–1– ACCTB100E 201704-T
ORDERING INFORMATION
For board-to-FPC
A35UH
High Current Connectors
FEATURES
1. 0.6 mm Mated Height with 2.2 mm width.
2. Supports 5A power terminals
3. With power terminal, so number of pins can be reduced
4. “ ” structure provides a slim and
low-profile design resistant to various environmental
conditions.
5. A maximum of 5 A can be supplied to the power
terminals. This allows for a reduction in the number of
power line pins and contributes to space savings.
APPLICATIONS
Multiple connection of power signal between USB and
battery in portable terminals such as smartphones and
tablet PCs
Socket
Header
1.8mm
2.2mm
RoHS compliant
Header
Socket
1.8mm
2.2mm
Power terminals
Specification:
5 A in two locations
Example; Charging current: Max. 5.0 A (0.3 A/pin, Pitch: 0.35 mm)
34 pins signal
terminals used
Product without
power terminals
34 pins signal
terminals can
be reduced.
With power
terminal
5 A power terminals
5.95mm
–5.95mm
New
5D: Socket
6D: Header
Mated height
<Socket>/<Header>
1: 0.6 mm
AXF 21
Number of pins (2 digits)
High current connectors A35UH (0.35mm pitch)
–2– ACCTB100E 201704-T
PRODUCT TYPES
Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Mated height Number of pins Part number Packing
Socket Header Inner carton (1-reel) Outer carton
0.6mm
10 AXF5D1012 AXF6D1012
15,000 pieces 30,000 pieces
12 AXF5D1212 AXF6D1212
16 AXF5D1612 AXF6D1612
20 AXF5D2012 AXF6D2012
24 AXF5D2412 AXF6D2412
30 AXF5D3012 AXF6D3012
34 AXF5D3412 AXF6D3412
40 AXF5D4012 AXF6D4012
44 AXF5D4412 AXF6D4412
50 AXF5D5012 AXF6D5012
60 AXF5D6012 AXF6D6012
70 AXF5D7012 AXF6D7012
Item Specifications Conditions
Electrical
characteristics
Rated current
5.0A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 5 A at total
pin contacts
Rated voltage 30V AC/DC
Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal)
Based on the contact resistance measurement method
specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force 1.300N/pin contacts × pin contacts
Composite removal force 0.165N/pin contacts × pin contacts
Environmental
characteristics
Ambient temperature –55°C to +85°C No icing or condensation.
Storage temperature –55°C to +85°C (product only)
–40°C to +50°C (emboss packing) No icing or condensation.
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C, humidity 90% to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C, saltwater concentration
5%±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
Bath temperature 40°C±2°C, gas concentration 3 ppm ±1
ppm, humidity 75% to 80% R.H.
Lifetime
characteristics Insertion and removal life 30 times Repeated insertion and removal speed of max. 200 times/
hours
Soldering heat resistance The initial specification must be satisfied electrically
and mechanically
Infrared reflow soldering:
Peak temperature: 260°C or less (on the surface of the PC
board around the connector terminals)
Soldering iron: 300°C within 5 sec., 350°C within 3 sec.
Unit weight 60 pin contacts: Socket 0.02g Header 0.01g
Part name Material Surface treatment
Molded portion LCP resin (UL94V-0) —
Contact, Post and
Power terminal Copper alloy
Contact portion:
Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Order Temperature (°C) Time (minutes)
1
2
3
4
–55
85
–55
0
−330
Max. 5
30
Max. 5
+3
0
0
−3
High current connectors A35UH (0.35mm pitch)
–3– ACCTB100E 201704-T
DIMENSIONS (Unit: mm)
Socket (Mated height: 0.6 mm)
Header (Mated height: 0.6 mm)
Socket and Header are mated
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Power
terminal Signal
terminal
Z (Note 1)
Y (Note 1)
(Note 2)
(Note 2)
(Contact and Power terminal)
The degree of terminal flat
0.08
0.59
2.20
A
B±0.1
0.35±0.05
0.12±0.03
1.96
0.60 (Suction face)
C±0.1
(0.55)
0.30±0.03
2.20
0.66
General tolerance: ±0.2
Notes: 1. Since power terminals are built into the body, the Y and Z parts are connected electrically.
2. Excluding the terminal section, a difference may occur in the exposure of the power terminals.
Please do not use this part for product inspection.
