TDA8822T/C1 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Preliminary speciﬁcation

File under Integrated Circuits, IC02 1997 Jan 08

INTEGRATED CIRCUITS

TDA8822

Universal I2C-bus programmable

RF modulator

1997 Jan 08 2

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

FEATURES

•5 V power supply

•Video amplifier with clamp and white clip circuits

•Programmable video modulation depth

•FM sound modulator (4.5, 5.5, 6.0 and 6.5 MHz)

•Programmable picture-to-sound ratio

•Programmable deviation of the sound subcarrier

•Input for modulated NICAM sound subcarrier or second

frequency modulated sound subcarrier

•Asymmetrical or symmetrical RF output buffer

•Symmetrical RF oscillator for UHF or VHF band

according to the application

•One I2C-bus programmable output port

•On-chip Phase-Locked Loop (PLL) frequency

synthesizer for the RF carrier

•On-chip PLL frequency synthesizer for the sound carrier

•On-chip power supply regulator

•On-chip I2C-bus and/or hardware controlled Test

Pattern Signal Generator (TPSG) with LED driver

•RF output switch-off during tuning.

APPLICATIONS

•Video recorders

•Cable converters

•Satellite receivers

•Set top boxes.

GENERAL DESCRIPTION

The TDA8822 is a programmable modulator which

generates an RF TV channel from a baseband video

signal and a baseband audio signal in the event of

negative video and FM sound standards (B/G, I, D/K, M

and N standards).

Two PLL frequency-synthesizers set the picture carrier

frequency and the sound subcarrier frequency to the

required frequencies. These PLL frequency-synthesizers

are programmed via the I2C-bus.

The I2C-bus controls these features:

•Video modulation depth

•Sound subcarrier modulation deviation

•Picture-to-sound ratio.

This makes the IC suitable for multistandard applications

without any adjustment into the application.

Additional features are provided like an input for the

NICAM or second FM carrier, a test pattern signal

generator with a LED driver and a general purpose

output port.

ORDERING INFORMATION

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA8822T SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1

TDA8822M SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1

1997 Jan 08 3

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

QUICK REFERENCE DATA

VCCA =V

CCD =5V; T

amb =25°C; in PAL B/G, PAL I, PAL D/K or NTSC; MD setting = 4; DEV setting = 2;

PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p); 1 kHz sine wave;

unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VCCA analog supply voltage 4.5 5.0 5.5 V

VCCD digital supply voltage 4.5 5.0 5.5 V

ICC(tot) total supply current −60 72 mA

mdmodulation depth adjustment

range typical value for MD setting between

0 and 7 72.5 −90.0 %

P/S picture-to-sound ratio

adjustment range typical value for PS setting between

0 and 7 −18 −−11 dB

VRF RF output voltage level

asymmetrical on a 75 Ω load frequency between 45 and 860 MHz 77 80 83 dBµV

fsc sound subcarrier frequency 4.5 −6.5 MHz

∆fsc sound subcarrier frequency

deviation range for B/G, I, D/K, SC setting = 1, 2 or 3;

typical value for DEV setting between

0 and 7

20 −45 kHz

for M, N, SC setting = 0; typical value

for DEV setting between 0 and 7 10 −22.5 kHz

1997 Jan 08 4

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGE674

VIDEO

PHASE

DETECTOR

VIDEO

CHARGE

PUMP

VCO

CLIP

TPSG

SWITCH

ADDER

AUDIO

CHARGE

PUMP

AUDIO

PHASE

DETECTOR

PROG.

DIVIDER

14 BITS

PROG.

DIVIDER

I2C-BUS

RECEIVER

AND

LOGIC

fdiv(audio)

fdiv(video)

fref(video)

fref(audio) REFERENCE

DIVIDER CRYSTAL

OSCILLATOR

PRESCALER

DIVIDE-BY-8

OSCILLATOR

MIXER

OUTPUT

BUFFER

VOLTAGE

REGULATOR

CLAMP

LOOP

AMP.

SND-IF

AMP.

AUDIO

AMP.

NICAM

AMP.

VIDEO

AMP.

in-lock flag

I2C-bus control

setting

sound oscillator

ON/OFF

DEV

setting

MD setting TPSG

ON/OFF

test test

frequency

setting

frequency

setting

RF oscillator

ON/OFF

test test test

1819

RFA RFB

VCCA

AGND

VIDEO

NICAM

AUDIO

PREEMPH

ACP

SCL 15

SDA

P0 17

TPSG

11 13

VCCD DGND

12 XTAL

9VVT

VCP

RFOSCD

RFOSCC

OGND

RFOSCB

RFOSCA

20 RFGND

TDA8822

1997 Jan 08 5

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

PINNING

SYMBOL PIN DESCRIPTION

VCCA 1 analog power supply

ACP 2 audio charge pump output

PREEMPH 3 audio pre-emphasis network

RFOSCA 4 RF oscillator A (collector) output

RFOSCB 5 RF oscillator B (base) input

OGND 6 RF oscillator ground

RFOSCC 7 RF oscillator C (base) input

RFOSCD 8 RF oscillator D (collector) output

VVT 9 video tuning voltage output

VCP 10 video charge pump output

VCCD 11 digital power supply

XTAL 12 crystal oscillator input

DGND 13 digital ground

SCL 14 serial clock (I2C-bus) input

SDA 15 serial data (I2C-bus) input/output

P0 16 general purpose output

TPSG 17 test pattern signal generator

input/output pin

RFB 18 RF output B

RFA 19 RF output A

RFGND 20 ground for the RF outputs

NICAM 21 NICAM input

AUDIO 22 audio input

AGND 23 analog ground

VIDEO 24 video input Fig.2 Pin configuration.

handbook, halfpage

VCCA

ACP

PREEMPH

RFOSCA

RFOSCB

OGND

RFOSCC

RFOSCD

VVT

VCP

VCCD

XTAL

VIDEO

AGND

AUDIO

NICAM

RFA

RFB

RFGND

TPSG

SDA

SCL

DGND

TDA8822

MGE673

1997 Jan 08 6

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

FUNCTIONAL DESCRIPTION

The TDA8822 is a programmable RF modulator which can

be divided into the following parts:

•Video part

•Audio part

•RF part.

