CRS04 Toshiba Schottky Barrier Rectifier Schottky Barrier Type CRS04 Switching Type Power Supply Applications Portable Equipment Battery Applications Unit: mm * Forward voltage: VFM = 0.49 V (max) * Average forward current: IF (AV) = 1.0 A * Repetitive peak reverse voltage: VRRM = 40 V * Suitable for compact assembly due to small surface-mount package "S-FLATTM" (Toshiba package name) Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Repetitive peak reverse voltage VRRM 40 V Average forward current IF (AV) 1.0 (Note) A IFSM 20 (50 Hz) A JEDEC Junction temperature Tj -40~150 C JEITA Storage temperature Tstg -40~150 C TOSHIBA Peak one cycle surge forward current (non-repetitive) Note : 3-2A1A Weight: 0.013 g (typ.) T = 31C: Rectangular waveform (a = 180C), VR = 20 V Glass-epoxy substrate (substrate size: 50 mm 50 mm, soldering land: 6 mm 6 mm) Electrical Characteristics (Ta = 25C) Characteristics Peak forward voltage Repetitive peak reverse current Junction capacitance Symbol Test Condition Thermal resistance (junction to lead) Typ. Max VFM (1) IFM = 0.1 A 3/4 0.395 3/4 VFM (2) IFM = 0.7 A 3/4 0.475 0.49 VFM (3) IFM = 1.0 A 3/4 0.51 3/4 IRRM (1) VRRM = 5 V 3/4 0.6 3/4 IRRM (2) VRRM = 40 V 3/4 3/4 100 VR = 10 V, f = 1.0 MHz 3/4 47 3/4 3/4 3/4 70 Cj Device mounted on a ceramic board Thermal resistance (junction to ambient) Min Rth (j-a) (soldering land: 2 mm 2 mm) Device mounted on a glass-epoxy board (soldering land: 6 mm 6 mm) 3/4 Rth (j-) 1 Unit V mA pF C/W 3/4 3/4 140 3/4 3/4 20 C/W 2002-04-01 CRS04 Marking Following Indicates the Date of Manufacture Product no. (abbr.) 0 1 2 3 4 5 6 7 8 9 Lot number S4 Cathode mark Month of manufacture January to December are denoted by letter A to L respectively. Year of manufacture Last decimal digit of the year of manufacture Standard Soldering Pad Unit: mm 1.2 1.2 2.8 Handling Precaution Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier products. This current leakage and improper operating temperature or voltage may cause thermal runaway. Please take forward and reverse loss into consideration when you design. 2 2002-04-01 CRS04 iF - vF PF (AV) - IF (AV) 10 Average forward power dissipation PF (AV) (W) Instantaneous forward current iF (A) 0.8 Tj = 150C 1 125C 75C 0.1 25C 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 Instantaneous forward voltage VF 0.6 Maximum allowable lead ltemperature Ta max (C) Maximum allowable ltemperature Ta max (C) 120 100 a = 60 DC 60 0 a 360 IF (AV) 20 Conduction angle a VR = 15 V 0 0.0 0.2 0.4 0.6 0.8 1.0 Average forward current 1.2 IF (AV) Conduction angle a 0.2 0.4 0.6 0.8 1.0 Average forward current 140 40 0 a 360 0.1 160 180 Rectangular waveform 0.2 Ceramic substrate (substrate size: 50 mm 50 mm) 120 a = 60 0.3 (V) 160 Rectangular waveform 120 0.4 Ta max - IF (AV) 80 180 0.5 0 0.0 1.4 DC 0.7 1.4 (A) IF (AV) 1.4 1.6 (A) Ta max - IF (AV) Glass-epoxy substrate (substrate size: 50 mm 50 mm, soldering land: 6 mm 6 mm) Rectangular waveform 140 IF (AV) 0 a 360 120 VR = 20 V Conduction angle a 100 80 60 40 20 0 0.0 1.6 1.2 a = 60 0.2 0.4 120 0.6 0.8 Average forward current 180 1.0 1.2 IF (AV) DC 1.4 1.6 (A) rth (j-a) - t Transient thermal impedance rth (j-a) (C/W) 1000 100 10 Device mounted on a ceramic board: Soldering land: 2 mm 2 mm 1 Device mounted on a glass-epoxy board: Soldering land: 6 mm 6 mm 0.1 1 10 100 1000 time t (ms) 10000 100000 3 2002-04-01 CRS04 Surge forward current Cj - VR (non-repetitive) 300 (pF) f = 50 Hz Cj 24 20 Junction capacitance (A) Peak surge forward current IFSM Ta = 25C 28 16 12 8 100 50 30 f = 1 MHz 4 Ta = 25C 10 1 0 1 10 3 I R - Tj (typ.) Average reverse power dissipation PR (AV) (W) Pulse test (mA) 10 30 V 40 V 0.1 20 V 10 V VR = 5 V 0.001 0.0001 0 20 40 60 80 30 50 100 100 Junction temperature Tj 120 140 (V) PR (AV) - VR 0.6 0.01 10 Reverse voltage VR 100 1 5 100 Number of cycles Reverse current IR (typ.) 500 32 0.5 (C) DC VR 0.4 300 Conduction angle a Tj = 150C 240 0.3 180 0.2 120 60 0.1 0 0 160 10 20 Reverse voltage VR 4 (typ.) Rectangular waveform 0 360 30 40 (V) 2002-04-01 CRS04 RESTRICTIONS ON PRODUCT USE 000707EAA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 5 2002-04-01