PAN4620
IEEE® 802.15.4 and Bluetooth® Low Energy Module
Product Specification
Rev. 0.1
Wireless Modules
PAN4620 802.15.4 and BLE Module
Product Specification Rev. 0.1 Page 2
Overview
The PAN4620 is Panasonic’s Internet of Things
dual mode module comprising NXP®’s Kinetis
MKW41Z512CAT4 SoC - a 2.4 GHz 802.15.4 and
Bluetooth® Low Energy wireless radio
microcontroller based on an ARM® Cortex-M0+
core.
Features
• UART, SPI, I²C, TSI, ADC & DAC
• Same form factor and compatible pinout for
VCC, GND, Reset, UART, I²C, and SWD as
PAN1026, PAN1760, PAN1760A, and PAN1761
• Single and concurrent operation of IEEE®
802.15.4 and BLE
• Open to various known application layers or
proprietary solutions
• Surface Mount Type dimensions: 15.6 mm x
8.7 mm x 1.9 mm
• On module 32 MHz and 32 kHz crystal
• SoC: NXP® Kinetis® KW41Z – 2.4 GHz 802.15.4
and BLE 4.2 Wireless Radio Microcontroller
• Core: Up to 48 MHz 32 bit ARM® Cortex-M0+
• Memory: 512 kB of flash and 128 kB of SRAM
• Voltage range: 1.8 V to 4.2 V
• Temperature range: -40 °C to 85 °C
Characteristics
• Transceiver frequency range 2360 MHz to
2483.5 MHz
• Programmable transmitter output power:
-30 dBm to 3 dBm
• Receiver sensitivity (BLE): -93 dBm
• Receiver sensitivity typical for IEEE® Standard
802.15.4: -98 dBm
• Typical receiver current consumption (3.6 V
supply): 8.5 mA
• Transmitter current consumption (3.6 V supply,
0 dBm): 7.6 mA
Bluetooth®
• Bluetooth® LE 4.2 compliant implementation
certified by BT SIG
• Supporting software consisting of BLE host stack
and profiles and IPv6 6LoBLE
• Bluetooth® Developer Studio Plug-In
IEEE® 802.15.4
• IEEE® standard 802.15.4 compliant
• Supporting software consisting of 802.15.4
MAC/PHY implementation, Simple Media Access
Controller (SMAC), and NXP®’s certified Thread®
stack
Block Diagram
PAN4620 802.15.4 and BLE Module
Product Specification Rev. 0.1 Page 3
By purchase of any of the products described in this document the customer accepts the document's
validity and declares their agreement and understanding of its contents and recommendations. Panasonic
Industrial Devices Europe GmbH (Panasonic) reserves the right to make changes as required at any time
without notification. Please consult the most recently issued Product Specification before initiating or
completing a design.
© Panasonic Industrial Devices Europe GmbH 2017.
This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is
without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do
not disclose it to a third party.
All rights reserved.
This Product Specification does not lodge the claim to be complete and free of mistakes.
Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status “Engineering
Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and they may differ from the published Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series
production.
Disclaimer
The customer acknowledges that samples may deviate from the Product Specification and may bear
defects due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic
disclaims liability for damages caused by:
The use of the Engineering Sample other than for evaluation purposes, particularly the installation
or integration in another product to be sold by the customer,
Deviation or lapse in function of the Engineering Sample,
Improper use of the Engineering Sample.
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental
damages. In case of any queries regarding the Engineering Samples, please contact your local sales
partner or the related product manager.
