Multilayer Ceramic Chip Capacitors Kyocera's series of Multilayer Ceramic Chip Capacitors are designed to meet a wide variety of needs. We offer a complete range of products for both general and specialized applications, including general-purpose CM series, high-voltage CF series, low profile CT series, DM series for automotive uses, and CA series for arrays. Features e have factories worldwide in order to supply our global customer W bases quickly and efficiently and to maintain our reputation as one of the highest-volume producers in the industry. * All our products are highly reliable due to their monolithic structure of high-purity and superfine uniform ceramics and their integral internal electrodes. * By combining superior manufacturing technology and materials with high dielectric constants, we produce extremely compact components with exceptional specifications. * Our stringent quality control in every phase of production from material procurement to shipping ensures consistent manufacturing and super quality. * Kyocera components are available in a wide choice of dimensions, temperature characteristics, rated voltages, and terminations to meet specific configurational requirements. * Pb Free RoHS Compliant CM CA series General CT series Low Profile series Arrays Multilayer Ceramic Chip Capacitors DM series Automotive CF series High-Voltage Structure External Termination Electrodes Internal Electrodes (Pd, Pd/ Ag or Ni) Dielectric Ceramic Layer Temperature compensation: Titanate family Zirconate family High dielectric constant: Barium Titanate family Tape and Reel Nickel Barrier Termination Products Ag or Cu or CuNi Ni Plating Sn Plating Bulk Cassette Please contact your local AVX, Kyocera sales office or distributor for specifications not covered in this catalog. Our products are continually being improved. As a result, the capacitance range of each series is subject to change without notice. Please contact an sales representative to confirm compatibility with your application. Multilayer Ceramic Chip Capacitors Kyocera Ceramic Chip Capacitors are available for different applications as classified below: Series Dieletric Options Typical Applications Features Terminations Available Size CM C0G (NP0) X5R X7R *X6S *X7S Y5V General Purpose Wide Cap Range Nickel Barrier 0201, 0402, 0603 0805, 1206, 1210 1812 CF C0G (NP0) X7R High Voltage & Power Circuits High Voltage 250VDC, 630VDC 1000VDC, 2000VDC 3000VDC, 4000VDC Nickel Barrier 0805, 1206, 1210 1812, 2208, 1808 2220 CT C0G (NP0) X5R X7R Y5V PLCC (Decoupling) Low Profile Nickel Barrier 0201, 0402, 0603 0805, 1206, 1210 DM X7R Automotive Thermal shock Resistivity High Reliability Nickel Barrier 0603, 0805, 1206 CA C0G (NP0) X5R, X7R Digital Signal Pass line Reduction in Placing Costs Nickel Barrier 0405, 0508 * option Multilayer Ceramic Chip Capacitors Dimensions W L T P P to P P External Electrode Dimensions Tape & Reel Size EIA CODE JIS CODE 03 0201 05 Dimensions (mm) L W T max. P min. P max. P to P min. 0603 0.60.03 0.30.03 0.33 0.13 0.23 0.20 0402 1005 1.00.05 0.50.05 0.55 0.15 0.35 0.30 105 0603 1608 1.60.10 0.80.10 0.90 0.20 0.60 0.50 21 0805 2012 2.00.10 1.250.10 1.35 0.20 0.75 0.70 316 1206 3216 3.20.20 1.600.15 1.75 0.30 0.85 1.40 32 1210 3225 3.20.20 2.500.20 2.70 0.30 1.00 1.40 42 1808 4520 4.50.20 2.000.20 2.20 0.15 0.85 2.60 43 1812 4532 4.50.30 3.200.20 3.00 0.30 1.10 2.00 52 2208 5720 5.70.40 2.000.20 2.20 0.15 0.85 4.20 55 2220 5750 5.70.40 5.000.40 2.70 0.30 1.40 2.50 (Thickness) depends on capacitance value. T Standard thickness is shown on the appropriate product pages. * CA series (please refer applicable page) * As for the size of the product specified individually, please contact us. * Bulk Cassette Size EIA CODE JIS CODE L W T 05 0402 1005 1.00.05 0.50.05 105 0603 1608 1.60.07 21 