Video part

The video part provides the following:

•The video part includes a clamping circuit which sets the

internal reference voltage to the bottom of the

synchronizing pulse. The modulation depth is adjusted

using 3 bits of the I2C-bus programming, called MD2,

MD1 and MD0. These 3 bits make 8 different values for

the modulation depth possible (see Table 1).

•After the modulation depth is set, the signal is fed

through a clip control circuit that clips the video signal to

avoid that the modulation depth becomes higher than

100%.

•The video part also contains a TPSG. This TPSG

generates a pattern that helps to tune the TV set to the

programmed channel of the modulator. The pattern

consists of a sync pulse and two vertical white bars on

the screen (see Fig.3)

The TPSG is activated in two ways:

– Forcing the pin TPSG to DGND in the application

(see Fig.8)

– Setting the TPSG bit to 1 via the I2C-bus, then the

TPSG pin acts as an output port, sinking current to

allow the indication of the use of the TPSG in the

application e.g. with an LED (see Fig.9).

Table 1 Modulation depth setting (typical values)

SETTING BIT MODULATION

DEPTH (%)

MD2 MD1 MD0

0 0 0 0 72.5

1 0 0 1 75.0

2 0 1 0 77.5

3 0 1 1 80.0

4 1 0 0 82.5

5 1 0 1 85.0

6 1 1 0 87.5

7 1 1 1 90.0

Fig.3 Test pattern signal.

handbook, full pagewidth

MGE675

0 5 10 15 20 25 30 35 40 45 50 55 60 65 t (µs)

1997 Jan 08 7

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

Audio part

The audio part provides the following:

•The sound subcarrier is created in an integrated VCO.

The signal at the output of this VCO is fed to a stage that

adjusts the picture-to-sound ratio and to the audio

programmable divider.

•The frequency of the sound subcarrier is set by

programming the bits SC1 and SC0 of the I2C-bus (see

Table 2). These two bits set the dividing ratio of the

audio programmable divider to get the divided frequency

fdiv(audio).

•The audio phase detector compares the

phase/frequency of the divided audio frequency fdiv(audio)

and the reference frequency for the audio, fref(audio) and

drives the Charge Pump (CP) that charges or

discharges the audio loop filter connected between

pins ACP and AGND to get the VCO oscillating to the

programmed frequency.

•fref(audio) and fdiv(audio) can be monitored on the general

purpose output port during a special test mode.

•The frequency deviation of the sound subcarrier is set

using 3 bits DEV2, DEV1 and DEV0 of the I2C-bus

programming (see Table 3), when a signal of 1 kHz with

a level of 50 mV (p-p) is applied on the audio input pin.

•The difference between the picture carrier level and the

sound subcarrier level is adjusted using 3 bits PS2, PS1

and PS0 (see Table 4).

•The NICAM amplifier has a constant gain, and is

designed for adding a second sound subcarrier in the TV

channel. This subcarrier can be either a second FM

carrier for dual-sound/stereo system used in PAL B/G or

a modulated NICAM carrier. The level between the

picture carrier and the NICAM carrier (P/N) will depend

on the input level on the NICAM input.

Table 2 Sound subcarrier frequency setting

Table 3 Sound subcarrier frequency deviation setting (typical values)

SC SETTING BIT SOUND SUBCARRIER

FREQUENCY (MHz) STANDARD

SC1 SC0

0 0 0 4.5 M, N

1 0 1 5.5 B, G

2 1 0 6.0 I

3 1 1 6.5 D, K

DEV SETTING BIT DEVIATION

(%) DEVIATION (kHz)

DEV2 DEV1 DEV0 B, G, I, D, K M, N

0 0 0 0 40.0 20.0 10.0

1 0 0 1 45.0 22.5 11.3

2 0 1 0 50.5 25.3 12.6

3 0 1 1 56.5 28.3 14.1

4 1 0 0 63.5 31.8 15.9

5 1 0 1 71.5 35.8 17.9

6 1 1 0 80.0 40.0 20.0

7 1 1 1 90.0 45.0 22.5

1997 Jan 08 8

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

Table 4 Picture-to-sound ratio setting (typical values)

PS SETTING BIT P/S RATIO

(dB)

PS2 PS1 PS0

0 000 −11

1 001 −12

2 010 −13

3 011 −14

4 100 −15

5 101 −16

6 110 −17

7 111 −18

RF part

The RF part provides the following:

•The RF oscillator can produce any frequency used for

TV transmission, from 35 to 890 MHz. The frequency

range depends on the components used in the

application (see Table 11).

•The RF mixer combines the video signal, the sound

subcarrier and the carrier from the NICAM input to build

a baseband TV channel. This baseband signal is then

mixed with the RF oscillator signal to get the RF TV

channel.