PAN4620 802.15.4 and BLE Module
Product Specification Rev. 0.1 Page 4
Table of Contents
1 About This Document ......................................................................................................................... 6
1.1 Purpose and Audience .............................................................................................................. 6
1.2 Revision History ......................................................................................................................... 6
1.3 Use of Symbols ......................................................................................................................... 6
1.4 Related Documents ................................................................................................................... 6
2 Overview .............................................................................................................................................. 7
2.1 Block Diagram ........................................................................................................................... 8
2.2 Pin Configuration ....................................................................................................................... 9
2.3 Transceiver Features ............................................................................................................... 13
3 Detailed Description ......................................................................................................................... 16
3.1 Dimensions .............................................................................................................................. 16
3.2 Footprint .................................................................................................................................. 17
3.3 Packaging ................................................................................................................................ 18
3.4 Case Marking .......................................................................................................................... 21
4 Specification ..................................................................................................................................... 22
4.1 Default Test Conditions ........................................................................................................... 22
4.2 Absolute Maximum Ratings ..................................................................................................... 22
4.3 Recommended Operating Conditions ...................................................................................... 23
4.4 Current Consumption............................................................................................................... 24
4.5 Internal Operating Frequencies ............................................................................................... 24
4.6 Interface Specification ............................................................................................................. 25
4.7 Flash electrical specifications .................................................................................................. 40
4.8 General switching specification ............................................................................................... 41
4.9 Transceiver Feature Summary ................................................................................................ 42
4.10 Reliability Tests ....................................................................................................................... 47
4.11 Recommended Soldering Profile ............................................................................................. 48
5 Cautions ............................................................................................................................................ 49
5.1 Design Notes ........................................................................................................................... 49
5.2 Installation Notes ..................................................................................................................... 49
5.3 Usage Condition Notes ............................................................................................................ 50
5.4 Storage Notes .......................................................................................................................... 50
5.5 Safety Cautions ....................................................................................................................... 50
5.6 Other Cautions ........................................................................................................................ 51
5.7 Life Support Policy ................................................................................................................... 51
6 Regulatory and Certification Information ....................................................................................... 52
6.1 Federal Communications Commission (FCC) for US .............................................................. 52
6.2 Innovation, Science, and Economic Development (ISED) for Canada .................................... 52
6.3 European Conformity According to RED (2014/53/EU) ........................................................... 52
6.4 Bluetooth® ................................................................................................................................ 52
6.5 RoHS and REACH Declaration ............................................................................................... 52
7 Appendix ........................................................................................................................................... 53
7.1 Ordering Information ................................................................................................................ 53
PAN4620 802.15.4 and BLE Module
Product Specification Rev. 0.1 Page 5
7.2 List of Acronyms ...................................................................................................................... 54
7.3 Contact Details ........................................................................................................................ 55
PAN4620 802.15.4 and BLE Module
1 About This Document
Product Specification Rev. 0.1 Page 6
1 About This Document
1.1 Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical
characteristics of the Panasonic PAN4620 module. It is intended for hardware design,
application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to
as “the PAN4620” or “the module” within this document.
1.2 Revision History
Revision
Date
Modifications/Remarks
0.1
28.02.2018
1st preliminary version.
1.3 Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product.
Non-observance can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates cross references within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbol.
1.4 Related Documents
Please refer to the Panasonic website for related documents 7.3.2 Product Information.
PAN4620 802.15.4 and BLE Module
2 Overview
Product Specification Rev. 0.1 Page 7
2 Overview
The PAN4620 is Panasonic’s Internet of Things dual mode module comprising NXP’s Kinetis
KW41Z SoC - a 2.4 GHz 802.15.4 and Bluetooth® Low Energy wireless radio microcontroller
based on an ARM® Cortex-M0+ core.
To provide maximum flexibility, the module can be operated in stand-alone and hosted mode.
With 512 kB flash memory and 128 kB SRAM the PAN4620 can easily be used as a stand-alone
controller eliminating the need for an external processor, saving complexity, space and cost. It
is thus well suited for very small and low-power applications. However, also the integration of
802.15.4 and/or BLE connectivity into existing applications can easily be achieved when using
the PAN4620 in hosted mode.
Using the PAN4620 with low power consumption in combination with NXP®’s certified Thread®
stack, BLE stack or a combination of both for concurrent operation allows to meet IoT
application requirements without the need for a gateway. Since Thread® does not define an
application layer, various application layers can be used, such as dotdot, IoTivity, OpenDOF,
and others.