0805 2012 2.00.1 Note) Regarding support for Bulk cases, please contact us for further information. P P to P min. max. min. 0.50.05 0.15 0.35 0.30 0.80.07 0.80.07 0.20 0.60 0.50 1.250.1 1.250.1 0.20 0.75 0.70 Multilayer Ceramic Chip Capacitors Ordering Information KYOCERA PART NUMBER: CM 21 X7R 104 SERIES CODE = = = = CM CF CT DM General Purpose High Voltage Low Profile Automotive CA = Capacitor Arrays SIZE CODE SIZE 03 = 05 = 105 = F12 = EIA (JIS) 0201 (0603) 0402 (1005) 0603 (1608) 0508 (1220)/ 4cap SIZE 21 = 316 = 32 = 42 = 43 = EIA (JIS) 0805 (2012) 1206 (3216) 1210 (3225) 1808 (4520) 1812 (4532) SIZE 52 = 55 = D11 = D12 = EIA (JIS) 2208 (5720) 2220 (5750) 0405 (1012)/ 2cap 0508 (1220)/ 2cap DIELECTRIC CODE CODE EIA CODE CG = C0G (NPO) X7S = X7S (Option) X5R = X5R X6S = X6S (Option) X7R = X7R Y5V = Y5V Negative temperature coefficient dielectric types are available on request. CAPACITANCE CODE Capacitance expressed in pF. 2 significant digits plus number of zeros. For Values < 10pF, Letter R denotes decimal point, 1.5pF eg. 100000pF = 104 = 1R5 0.5pF 0.1mF = 104 = R50 4700pF = 472 100mF = 107 TOLERANCE CODE A = 0.05pF (option) B = 0.1pF (option) C = 0.25pF D = 0.5pF F = 1pF G = 2% (option) J = 5% K = 10% M = 20% Z = -20 to +80% VOLTAGE CODE 04 06 10 16 25 35 50 = = = = = = = 4VDC 6.3VDC 10VDC 16VDC 25VDC 35VDC 50VDC 100 250 400 630 = = = = 100VDC 250VDC 400VDC 630VDC 1000 2000 3000 4000 = = = = 1000VDC 2000VDC 3000VDC 4000VDC TERMINATION CODE A = Nickel Barrier PACKAGING CODE B = Bulk C = Bulk Cassette (option) T = 7" Reel Taping & 4mm Cavity pitch OPTION Thickness max. value is indicated in CT series EX. 125 1.25mm max. 095 0.95mm max. L = 13" Reel Taping & 4mm Cavity pitch H = 7" Reel Taping & 2mm Cavity pitch N = 13" Reel Taping & 2mm Cavity pitch K 50 A T Multilayer Ceramic Chip Capacitors Temperature Characteristics and Tolerance High Dielectric Constant DC max. Temperature Range EIA Dielectric X5R -55 to 85C X7R -55 to 125C *X7S -55 to 125C *X6S -55 to 105C Y5V -30 to 85C 15% 22% -82 to +22% * option Temperature Compensation Type Dielectric Value (pF) C0G (NPO) 0 ppm/ C UD (N750) -750 ppm/ C SL +350 to -1000ppm/ C 0.5 to 2.7 CK UK SL 3.0 to 3.9 CJ UJ SL 4.0 to 9.0 CH UJ SL 10 CG UJ SL K = 250ppm/ C, J = 120ppm/ C, H = 60ppm/ C, G = 30ppm/ C e.g. CG = 030ppm/ C Note: All parts of C0G will be marked as "CG" but will conform to the above table. Available Tolerances E Standard Number Dielectric materials, capacitance values and tolerances are available in the following combinations only: EIA Dielectric Tolerance Capacitance C=0.25pF D=0.50pF E3 *1 <10pF 1.0 1.0 1.5 F=1pF COG *3 A=0.05pF <0.5pF B=0.1pF 5pF *3 G=2% J=5% K=10% *3 X6S *3 X7S X5R X7R Y5V *2 K=10% M=20% Z=-20% to +80% E6 10pF 2.2 2.2 E12 Series 3.3 E6 Series E3 Series Note: *1 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF, 2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF *2 J = 5% for X7R (X5R) is available on request. *3 option 4.7 4.7 6.8 E12 E24 (Option) 1.0 1.0 1.1 1.2 1.2 1.3 1.5 1.5 1.6 1.8 1.8 2.0 2.2 2.2 2.4 2.7 2.7 3.0 3.3 3.3 3.6 3.9 3.9 4.3 4.7 4.7 5.1 5.6 5.6 6.2 6.8 6.8 7.5 8.2 8.2 9.1 CF Series High Voltage Applications [RoHS Compliant Products] Features Perform less than 1 fit failure ratio by high voltage durability and high reliability which has optimized internal electrode structure based on designing of safety. Equivalent circuit Internal structure General Spec. Mid-voltage range Straight structure Straight structure Dual cascade Triple cascade Mid-voltage range (Straight structure) Enough break-down voltage margin by taking suitable dielectric thickness for individual rated voltage. * * Mid-voltage range (Dual cascade structure) Realize high voltage performance by series connection of two multilayer capacitor units in a MLCC to divide applied voltage into