© Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. 1
1Publication Order Number:
NCP590/D
NCP590
Dual Output, High Accuracy,
Ultra Low Dropout
CMOS LDO
The NCP590 is a family of very high precision dual-output CMOS
LDOs offered in a 2x2 DFN8 package. Each output is capable of
delivering up to 300 mA and is available in voltages from 0.8 V to
5 V.
The set point output voltage is accurate to within ±0.9% with an
operating voltage input up to 5.5 V. With its ultra low dropout
characteristics and low quiescent and ground current consumption,
the NCP590 is ideal for all battery operated consumer and
microprocessor applications. The NCP590 is protected against short
circuit and thermal overload conditions.
Features
Dual Outputs, Each Supporting up to 300 mA Current
Available in Output Combinations Ranging from 0.8 V to 5.0 V
2.1 V to 5.5 V VCC Operating Supply Range
Ultra-High Accuracy (0.9% max at 100 mA load & 25°C)
Each Output has a Dedicated Enable Control Pin
Enable Threshold Supports sub-1 V Systems
Very Low Drop Out Voltage (50 mV typ @ 100 mA load)
Low Noise (~20 mVrms) without Bypass Capacitor
Ultra Low Shutdown Current (0.2 mA)
Low Quiescent and Ground Current (80 - 100 mA typ.)
Thermal Shutdown and Current Limit Protection
Active Output Discharge when Disabled
No Minimum Output Current Required for Stability
Requires Cout of only 1.0 mF (any ESR) for Stability
Stable with Any Type of Capacitor (including MLCC) and Zero Load
Input Under Voltage Lock Out (UVLO)
Internally Compensated Regulator for Quick Transient Response
Space-Efficient 2x2 DFN8 Package
This is a Pb-Free Device
Applications
Cellular Phones
Cameras
MP3/CD Players, PDA's, Camcorders
DSP Supplies
Portable Info-tronics
PCMCIA Cards
Networking Systems, DSL/Cable Modems
DFN8, 2x2
MN SUFFIX
CASE 506AA
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MARKING DIAGRAM
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
ORDERING INFORMATION
1
XX = Specific Device Code
M = Date Code
XX M
14
PIN CONNECTIONS
(Top View)
Vin
EN1
EN2
NC
Vout1
Vout2
GND
NC
8
7
6
5
1
2
3
4
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2
Figure 1. Typical Application
NCP590
Vin Vin
EN1
EN2
NC
ON
OFF
ON
OFF
Cin
1 mF
Vout1
Vout2
GND
NC
Cout1
1 mF
Cout2
1 mF
Vout1
Vout2
RLoad
RLoad
PIN FUNCTION
Pin No. Symbol Function
1 Vin Input; Bypass directly at the IC with a 1 mF ceramic capacitor to Ground
2 EN1 Enable for output regulator 1; raise above 0.95 V to enable Vout1
3 EN2 Enable for output regulator 2; raise above 0.95 V to enable Vout2
4, 5 NC NC; Do not make connection to these pins
6 GND Ground
PAD GND The thermal pad should be connected to ground for best thermal performance. Float if necessary
7 Vout2 Output 2; Bypass to GND with a capacitor, 4.7 mF C 0.7 mF, any ESR
8 Vout1 Output 1; Bypass to GND with a capacitor, 4.7 mF C 0.7 mF, any ESR
Figure 2. Block Diagram
Current Limit
Saturation Sense
Thermal Protection
Error
Amplifier
Programmable
Reference
+
-
Current Limit
Saturation Sense
Thermal Protection
Error
Amplifier
+
-
Vout2
Vout1
GND
Vin
EN1
EN2
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ABSOLUTE MAXIMUM RATINGS TJ = -40°C to 125°C
Pin Symbol, Parameter Symbol Condition Min Max Unit
VIN, Input to regulator Voltage VIN -0.3 6.0 V
Current IIN - Internally
Limited
VIN, Input peak Transient Voltage to regulator wrt GND VIN 7.0 V
VOUT1, VOUT2,
Regulated Output
Voltage VOUT -0.3 VIN + 0.3
or 6.0
(Note 1)
V
Current IOUT - Internally
Limited
EN1, EN2, Enable Input VEN -0.3 VIN + 0.3
or 6.0
(Note 1)
V
Junction Temperature
Storage Temperature
TJ
Tstg
-
-50
125
150
_C
ESD Capability, Human body model (Note 3) ESDHB -2 2 kV
ESD Capability, Machine model (Note 3) ESDMM -200 200 V
Voutx-Vin (Note 2) VRB - 0.3 V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Which ever limit is lower
