SHARP 10: [SPEC No. | EL13034 ISSUE: Nov. 12 2001 | SPECIFICATIONS Product Type VOLTAGE REFERENCE IC FOR LCD Model No. IR3E3074 *This specifications contains 24 pages including the cover and appendix. If you have any objections,please contact us before issuing purchasing order. CUSTOMERS ACCEPTANCE PRESENTED DATE: BY: hon BY: T. OHNO Dept. General Manager REVIEWED BY: PREPARED BY: WL. Yamaguich H. Dee Product Development Dept. I Analog Ic Division Integrated Circuits Group SHARP CORPORATIONSHARP IR3E3074 us @Handle this document carefully for it contains material protected by international copyright law. Any reproduction, -full or in part, of this material is prohibited without the express written permission of the company. @ihen using the products covered herein, please observe the conditions written herein and the precautions outlined in the following paragraphs. In no event shall the company be liable for any damages resulting from failure to strictly adhere to these conditions and precautions. (1)The products covered herein are designed and manufactured the following application areas. When using the products covered herein for the equipment listed in Paragraph (2), even for the following application areas, be sure to observe the precautions given in Paragraph (2). Never use the products for the equipment listed in Paragraph (3). . Office electronics . Instrumentation and measuring equipment . Machine tools . Audiovisual equipment . Home appliances . Communication equipment other than for trunk lines. (2)Those contemplating using the products covered herein for the following equipment which demands high reliability, should first contact a sales representative of the company and then accept responsibility for incorporating into the design fail-safe operation, redundancy, and _ other appropriate measures for ensuring reliability and safety of the equipment and the overall] system. . Control and safety devices for airplanes, trains, automobiles, and other transportation equipment . Mainframe computers . Traffic control systems . Gas leak detectors and automatic cutoff devices . Rescue and security equipment . Other safety devices and safety equipment, etc. (3)Do not use the products covered herein for the following equipment which demands extremely high performance in terms of functionality, reliability, or accuracy. . Aerospace equipment . Communications equipment for trunk lines . Control equipment for the nuclear power industry . Medical equipment related to life support, etc. (4)Please direct all queries and comments regarding the interpretation of the above three Paragraphs to a sales representative of the company. @Piease direct all queries regarding the products covered herein to a sales representative of the company.IRSE3074 ne CONTENTS Page 1. General Description 2 2. Terminal Name 3 3. Terminal Connections . 3 4. Block Diagram 4 5. Input/Output Circuit Type 5 6. Precautions . 6 7. Absolute Maximum Ratings 6 8. Electrical Characteristics 7 9. Package and Packing Specification , 9SHARP IR3E3074 ia 1. General Description - The Sharp IR3E3074 is an IC that generates gamma correction reference voltage for TFT LCD color monitors. Features: -Low power consumption. 9mW(TYP) *Contains a regulator of high accuracy. 4.1V+2.5% *Output sink/source current. ImA(MAX) Not designed or rated as radiation hardened. Package material: Plastic Chip material and wafer substrate type: P type silicon Number of pins and package type: 12-pin SSOP Process(Structure): Bipolar Applications TFT LCD color monitorsSHARP ot IR3E3074 2. Terminal Name terminal for Reference vol terminal for TFT LCD. No connection terminal. GND terminal. Reference vol output terminal for TFT LCD. nce vol ut terminal for TFT LCD. Reference vol terminal for TFT LCD. 3. Terminal Connections (TOP VIEW) N.C. VDD SW VCC COM v4 Vo V3 V1 V2 N.C GNDSHARP IR3E3074 4. Block Diagram GND VCC VDD f \_f (\_ LY YY 41 12 VOLTAGE ma REFERENCE | O vi Late -- i 5 =O,SHARP IR3SE3074 : 5. Input/Output Circuit Type (Vec=5.0V) No. Symbol Voltage Circuit type Discription 2 SW O~5V VCE Input terminal for switching signal. LOW : input voltage S0.8V HIGH: input voltage 22.0V 00 GND 3 COM |9Vor5V VCC Produce SW signal with the amplitude of O~5V. GND 4 vo 3.96V VCC Reference voltage output or 0.56V terminal for TFT LCD. 5 VL 3.06V | or 1.46V 9 V3 1.34V or 3.54V 10 V4 1.06V or 4.00V GND 8 V2 2.00V VCC Reference voltage output or 2.70V terminal for TFT LCD. GND 12 VDD 4.10V VCC Reference voltage output terminal. Connect a capacitor between GND. GND 7 GND OV GND terminal. 