two. High durability to surging voltage is guaranteed. Mid-voltage range (Triple cascade structure) Realize high voltage performance by series connection of three multilayer capacitor units in a MLCC to divide applied voltage into three. Excellent safety is secured. * The multi cascade structure is a safety design to avoid short circuit failure. Applications * * oft modem/ Isolation circuit (Satisfied safety capacitor) S Camera/ Strobe circuit, Serge Killing, Trigger Circuit * * CD Back light Inverter, Ballast Capacitor L Power Circuit/ DC-DC Converter, Snubber Circuit Special specification for individual application A suitable guaranteeing specification will be examined to satisfy customer's application, such as for AC voltage application. * Information of usage condition will be necessary to be examined. Custom specification will be available according to your request. Ex. Specification relaiting to AC voltage. * Using condition shall be confirmed. Temperature Compensation Dielectric Size (EIA Code) CF21 (0805) CF316 (1206) CF32 (1210) CF42 (1808) CF43 (1812) CF52 (2208) Temperature Characteristics CD CD CD CD CD CD Rated Voltage (VDC) Capacitance (pF) 250 630 1000 A D D R50 1R0 1R5 100 120 101 121 102 0.5 1.0 1.5 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 CD E6 series: Standard E12 series: Option 2000 630 1000 2000 1000 2000 3000 J J J 1000 2000 3000 4000 D K E F B K F E E K K G E G M F M M CF Series High Voltage Applications [RoHS Compliant Products] X7R Dielectric Size (EIA Code) CF21 (0805) Rated Voltage (VDC) Capacitance (pF) 250 101 151 102 152 103 153 104 154 105 100 150 220 330 470 680 1000 1500 2200 3300 4700 6800 10000 15000 22000 33000 47000 68000 100000 150000 220000 330000 470000 680000 1000000 CF316 (1206) 250 CF32 (1210) 630 1000 D D B 250 630 CF42 (1808) 1000 1000 2000 CF43 (1812) 250 630 1000 CF55 (2220) 2000 250 630 1000 2000 K E F E C D E M K F L M N F F E M F G F L L G L M N M L H M M N L N X7R E3 series: Standard, E6 series: Option Size 21, 316, 32 Thickness (mm) A B 0.60.1 C D 42, 52 E F 0.850.1 1.050.1 1.150.1 1.250.1 1.60.15 G H 2.00.2 2.50.2 J 43, 55 K L M N 1.6 max. 2.2 max. 2.0 max. 2.5 max. 2.8 max. Taping (180 dia reel) 4kp (P8) 4kp (P8) 3kp (E8) 3kp (E8) 3kp (E8) 2.5kp (E8) 2kp (E8) 1kp (E8) 2kp (E12) 2kp (E12) 1kp (E12) 0.5kp (E12) 0.5kp (E12) Taping (330 dia reel) 10kp (P8) 10kp (P8) 10kp (E8) 10kp (E8) 10kp (E8) 5kp (E8) 5kp (E8) -- -- -- -- -- -- Taping denotes the quantity packaged per reel (kp means 1000 pcs.). P8 in parenthesis denotes 8mm width paper tape; E8 denotes 8-mm width plastic tape; E12 denotes 12-mm width plastic tape. Safety Regulations Satisfied Capacitors Features * * Guarantee 2.5kV impulse (Y3), and 5.0kV impulse (Y2). Realize smaller and lower profile ones, comparing conventional leaded capacitors. Applications * Soft Modem/ Isolation CLASS Y2 Temperature Compensation Dielectric CLASS Y3 (+2.5kV Impulse) Temperature Compensation Dielectric CLASS Y3 (+2.5kV Impulse) X7R Dielectric Size (EIA Code) CF42 (1808) Size (EIA Code) CF42 (1808) Size (EIA Code) CF42 (1808) Rated Voltage (VDC) Capacitance (pF) 3000 Rated Voltage (VDC) Capacitance (pF) 3000 Rated Voltage (VDC) Capacitance (pF) 2000 5.0 6.0 7.0 8.0 9.0 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 100 120 101 121 J 100 120 K 101 121 5.0 6.0 7.0 8.0 9.0 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 101 151 J 102 152 103 K Thickness and package quantity Size Thickness (mm) Taping (180 dia reel) Taping (330 dia reel) 42 J K 1.6 max. 2kp (E12) -- 2.2 max. 2kp (E12) -- Taping denotes the quantity packaged per reel (kp means 1000 pcs.). P8 in parenthesis denotes 8mm width paper tape; E8 denotes 8-mm width plastic tape; E12 denotes 12-mm width plastic tape. 100 150 220 330 470 680 1000 1500 2200 3300 4700 6800 10000 K Multilayer Ceramic Chip Capacitors Electrical Characteristics Capacitance-Temperature (temperature compensation) Aging (change of capacitance over time) at 1MHz, 1Vrms DCapacitance (%) 5 0 For temperature compensation: 1MHz, 1Vrms/ for high dielectric constant: 1kHZ, 1Vrms 10 C C X7R 0 DCapacitance (%) 10 10 Y5V 20 5 U 10 60 40 20 0 20 40 60 80 100 Initial value should be after 48hr. of Heat treatment. 