2. Exceeding this value will turn on the body diode of the PMOS driver (reference Figure 2).
THERMAL RESISTANCE
Parameter Symbol Condition Value Unit
Junction-to-Ambient 2X2 DFN
1 oz Cu
qJA 207.0 sq mm 1 oz Cu
54.2 sq mm 1 oz Cu
20.2 sq mm 1 oz Cu
158
210
375
_C/W
Junction-to-Ambient 2X2 DFN
2 oz Cu
qJA 207.0 sq mm 2 oz Cu
54.2 sq mm 2 oz Cu
20.2 sq mm 2 oz Cu
133
184
330
_C/W
Junction-to-Board 2X2 DFN PsiJB 36.4 _C/W
Lead Temperature Soldering, (Note 4)
Reflow (SMD styles only), lead free
Tsld 60 -150 sec above 217
40 sec max at peak
265 pk _C
Moisture Sensitivity Level MSL 1
3. This device series incorporates ESD protection and is tested by the following methods:
ESD HBM tested per AEC-Q100-002 (EIA/JESD22-A114)
ESD MM tested per AEC-Q100-003 (EIA/JESD22-A115)
4. Per IPC/JEDEC J-STD-020C
NCP590
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4
ELECTRICAL CHARACTERISTICS -40°C v TA v 85°C (Note 5); VIN = VOUT +0.5 V or 2.1 V, whichever is greater (Note 6).
VEN1,2 = 0.95 V, CIN = COUT1,2 = 1.0 mF, unless noted otherwise
Parameter Symbol Test Conditions Min Typ Max Unit
Regulators
Input Voltage VIN ** which ever limit is greater Vout(max)
+ 0.5 or
2.1 V**
- 5.5 V
Enable Input Voltage VEN * which ever limit is lower 0.0 - VIN+ 0.3
or 5.5*
V
Voltage Accuracy VOUT IOUT = 100 mA, TA = 25°C (Note 11) -0.9 - +0.9 %
Voltage Accuracy VOUT IOUT = 1 mA to 200 mA
-40 _C v TA v 85_C (Notes 9, 11, 12)
-1.9 - +1.9 %
Overall Voltage Accuracy VOUT IOUT = 1 mA to 200 mA, VIN = (VOUT
+0.5 V) to 5.5 V, 2.1 VINmin 0°C v TA
v 85°C, (Notes 12, 13)
-2.4 - +2.4 %
Line Regulation (Note 7) DVOUT IOUT = 1.0 mA
VIN = (Vout + 0.5 V) to 5.5 V,
VINmin = 2.1 V
-±0.05 - %/V
Load Regulation (Note 7) DVOUT IOUT = 1 mA to 200 mA -0.012 -0.005 0.012 %/mA
Drop-out Voltage, (Note 8) VDO IOUT = 50 mA - 23 40 mV
Drop-out Voltage, (Note 8) VDO IOUT = 100 mA - 52 85 mV
Drop-out Voltage, (Note 8) VDO IOUT = 150 mA - 80 125 mV
Drop-out Voltage, (Note 8) VDO IOUT = 200 mA -110 170 mV
Drop-out Voltage, (Note 8) VDO IOUT = 300 mA - 165 225 mV
Quiescent Current;
Iq = IIN – IOUT
IqVEN1 = 0.95 V, IOUT1 = 0 mA;
VEN2 = 0.4 V, IOUT2 = 0 mA
OR
VEN2 = 0.95 V, IOUT2 = 0 mA;
VEN1 = 0.4 V, IOUT1 = 0 mA
One Regulator ON; One Regulator OFF
- 80 125 mA
Quiescent Current;
Iq = IIN – IOUT
IqIOUT1 = IOUT2 = 0 mA
Both Regulators ON
-115 195 mA
5. Performance guaranteed over specified operating range by design, guard banded test limits, and/or characterization. Production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
6. VOUT based on the greater of the two outputs.
7. Overall accuracy specified over specified operating conditions of line, load, and temperature.
8. Drop out voltage VDO = VIN – VOUT measured when the output voltage has dropped 100 mV from the nominal value for VOUT > 2.0 V.