FCC, IC, and CE approval are under way.
Please refer to the Panasonic website for related documents 7.3.2 Product Information.
Further information on the variants and versions 7.1 Ordering Information.
For further information please also refer to the MKW41Z512CAT4 datasheet and reference
manual from NXP®.
PAN4620 802.15.4 and BLE Module
2 Overview
Product Specification Rev. 0.1 Page 8
2.1 Block Diagram
PAN4620 802.15.4 and BLE Module
2 Overview
Product Specification Rev. 0.1 Page 9
2.2 Pin Configuration
Pin Assignment
Top view with all values in [mm]
Pin Functions
No
Pin Name
Alternative Pin
Pin Type
Description
A1
GND
Ground
Connect to ground
A2
NC
Not connected
A3
RESET
PTA2, TPM0_CH3
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
A4
NC
Not connected
A5
VCC
Power
Supply voltage 1.8 V to 4.2 V
A6
VCC
Power
Supply voltage 1.8 V to 4.2 V
A7
GND
Ground
Connect to ground
A8
PTC18
TSI0_CH6, LLWU_P2,
SPI0_SIN, I2C1_SDA,
LPUART0_TX,
BSM_DATA, DTM_TX
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
PAN4620 802.15.4 and BLE Module
2 Overview
Product Specification Rev. 0.1 Page 10
No
Pin Name
Alternative Pin
Pin Type
Description
A9
GND
Ground
Connect to ground
A11
GND
Ground
Connect to ground
A12
GND
Ground
Connect to ground
B1
NC
Not connected
B2
PTA17
TSI0_CH11, LLWU_P5,
RF_RESET, SPI1_SIN,
TPM_CLKIN1
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
B3
PTC19
TSI0_CH7, LLWU_P3,
SPI0_PCS0, I2C0_SCL,
LPUART0_CTS_b,
BSM_CLK,
BLE_RF_ACTIVE
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
B4
PTC17
TSI0_CH5, LLWU_P1
SPI0_SOUT, I2C1_SCL
LPUART0_RX,
BSM_FRAME, DTM_RX
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
B5
PTC16
TSI0_CH4, LLWU_P0,
SPI0_SCK, I2C0_SDA,
LPUART0_RTS_b,
TPM0_CH3
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
B6
PTA16
TSI0_CH10, LLWU_P4,
SPI1_SOUT, TPM0_CH0
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
B7
NC
Not connected
B8
NC
Not connected
B9
NC
Not connected
C1
NC
Not connected
C2
PTA19
TSI0_CH13, ADC0_SE5,
LLWU_P7, SPI1_PCS0,
TPM2_CH1
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
C3
PTA18
TSI0_CH12, LLWU_P6,
SPI1_SCK, TPM2_CH0
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
C4
SWDIO
PTA0, TSI0_CH8,
SPI0_PCS1, TPM1_CH0,
SWD_DIO
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
C5
SWDCLK
PTA1, TSI0_CH9,
SPI1_PCS0, TPM1_CH1,
SWD_CLK
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
PAN4620 802.15.4 and BLE Module
2 Overview
Product Specification Rev. 0.1 Page 11
No
Pin Name
Alternative Pin
Pin Type
Description
C6
PTC1
I2C0_SDA,
LPUART0_RTS_b,
TPM0_CH2,
BLE_RF_ACTIVE
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
C7
NC
Not connected
C8
GND
Ground
Connect to ground
C9
GND
Ground
Connect to ground
D1
PTB0
LLWU_P8,
XTAL_OUT_EN,
I2C0_SCL, CMP0_OUT,
TPM0_CH1, CLKOUT
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
D2
PTB1
ADC0_SE1, CMP0_IN5,
DTM_RX, I2C0_SDA,
LPTMR0_ALT1,
TPM0_CH2, CMT_IRO
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
D3
PTB2
ADC0_SE3, CMP0_IN3,
RF_NOT_ALLOWED,
DTM_TX, TPM1_CH0
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