30 10 120 100 1,000 Capacitance-Temperature (high dielectric constant) X7R, Y5V 100,000 Impedance-Frequency at 1kHz, 1Vrms 20 100 X 7R X7R at 0VDC 0 10 20 Impedance () Capacitance (%) 10,000 Duration (hrs.) Temperature (oC) X7R at RV/ 2 40 60 Y5V at 0VDC X7 1 X7 R 0.1 X7R R1 1 F R0 .1 1 at 1Vrms X7 0.0 000 pF C F C 10 C 10 00 0p C 1p F 10 pF F pF F 10 F 0.01 80 Y5V at RV/ 2 100 60 40 20 0 20 40 60 80 100 0.001 0.1 120 Temperature (oC) 1 DC Bias 20 Rated at 25V: C, X7R, Y5V For temperature compensation at 1MHz, 1Vrms For high dielectric constant at 1kHz, 1Vrms 25 C 1,000 10,000 For temperature compensation: 1MHz For high dielectric constant: 1kHz Rated at 25V: C, X7R, Y5V 20 DCapacitance (%) X7R -20 C/ C (%) 100 AC Voltage 0 -40 -60 Y5V 15 Y5V X7R 10 5 0 -80 -100 10 Frequency (MHz) C 5 0 5 10 15 20 25 VDC Please verify individual characteristics at the design stage to ensure total suitability. 10 1 2 3 AC Voltage (Vrms) 4 5 Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test Conditions and Specifications for Temperature Compensation type (CD to UD * SL Characteristics) Test Items Specifications (C: nominal capacitance) Capacitance Value Within tolerance Q C30pF: Q1000 C<30pF: Q400+20C Test Conditions Capacitance C1000pF C>1000pF Fire 1MHz10% 1kHz10% Dielectric resistance (*1) No problem observed Appearance No problem observed Microscope (10xmagnification) Termination strength No problem observed Bending strength No mechanical damage at 1mm bent Apply a sideward force of 500g (5N) mounted sample. Glass epoxy PCB (t=1.6mm); fulcrum Spacing: 90mm; for 10 seconds. Soldering heat resistance 0.5 to 5Vrms Measured after the rated voltage is applied for 1 minute at normal room temperature and humidity. (*2) Insulation resistance (IR) (*1) 10,000MW or 500MW * F min., whichever is less Vibration test Vol (*3) Appearance No significant change is detected DC Within tolerance Q C30pF: Q1000 C<30pF: Q400+20C Appearance No significant change is detected DC 2.5% or 0.25pF max., whichever is larger Q C30pF: Q1000 C<30pF: Q400+20C IR (*1) 10,000MW or 500MW * F min., whichever is smaller Withstand voltage(*1) Resists without problem Apply 3 times of the rated voltage for 1 to 5 seconds. (*4) to a PCB- Vibration frequency: 10 to 55 (Hz) Amplitude: 1.5mm Sweeping condition: 105510Hz/ min. In X, Y and Z directions: 2 hours each Total 6 hours Soak the sample in 260C5C solder for 100.5 seconds and place in a room at normal temperature and humidity; measure after 242 hours. (Preheating Conditions) Order 1 2 Temperature 80 to 100C 150 to 200C Time 2 minutes 2 minutes Soaking Condition Solderability Temperature cycle Load humidity test (*5) High- temperature with loading Sn63 Solder Sn-3Ag-0.5Cu Solder coverage: 90% min. Appearance No significant change is detected DC 2.5% or 0.25pF max., whichever is larger Q C30pF: Q1000 C<30pF: Q400+20C IR (*1) 10,000MW or 500MW * F min., whichever is smaller Withstand voltage(*1) Resists without problem Appearance No significant change is detected DC 7.5% or 0.75pF max., whichever is larger Q C30pF: Q200 C<30pF: Q100+10C/ 3 IR (*1) 500MW or 25MW * F min., whichever is smaller Appearance No significant change is detected DC 3% or 0.3pF max., whichever is larger Q C30pF: Q350 10pFC<30pF: Q275+5C/ 2 C<10pF: Q200+10C IR (*1) 1,000MW or 50MW * F min., whichever is smaller *1The charge and discharge current of the capacitor must not exceed 50mA. *2Apply 500V for 