11 VCC 5V Power supply terminal.IR3E3074 6. Precautions GND terminal . Make sure that Pin 7 is connected to GND, and do not open it. ii)Decoupling capacitor Place the decoupling capacitor connected to Pin 11,12 to the IC pin as near as possible. 7. Absolute Maximum Ratings (Ta=25C) Parameter Symbol Condition Rating Unit Supply voltage VCC 7.0 V Power dissipation PD TaS25C 350 mW Derating ratio Ta>25T 3 mW/*C Operating temperature Topr -25-~75 Cc range Srorage temperature Tstg -55~150 c range Recommended operating conditions Parameter Symbol Condition Rating Unit Operating supply VCC 4.6~5.0~5.5 Vv voltage rangeSHARP IR3E3074 8. Electrical Characteristics Unless otherwise specified: VCC=5V, Ta=25, (SW)=5V I VDD 3] Output line AVLI Output regulation of VO~V9 at 4| Output load AVLD1| (SW)=0V io and * 5| Output voltage 6; COM output voltage Vv Vv time | tL M HL (#1) Output regulation of VO~V4. (SG1) + 64 u s* 64 sF 5V OVSHARP IR3E3074 Test Circuit (SW (VCC)SHARP IR3E3074 4, 9 9 Package and packing specification | 1.Storage Conditions. 1-1.Storage conditions required before opening the dry packing. - Normal temperature : 5~40T + Normal humidity : 80% R.H. max. 1-2.Storage conditions required after opening the dry packing. In order to prevent moisture absorption after opening, ensure the following storage conditions apply: (1) Storage conditions for one-time soldering. (Convection reflow*!, IR/Convection reflow.*}, V.PS., or Manual soldering. ) - Temperature :5~40T * Humidity : 75% R.H. max. * Period : 30 days max. after opening. (2) Storage conditions for two-time soldering. (Convection reflow"!, IR/Convection reflow.*!) Storage conditions following opening and prior to performing the 2nd reflow. - Temperature :5~40T. * Humidity : 75% R.H. max. Period : 30 days max. after opening. 1:Air or nitrogen environment. 1-3.Temporary storage after opening. To re-store the devices before soldering, do so only once and use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using heat-sealing. The storage period, temperature and humidity must be as follows : (1) Storage temperature and humidity. *1: External atmosphere temperature and humidity of the dry packing. First opening <- X1_> Re-sealing q- Y_ __ Reopening q. X2 p> Mounting <y LY WN eo Y Y YY ; 1 Temperature : 5~40T | 5~40T *K1 5~40T 5~40T Humidity : 80%R.H. maxi 75%R.H. max. i 80%R.H. max. 75%R.H. max. (2) Storage period. + X1+X2 : 30 days max. : Two weeks max. 20011105SHARP IR3E3074 2 10 2, Baking Condition. (1) Situations requiring baking before mounting. * Storage conditions exceed the limits specified in Section 1-2 or 1-3. * Humidity indicator in the desiccant was already red (pink) when opened. ( Also for re-opening.) (2) Recommended baking conditions. Baking temperature and period : 120 for 16~24 hours or 150C for 5~10 hours. * The above baking conditions do not apply since the embossed carrier tape are not heat-resistant . Replace the devices on heat-resistant carrier . (3) Storage after baking. After baking, store the devices in the environment specified in Section 1-2 and mount immediately. 3.Surface mount conditions. The following soldering condition are recommended to ensure device quality. 