Wire to Board ID Method Connectors ID-01 Series Mating Diagram 4.8 Wire Cut length 0.5 max. 2.2 1.8 1.2 4 Features 1.5 5.1 Taping Dimension 4 .5 o1 12 2 1.75 1. Cable pitch : 1 mm 2. Rating : 1A, 30V AC/DC 3. Contact Resistance : 20m max.,initially 4. Insulation Resistance: 100M min.at 250V DC 5. Withstanding Voltage : 250V AC (for one minute) 6. Operating Temperature Range : -25C to +85C 7. Applicable Cable : AWG 32, 0.39mm Dia jacket OD 0.7 5.5 Specification P.C. Board Dimension 5 1. Small and low profile type 2P wire to board ID method connector of 1.0mm cable pitch and 1.2mm mating height. 2. Resistant to vibration and shocks when dropped and highly reliable due to a 2point contact structure. 3. Cable connection helping to achieve excellent cable retention performance and contact reliability due to double insulation displacement slots at the front and back. 4. A top entry mating structure where the wire emerges horizontally. 5. Excellent mating retention force in addition to ensured clicking feeling during insertion and withdrawal due to the mold locking structure. 6. A reverse insertion prevention design. 7. Supplied in the embossed taping with automatic mounter. 2 4 Reel Dimension 2 Pull out in this direction Recycle mark o80 o330 10,000pcs/reel 4 o13 o21 ID-01 Series l Receptacle : CFX2102-0201F Material and Plating 4.8 1.8 1.08 l Housing : Thermoplastic Resin, Black, 94HB l Contact : Cu Alloy, Sn Plating 1.2 4 l Plug : CFX2302-0201F Material and Plating l Housing : Thermoplastic Resin, White, 94V-0 l Contact : Cu Alloy, Sn Plating 3 1 2.2 5 .4 1 o0 1.8 5