D4
PTB3
ADC0_SE2, CMP0_IN4,
CLKOUT, TPM1_CH1,
RTC_CLKOUT
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
D5
NC
Not connected
D6
NC
Not connected
D7
GND
Ground
Connect to ground
D8
GND
Ground
Connect to ground
D9
ANT
E1
PTC3
TSI0_CH15, LLWU_P11,
RX_SWITCH, I2C1_SDA,
LPUART0_TX,
TPM0_CH1, DTM_TX
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
E2
PTC2
TSI0_CH14, LLWU_P10,
TX_SWITCH, I2C1_SCL,
LPUART0_RX,
CMT_IRO, DTM_RX
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
E3
NC
Not connected
E4
NC
Not connected
E5
PTC0
LLWU_P9, I2C0_SCL,
LPUART0_CTS_b,
TPM0_CH1
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
PAN4620 802.15.4 and BLE Module
2 Overview
Product Specification Rev. 0.1 Page 12
No
Pin Name
Alternative Pin
Pin Type
Description
E6
PTC6
TSI0_CH2, LLWU_P14,
XTAL_OUT_EN,
I2C1_SCL,
LPUART0_RX,
TPM2_CH0,
BSM_FRAME
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
E7
NC
Not connected
E8
GND
Ground
Connect to ground
E9
GND
Ground
Connect to ground
F1
GND
Ground
Connect to ground
F2
NC
Not connected
F3
ADC0_DP0,
CMP0_IN0
Analog
F4
ADC0_DM0,
CMP0_IN1
Analog
F5
PTC4
TSI0_CH0, LLWU_P12,
LPUART0_CTS_b,
TPM1_CH0, BSM_DATA
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
F6
PTB18
DAC0_OUT, ADC0_SE4,
CMP0_IN2, I2C1_SCL,
TPM_CLKIN0,
TPM0_CH0
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
F7
PTC7
TSI0_CH3, LLWU_P15,
SPI0_PCS2, I2C1_SDA,
LPUART0_TX,
TPM2_CH1, BSM_DATA
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
F8
PTC5
TSI0_CH1, LLWU_P13,
RF_NOT_ALLOWED
LPTMR0_ALT2,
LPUART0_RTS_b,
TPM1_CH1, BSM_CLK
Digital I/O
Can be configured to use the mentioned
alternative pin functions.
F9
GND
Ground
Connect to ground
F11
GND
Ground
Connect to ground
F12
GND
Ground
Connect to ground
PAN4620 802.15.4 and BLE Module
2 Overview
Product Specification Rev. 0.1 Page 13
2.3 Transceiver Features
The PAN4620 features an integrated chip antenna and corresponding matching networks.
Both, a high accuracy 32 MHz crystal and a low frequency clock are integrated in the module.
Therefore, no external crystal is required to make full use of the reduced power modes.
The operating frequency is in the ISM band and the MBAN band from 2360 MHz to 2483.5 MHz
with a programmable output power from -30 dBm to 3 dBm
Bluetooth® Features 2.3.1
Bluetooth® LE v4.2 (1 Mbps)
Two simultaneous connections (2 independent hardware connection engines)
Receive sensitivity of –93 dBm
For further information see 4.9 Transceiver Feature Summary.
IEEE® 802.15.4 Features 2.3.2
IEEE® Standard 802.15.4-2011 compliant OQPSK modulation
Receive sensitivity of -98 dBm (Receive sensitivity in generic FSK modes depends on
mode selection and data rate.)
Hardware acceleration for packet processing/link layer
NXP®’s certified Thread® stack
For further information see 4.9 Transceiver Feature Summary.
MCU Features 2.3.3
The KW41Z features an ARM® Cortex-M0+MCU with up to 48 MHz. As compared to Cortex-M0,
the Cortex-M0+ uses an optimized 2-stage pipeline microarchitecture for reduced power
consumption and improved architectural performance (cycles per instruction).
