltage and
ripple voltage peak values does not exceed the rated
voltage as shown in figure below.
3. Temperature Derating: power dissipation is
affected by the heat sinking capability of the
mounting surface. If these capacitors are to
be operated at temperatures above +25 °C, the
permissible ripple current (or voltage) shall be
calculated using the derating coefficient as shown in
the table below:
4. Reverse Voltage: the capacitors are not intended for
use with reverse voltage applied. If the application of
an reverse voltage is unavoidable, it must not exceed
the following values:
At 25 °C: 10 % of the rated voltage or 1 V, whichever
is smaller.
At 85 °C: 5 % of the rated voltage or 0.5 V, whichever
is smaller.
5. Mounting Precautions:
5.1 Limit Pressure on Capacitor Installation with
Mounter: pressure must not exceed 4.9 N with a tool
end diameter of 1.5 mm when applied to the
capacitors using an absorber, centering tweezers, or
similar (maximum permitted pressurization time: 5 s).
An excessively low absorber setting position would
result in not only the application of undue force to the
capacitors but capacitor and other component
scattering, circuit board wiring breakage, and / or
cracking as well, particularly when the capacitors are
mounted together with other chips having a height of
1 mm or less.
5.2 Flux Selection
5.2.1 Select a flux that contains a minimum of chlorine and
amine.
5.2.2 After flux use, the chlorine and amine in the flux
remain must be removed.
5.3 Cleaning After Mounting: the following solvents are
usable when cleaning the capacitors after mounting.
Never use a highly active solvent.
• Halogen organic solvent (HCFC225, etc.)
• Alcoholic solvent (IPA, ethanol, etc.)
• Petroleum solvent, alkali saponifying agent, water,
etc.
Circuit board cleaning must be conducted at a
temperature of not higher than 50 °C and for an
immersion time of not longer than 30 minutes. When
an ultrasonic cleaning method is used, cleaning must
be conducted at a frequency of 48 kHz or lower, at
an vibrator output of 0.02 W/cm3, at a temperature of
not higher than 40 °C, and for a time of 5 minutes or
shorter.
Notes
• Care must be exercised in cleaning process so that the
mounted capacitor will not come into contact with any
cleaned object or the like or will not get rubbed by a stiff
brush or similar. If such precautions are not taken
particularly when the ultrasonic cleaning method is
employed, terminal breakage may occur.
• When performing ultrasonic cleaning under conditions
other than stated above, conduct adequate advance
checkout.
MAXIMUM RIPPLE CURRENT TEMPERATURE
DERATING FACTOR
TEMPERATURE TMC NMC
25 °C 1.0 1.0
85 °C 0.9 0.9
105 °C 0.65 0.4
125 °C 0.4 -
IRMS
P
RESR
------------=
VRMS ZP
RESR
------------=
VRMS IRMS x Z=
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www.vishay.com Vishay
Revision: 08-Feb-17 1Document Number: 91000
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