9. Guaranteed by design, not production tested.
10. Regulated and stable output over full load range down to 0 mA load.
11. VIN is set at VIN = ((VOUT + 0.5 V) + 5.5 V) / 2 or VIN = ((2.1 V) + 5.5 V) / 2, whichever is greater.
12. Applicable for VOUT u 1.2 V.
13. For all output voltages and -40°C to 85°C overall voltage accuracy is 2.9%.
14. Typical disable current is in the nA.
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ELECTRICAL CHARACTERISTICS -40°C v TA v 85°C (Note 5); VIN = VOUT +0.5 V or 2.1 V, whichever is greater (Note 6).
VEN1,2 = 0.95 V, CIN = COUT1,2 = 1.0 mF, unless noted otherwise
Parameter UnitMaxTypMinTest ConditionsSymbol
Regulators
Ground Current;
IGND = IIN – IOUT
IGND VEN1 = 0.95 V, IOUT1 = 200 mA;
VEN2 = 0.4 V, IOUT2 = 0 mA
OR
VEN2 = 0.95 V, IOUT2 = 200 mA;
VEN1 = 0.4 V, IOUT1 = 0 mA
One Regulator ON; One Regulator OFF
- 105 150 mA
Ground Current;
IGND = IIN – IOUT
IGND IOUT1 = IOUT2 = 200 mA
Both Regulators ON
- 175 250 mA
Disable Current;
IDIS = IIN – IOUT
IDIS IOUT1,2 = 0 mA, VEN1,2 = 0.4 V
Both Regulators OFF
0 (Note
14)
1mA
ILoad Load Current (Note 10) IOUT 0 - - mA
Maximum Output Current IOUT 300 - - mA
Current Limit, per Regulator (Note 9) ISC VOUT = 0 V - 750 - mA
Output Noise Voltage (Note 9) enBW = 10 Hz to 100 kHz
VOUT = 0.8 V
VOUT = 2.8 V
-
-
20
30
-
-
mVRMS
Thermal Shutdown (Note 9) TjSD Junction Temperature - 155 - _C
Hysteresis - 15 -
Input under voltage lock out UVLO - 1.9 2.1 V
UVLO hysteresis UVLOhys - 0.1 - V
Power Supply Rejection Ratio
(Note 9)
PSRR IOUT = 200 mA
120 Hz 0.8 V output
120 Hz 1.8 V output
120 Hz 2.8 V output
-
-
-
60
55
50
-
-
-
dB
Power Supply Rejection Ratio
(Note 9)
PSRR IOUT = 200 mA
1 KHz 2.8 V output - 40 -
dB
Enable Control Characteristics
Maximum Input Current at EN Input IEN VEN = 0.0 V - 0.01 - mA
VEN = VIN - 0.01 -
Low Input Threshold VIL - - 0.4 V
High Input Threshold VIH 0.95 - - V
Timing Characteristics
Turn On Time Delay, Both outputs
turned on with ENABLE
TON To 95% DVO
VIN(MIN) to 5.5 V
- 375 700 ms
Turn Off Time Delay, Both outputs
turned off with ENABLE (Note 9)
TOFF VIN = 5.5 V
VOUT = 5 V, to VOUT = 250 mV
VOUT = 0.8 V, to VOUT = 40 mV
-
-
215
155
-
-
ms
ms
Recommended Output Capacitor Specifications
Output Capacitance (Note 9) COUT Capacitance over full temperature
range of application. Any ESR
0.7 1.0 4.7 mF
5. Performance guaranteed over specified operating range by design, guard banded test limits, and/or characterization. Production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
6. VOUT based on the greater of the two outputs.
7. Overall accuracy specified over specified operating conditions of line, load, and temperature.
8. Drop out voltage VDO = VIN – VOUT measured when the output voltage has dropped 100 mV from the nominal value for VOUT > 2.0 V.
9. Guaranteed by design, not production tested.
10. Regulated and stable output over full load range down to 0 mA load.
11. VIN is set at VIN = ((VOUT + 0.5 V) + 5.5 V) / 2 or VIN = ((2.1 V) + 5.5 V) / 2, whichever is greater.
12. Applicable for VOUT u 1.2 V.
13. For all output voltages and -40°C to 85°C overall voltage accuracy is 2.9%.
14. Typical disable current is in the nA.
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Figure 3. Measuring Circuit
NCP590
Vin Vin
EN1
EN2
NC
ON
OFF
ON
OFF
Iin
Cin
1 mF
IGND
Vout1
Vout2
GND
NC
IOUT1
IOUT2
Cout1
1 mF
Cout2
1 mF
Vout1
Vout2
RLoad
RLoad
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TYPICAL PERFORMANCE CHARACTERISTICS
200 mA
1.0 mA
Figure 4. Current Limit vs. Temperature Figure 5. Typical Output Voltage Variation vs.
