ES2A thru ES2M Super Fast Surface Mount Rectifiers Reverse Voltage 50 to 1000 Volts Forward Current 2.0 Amperes Features Glass passivated junction chip For surface mounted application Low profile package Built-in strain relief Ideal for automated placement Easy pick and place Superfast recovery time for high efficiency Glass passivated chip junction High temperature soldering: 250oC/10 seconds at terminals Plastic material used carries Underwriters Laboratory Classification 94V-O Mechanical Data Cases: Molded plastic Terminals: Solder plated Polarity: Indicated by cathode band Weight: 0.003 ounce, 0.093 gram Maximum Ratings and Electrical Characteristics Ratings at 25oC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20% Parameter Symbols ES 2A ES 2B ES 2C ES 2D ES 2F ES 2G ES 2J ES 2K ES 2M Units Maximum repetitive peak reverse voltage VRRM 50 100 150 200 300 400 600 800 1000 Volts Maximum RMS voltage VRMS 35 70 105 140 210 280 420 560 700 Volts Maximum DC blocking voltage V DC 50 100 150 200 300 400 600 800 1000 Volts Maximum average forward rectified current S ee F i g. 1 I(AV) 2.0 Amps Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 50.0 Amps Maximum instantaneous forward voltage @ 2.0A VF Maximum DC reverse current at rated DC blocking voltage @ TA=25oC @ TA=100oC trr Typical junction capacitance (Note 2) CJ Operating junction temperature range Storage temperature range Notes: 1.3 1.7 Volts 10.0 350 IR Maximum reverse recovery time (Note 1) Typical thermal resistance (Note 3) 0.95 uA uA 35 25 nS 20 pF RJA RJL 75 20 TJ -55 to +150 o C -55 to +150 o C TSTG 1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A 2. Measured at 1 MHz and Applied VR=4.0 Volts 3. Units Mounted on P.C.B. 5.0 x 5.0mm (0.013mm thick) Pad Areas 239 o C/W RATINGS AND CHARACTERISTIC CURVES (TA = 25oC unless otherwise noted) 240