•The two signals from the RF mixer are sent to the output

buffer. This output buffer can be used either as two

asymmetrical outputs or as one symmetrical output.

•The output buffer is switched-off while the PLL is not

in-lock, to avoid parasitic output signal during the tuning

of the RF oscillator. The in-lock information is given by

the phase detector of the loop.

•The signal from the RF oscillator is fed to the PLL which

controls the picture carrier frequency. The RF signal is

first divided by 8 in the prescaler, and then divided in the

programmable 14-bits divider. The dividing ratio of this

divider is programmed via the I2C-bus. The minimum

frequency that can be synthesized is 16 MHz, and the

maximum frequency is 1023.9375 MHz.

•The divided frequency called fdiv(video) is compared to the

reference frequency called fref(video) coming from the

crystal oscillator and divided in the reference divider.

The crystal oscillator is intended to be used with a

crystal of 4 MHz.

•The comparison between fref(video) and fdiv(video) is done

in the video phase detector. The resulting signal is fed

via the video charge pump to the loop amplifier,

including the tuning voltage drive (33 V) inside the IC.

•fref(video) and fdiv(video) can also be monitored on the

output port during a special test mode.

•The I2C-bus receiver and control logic includes the

control of:

– Picture carrier frequency

– Sound subcarrier frequency

– Sound subcarrier frequency deviation

– Video modulation depth

– Picture-to-sound ratio

– TPSG on/off and LED drive control

– RF oscillator on/off

– Sound oscillator on/off

– General purpose output port on/off

– Test modes setting.

Software information

The transmission is made using 4 words in I2C-bus format.

First the address CA has to be sent, then at least two

consecutive words have to be sent, either the two words

F1 and F0, or the two words C1 and C0.

The two words C1 and F1 are differentiated inside the IC

by the first bit being logic 1 or logic 0 respectively.

The contents of the 4 bytes is shown in Table 5.

At the power-up of the TDA8822, the I2C-bus state is the

following:

•N13 to N0 are not fixed

•SC setting = 1: the sound carrier is fixed to 5.5 MHz

•MD is set to 4 (82.5%), PS is set to 1 (−12 dB) and DEV

is set to 2 (50.5%)

1997 Jan 08 9

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

•T0 is set to logic 1, RF0 is set to logic 1, TPSG is set to

logic 1 and P0 is set to logic 0 to select the video high

impedance test mode because it is in this mode that the

RF oscillator starts in the best conditions.

The TPSG bit is used to switch on or off the TPSG using

the I2C-bus. It is also possible to switch the TPSG on in the

application, connecting the pin TPSG to DGND. This

pin TPSG has a double function and acts as an input or as

an output.

These are the two functions:

•Output: if the TPSG is set using the I2C-bus, the

pin TPSG is used as an output open collector NPN port.

This port can be used to indicate with an LED that the

TPSG is on. This is especially useful in systems using

an on-screen display. If the TV set is not tuned to the

right channel there is an alternate indication that the

TPSG is on (see Fig.9).

•Input: if the TPSG is set with an hardware switch in the

application, the TPSG pin is used as one of the inputs to

select the TPSG mode (see Fig.8).

Notice that if the TPSG bit is set to logic 1 while the RF0

bit is set to logic 0, the TPSG is turned off, and the sound

oscillator is off (see Table 8).

N13 to N0 are the 14 bits to set the video programmable

divider ratio and then to set the picture carrier frequency

following the formula: fosc =f

ref(video) ×8×N,

where:

•fref(video) is the frequency on pin XTAL divided by the

reference divider ratio. For example, with a 4 MHz

crystal connected to

pin XTAL,fref video()

4000000

512

------------------------ 7812.5 Hz==

•N is the programmable divider ratio:

N=N

13 ×213 +N

12 ×212 + ... + N1×2+N

•f

osc is the RF oscillator frequency.

DEV2, DEV1 and DEV0 are the bits to set the sound

subcarrier frequency deviation (see Table 3).

PS2, PS1 and PS0 are the bits to set the picture-to-sound

ratio (see Table 4).

MD2, MD1 and MD0 are the bits to set the modulation

depth (see Table 1).

SC1 and SC0 are the bits to set the sound subcarrier

frequency according to Table 2.

RF0 is a bit that controls the RF oscillator on/off. In normal

mode, it should be set to logic 1. If the modulator is not

used and may create some interferences with other

signals in the application, it should be set to logic 0

(see Table 6).

Notice that if the bit RF0 is logic 0 while the bit TPSG is

logic 1, then the RF oscillator is still running, but the sound

oscillator is off, and the TPSG is also off (see Table 8).

The bit P0 controls the output port P0, which is an open

collector NPN port, able to drive up to 10 mA

(see Table 7).

T0 is a bit used for test purposes. If this bit is set to logic 0,

the IC operates in normal configuration. If it is set to

logic 1, then the use of bits TPSG, RF0 and P0 is changed

to select 1 of the 8 test modes as explained in Table 9.