2.3.3.1 Interrupt Controller
Supports up to 32 interrupt request sources
32 vectored interrupts, 4 programmable priority levels
Includes a single non-maskable interrupt
Supports interrupt handling when system clocking is disabled in low power modes
PAN4620 802.15.4 and BLE Module
2 Overview
Product Specification Rev. 0.1 Page 14
2.3.3.2 On chip memory
512 kB flash memory implemented as two equal 256 kB blocks.
One block can be read or erased, while code is being executed or read from the other.
Flash can be marked execute only in 8 kB blocks to prevent code being from being read
by third parties.
128 kB SRAM
The chip features security circuitry to prevent unauthorized access to RAM and flash
contents through the debugger.
2.3.3.3 Debug Controller
Serial wire debug (SWD) interface
Hardware breakpoint unit for 2 code addresses
Hardware watchpoint unit for 2 data items
Micro trace buffer for program tracing
Security Features 2.3.4
Advanced encryption standard accelerator (AES-128 Accelerator)
True random number generator (TRNG)
Flash memory protection
Power Management Control Unit 2.3.5
Supports external voltage sources of 2.1 V to 4.2 V and is therefore ideally suited for
single coin-cell battery operation.
Programmable power saving modes
Integrated low frequency clock to make full use of the reduced power modes
Available wake-up from power saving modes via internal and external sources
Integrated power-on reset (POR)
Integrated low voltage detect (LVD) with reset (brownout) capability
Selectable LVD trip points
Programmable low voltage warning (LVW) interrupt capability
Individual peripheral clocks can be gated off to reduce current consumption
Internal buffered bandgap reference voltage
Factory programmed trim for bandgap and LVD
1 kHz low power oscillator (LPO)
PAN4620 802.15.4 and BLE Module
2 Overview
Product Specification Rev. 0.1 Page 15
Peripheral Features 2.3.6
16-bit analog-to-digital converter
12-Bit digital-to-analog converter
High-speed analog comparator (CMP)
Timer: low power timer (LPTMR), timer/PWM, programmable interrupt timer (PIT),
Real-time clock (RTC)
Inter-integrated circuit (I²C), two channels, up to 400 kHz, multi-master operation
Low power universal asynchronous receiver transmitter (LPUART), one channel full-
duplex operation
Serial peripheral interface (SPI), master and slave mode, full-duplex, three-wire
synchronous transfers
Carrier modulator timer (CMT) with four modes of operation
Touch sensor input with up to 16 external electrodes
24 General purpose Input/Outputs
GPIOs can be configured to function as a interrupt driven keyboard scanning matrix
For further information see 4.6 Interface Specification.
PAN4620 802.15.4 and BLE Module
3 Detailed Description
Product Specification Rev. 0.1 Page 16
3 Detailed Description
3.1 Dimensions
All dimensions are in millimeters.
No.
Item
Dimension
Tolerance
Remark
1
Width
8.70
± 0.35
2
Length
15.60
± 0.35
3
Height
1.80
± 0.35
With case
PAN4620 802.15.4 and BLE Module
3 Detailed Description
Product Specification Rev. 0.1 Page 17
3.2 Footprint
The outer dimensions have a tolerance of 0.35 mm.
Top view with all values in [mm]
PAN4620 802.15.4 and BLE Module
3 Detailed Description
Product Specification Rev. 0.1 Page 18
3.3 Packaging
The product is an engineering sample status product and will be delivered in the package
described below.
Tape Dimensions 3.3.1
Packing in Tape 3.3.2
Empty spaces in the component packed area shall be less than two per reel and those spaces
shall not be consecutive.
The top cover tape shall not be found on reel holes and it shall not stick out from the reel.