Load Current
TEMPERATURE (°C) LOAD CURRENT (mA)
806040200-20-40
0
100
200
300
500
600
800
900
3002001000
-3.5
-3.0
-2.5
-2.0
-1.5
-1.0
-0.5
0
Figure 6. Power Supply Rejection Ratio Figure 7. Cross Channel Rejection vs.
Frequency
f, FREQUENCY (Hz) f, FREQUENCY (Hz)
10,0001,00010010
0
10
20
30
40
50
60
Figure 8. Output Voltage Change vs.
Temperature for 0.8 Vout
Figure 9. Output Voltage Change vs.
Temperature for 5.0 Vout
TEMPERATURE (°C) TEMPERATURE (°C)
806040200-20-40
0.785
0.790
0.795
0.800
0.805
0.810
0.815
806040200-20-40
4.95
4.96
4.97
5.00
5.01
5.02
5.04
5.05
CURRENT LIMIT (mA)
OUTPUT DROOP (%)
RIPPLE REJECTION (dB)Vout, OUTPUT VOLTAGE (V)
Vout, OUTPUT VOLTAGE (V)
400
700
200 mA
150 mA
100 mA
50 mA
1 mA
4.98
4.99
5.03
200 mA
150 mA
100 mA 50 mA
1 mA
VOUT = 2.8 V
5.0 V 3.3 Vout
2.8 Vout
1.5 Vout
0.8 Vout
-60
-50
-40
-30
-20
-10
0
REJECTION (dB)
10 100 1000 10000
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TYPICAL PERFORMANCE CHARACTERISTICS
Figure 10. Output Voltage Change vs.
Temperature for 2.8 Vout
Figure 11. 2.8 Vout vs. Line Transient
TEMPERATURE (°C)
806040200-20-40
2.77
2.79
2.80
2.81
2.82
2.83
Figure 12. Load Transient on 2.8 Vout and
Effect on 2.8 Vout for 200 mA Step
Figure 13. Load Transient on 5.0 Vout and
Effect on 3.3 Vout for 200 mA Step
Figure 14. Load Transient on 0.8 Vout and
Effect on 1.5 Vout for 200 mA Step
Figure 15. Typical Turn-on Delay for 3.3 Vout
1 mA, 5.0 Vout 200 mA Output with
Simultaneous Vin and Enable
Vout, OUTPUT VOLTAGE (V)
2.78 200 mA
150 mA
100 mA
50 mA
1 mA
CH2
2.8 V Output1
200 mA step
50 mV / div
CH3
2.8 V Output2
1 mA Load
10 mV / div
CH2, 0.8 V Output
200 mA step
50 mV / div
CH3
1.5 V Output
1 mA Load
10 mV / div
CH4
200 mA step on
0.8 V Output
CH2
Vin 3.3 V to 3.8 V
1 V / div
30 ms rise
30 ms fall
CH3
2.8 V Output, 1 mA Load
10 mV / div, 7 mV pk
NCP590 2.8 V Output, Line Transient Response, dVin = 0.5 V,
Trise = Tfall = 30 msec.
CH3, 5.0 Vout
50 mV / div
200 mA step
CH2
3.3 Vout
10 mV / div
1 mA Load
CH4
5.0 Vout
200 mA step
CH3
EN1, EN2,
Vin 2 V / div
CH2
Vout2 2 V / div
C2 Rise, 50.9 ms
D: 4.80 V
D: 362 ms
@: 4.76 V
C4 rise
24.3 ms
NCP590 Delay 5.5 Vin, EN1 = EN2 = Vin step, Vout1 = 3.3 V 1 mA,
Vout2 = 5.0 V 200 mA
CH4
200 mA step on
2.8 V Output1, 200 mA / div
CH4, Vout1 1 V / div
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APPLICATION INFORMATION
Output Regulator
The output is controlled by a precision trimmed
reference and error amplifier. The output has saturation
control for regulation while the input voltage is low,
preventing over saturation. Current limit and voltage
monitors complement the regulator design to give safe
operating signals to the processor and control circuits.
Standard linear regulator design circuitry consists of
only an active output driver providing current at the
regulated voltage with resistors from the regulated output
to ground (used in the feedback loop). This provides good
turn-on characteristics from the active PFET output driver,
but turn-off characteristics are determined by the output
capacitor values and impedance of the load in parallel with
the internal resistors in the feedback loop. The turn-off
time in the situation with high impedance loads will be
slow. The NCP590 has active pull-down transistors which
turn on during device turn-off creating efficient fast
turn-offs independent of loading.