Table 5 Contents of programming words

BYTE MSB LSB ACKNOWLEDGE BIT

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

Address byte CA 11001010 ACK

F1: frequency

byte 1 0 TPSG N13 N12 N11 N10 N9 N8 ACK

F0: frequency

byte 0 N7 N6 N5 N4 N3 N2 N1 N0 ACK

C1: control byte 1 1 DEV2 DEV1 DEV0 PS2 PS1 PS0 0 ACK

C0: control byte 0 MD2 MD1 MD0 SC1 SC0 RF0 P0 T0 ACK

1997 Jan 08 10

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

Table 6 RF oscillator on/off setting (see note 1)

Note

1. This table is valid only if bit TPSG is set to logic 0.

Table 7 Output port programming

Table 8 Overview of the normal modes

Note

1. X means logic 0 or logic 1, don’t care.

STATE OF RF0 ACTION ON RF OSCILLATOR

0 stopped; no RF carrier

1 operating; normal use

STATE OF P0 PORT STATE VOLTAGE ON PORT

(with a pull-up resistor to VCCD)

0 high impedance close to VCCD

1 sinking current close to 0 V

T0 RF0 TPSG P0 PIN TPSG MODE

010X

(1) input: open RF on; TPSG off

010X

(1) input: to DGND RF on; TPSG on

011X

(1) output: sinking current RF on; TPSG on

000X

(1) input: open or to DGND RF off

001X

(1) input: open RF on; TPSG off; sound oscillator off

001X

(1) input: to DGND RF on; TPSG on; sound oscillator off

(1) X(1) 0X

(1) Port P0 off (high impedance)

(1) X(1) 1X

(1) Port P0 on (sinking current)

1997 Jan 08 11

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

Table 9 Overview of the test modes

Notes

1. During the test mode (bit T0 set to logic 1), the pin TPSG is unused, meaning that the input information does not have

any effect, and that the output port does not sink any current.

2. In ‘fref(audio) on P0’ mode, the reference frequency of the audio PLL is available on the port P0.

3. In ‘fdiv(audio) on P0’ mode, is available on the port P0 (fdiv(audio) is the frequency from the sound oscillator

divided by the dividing ratio of the audio programmable divider).

4. In ‘fref(video) on P0’ mode, the reference frequency of the video PLL is available on the port P0.

5. In ‘fdiv(video) on P0’ mode, is available on the port P0 (fdiv(video) is the frequency of the RF oscillator divided

by the dividing ratio of the video programmable divider).

6. In ‘both CP sinking or sourcing current’ modes, the charge pump of the audio PLL and the one of the video PLL are

sinking or sourcing their nominal current.

7. The ‘video charge pump off’ mode allows to measure the leakage current on the video PLL charge pump.

8. The ‘audio charge pump off’ mode allows to measure the leakage current on the audio PLL charge pump.

9. In the ‘video high-impedance’ mode, it is possible to inject an external tuning voltage for the RF carrier setting.

In this mode, the video PLL is off.

10. In the ‘baseband signal on RF outputs’ mode, the RF oscillator is off, and it is possible to measure the baseband

video and audio subcarrier signals on the RF output pins.

11. During the ‘balance test’ mode the picture carrier is over-modulated allowing the measurement of the residual carrier.

T0 RF0 TPSG P0 PIN(1) TPSG TEST MODES

1000 X f

ref(audio) on P0; both CP sinking current; notes 2 and 6

1001 X f

div(audio) on P0; note 3

1010 X f

ref(video) on P0; both CP sourcing current; notes 4 and 6

1011 X f

div(video) on P0; note 5

1100 X video charge pump off; note 7

1101 X audio charge pump off and balance test; notes 8 and 11

1110 X video high impedance test; note 9

1111 X baseband signal on RF outputs; note 10

fdiv audio()

--------------------------

fdiv video()

-------------------------

1997 Jan 08 12

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

Example of programming

We want to program the TDA8822 in a UHF application, on channel 21 (picture carrier at 471.25 MHz) in a B/G standard

(sound carrier at 5.5 MHz from the picture carrier) with a Picture-to-Sound ratio of −12 dB, a modulation depth of 82.5%

and a deviation set to 50.5% in normal mode, without TPSG, output port on.

These are the values of the bits that must be programmed:

•The video dividing ratio will be

•TPSG bit will be set to logic 0

•DEV2 will be set to logic 0, DEV1 to logic 1 and DEV0 to logic 0

•PS2 will be set to logic 0, PS1 to logic 0 and PS0 to logic 1

•MD2 will be set to logic 1, MD1 to logic 0 and MD0 to logic 0

•SC1 will be set to logic 0 and SC0 to logic 1

•P0 will be set to logic 1

•RF0 will be set to logic 1

•T0 will be set to logic 0.

The protocol to the TDA8822 is illustrated in Table 10.

Table 10 Example of programming for the TDA8822.

BYTE MSB LSB ACKNOWLEDGE

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

Address byte CA 11001010 ACK

F1: frequency

byte 1 00011101 ACK

F0: frequency

byte 0 01110100 ACK

C1: control byte 1 10100010 ACK

C0: Control byte 0 10001110 ACK

osc

fref 8×

----------------- 471250000

7812.5 8×

------------------------------ 7540 01110101110100== ==

1997 Jan 08 13

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it

is desirable to take normal precautions appropriate to handling integrated circuits. The IC withstands the ESD test in

accordance with the

“UZW-B0/FQ-A302”

specification equivalent to the

“MIL-STD-883C category B”

(2000 V). The IC

withstands the ESD test in accordance with Philips Semiconductors Machine Model (MM), specification

“UZW-B0/FQ-B302”

, issue date November 6th, 1990,(0 Ω, 200 pF, 200 V).