1 minute in case the rated voltage is 630V or higher. *3For the CF series, use 1.5 times when the rated voltage is 250V; use/ 1.2 times when the rated voltage exceeds 630V. 2355C 2455C 20.5 sec. 30.5 sec. (Cycle) Normal room temperature (3 min.) Lowest operation temperature (30 min.) Normal room temperature (3 min.) Highest operation temperature (30 min.) After five cycles, measure after 242 hours. After appling rated voltage for 500+24/ -0 hours in pre-condition at 402C, humidity 90 to 95%RH allow parts to stabilize for 484 hours, at room temperature before making measurements. After applying (*3) twice of the rated voltage at a temperature of 1253C for 1000+48/ -0 hours, measure the sample after storing 242 hours. *42N at 0201 Size *5Except CF series. Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test Conditions and Specifications for High Dielectric Type (X5R, X7R, Y5V) Test Items Capacitance Value Specifications X7R/ X5R Within tolerance 2.5% max., 3.5% max. (*1), 5.0% max. (*2) 7.0% max. (*3), 7.5% max. (*4) tand (%) Test Conditions Y5V 5.0% max., 7.0% max. (*5) 9.0% max. (*6), 12.5% max. (*7) Do previous treatment (*8, *10) Capacitance Fire C10mF C>10mF Vol 1kHz10% 1.00.2Vrms 120Hz10% 0.50.2Vrms Insulation resistance (IR) (*11) 10,000MW or 500MW * F min., whichever is less Measured after the rated voltage is applied for 1 minute at normal room temperature and humidity. (*12) Dielectric resistance (*11) No problem observed (*13) Appearance No problem observed Microscope (10xmagnification) Termination strength (*14) No problem observed Bending strength test (*14) No problem observed at 1mm bent Apply a sideward force of 500g (5N) (*15) to a PCB-mounted sample. Glass epoxy PCB (*03, 05 type and CA Series: T=0.8mm); fulcrum Spacing: 90mm; for 10 seconds. Vibration test Soldering heat resistance Appearance No significant change is detected DC Within tolerance tand (%) Satisfies the initial value Appearance No significant change is detected DC Within 7.5% Within 20% tand (%) Satisfies the initial value IR (*11) 10,000MW or 500MW * F min., whichever is smaller Withstand voltage (*11) Resists without problem Apply 2.5 times of the rated voltage for 1 to 5 seconds. Vibration frequency: 10 to 55 (Hz) Amplitude: 1.5mm Sweeping condition: 105510Hz/ min. In X, Y and Z directions: 2 hours each Total 6 hours Do previous treatment (*8) Soak the sample in 260C5C solder for 100.5 seconds and place in a room at normal temperature and humidity; measure after 484 hours. (Preheating Conditions) Order 1 2 Temperature 80 to 100C 150 to 200C Time 2 minutes 2 minutes Soaking Condition Solderability Temperature cycle Load humidity test (*16) Appearance DC No significant change is detected Within 7.5% Within 20% tand (%) Satisfies the initial value IR (*11) 10,000MW or 500MW * F min., whichever is smaller 2355C 2455C 20.5 sec. 30.5 sec. Do previous treatment (*8) (Cycle) Normal room temperature (3 min.) Lowest operation temperature (30 min.) Normal room temperature (3 min.) Highest operation temperature (30 min.) Withstand voltage (*11) Resists without problem After five cycles, measure after 484hours. Appearance Do previous treatment (*9) After applying rated voltage at 402C and humidty 90 to 95%RH, for 500+24/ -0 hours and keep at room condition for 484 hours then measure and check the specification limits. DC tand (%) High- temperature with loading Sn63 Solder Sn-3Ag-0.5Cu Solder coverage: 90% min. No significant change is detected Within 12.5% Within 30% 200% max. of initial value 150% max. of initial value IR (*11) 500MW or 25MW * F min., whichever is smaller Appearance No significant change is detected DC tand (%) IR (*11) Within 12.5% Within 30% 200% max. of initial value 150% max. of initial value 1,000MW or 50MW * F min., whichever is smaller *1X7R 16V/ 25V