100730-PAN1720.vsd
trailer (empty)
1 x circumference /
hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Direction of unreeling (for customer)
PAN4620 802.15.4 and BLE Module
3 Detailed Description
Product Specification Rev. 0.1 Page 19
Component Direction 3.3.3
Reel Dimension 3.3.4
PAN4620 802.15.4 and BLE Module
3 Detailed Description
Product Specification Rev. 0.1 Page 20
Package Label 3.3.5
(1T)
(1P)
(2P)
(9D)
(Q)
(HW/SW)
Lot code
Customer order number, if applicable
Order number
Date code
Quantity
Hardware/software version
Total Package 3.3.6
PAN4620 802.15.4 and BLE Module
3 Detailed Description
Product Specification Rev. 0.1 Page 21
3.4 Case Marking
1
2
3
4
5
6
7
8
9
PAN4620
Hardware/Software Version
ENW-No. / Model Name
FCC ID
IC ID
Lot code
Engineering Sample marking, if applicable
Marking for Pin 1
2D barcode, for internal usage only
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 22
4 Specification
All specifications are over temperature and process, unless indicated
otherwise.
4.1 Default Test Conditions
Temperature: 25 ± 10 °C
Humidity: 40 to 85 % RH
Supply Voltage: 3.6 V
4.2 Absolute Maximum Ratings
The maximum ratings may not be exceeded under any circumstances, not even
momentarily or individually, as permanent damage to the module may result.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
TSTOR
Storage
Temperature
-40
+85
°C
VESD
ESD
robustness
Electrostatic discharge voltage,
human body model
Electrostatic discharge voltage,
charged-device model
-2000
-500
+2000
+500
V
V
RF input
power
Pmax
10
dBm
VDD
Supply
voltage
-0.3
4.2
V
VIO
Voltage on
any IO pin
-0.3
VDD+0.3
V
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 23
4.3 Recommended Operating Conditions
The maximum ratings may not be exceeded under any circumstances, not
even momentarily or individually, as permanent damage to the module may
result.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VDD
Supply voltage
DCDC converter needs 2.1 V
min to start, the supply can
drop to min. of 1.8 V after
DCDC converter settles.
Start up 2.1
Operating 1.81
4.2
V
fIN
Input frequency
2.36
2.48
GHz
TA
Ambient
temperature
range
-40
25
85
°C
VIO
Voltage on any
IO pin
-0.3
VDD+0.3
V
ID
Instantaneous
max. current
Single pin limit (applies to all
port pins)
-25
25
mA
VIL
Logic low input
voltage
0
0.3∙
VDD INT2
V
VIH
Logic high input
voltage
0.7∙VDD INT
VDD INT
V
1
DC-DC converter requires slightly higher input voltage during startup. Bit
DCDC_STS_DC_OK will be set when the DC-DC converter finished the startup
sequence. Typical startup time is 50 ms and it varies with the loading of the converter.
2
VDD INT is the internal LDO regulated voltage supplying various circuit blocks,
VDD INT=1.2 V.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 24
4.4 Current Consumption
The current consumption depends on the user scenario and on the setup and
timing in the power modes.
Assume VDD = 3.6 V, Tamb = 25 °C, if nothing else is stated.
Parameter
Condition
Min.
Typ.
Max.
Units
Typical average RX
current
Measured under continuous RX with
MCU stop / Flash doze
8.4
mA
Typical average TX
(0 dBm) current
Measured under continuous TX with MCU
stop / Flash doze
7.6
mA
Typical average RX
current
Measured under continuous RX with
MCU run / Flash enabled
10.2
mA
Typical average TX
(0 dBm) current
Measured under continuous TX with MCU
run / Flash enabled
9.6
mA
Low Power Mode
current
Current consumption in very low leakage
stop mode
182
nA
4.5 Internal Operating Frequencies
Symbol
Parameter
Condition
Max.
Unit
fSYS
System and core clock
Normal run mode
48
MHz
fBUS
Bus clock
Normal run mode
24
MHz
fFLASH
Flash clock
Normal run mode
24
MHz
fLPTMR
LPTMR clock
Normal run mode
24
MHz
fSYS
System and core clock
VLPR and VLPS mode3
4
MHz
fBUS
Bus clock
VLPR and VLPS mode3
1
MHz
fFLASH
Flash clock
VLPR and VLPS mode3
1
MHz
fLPTMR
LPTMR clock4
VLPR and VLPS mode3
24
MHz
fERCLK
External reference clock
VLPR and VLPS mode3
16
MHz
3
The frequency limitations in VLPR and VLPS modes here override any frequency
specification listed in the timing specification for any other module. These same
frequency limits apply to VLPS, whether VLPS was entered from RUN or from VLPR.