Dimension table (mm)
Number of pins/
dimension A B C
10 4.25 1.40 3.45
12 4.60 1.75 3.80
16 5.30 2.45 4.50
20 6.00 3.15 5.20
24 6.70 3.85 5.90
30 7.75 4.90 6.95
34 8.45 5.60 7.65
40 9.50 6.65 8.70
44 10.20 7.35 9.40
50 11.25 8.40 10.45
60 13.00 10.15 12.20
70 14.75 11.90 13.95
CAD Data
A
B±0.1
0.35±0.05
0.12±0.03
The degree of terminal flat
0.46
1.80
1.42
0.80 (Suction face)
(Post and Power terminal)
0.08
Power
terminal
Signal
terminal
(Power terminal)
C±0.1
0.08±0.03
0.48
0.32
1.28
General tolerance: ±0.2
Dimension table (mm)
Number of pins/
dimension A B C
10 3.55 1.40 3.17
12 3.90 1.75 3.52
16 4.60 2.45 4.22
20 5.30 3.15 4.92
24 6.00 3.85 5.62
30 7.05 4.90 6.67
34 7.75 5.60 7.37
40 8.80 6.65 8.42
44 9.50 7.35 9.12
50 10.55 8.40 10.17
60 12.30 10.15 11.92
70 14.05 11.90 13.67
CAD Data
Header
Socket
0.60±0.1
High current connectors A35UH (0.35mm pitch)
–4– ACCTB100E 201704-T
EMBOSSED TAPE DIMENSIONS (Unit: mm)
• Dimension table (Unit: mm)
• Connector orientation with respect to embossed tape feeding direction
Number of pins Type of taping A B C Quantity per reel
Socket Max. 30 Tape I 16.0 7.5 17.4 15,000
34 to 70 Tape I 24.0 11.5 25.4 15,000
Number of pins Type of taping A B C Quantity per reel
Header Max. 34 Tape I 16.0 7.5 17.4 15,000
40 to 70 Tape I 24.0 11.5 25.4 15,000
Type
Direction
of tape progress
Common for A35UH
Note: There is no indication on this product regarding top-bottom or left-right orientation.
• Specifications for taping
In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.
• Specifications for the plastic reel
In accordance with EIAJ ET-7200B.
Leading direction after packaging
(1.75)
(B)
(A )
(2.0) (4.0)4.0
+0.3
−0.1
Tape I
1.5 dia.
+0.1
0
Top cover tape
Embossed carrier tape
Embossed mounting-hole
Taping reel
(C±1)
380 dia.
Label
HeaderSocket
High current connectors A35UH (0.35mm pitch)
–5– ACCTB100E 201704-T
NOTES
1. Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
2. Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of 0.35
mm, 0.4 mm or 0.5 mm.
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures are recommended metal mask patterns. Please use
them as a reference.
• Socket (Mated height: 0.6 mm)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 46%)
• Header (Mated height: 0.6 mm)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Signal terminal opening ratio: 70%)
(Power terminal opening ratio: 77%)
: Insulatin area
: Resist on
pattern
2.60±0.03
0.60±0.03
1.325±0.03
1.04±0.03
1.42±0.03
2.50±0.03
2.18±0.03
(0.73)
(0.38)
0.20±0.03
1.60±0.03
(0.50)
0.20±0.03
0.35±0.03
0.435±0.03
0.28±0.03
12×C0.15
(0.35)
(0.31)
1.325±0.01
0.60±0.01
0.435±0.01
0.24±0.01
0.35±0.01
0.18±0.01
2.50±0.01
2.18±0.01
(0.39)
1.82±0.01
2.60±0.01
1.80±0.01
1.56±0.01
8×C0.15
Please refer to the latest product specifications when
designing your product.
0.35±0.03
0.20±0.03
0.26±0.03
1.045±0.03
1.48±0.03
(0.50)
0.90±0.03
1.20±0.03
2.20±0.03
(0.39)
0.70±0.03
: Insulatin area
: Resist on
pattern
0.20±0.01
0.885±0.01
0.35±0.01
0.18±0.01
1.48±0.01
(0.39)
1.42±0.01
2.20±0.01
0.70±0.01
(0.39)
–1– ACCTB48E 201606-T
For board-to-board/board-to-FPC
About safety Remarks
Regarding the design of devices and PC board patterns
Regarding the selection of the connector placement machine and the mounting
procedures
Notes on Using Narrow pitch Connectors/
High Current Connectors
1) Do not use these connectors beyond
the specification sheets. The usage
outside of specified rated current,
dielectric strength, and environmental
conditions and so on may cause circuitry
damage via abnormal heating, smoke,
and fire.
2) In order to avoid accidents, your
thorough specification review is
appreciated.
Please contact us if your usage is out of
the specifications. Otherwise, Panasonic
Corporation cannot guarantee the quality
and reliability.
3) Panasonic Corporation is consistently
striving to improve quality and reliability.
However, the fact remains that electrical
components and devices generally cause
failures at a given statistical probability.
Furthermore, their durability varies with
use environments or use conditions. In
this respect, please check for actual
electrical components and devices under
actual conditions before use.
Continued usage in a state of degraded
condition may cause the deteriorated
insulation, thus result in abnormal heat,
smoke or firing. Please carry out safety
design and periodic maintenance
including redundancy design, design for
fire spread prevention, and design for
malfunction prevention so that no
accidents resulting in injury or death, fire
accidents, or social damage will be
caused as a result of failure of the
products or ending life of the products.