THERMAL CHARACTERISTICS

SYMBOL PARAMETER MIN. MAX. UNIT

VCCA analog supply voltage −0.3 +7.0 V

VCCD digital supply voltage −0.3 +7.0 V

VCC operating supply voltage 4.5 5.5 V

Vmax maximum voltage on all pins except SCL, SDA and VVT −0.3 VCC V

VBUS(max) maximum voltage on SCL and SDA pins −0.3 +7.0 V

VVVT(max) maximum voltage on VVT pin −0.3 +35.0 V

Tstg storage temperature −40 +125 °C

Tamb operating ambient temperature −20 +85 °C

SYMBOL PARAMETER VALUE UNIT

Rth j-a thermal resistance from junction to ambient in free air

SO24; SOT137-1 74 K/W

SSOP24; SOT340-1 120 K/W

1997 Jan 08 14

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

CHARACTERISTICS

VCCA =V

CCD =5V; T

amb =25°C; in PAL B/G, PAL I, PAL D/K, or NTSC; MD setting = 4; DEV setting = 2;

PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p) 1 kHz sine wave;

unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

IPpower supply current analog and digital parts −60 72 mA

Video characteristics

IVIDEO video input current −0.5 2.0 µA

zVIDEO video input impedance 30 −− kΩ

dmodulation depth part-to-part variation;

MD setting = 4 77.5 82.5 87.5 %

md(clip) modulation depth during clipping

condition video input level lower

than 1 V (p-p) −−99 %

md(TPSG) modulation depth when TPSG mode

on part to part variation,

MD setting = 4 72.5 82.5 92.5 %

md(APL) variation of the modulation depth with

change of APL between 10 and 90% reference for APL = 50% −2 0 +2 %

S/N video signal-to-noise ratio note 1 48 52 −dB

Gdiff differential gain note 2 −36 %

diff differential phase note 2 −3 6 deg

V/S video-to-sync ratio input signal: V/S=7:3 6.9:3.1 7:3 7.1:2.9

video frequency response for the video

signal note 3 −1−+1 dB

Audio characteristics

ZAUDIO audio input impedance without any resistor

between AUDIO and

AGND

30 −− kΩ

∆f

mmodulation deviation SC setting = 1, 2 or 3;

DEV setting = 2 20 25 30 kHz

SC setting = 0;

DEV setting = 2 10 12.5 15 kHz

∆fm(max) maximum modulation deviation VAUDIO = 500 mV (p-p);

note 4 180 250 −kHz

THD total harmonic distortion 50 mV (p-p) sine wave at

1 kHz on AUDIO pin −0.4 1.0 %

S/N audio signal-to-noise ratio note 5 44 47 −dB

fAUDIO frequency response of the audio signal note 6 −1−+1 dB

∆fsc(acc) sound subcarrier accuracy note 7 −1 0 +1 kHz

P/S picture-to-sound ratio no audio signal; no video

signal; PS setting = 1 −15 −12 −9dB

1997 Jan 08 15

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

NICAM characteristics

ZNICAM NICAM input impedance 10 −− kΩ

P/N level between picture carrier and

NICAM carrier NICAM input

level = 150 mV (p-p);

no video signal

−23 −20 −17 dB

fNICAM frequency response of the NICAM

input for frequencies between 5

and 8 MHz; reference for

6.5 MHz

−1−+1 dB

BER bit error rate note 11 −10−6−

EHD eye-height degradation note 11 −4−%

Channel characteristics

fRF RF frequency range with application VHF 1 47 −88 MHz

with application VHF 3 174 −230 MHz

with application UHF 470 −860 MHz

fRF(acc) picture carrier accuracy note 7 −75 −+75 kHz

VRF output level on RF outputs during sync.

pulse, loaded with 75 Ωbetween 45 and 860 MHz 77 80 83 dBµV

VRF(ﬂat) ﬂatness of the RF output level across

each band reference is centre of

each band −202 dB

o(RF) RF output impedance single ended −75 −Ω

SPUospurious outside channel note 8 −−−40 dBc

SPU2PC RF second harmonic level on asymmetrical output at

low end of UHF band −−−10 dBc

SPU2SC sound carrier second harmonic level −−65 −60 dBc

SPU3SC sound carrier third harmonic level −−65 −60 dBc

SPUfref reference frequency spurious measured with Philips

application board −−−40 dBc

CHRBEAT chroma beat note 9 −−−63 dBc

NICBEAT NICAM beat note 10 −−−63 dBc

Video charge pump output and video tuning ampliﬁer: VCP and VVT

IVCP output current −50 −µA

VCP(lk) off-state leakage current −10 −10 nA

VVVT(min) minimum tuning voltage on pin VVT 27 kΩ resistor between

pin VVT and +33 V −−0.2 V

IVVT(lk) leakage current on pin VVT 27 kΩ resistor between

pin VVT and +33 V; high

impedance test mode

−−10 µA

Audio charge pump output: ACP

IACP output current −3−µA

ACP(lk) off-state leakage current −10 −10 nA

VACP tuning voltage range for the audio PLL,

on pin ACP 1.5 −4.5 V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 Jan 08 16

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

Notes

1. Ratio between the CCIR 17-line bar amplitude (corresponding to the level difference between black and white;

see Fig.4) and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after

demodulation. Measurement is done for frequencies between 200 kHz and 5 MHz. Measurement is unweighted.

2. Measured on CCIR 330 line, corresponding to a 5-step staircase with a chroma carrier of amplitude equal to 0.3

times the voltage between sync pulse and white (see Fig.5). The video signal is 500 mV (p-p). The modulation depth

is adjusted using the I2C-bus to MD setting = 4 (82.5% typical modulation depth).

3. Measured with a spectrum analyser with ‘peak hold’ function, applying a 500 mV (p-p) sine wave at the video input

of the IC, with a sweeping frequency between 0.5 and 6.0 MHz. The reference is the value measured at 1.0 MHz.

