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ITRMS = 2x 300 A
ITAVM = 2x 130 A
VRRM = 800-1800 V
Symbol Test Conditions Maximum Ratings
ITRMS, IFRMS TVJ = TVJM 300 A
ITAVM, IFAVM TC = 85°C; 180° sine 130 A
ITSM, IFSM TVJ = 45°C; t = 10 ms (50 Hz), sine 4750 A
VR = 0 t = 8.3 ms (60 Hz), sine 5080 A
TVJ = TVJM t = 10 ms (50 Hz), sine 4230 A
VR = 0 t = 8.3 ms (60 Hz), sine 4530 A
òi2dt TVJ = 45°C t = 10 ms (50 Hz), sine 113 000 A2s
VR = 0 t = 8.3 ms (60 Hz), sine 108 000 A2s
TVJ = TVJM t = 10 ms (50 Hz), sine 89 500 A2s
VR = 0 t = 8.3 ms (60 Hz), sine 86 200 A2s
(di/dt)cr TVJ = TVJM repetitive, IT = 500 A 150 A/ms
f =50 Hz, tP =200 ms
VD = 2/3 VDRM
IG = 0.5 A non repetitive, I T = 500 A 500 A/ms
diG/dt = 0.5 A/ms
(dv/dt)cr TVJ = TVJM;V
DR = 2/3 VDRM 1000 V/ms
RGK = ¥; method 1 (linear voltage rise)
PGM TVJ = TVJM tP = 30 ms 120 W
IT = ITAVM tP = 500 ms60W
PGAV 8W
VRGM 10 V
TVJ -40...+125 °C
TVJM 125 °C
Tstg -40...+125 °C
VISOL 50/60 Hz, RMS t = 1 min 3000 V~
IISOL £ 1 mA t = 1 s 3600 V~
MdMounting torque (M6) 2.25-2.75/20-25 Nm/lb.in.
Terminal connection torque (M6) 4.5-5.5/40-48 Nm/lb.in.
Weight Typical including screws 125 g
VRSM VRRM Type
VDSM VDRM
V V Version 1 Version 1
900 800 MCC 132-08io1 MCD 132-08io1
1300 1200 MCC 132-12io1 MCD 132-12io1
1500 1400 MCC 132-14io1 MCD 132-14io1
1700 1600 MCC 132-16io1 MCD 132-16io1
1900 1800 MCC 132-18io1 MCD 132-18io1
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
Features
International standard package
Direct copper bonded Al2O3 -ceramic
base plate
Planar passivated chips
Isolation voltage 3600 V~
UL registered, E 72873
Keyed gate/cathode twin pins
Applications
Motor control
Power converter
Heat and temperature control for
industrial furnaces and chemical
processes
Lighting control
Contactless switches
Advantages
Space and weight savings
Simple mounting
Improved temperature and power
cycling
Reduced protection circuits
MCC132
MCD132
Thyristor Modules
Thyristor/Diode Modules
MCD
MCC
3671542
31542
12367
54
032
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Symbol Test Conditions Characteristic Values
IRRM, IDRM TVJ = TVJM; VR = VRRM; VD = VDRM 10 mA
VT, VFIT, IF = 300 A; TVJ = 25°C 1.36 V
VT0 For power-loss calculations only (TVJ = 125°C) 0.8 V
rT1.5 mW
VGT VD = 6 V; TVJ = 25°C 2.5 V
TVJ = -40°C 2.6 V
IGT VD = 6 V; TVJ = 25°C 150 mA
TVJ = -40°C 200 mA
VGD TVJ = TVJM;V
D = 2/3 VDRM 0.2 V
IGD 10 mA
ILTVJ = 25°C; tP = 30 ms; VD = 6 V 300 mA
IG = 0.5 A; diG/dt = 0.5 A/ms
IHTVJ = 25°C; VD = 6 V; RGK = ¥ 200 mA
tgd TVJ = 25°C; VD = 1/2 VDRM 2ms
IG = 0.5 A; diG/dt = 0.5 A/ms
tqTVJ = TVJM; IT = 160 A, tP = 200 ms; -di/dt = 10 A/ms typ. 150 ms
VR = 100 V; dv/dt = 20 V/ms; VD = 2/3 VDRM
QSTVJ = TVJM; IT, IF = 300 A, -di/dt = 50 A/ms 550 mC
IRM 235 A
RthJC per thyristor/diode; DC current 0.23 K/W
per module other values 0.115 K/W
RthJK per thyristor/diode; DC current see Fig. 8/9 0.33 K/W
per module 0.165 K/W
dSCreepage distance on surface 12.7 mm
dAStrike distance through air 9.6 mm
aMaximum allowable acceleration 50 m/s2
Optional accessories for modules
Keyed gate/cathode twin plugs with wire length = 350 mm, gate = yellow, cathode = red
Type ZY 180L (L = Left for pin pair 4/5) UL 758, style 1385,
Type ZY 180R (R = right for pin pair 6/7) CSA class 5851, guide 460-1-1
Dimensions in mm (1 mm = 0.0394")
MCC MCD
Fig. 1 Gate trigger characteristics
Fig. 2 Gate trigger delay time
MCC132
MCD132
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Fig. 4 i2t versus time (1-10 ms) Fig. 4a Maximum forward current
at case temperature
Fig. 5 Power dissipation versus on-
state current and ambient
temperature (per thyristor or
diode)
Fig. 6 Three phase rectifier bridge:
Power dissipation versus direct
output current and ambient
temperature
MCC 132
MCD 132
Fig. 3 Surge overload current
ITSM, IFSM: Crest value, t: duration
s
t
ms
t
0.001 0.01 0.1 1
0
1000
2000
3000
4000
110
104
105
106
A2s
ITSM Ai2t
TVJ = 45°C
TVJ = 125°C
80 % VRRM
TVJ = 45°C
50 Hz
TVJ = 125°C
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Fig. 7 Three phase AC-controller:
Power dissipation versus RMS
output current and ambient
temperature
Fig. 8 Transient thermal impedance
junction to case (per thyristor or
diode)
Fig. 9 Transient thermal impedance
junction to heatsink (per thyristor
or diode)
MCC 132
MCD 132
RthJC for various conduction angles d:
d RthJC (K/W)
DC 0.230
180°0.244
120°0.255
60°0.283
30°0.321
Constants for ZthJC calculation:
iR
thi (K/W) ti (s)
1 0.0095 0.001
2 0.0175 0.065
3 0.203 0.4
RthJK for various conduction angles d:
d RthJK (K/W)
DC 0.330
180°0.344
120°0.355
60°0.383
30°0.421
Constants for ZthJK calculation:
iR
thi (K/W) ti (s)
1 0.0095 0.001
2 0.0175 0.065
3 0.203 0.4
4 0.1 1.29
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