type. *2Apply to X5R16V/ 25V type, X7R 6.3V/ 10V type. *3Apply to X5R 10V type. *4Apply to X5R 4V and 6.3V type. *5Apply to 25V series of CM105Y5V154 over, CM21Y5V105 over, 316Y5V155 over. *6Apply to Y5V 16V type, CM32Y5V335 to 106 (25V Type). *7Apply to Y5V 6.3V/ 10V type. Apply 16% max. to CM21Y5V106/ CM316Y5V226. *8Keep specimen at 150C+0/ -10C for one hour, leave specimen at room ambient for 484 hours. *9Apply the same test condition for one hour, then leave the specimen at room ambient for 484 hours. Do previous treatment (*9) After applying twice (*17) of the rated voltage at the highest operating temperature for 1000+48/ -0 hours, measure the sample after storing 484 hours. *10Measurement condition 1kHz, 1Vrms for Y5V, C<47mF type. *11The charge/ discharge current of the capacitor must not exceed 50mA. *12For the CF series over 630V, apply 500V for 1 minute at room ambient. *13Use 1.5 times when the rated voltage is 250V or over. Use 1.2 times when the rated voltage is 630V or over. *14Exclude CT series with thickness of less than 0.66mm and CA series. *152N at 0201 Size *16Except CF series. *17Use 1.5 times when the rated voltage is 4V/ 6.3V/ 10V/ 250V and 100V (32X7R474/ 43X7R105/ 55X7R105). Use 1.2 times when the rated voltage is 630V or over. * The above test conditions and standards do not apply to products with optional specifications. Multilayer Ceramic Chip Capacitors Packaging Options Tape and Reel * Reel Reel W2 E 13-inch Reel (CODE: L, N) Code Reel 7-inch Reel (CODE: T, H) C B D R (Unit: mm) Code Reel 7-inch Reel (CODE: T, H) 13-inch Reel (CODE: L, N) A W1 A B 180 +0 -2.0 f60 min. 3302.0 f1001.0 E W1 C D 130.5 210.8 W2 R 16.5 max. 1.0 10.01.5 2.00.5 9.51.0 * Carrier tape width 8mm. For size 42 (1808) or over, Tape width 12mm and W1: 141.5, W2: 18.4mm max. Carrier Tape F=2mm (03, 05, 105 Type) Punched rectangular hole to hold capacitor J Feed Hole (Unit: mm) (Paper) E Type A B F 03 (0.6x0.3) 0.370.03 0.670.03 2.00.05 A D C B F F 05 (1.0x0.5) 0.650.1 1.150.1 2.00.05 105 (1.6x0.8) 1.00.2 1.80.2 4.00.1 D11 (1.37x1.0) 1.150.2 1.550.2 4.00.1 D12 (1.25x2.0) 1.50.2 2.30.2 4.00.1 F12 (1.25x2.0) 1.50.2 2.30.2 4.00.1 21 (2.0x1.25) 1.50.2 2.30.2 4.00.1 E 316 (3.2x1.6) 2.00.2 3.60.2 4.00.1 D 32 (3.2x2.5) 2.90.2 3.60.2 4.00.1 42 (4.5x2.0) 2.40.2 4.90.2 4.00.1 43 (4.5x3.2) 3.60.2 4.90.2 8.00.1 52 (5.7x2.0) 2.40.2 6.00.2 4.00.1 55 (5.7x5.0) 5.30.2 6.00.2 8.00.1 H 03 Type: 0.5 max. 05 Type: 0.75 max. 105 Type: 1.1 max. F=4mm (105, D11, D12, F12, 21, 316, 32, 42, 52 Type) (Plastic) Punched rectangular hole to hold capacitor J Feed Hole A C B F H (Paper) 2.8 max. 1.0 +0.2 -0 G 0.6 max. Holes only for plastic carrier tape. 1.1 max. F=8mm (43, 55 Type) (Plastic) Punched rectangular hole to hold capacitor Feed Hole J 2.8 max. E (Unit: mm) F A Carrier Tape C D 8.0 0.3 3.5 0.05 E G 1.75 0.1 2.0 0.05 H J D C B F H G Bulk Cassette 2.0 0.05 1.0 +0.2 -0 4.0 0.1 0.6 max. (Unit: mm) 12 36 Slider Shutter 110 Connection Area 8.0 0.1 8mm Paper 8mm Plastic 12mm Plastic 12.0 0.3 5.5 0.05 4.0 1.5 0.1 +0.1/ -0 Multilayer Ceramic Chip Capacitors Precautions Circuit Design 1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior performance or cause a short, open, smoking, or flaming to occur, etc. 2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical devices; devices which are highly public orientated; and devices which demand a high standard of liability. Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate grave consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high reliability design different from that of general purpose capacitors. 3. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications. Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and specifications is exceeded, the capacitor's insulation resistance may deteriorate, power may suddenly surge and short-circuit may occur. The capacitor has a loss, and may self-heat due to equivalent series resistance when alternating electric current is passed therethrough. As this effect becomes especially pronounced in high frequency circuits, please exercise caution. When using the capacitor in a (self-heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for usage. Also, please make certain temperature rises remain below 20C. 4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the rated voltage when AC voltage is super-imposed to the DC voltage. In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage. Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case situations, may cause the capacitor to smoke or flame. 5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage, even though it is within the rated voltage, please inquire to the manufacturer. In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is within the rated voltage, it is possible capacitor reliability will deteriorate. 6. It is a common phenomenon of high-dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage. Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load voltage at the time of operation. 7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in the catalog and specifications. In addition, it is a common piezo phenomenon of high dielectric products to have some voltage due to vibration or to have noise due to voltage change. Please contact sales in such case. 8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the respective product in order that the assembled product function appropriately. 9. Please contact us upon using conductive adhesives. Storage 1. If the component is stored in minimal packaging (a heat-sealed or chuck-type plastic bag), the bag should be kept closed. Once the bag has been opened, reseal it or store it in a desiccator. 2. Keep storage place temperature +5 to +35 degree C, humidity 45 to 70% RH. 3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be effected. 4. Precautions 1) to 3) apply to chip capacitors packaged in carrier tapes and bulk cases. 5. The solderability is assured for 12 months from our shipping date (six months for silver palladium) if the above storage precautions are followed. 6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas. Multilayer Ceramic Chip Capacitors Surface Mounting Information Dimensions for recommended typical land Land Pattern Sample capacitor c b a Soldering resist Standard (Unit: mm) Size LxW a b 03 0.6x0.3 0.20 to 0.30 0.25 to 0.35 0.30 to 0.40 c 05 1.0x0.5 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60 105 1.6x0.8 0.70 to 1.00 0.80 to 1.00 0.60 to 0.80 21 2.0x1.25 1.00 to 1.30 1.00 to 1.20 0.80 to 1.10 316 3.2x1.6 2.10 to 2.50 1.10 to 1.30 1.00 to 1.30 32 3.2x2.5 2.10 to 2.50 1.10 to 1.30 1.90 to 2.30 42 4.5x2.0 2.50 to 3.20 1.80 to 2.30 1.50 to 1.80 43 4.5x3.2 2.50 to 3.20 1.80 to 2.30 2.60 to 3.00 52 5.7x2.0 4.20 to 4.70 2.00 to 2.50 1.50 to 1.80 55 5.7x5.0 4.20 to 4.70 2.00 to 2.50 4.20 to 4.70 * CA series: Please refer applicable page. When mounting the capacitor to the substrate, it is important to consider carefully that the amount of solder (size of fillet) used has a direct effect upon the capacitor once it is mounted. a) The greater the amount of solder, the greater the stress to the elements. As this may cause the substrate to break or crack, it is important to establish the appropriate dimensions with regard to the amount of solder when designing the land of the substrate. b) In the situation where two or more devices are mounted onto a common land, separate the device into exclusive pads by using soldering resist. Automotive Series (Unit: mm) Size LxW 105 1.6x0.8 0.60 to 0.90 0.80 to 1.00 0.70 to 1.00 a b c 21 2.0x1.25 0.90 to 1.20 0.80 to 1.20 0.90 to 1.40 316 3.2x1.6 1.40 to 1.90 1.00 to 