3-1.Soldering. (1) Convection reflow or IR/Convection. (one-time soldering only in air or nitrogen environment) * Temperature and period : Peak temperature of 240C max., above 230 for 15 sec. max. Above 200C for 50 sec. max. Preheat temperature of 140~160T for 90+30 sec. Temperature increase rate of 1~3T /sec. * Measuring point : IC package surface. * Temperature profile : 240C max 230 b 200C = : ee 5 160C So a 2 | 140 : Ss Preheating ( 90+30 sec.) 3 8 a, o mS, Temp. increase 1~3C sec. Time Y 20011105SHARP IR3E3074 uu (2) Convection reflow or IR/Convection. (two-time soldering only in air or nitrogen environment) * Temperature and period : Peak temperature of 230C max. Above 200C for 50 sec. max. Preheat temperature of 140~160T for 90+30 sec. Temperature increase rate of 1~3C sec. * Measuring point : IC package surface. * Temperature profile : 230 max. 200 2 Lave nas 5 160 2 % | 140C ; Ss Preheating (90+ 30 sec.) & o m+, Temp. increase 1~3C /sec. Time Y (3) V.P.S.( one-time soldering only ) * Temperature and period : Peak temperature of 215C max., above 200T for 40 sec. max. Preheat temperature of 140~160T for 90+30 sec. Temperature increase rate of 1~4T /sec. * Measuring point : IC package surface. * Temperature profile 40 sec. max. Preheating (90+ 30 sec.) IC package surface temperature Temp. increase 1~4T /sec. Y 20011105SHARP IR3E3074 4 12 (4) Manual soldering ( soldering iron) ( one-time soldering only ) Soldering iron should only touch the ICs outer leads. * Temperature and period : 350 max. for 3 sec. / pin max., or 260C max. for 10 sec. / pin max. (Soldering iron should only touch the ICs outer leads.) * Measuring point : Soldering iron tip. 4. Condition for removal of residual flax. (1) Ultrasonic washing power : 25 watts / liter max. (2) Washing time : Total 1 minute max. (3) Solvent temperature : 15~40 5. Package outline specification. Refer to the attached drawing. 6. Markings. 6-1.Marking details. (The information on the package should be given as follows.) (1) Productname : 35307 (2) Companyname : S (3) Date code (Example) Y M W tH, Denotes the production week. | Denotes the production month. (1 2:~+8:9-0N:D) Denotes the production year. (Last two digits of the year.) 6-2.Marking layout. The layout is shown in the attached drawing. (However, this layout does not specify the size of the marking character and marking position.) 20011105SHARP IR3E3074 13 12-0.33L0, | P-O.75TYP. TT } $f 1 012 @ H H Lf = Oo ~ 2g f - .\ N < =| 3 a = ot | 38 jee ) J A 4 y) | 0.1520.05 50t02 led ou = o ~ 4 |L7\ 0.1 + So DETAIL A N; 10 oO Hl ! [ oO a -, WO | PKG. BASE PLANE Oy ~. Se HL 4 O~10 mA | | * | o YFREUS WYP AY Y- RMB LEAD FINISH | _TIN-LEAD PLATING LEAD MATERIAL 42ALLOY oi | Ss TIAF YI NYT -TRETE, NUE NAME | SSOP012-P-0225 SERVSDETS, ' Bhp | . NOTE Plastic body dimensions do not include burr DRAWING NO. !AA865 UNIT | mm of resin. 20011105SHARP IR3E3074 14 VILA FV hH Marking layout 3E307 YMW 20011105SHARP IR3E3074 a 15 7.Packing specifications (Embossed carrier tape specifications) This standard applies to the embossed carrier tape specifications for ICs supplied by SHARP CORPORATION. SHARPs embossed carrier tape specifications are generally based on those described in JIS C 0806 (Japanese Industrial Standard) and EIA481A. 7-1.Tape structure The embossed carrier tape is made of conductive plastic. The embossed portions of the carrier tape are filled with IC packages and a top covering tape is used to enclose them. 7-2.Taping reel and embossed carrier tape size For the taping reel and embossed carrier tape sizes, refer to the attached drawing. 7-3.IC package enclosure direction in embossed carrier tape The IC package enclosure direction in the embossed portion relative to the direction in which the tape is pulled is indicated by an index mark on the package (indicating the No. 1 pin) shown in the attached drawing. : 7-4.Missing IC packages in embossed carrier tape The number of missing IC packages in the embossed carrier tape per reel should not exceed Hither 1 or 0.1 % of the total contained on the tape per reel, whichever is larger. There should never be more than two consecutive missing IC packages. 