EPSA12BBHF-110.000M Pb RoHS EPSA12 B B H F -110.000M Series RoHS Compliant (Pb-free) 2.5V 4 Pad 5mm x 7mm Ceramic SMD LVCMOS Programmable Spread Spectrum Oscillator Frequency Tolerance/Stability 50ppm Maximum Nominal Frequency 110.000MHz Spread Spectrum 2.00% Center Spread Output Control Function Tri-State Operating Temperature Range -40C to +85C ELECTRICAL SPECIFICATIONS Nominal Frequency 110.000MHz Frequency Tolerance/Stability 50ppm Maximum (Inclusive of all conditions: Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25C, Shock, and Vibration.) Operating Temperature Range -40C to +85C Supply Voltage 2.5Vdc 5% Maximum Supply Voltage -0.5Vdc to +3.2Vdc Input Current 25mA Maximum Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH=-8mA) Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL=+8mA) Rise/Fall Time 3nSec Maximum (Measured at 10% to 90% of Waveform) Duty Cycle 50% 5(%) (Measured at 50% of waveform) Load Drive Capability 15pF Maximum Output Logic Type CMOS Output Control Function Tri-State (Disabled Output: High Impedance) Tri-State Input Voltage (Vih and Vil) 70% of Vdd Minimum or No Connection to Enable Output, 30% of Vdd Maximum to Disable Output Tri-State Output Disable Time 100nSec Maximum Tri-State Output Enable Time 100nSec Maximum Disable Current 20mA Maximum (Unloaded; Pad 1=Ground) Spread Spectrum 2.00% Center Spread Modulation Frequency 30kHz Minimum, 32kHz Typical, 45kHz Maximum Period Jitter 100pSec Maximum (Cycle to Cycle; Spread Spectrum-On) Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 1 of 5 EPSA12BBHF-110.000M MECHANICAL DIMENSIONS (all dimensions in millimeters) 7.00 0.15 5.08 0.15 4 3 MARKING ORIENTATION 5.00 0.15 2.20 0.15 2 1 1.4 0.2 1.4 0.1 3.68 0.15 PIN CONNECTION 1 Tri-State 2 Case Ground 3 Output 4 Supply Voltage LINE MARKING 1 ECLIPTEK 2 110.00M 3 SXXXXX S=Configuration Designator XXXXX=Ecliptek Manufacturing Identifier 1.60 0.20 Suggested Solder Pad Layout All Dimensions in Millimeters 2.0 (X4) 2.2 (X4) Solder Land (X4) 2.88 1.81 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 2 of 5 EPSA12BBHF-110.000M CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 90% of Waveform OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% of Waveform 10% of Waveform VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 Test Circuit for CMOS Output Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Frequency Counter Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Tri-State or Power Down Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and High bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet for `Load Drive Capability'. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 3 of 5 EPSA12BBHF-110.000M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 4 of 5 EPSA12BBHF-110.000M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 5 of 5