1.30 1.30 to 1.80 Ideal Solder Thickness T/ 3 to T/ 2 Chip Capacitor T Solder PCB Typical mounting problems Item Not recommended example Recommended example/ Separated by solder Solder resist Multiple parts mount Solder resist Mount with leaded parts Leaded parts Soldering iron Wire soldering after mounting Wire Solder resist Overview Leaded parts Solder resist Solder resist Multilayer Ceramic Chip Capacitors Surface Mounting Information Mounting Design The chip could crack if the PCB warps during processing after the chip has been soldered. Recommended chip position on PCB to minimize stress from PCB warpage (Not recommended) (Ideal) Actual Mounting 1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking. 2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf. 3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture. Crack Support pin 4) Bottom position of pick up nozzle should be adjusted to the top surface of a substrate which camber is corrected. 5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case. 6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors. Resin Mold 1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a low shrinkage resin. 2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin. 3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage. Such gases may crack the chip capacitor or damage the device itself. Multilayer Ceramic Chip Capacitors Surface Mounting Information Soldering Method 1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature difference (Delta T) to within 130 degree Celsius. 2) The product size 1.0x0.5mm to 3.2x1.6mm can be used in reflow and wave soldering, and the product size of over 3.2x2.5mm, 0.6x0.3mm, and capacitor arrays can be used in reflow. Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution. 3) Please see our recommended soldering conditions. 4) In case of using Sn-Zn Solder, please contact us in advance. Recommended Temperature Profile (62Sn Solder) Reflow Recommended Temperature Profile (Sn-3Ag-0.5Cu) Reflow Peak temperature 230C5C 15 seconds maximum 300 250C5C 5 to 10 sec. max. Preheat 300 Temperature 200 T 150 100 More than180C, 40 seconds maximum 50 250 Temperature Cool at normal room temperature after removing from furnace. 250 200 150 1 to 3C/ sec. 170 to 180C 100 220C max. 90 sec. max. 50 0 0 60 seconds Preheat 9030 sec. 60 seconds Minimize soldering time. Ensure that the temperature difference (T) does not exceed 150C. Ensure that the temperature difference (T) does not exceed 130C for 3.2x2.5mm size or larger. MLCC can withstand the above reflow conditions up to 3 times. Wave Minimize soldering time. Ensure that allowable temperature difference does not exceed 150C. Ensure that allowable temperature difference does not exceed 130C for 3.2x2.5mm size or larger. Wave 300 Preheat 300 Cool at normal room temperature 250 Temperature Temperature 230C to 260C 150 Cool at normal room temperature 250 T 200 Preheat 100 T 200 245C to 260C 150 100 50 0 60 to 120 sec. 60 to 120 sec. 5 sec. max. Ensure that the chip capacitor is preheated adequately. Ensure that the temperature difference (T) does not exceed 150C. Cool naturally after soldering. Wave soldering is not applicable for chips with size of 3.2x2.5mm or larger. 5 sec. max. Ensure that the chip capacitor is preheated adequately. Ensure that the temperature difference (T) does not exceed 150C. Cool naturally after soldering. Wave soldering is not applicabel for chips with size of 3.2s2.5mm or larger. Sodering iron 1) Temperature of iron chip 2) Wattage 3) Tip shape of soldering iron 4) Soldering Time 380C max. 80W max. f3.0mm max. 3 sec. max. 5) Cautions a) Pre-heating is necessary Rapid heating must be avoided. Delta T150C b) Avoid direct touching to capacitors. c) Avoid rapid cooling after soldering. Natural cooling is recommended.