7-5.Tape joints There is no joint in an embossed carrier tape. 7-6.Peeling strength of the top covering tape Peeling strength must meet the following conditions. (1) Peeling angle at 165~180 . (2) Peeling speed at 300mm/min. (3) Peeling strength at 0.2~0.7N (20~70gf) . Top covering tape 165 ~180 Drawing direction Embossed carrier tape 20011105SHARP IR3E3074 4 16 7-7. Packing (1) The top covering tape (leader side) at the leading edge of the embossed carrier tape, and the trailing edge of the embossed carrier tape, should both be held in place with paper adhesive tape at least 30-mm in length. (2) The leading and trailing edges of the embossed carrier tape should be left empty (with embossed portions not filled with IC packages) in the attached drawing. (3) The number of IC packages enclosed in the embossed carrier tape per reel should generally comply with the list given below. Number of IC Packages/ . | Number of IC Packages/ Number of IC Packages/ Reel Inner carton Outer carton 2500 devices / Reel 2500 devices / Inner carton 12500 devices / Outer carton 7-8.Indications The following should be indicated on the taping reel and the packing carton. - Part Number ( Product Name) - Storage Quantity * Packed date * Manufactures Name (SHARP ) Note : The IC taping direction is indicated by "E1" or " E2" suffixed to the part number . E2 : Equivalent to" B" of the JIS C 0806 standard.. 7-9.Protection during transportation The IC packages should have no deformation and deterioration of their electrical Characteristics resulting from transportation. 8.Precautions for use. (1) Opening must be done on an anti-ESD treated workbench. All workers must also have undergone anti-ESD treatment. (2) The devices should be mounted the devices within one year of the date of delivery. 20011105SHARP [R3E3074 bo 17 EMBOSS TAPING TYPE (CE2) IC TAPING DIRECTION THE DRAWING DIRECTION OF TAPE eoeccoggoocescoocooqagg0gsgo0g 05930 mQo0lCUdfs =c a Ls ao go fom = = 1 = a = = = 5 =. = 5 EF 3 + & 2 = = i = = = = | | l INDEX OF IC PACKAGE (Indicate the NO.] pin of IC package) _ [ LEADER SIDE AND END SIDE OF TAPE | EMPTY EMBOSS | ADHESIVE TAPECPAPER) [SS ADHESIVE TAPECPAPER) 30 mm MIN. FILLED EMBOSSCWITH IC PACKAGE) 30 mm MIN. ! occa opop/eeese ooccec TF OU 0 A\ 2 AL _ neces eaene teeceeeerscerwatconeme, 1 4 START ID END SIDE 3 + ! Gre SED | CARRIER TAPE | | CARRIER TAPE ! 500mm NIN. | | 500mm MIN. | | nO ' | TOP COVER TAPE 200mm MIN. Zi | es NAME | Emboss taping type (E2) NOTE He | DRAWING NO. | cV522 UNIT mm 20011105SHARP IR3E3074 - 18 A 1? A wa =) - | : WD __h CN. I WY cy Le NGS co = = Ty bs Po wT Be _ Cry. ' 1 W I | : th - i LT _ CIN Hy XT Lo W | dle 2.0 73:3 wscest_| 1.75 23) mt < 12.0 223 5.4 _s i 2 > | io i) RO, 3LI-F -* EAR NAME as LEC8SPTS NOTE BAT DRAWING NO. ! CV710-01| UNIT 20011105SHARP IR3E3074 19 9330 Sif | as NAME ! Reel for embossed carrier tape} NOTE Ber | DRAWING NO. { CV755 | UNIT | mm 20011105SHARP IR3E3074 20 << Cushion pad Embossed carrier tape with reel Inner carton label Laminated alumini'~ bag Cushion pad ess 7 / - Inner carton label Inner carton L W H Inner carton ? Quter dimensions : 345 XK 345 & 5 GRR fas NAME 1 Packing specifications 1) NOTE ' BLAr DRAWING NO. | CV428 | UNIT nm 20011105SHARP IR3E3074 4 21 Inner carton Adhesive tape ( H taping ) Inner carton label RX SS A SA | _IHH}HYS}S|S>= > > Z Outer carton label LLL LLL Outer carton L W H Inner carton ~ Outer dimensions : 345 X 345 xX 55 Outer carton ~ Outer dimensions : 365 X 315 X 385 Si | GS HPRRORORS, AERCRRSTEMHVRT. NAME | Packing specifications 2) | NOTE There is a possibility different from this specification By! when the number of shipments is fractions. DRAWING NO. |BJ426 | UNIT! mm 20011105SHARP IR3E3074 o 22 Inner carton label [R3E3074 (3N) 1 1R3E3074 <QUANTITY> Quanti 2500 uantity (3N) 2 2500 XXXXXXXXXXXX 103120 Quantity PD lot Company code 1R3E3074/E2/ | Part No. (SHARP) YYYY. MM. DD TYPE : A SHARP MADE IN JAPAN ELAJ C-3 <RMK> XXXXXXXXXXXXXXXXX A A The country of origin (It displays, when the country of origin is Japan.) Packed date Assembly management No. | The country of origin Outer carton label (It displays, when the country of origin is Japan.) Part No. / (gare) (P| (4S) PKG_1D : 1R3E3074/E2/ / (Q) QUANTITY : 12500 MADE IN JAPAN | YYYY. MM, DO | (P)CUST PROD ID : 1R3E3074 Shipment lot XXXXXXXXXXXX SHARP 20011105