4. To have a deviation between 50 and 250 kHz, the audio frequency must be higher than 100 Hz.

5. Measured with an audio frequency of 1 kHz with a level adjusted to get a deviation of 50 kHz with DEV setting = 2,

using CCIR 468-3 weighting filter, with a quasi-peak detection. The input signal has pre-emphasis and the receiver

has de-emphasis. Video signal is 500 mV (p-p) EBU colour bars on pin VIDEO.

XTAL characteristics

|ZXTAL| XTAL input impedance absolute value;

with a 4 MHz crystal 600 1200 −Ω

Output Port characteristics

VPORT low voltage port on; IPORT =10mA −150 400 mV

IPORT(lk) off-state leakage current port off; VCCD = 5.5 V −−10 µA

IPORT(sink) sinking current in the port port on 10 −− mA

TPSG pin characteristics

VTPSG(on) voltage on pin TPSG to switch the

TPSG on 0−1.5 V

VTPSG(off) voltage on pin TPSG to switch the

TPSG off 3.0 −VCCD V

ITPSGL LOW input current in pin TPSG TPSG to DGND −100 −− µA

TPSGH HIGH input current in pin TPSG TPSG to VCCD −−100 µA

ITPSG(sink) output sinking current in pin TPSG TPSG set on using

I2C-bus 10 −− mA

VTPSG(sink) voltage on pin TPSG used as output TPSG set on using

I2C-bus −150 400 mV

I2C-bus receiver characteristics, pins SCL and SDA

fSCL frequency on SCL line −−100 kHz

VIH HIGH level input voltage 3 −5.5 V

VIL LOW level input voltage 0 −1.5 V

IIH HIGH level input current VIH =5V; V

CCD =0or5V −−10 µA

IIL LOW level input current VIL =0V; V

CCD =0or5V −10 −− µA

SDA(ack) acknowledge output voltage on SDA during acknowledge

pulse; IIL =3mA −−0.4 V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 Jan 08 17

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

6. Measured with no pre-emphasis on the audio input and no de-emphasis in the receiver. Measurement is done for

frequencies between 50 Hz and 15 kHz, reference is the level measured at 1 kHz.

7. The accuracy only depends on the accuracy of the reference frequency (accuracy of the crystal). Notice that the

value of the capacitor in series with the crystal must be chosen to be as close as possible to the load capacitance of

the crystal.

8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator

frequency and the sound oscillator frequency (fRF +2f

, 2fRF +f

, etc.). This measurement includes the spurious at

the 1⁄4fRF,1⁄2fRF and 3⁄4fRF.

9. Chroma beat

a) For PAL: measured applying a 4.43 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the

difference between the level of the unmodulated picture carrier and the level of the spike appearing at the

frequency of the picture carrier plus 1.07 MHz for PAL B/G, 1.57 MHz for PAL I and 2.07 MHz for PAL D/K.

b) For NTSC: measured applying a 3.58 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the

difference between the level of the unmodulated picture carrier and the level of the spike appearing at the

frequency of the picture carrier plus 920 kHz.

10. NICAM beat

a) For PAL B/G: measured applying a sine wave of 150 mV (p-p) at 5.85 MHz on the NICAM input. Measurement

is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the

frequency of the picture carrier plus 350 kHz or 5.15 MHz.

b) For PAL I: measured applying a sine wave of 150 mV (p-p) at 6.552 MHz on the NICAM input. Measurement is

the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the

frequency of the picture carrier plus 552 kHz or 5.448 MHz.

11. NICAM eye height and Bit Error Rate measurement conditions:

a) A NICAM frame is applied from a Textronix 728E in B/G mode on the NICAM input of the TDA8822 through an

attenuator to get 150 mV (p-p). The sound subcarrier is set to 5.5 MHz (SC = 1) and the picture to sound ratio is

set to -12 dB (PS = 1). There is no video signal applied to the video input and no audio signal on the audio input.

b) The RF carrier is demodulated with a Rohde & Schwartz EMFP demodulator for PAL B/G, the sound trap filter is

set off, and the video signal is fed to a Textronix 728D NICAM demodulator for B/G. Measurements of the eye

height and bit error rate are done on the 728D.

1997 Jan 08 18

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

Fig.4 CCIR insertion line 17.

handbook, full pagewidth

010203040 50 60 64 70

MBE396

t (µs)

1 V

0.3 V

0 V

Fig.5 CCIR insertion line 330.

handbook, full pagewidth

010203040 50 60 64 70

MBE397

t (µs)

1 V

0.3 V

0 V

1997 Jan 08 19

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

INTERNAL PIN CONFIGURATION

Fig.6 Pin equivalent circuit for each pin.

handbook, full pagewidth

MGE681

VCCA

AGND

ACP

VCCD

DGND

VCCA

regulated voltage

AGND

PREEMPH

regulated voltage

RFOSCA

RFOSCB

RFOSCC

OGND

RFOSCD

DGND

VVT

VCCD

DGND

VCP

VCCD

DGND

XTAL

VCCA

AGND

VIDEO

regulator voltage

AGND

AUDIO

NICAM

VCCA

AGND

VCCA

RFA

RFB

RFGND

VCCD

DGND

TPSG

VCCD

DGND

VCCD

DGND

SCL

VCCD

DGND

SDA

VOLTAGE

REGULATOR

regulated

voltage

VCCA

VCCD

DGND

AGND

1997 Jan 08 20

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

APPLICATION INFORMATION

Fig.7 Reference application.