1) When using the board to board
connectors, do not connect a pair of
board with multiple connectors.
Otherwise, misaligned connector
positions may cause mating failure or
product breakage.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) PC board
Control the thicknesses of the coverlay
and adhesive to prevent poor soldering.
This connector has no stand-off.
Therefore, minimize the thickness of the
coverlay, etc. so as to prevent the
occurrence of poor soldering.
6) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
7) When mounting connectors on a FPC
board:
• When the connector soldered to FPC is
mated or unmated, solder detachment
may occur by the force to the terminals.
Connector handling is recommended in
the condition when the reinforcing plate is
attached to the backside of FPC where
the connector is mounted. The external
dimension of the reinforcing plate is
recommended to be larger than the
dimension of “PC board recommended
process pattern” (extended dimension of
one side is approximately 0.5 to 1.0 mm).
The materials and thickness of the
reinforcing plate are glass epoxy or
polyimide (thickness 0.2 - 0.3 mm) or
SUS (thickness 0.1 - 0.2 mm).
• As this connector has temporary locking
structure, the connector mating may be
separated by the dropping impact
depend on the size, weight or bending
force of the FPC. Please consider the
measures at usage to prevent the mating
separation.
8) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Connector
Spacer
Spacer PC board
Screw
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the chucking force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
6) In case of dry condition, please note
the occurrence of static electricity.
The product may be adhered to the
embossed carrier tape or the cover tape
in dry condition.
Recommended humidity is from 40%RH
to 60%RH and please remove static
electricity by ionizer in manufacturing
process.
Notes on Using Narrow pitch Connectors/High Current Connectors
–2– ACCTB48E 201606-T
Regarding soldering
Handling Single Components
Precautions for mating
■ Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals.
(Please refer to the specification for detail
because the temperature setting differs
by products.)
2) As for cream solder printing, screen
printing is recommended.
3) When setting the screen opening area
and PC board foot pattern area, refer the
recommended PC board pattern and
window size of metal mask on the
specification sheet, and make sure that
the size of board pattern and metal mask
at the base of the terminals are not
increased.
4) Please pay attentions not to provide
too much solder. It makes miss mating
because of interference at soldering
portion when mating.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) The condition of solder or flux rise and
wettability varies depending on the type
of solder and flux. Solder and flux
characteristics should be taken into
consideration and also set the reflow
temperature and oxygen level.
7) Do not use resin-containing solder.
Otherwise, the contacts might be firmly
fixed.
8) Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
For products other than the ones above,
please refer to the latest product
specifications.
9) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector before
mounting.
10) Consult us when using a screen-
printing thickness other than that
recommended.
■ Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
Table A
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) These connector is low profile type. If
too much solder is supplied for hand
soldering, It makes miss mating because
of interference at soldering portion.
Please pay attentions.
■ Solder reworking
1) Finish reworking in one operation.
2) In case of soldering rework of bridges.
Don’t use supplementary solder flux.
Doing so may cause contact problems by
flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
Terminal Paste
solder
PC board
foot pattern
Product name Soldering iron temperature
SMD type connectors 300°C within 5 sec.
350°C within 3 sec.
60 to 120 sec.
Preheating
Peak temperature
200°C
220°C
Upper limited (Solder heat resistance)
Peak temperature 260°C
230°C
180°C
150°C
70 sec.
25 sec.
Lower limited (Solder wettability)
Time
Temperature
Apply the solder
wire here
Terminal
Pattern
PC board
Small angle as
possible up to
45 degrees
Soldering
iron
1) Make sure not to drop or allow parts to
fall from work bench.
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
This product is designed with ease of
handling. However, in order to prevent the
deformation or damage of contacts and
molding, take care and do not mate the
connectors as shown right.
Strongly pressed and twisted
Tilted mating
Press-fitting while the mating
inlets of the socket and
header are not matched.
Notes on Using Narrow pitch Connectors/High Current Connectors
–3– ACCTB48E 201606-T
Cleaning flux from PC board
Handling the PC board after mounting the connector
Storage of connectors
Other Notes
Regarding sample orders to confirm proper mounting
There is no need to clean this product.
If cleaning it, pay attention to the
following points to prevent the negative
effect to the product.
1) Keep the cleaning solvent clean and
prevent the connector contacts from
contamination.
2) Some cleaning solvents are strong and
they may dissolve the molded part and
characters, so pure water passed liquid
solvent is recommended.
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
1) Do not remove or insert the electrified
connector (in the state of carrying current
or applying voltage).
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Product failures due to condensation
are not covered by warranty.
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50-
piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Condition when delivered from manufacturing
Required number
of products for
sample production
(Unit 50 pcs.)
Embossed tape
amount required for
the mounting
Reel
(Delivery can also be made on a reel by
customer request.)
Please refer to the latest product
specifications when designing your
product.