4
The LPTMR can be clocked at this speed in VLPR or VLPS only when the source is an
external pin.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 25
Symbol
Parameter
Condition
Max.
Unit
fLPTMR-ERCLK
LPTMR external reference
clock
VLPR and VLPS mode3
16
MHz
fTPM
TPM asynchronous clock
VLPR and VLPS mode3
8
MHz
fLPUART0
LPUART0 asynchronous
clock
VLPR and VLPS mode3
12
MHz
4.6 Interface Specification
LPUART 4.6.1
See also Section 4.8 General switching specification.
Signal Name
Description
I/O
Pad
LPUART0_RX
Receive Data
I
B4, E2, E6
LPUART0_TX
Transmit Data
I/O
A8, E1, F7
LPUART0_CTS_b
Clear To Send
I
B3, E5, F5
LPUART0_RTS_b
Request To Send
O
B5, C6, F8
Description
Range
Default.
Baud rate
Programmable baud rates (13-bit modulo divider)
115200
Data bits
Programmable 8-bit or 9-bit data format
8 data bits
Parity bits
Hardware parity generation and checking
No parity
Stop bit
1-2
One stop bit
Inter-Integrated Circuit (I2C) 4.6.2
Two I2C channels. See also Section 4.8 General switching specification.
Signal Name
Module
Description
I/O
Pad
I2C0_SCL
I2C0
I2C serial clock line
I/O
B3, D1, E5
I2C0_SDA
I2C0
I2C serial data line
I/O
B5, C6, D2
I2C1_SCL
I2C1
I2C serial clock line
I/O
B4, E2, E6
I2C1_SDA
I2C1
I2C serial data line
I/O
A8, E1, F7
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 26
I2C timing (compare Figure 1):
Symbol
Description
Standard Mode
Fast Mode
Unit
Min.
Max.
Min.
Max.
fSCL
SCL clock frequency
0
100
0
400
kHz
tHD; STA
Hold time (repeated) START
condition. After this period,
the first clock pulse is
generated.
4
-
0.6
-
µs
tLOW
LOW period of the SCL clock
4.7
-
1.3
-
µs
tHIGH
HIGH period of the SCL clock
4
-
0.6
-
µs
tSU; STA
Set-up time for a repeated
START condition
4.7
-
0.6
-
µs
tHD; DAT
Data hold time for I2C bus
devices
05
3.456
07
0.96
µs
tSU; DAT
Data set-up time
2508
-
1006,9
-
ns
tr
Rise time of SDA and SCL
signals
-
1000
20+0.1Cb10
300
ns
tf
Fall time of SDA and SCL
signals
-
300
20+0.1Cb9
300
ns
tSU; STO
Set-up time for STOP
condition
4
-
0.6
-
µs
tBUF
Bus free time between STOP
and START condition
4.7
-
1.3
-
µs
tSP
Width of spikes that must be
suppressed by the input filter
N/A
N/A
0
50
µs
5
The master mode I2C deasserts ACK of an address byte simultaneously with the falling
edge of SCL. If no slaves acknowledge this address byte, then a negative hold time
can result, depending on the edge rates of the SDA and SCL lines.
6
The maximum tHD; DAT must be met only if the device does not stretch the LOW
period (tLOW) of the SCL signal.
7
Input signal Slew = 10 ns and Output Load = 50 pF.
8
Set-up time in slave-transmitter mode is 1 IPBus clock period, if the TX FIFO is empty.