(1) The components marked: C4, C5, C6, C7, C8, L1 and D1 must be chosen from Table 11 to get the desired frequency range.

handbook, full pagewidth

MGE678

(1) C5

(1) C7

(1) C8

(1)

C27

100 nF

C10

4.7

(1)

R7 R8

22 kΩ15 kΩ

10 nF

22 kΩR9

27 kΩ

R10

kΩ

L1 (1)

2.2

µF

100

C25

4.7

kΩ

24VIDEO 23

AGND 22AUDIO 21

NICAM 20RFGND19RFA 18

RFB 17TPSG 16

P0 15

SDA 14

SCL 13

DGND

XTAL

VCCD

VCP

VVT

RFOSCD

RFOSCC

OGND

RFOSCB

RFOSCA

PRE

EMPH

ACP

VCCA

C26

68 nF

C11

10 nF

C12

18 pF

XTAL1

4 MHz

R26

82 ΩR25

470 Ω

R24

100 nF

C24

R27

220 pF

C22

220 kΩR22

kΩ

R21

51 Ω1 nF

C21

R14

270 ΩR15

270 Ω

C19

100

C18

100

RFB

RFA

R18

1 kΩ

VVT = 33 V

VCC = 5 V

VIDEO

AUDIO

NICAM

SDA

SCL

TDA8822

1997 Jan 08 21

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

Application design

In the design of the application, it is highly recommended to separate the part of the RF oscillator as much as possible

from the part of the RF outputs in order to avoid parasitic coupling between these two parts.

A good solution is shielding the RF oscillator part to avoid radiation from and to this part. The pin OGND must be

connected to the shielding box and to ground.

The frequency range the IC covers is fixed by the choice of the components marked with a note (1) in Fig.7. For these

components, it is recommended to use the values indicated in Table 11.

Table 11 Components to be used for the RF oscillator

BAND FREQUENCY

RANGE VALUE FOR

C4, C5, C7, C8 VALUE

FOR C6 D1 L1: NUMBER

OF TURNS L1:COIL

DIAMETER L1: WIRE

DIAMETER

VHF1 47 to 130 MHz 5.6 pF 100 pF BB132 14.5 3.0 mm 0.3 mm

VHF3 130 to 350 MHz 4.7 pF 150 pF BB133 4.5 3.0 mm 0.4 mm

UHF 470 to 860 MHz 1.8 pF 22 pF BB134 1.5 2.5 mm 0.5 mm

Video input (pin 24)

The video input level on the IC is of 500 mV (p-p). In most

of the cases, the available video signals are of 1 V (p-p)

with a source impedance of 75 Ω.

To handle this kind of signal, we use a resistive divider with

two 470 Ω resistors (R24 and R25 in Fig.7) to divide the

1 V (p-p) signal down to 500 mV (p-p). In order to get an

input impedance of 75 Ω, a resistor of 82 Ω is implemented

in parallel to the divider (R26 in Fig.7).

Audio pre-emphasis

The capacitor C22 connected in parallel with R27 is

defining the time constant for the pre-emphasis following

Table 12.

Table 12 Choice of the pre-emphasis constant

Note

1. This mode has to be considered if the pre-emphasis is

applied else-where on the path of the audio signal, or

if there is no need for pre-emphasis in specific

applications. Note also that the pre-emphasis can be

done by connecting a capacitor between pin

PREEMPH (pin 3) and ground. The value for this

capacitor is 10 nF for PAL and 15 nF for NTSC.

STANDARD CAPACITOR

C22 TIME

CONSTANT

NTSC 330 pF 75 µs

PAL 220 pF 50 µs

special; note 1 no capacitor −

Audio input (pin 22)

The IC is sensitive to 45 mV (p-p) on pin AUDIO and the

DC voltage on this pin is close to 0 V.

This pin needs to be grounded through a 12 kΩ resistor

(R22 in Fig.7). Care must then be taken if a coupling

capacitor needs to be implemented on the audio path to

connect it between the signal source and the input, with

the resistor of 12 kΩ still connected to the AUDIO pin.

NICAM input (pin 21)

The NICAM pin is sensitive to 150 mV (p-p) to reach a

level between picture carrier and NICAM carrier of typical

−20 dBc.

It is possible to put on this pin either a NICAM modulated

carrier for a NICAM application or a frequency modulated

carrier for the stereo system with a second FM carrier used

e.g. in Germany.

In a specific application where the main sound subcarrier

would be generated outside the IC, it is also possible to

inject the main sound carrier to this pin, with a level

depending on the wanted P/S. In this event, it is necessary

to stop the internal sound oscillator by setting RF0 to

logic 0 and TPSG to logic 1 (see Table 8).

1997 Jan 08 22

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

TPSG input/output (pin 17)

As already mentioned, this pin can be used either as an

input or as an output.

•As an input, it allows to turn on the TPSG, without

changing anything to the word the TDA8822 is

programmed through the I2C-bus.

In this mode, it is simply necessary to connect a switch

between the pin TPSG and DGND (see Fig.8). If the

switch is open, then the TPSG is selected

corresponding to the I2C-bus programming; if the switch

is closed, then the TPSG is on.

•As an output, it allows to indicate e.g. with an LED that

the TPSG has been programmed on using the I2C-bus.

In this mode, the pin acts as an open-collector output

port, it is possible to connect a LED to the 5 V power

supply with a series resistor to limit the current to about

10 mA (see Fig.9).