Stability Considerations
The input capacitor Cin in Figure 3 is necessary to
provide low impedance to the input of the regulator.
The output or compensation capacitor Coutx helps
determine three main characteristics of a linear regulator:
start-up delay, load transient response and loop stability.
The capacitor value and type should be based on cost,
availability, size and temperature constraints. The
aluminum electrolytic capacitor is the least expensive
solution, but, if the circuit operates at low temperatures
(-25°C to -40°C), both the value and ESR of the capacitor
will vary considerably. The capacitor manufacturer's data
sheet usually provides this information.
Stability is guaranteed at values COUT = 0.7 mF to 4.7 mF
and any ESR within the operating temperature range.
Calculating Power Dissipation in a Dual Output Linear
Regulator
The maximum power dissipation for a dual output
regulator (Figure x) is:
PD = (VINVOUT1) x IOUT1 + (VIN VOUT2 ) x IOUT2
+ VIN x IGND (1)
where:
VIN is the maximum input voltage,
VOUT is the output voltage for each output,
IOUT is the output current for each output in the application,
and
IGND is the quiescent or ground current the regulator
consumes at IOUT
.
Once the value of PD(max) is known, the maximum
permissible value of RqJA can be calculated:
RqJA +(125oC*TA)ńPD(eq. 1)
The value of RqJA can then be compared with those in the
thermal resistance section of the data sheet. Those board
areas with RqJA
's less than the calculated value in equation
2 will keep the die temperature below 125°C. In some
cases, none of the circuit board areas will be sufficient to
dissipate the heat generated by the IC, and an external heat
sink will be required. The current flow and voltages are
shown in the Measurement Circuit Diagram. A chart
showing thermal resistance vs. pcb heat spreader area is
shown below.
Enable
Enabling the two outputs is controlled by two
independent pins, EN1 and EN2. A high (above the high
input threshold) on these logic level input pins causes the
outputs to turn on.
Normal operation allows for input voltages to these pins
to 0.3 V above VIN. It is sometimes necessary to interface
logic outputs from different operating voltages into these
pins. This happens when standard operating system
voltages must interface together (i.e., 5 V to 3.3 V systems).
For example, a 5 V control voltage is needed to control
the NCP590 operating with VIN = 3.6 V. The input current
into the ENx pin can be kept to safe levels by adding a 100 k
resistor in series with the 5 V control drive voltage. This
will keep the input voltage in compliance with the
maximum ratings and will allow control of the output. Use
of this setup will affect turn-on time and will increase the
enable current higher than the input current specified in the
electrical parameter tables.
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10
Figure 16. Thermal Performance on PCB Heat Spreader
COPPER HEAT SPREADING AREA (mm2)
qJA (°C/W)
400
350
300
200
150
100
250
50
0
650600550500450400350300250200150100500
1 oz
2 oz
Thermal impedance of the NCP590 DFN8 mounted to a single sided copper plated circuit board.
ORDERING INFORMATION*
Device Output Voltage
Package Shipping
Orderable Part Number Marking Code VOUT1 VOUT2
NCP590MNVVTAG VV 3.3 3.3 DFN8 2x2 10,000 / Tape & Reel
NCP590MNPPTAG PP 2.8 2.8 DFN8 2x2 10,000 / Tape & Reel
NCP590MNDPTAG DP 1.8 2.8 DFN8 2x2 10,000 / Tape & Reel
NCP590MNOATAG OA 1.5 2.4 DFN8 2x2 10,000 / Tape & Reel
NCP590MN5DTAG 5D 1.2 1.8 DFN8 2x2 10,000 / Tape & Reel
NCP590MN5ATAG 5A 1.2 1.5 DFN8 2x2 10,000 / Tape & Reel
*Contact factory for additional voltage combinations.
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PACKAGE DIMENSIONS
DFN8, 2x2
CASE 506AA-01
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
A
D
E
B
C0.10
PIN ONE
2 X
REFERENCE
2 X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
L
(A3)
D2
E2
C
C0.10
C0.10
C0.08
8 X
A1
SEATING
PLANE
e/2 e
8 X
K
NOTE 3
b8 X
0.10 C
0.05 C
ABB
DIM MIN MAX
MILLIMETERS
A0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b0.20 0.30
D2.00 BSC
D2 1.10 1.30
E2.00 BSC
E2 0.70 0.90
e0.50 BSC
K0.20 ---
L0.25 0.35
14
85
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NCP590/D
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