EC2600TS-12.500M EC26 00 TS -12.500M Series RoHS Compliant (Pb-free) 3.3V 4 Pad 5mm x 7mm Ceramic SMD LVCMOS Oscillator Frequency Tolerance/Stability 100ppm Maximum Operating Temperature Range -10C to +70C Pb RoHS Nominal Frequency 12.500MHz Pin 1 Connection Tri-State (High Impedance) Duty Cycle 50 10(%) ELECTRICAL SPECIFICATIONS Nominal Frequency 12.500MHz Frequency Tolerance/Stability 100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year Aging at 25C, Shock, and Vibration) Operating Temperature Range -10C to +70C Supply Voltage 3.3Vdc 10% Input Current 10mA Maximum Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH=-8mA) Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL=+8mA) Rise/Fall Time 5nSec Maximum (w/15pF Load), 7nSec Maximum (w/30pF Load) (Measured at 20% to 80% of waveform) Duty Cycle 50 10(%) (Measured at 50% of waveform) Load Drive Capability 30pF Maximum Output Logic Type CMOS Pin 1 Connection Tri-State (High Impedance) Tri-State Input Voltage (Vih and Vil) +0.7Vdd Minimum or No Connect to Enable Output, +0.3Vdd Maximum to Disable Output (High Impedance) Standby Current 10A Maximum (Disabled Output: High Impedance) RMS Phase Jitter 1pSec Maximum (12kHz to 20MHz offset frequency) Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev U 8/12/2010 | Page 1 of 5 EC2600TS-12.500M MECHANICAL DIMENSIONS (all dimensions in millimeters) 7.00 0.15 5.08 0.15 4 3 MARKING ORIENTATION 5.00 0.15 2.60 0.15 2 1 1.2 0.2 1.4 01 3.68 0.15 PIN CONNECTION 1 Tri-State 2 Ground/Case Ground 3 Output 4 Supply Voltage LINE MARKING 1 ECLIPTEK 2 12.500M 3 XXYZZ XX=Ecliptek Manufacturing Code Y=Last Digit of the Year ZZ=Week of the Year 1.6 +0.2/-0.5 Suggested Solder Pad Layout All Dimensions in Millimeters 2.0 (X4) 2.2 (X4) Solder Land (X4) 2.88 1.81 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev U 8/12/2010 | Page 2 of 5 EC2600TS-12.500M CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% of Waveform OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% of Waveform 20% of Waveform VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 Test Circuit for CMOS Output Frequency Counter Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) No Connect or Tri-State Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Rev U 8/12/2010 | Page 3 of 5 EC2600TS-12.500M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Rev U 8/12/2010 | Page 4 of 5 EC2600TS-12.500M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Rev U 8/12/2010 | Page 5 of 5