XTAL pin (pin 12)

This pin is connected to a 4 MHz crystal in series with a

capacitor. The value of this capacitor has to be as close as

possible to the load capacitance of the crystal.

It is also possible to drive the IC with an external 4 MHz

signal from a voltage source. A level of 50 mV(RMS)

insures stable operation. A capacitor of about 18 pF and a

resistor of 680 Ω needs to be placed in series with the

voltage source.

ACP pin (pin 2)

This pin is the charge pump output for the sound subcarrier

PLL as well as the input of the sound subcarrier VCO.

It is necessary to connect the loop filter between this pin

and ground. The loop filter indicated in Fig.7 gives a cut-off

frequency lower than 20 Hz.

If a cutoff frequency slightly higher than 20 Hz can be

accepted, it is possible to reduce the value of the 2.2 µF

capacitor (C2) to 220 nF. In this case C26 needs to be

changed from 68 nf to 22 nF and R3 needs to be changed

from 4.7 kΩ to 33 kΩ.

RF outputs (pins 18 and 19)

For inexpensive applications, it is possible to use the IC

with an asymmetrical output.

In an asymmetrical application, the unused output pin

must be loaded with a load as close as possible to the load

connected to the used pin.

A good improvement in performance is obtained using a

symmetrical to asymmetrical transformer

(balun; balance-to-unbalance) connected between the two

outputs. In this event both outputs have their loads

matched. The level of the RF second harmonic, and the

spurious outside channel is decreasing. The parasitic

coupling between RF outputs and RF oscillator is also

reduced.

RF harmonics

This IC has been designed to have the lowest level of

unwanted RF harmonics at the frequencies where these

are the hardest to be filtered out, especially for the second

harmonic of the RF carrier at the lowest frequencies of the

UHF band.

It is possible to reduce the level of the second harmonic by

using a wide-band transformer at the output of the IC and

create a symmetrical application.

To reduce the out-of-band harmonics and especially the

third one, it is necessary to use a low-pass filter at the

output of the IC.

1997 Jan 08 23

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

Fig.8 Use of the pin TPSG as an input.

handbook, halfpage

MGE679

DGND

SCL

SDA

TPSG

RFB

RFA

RFGND

C19

100 pF

C18

100 pF

R15

270 Ω

R14

270 Ω

RFB

RFA

SDA

SCL

VCC = 5 V

R15 1 kΩ

Fig.9 Use of the pin TPSG as an output.

handbook, halfpage

MGE680

DGND

SCL

SDA

TPSG

RFB

RFA

RFGND

C19

100 pF

C18

100 pF

R15

270 Ω

R14

270 Ω

RFB

RFA

SDA

SCL

VCC = 5 V

R15 1 kΩ

R17 330 Ω

1997 Jan 08 24

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

PACKAGE OUTLINES

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

2.65 0.30

0.10 2.45

2.25 0.49

0.36 0.32

0.23 15.6

15.2 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT137-1

detail X

vMA

(A )

0.25

075E05 MS-013AD

pin 1 index

0.10 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.61

0.60 0.30

0.29 0.050

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

0 5 10 mm

scale

SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1

95-01-24

97-05-22

1997 Jan 08 25

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

UNIT A1A2A3bpcD

(1) E(1) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 0.21

0.05 1.80

1.65 0.38

0.25 0.20

0.09 8.4

8.0 5.4

5.2 0.65 1.25

7.9

7.6 0.9

0.7 0.8

0.4 8

0.13 0.10.2

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

1.03

0.63

SOT340-1 MO-150AG 93-09-08

95-02-04

detail X

vMA

(A )

112

24 13

0.25

pin 1 index

0 2.5 5 mm

scale

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1

max.

2.0

1997 Jan 08 26

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“IC Package Databook”

(order code 9398 652 90011).

Reﬂow soldering

Reflow soldering techniques are suitable for all SO and

SSOP packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250 °C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45 °C.

Wave soldering

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

technique should be used.

•The longitudinal axis of the package footprint must be

parallel to the solder flow.

•The package footprint must incorporate solder thieves at

the downstream end.

SSOP

Wave soldering is not recommended for SSOP packages.

This is because of the likelihood of solder bridging due to

closely-spaced leads and the possibility of incomplete

solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following

conditions must be observed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)

soldering technique should be used.

•The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate

solder thieves at the downstream end.

Even with these conditions, only consider wave

soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or

SSOP20 (SOT266-1).

METHOD (SO AND SSOP)

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

1997 Jan 08 27

Philips Semiconductors Preliminary speciﬁcation

Universal I2C-bus programmable RF

modulator TDA8822

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

PURCHASE OF PHILIPS I2C COMPONENTS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the

components in the I2C system provided the system conforms to the I2C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

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Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. +90 212 279 2770, Fax. +90 212 282 6707

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 625 344, Fax.+381 11 635 777

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,

Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. +61 2 9805 4455, Fax. +61 2 9805 4466

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. +43 1 60 101, Fax. +43 1 60 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 689 211, Fax. +359 2 689 102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,

Tel. +1 800 234 7381

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. +45 32 88 2636, Fax. +45 31 57 1949

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615800, Fax. +358 9 61580/xxx

France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 23 53 60, Fax. +49 40 23 536 300

Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. +30 1 4894 339/239, Fax. +30 1 4814 240

Hungary: see Austria

India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722

Indonesia: see Singapore

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381

Middle East: see Italy

Printed in The Netherlands 537021/50/01/pp28 Date of release: 1997 Jan 08 Document order number: 9397 750 01601