9
A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the
requirement tSU; DAT ≥ 250 ns must then be met. This is automatically the case, if the
device does not stretch the LOW period of the SCL signal. If such a device does
stretch the LOW period of the SCL signal then it must output the next data bit to the
SDA line trmax + tSU; DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C
bus specification), before the SCL line is released.
10
Cb = total capacitance of the one bus line in pF.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 27
Figure 1 - Timing definition for fast and standard mode devices on the I2C bus.
DMA Serial Peripheral Interface (DSPI) 4.6.3
Two independent SPI channels Master/Slave.
Signal Name
Module
Description
I/O
Pad
SPI0_PCS0
SPI0
Chip Select/Slave Select
I/O
B3
SPI0_PCS1
SPI0
Chip Select
O
C4
SPI0_PCS2
SPI0
Chip Select
O
F7
SPI0_SCK
SPI0
Serial Clock
I/O
B5
SPI0_SIN
SPI0
Data In
I
A8
SPI0_SOUT
SPI0
Data Out
O
B4
SPI1_PCS0
SPI1
Chip Select/Slave Select
I/O
B3
SPI1_SCK
SPI1
Serial Clock
I/O
C3
SPI1_SIN
SPI1
Data In
I
B2
SPI1_SOUT
SPI1
Data Out
O
B6
4.6.3.1 DSPI switching specifications (limited voltage range)
Master mode DSPI timing (compare Figure 2):
Symbol
Description
Min.
Max.
Unit
Operating voltage
2.7
3.6
V
Frequency of operation
-
12
MHz
DS1
DSPI_SCK output cycle time
2 x tBUS
-
ns
DS2
DSPI_SCK output high/low time
(tSCK/2)-2
(tSCK/2)+2
ns
DS3
DSPI_PCSn valid to DSPI_SCK delay11
(tBUS x 2)-2
-
ns
11
The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK].
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 28
Symbol
Description
Min.
Max.
Unit
DS4
DSPI_SCK to DSPI_PCSn invalid delay12
(tBUS x 2)-2
-
ns
DS5
DSPI_SCK to DSPI_SOUT valid
-
8.5
ns
DS6
DSPI_SCK to DSPI_SOUT invalid
-2
-
ns
DS7
DSPI_SIN to DSPI_SCK input setup
16.2
-
ns
DS8
DSPI_SCK to DSPI_SIN input hold
0
-
ns
Figure 2 - Master mode DSPI timing.
Slave mode DSPI timing (compare Figure 3):
Symbol
Description
Min.
Max.
Unit
Operating voltage
2.7
3.6
V
Frequency of operation
-
6
MHz
DS9
DSPI_SCK output cycle time
4 x tBUS
-
ns
DS10
DSPI_SCK output high/low time
(tSCK/2)-2
(tSCK/2)+2
ns
DS11
DSPI_SCK to DSPI_SOUT valid
-
21.4
ns
DS12
DSPI_SCK to DSPI_SOUT invalid
0
-
ns
DS13
DSPI_SIN to DSPI_SCK input setup
2.6
-
ns
DS14
DSPI_SCK to DSPI_SIN input hold
7.0
-
ns
DS15
DSPI_SS active to DSPI_SOUT driven
-
14
ns
DS16
DSPI_SS inactive to DSPI_SOUT not driven
-
14
ns
12
The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC].
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 29
Figure 3 - Slave mode DSPI timing.
4.6.3.2 DSPI switching specifications (full voltage range)
Master mode DSPI timing (compare Figure 4):
Symbol
Description
Min.
Max.
Unit
Operating voltage13
1.71
3.6
V
Frequency of operation
-
12
MHz
DS1
DSPI_SCK output cycle time
2 x tBUS
-
ns
DS2
DSPI_SCK output high/low time
(tSCK/2)-4
(tSCK/2)+4
ns
DS3
DSPI_PCSn valid to DSPI_SCK delay14
(tBUS x 2)-4
-
ns
DS4
DSPI_SCK to DSPI_PCSn invalid delay15
(tBUS x 2)-4
-
ns
DS5
DSPI_SCK to DSPI_SOUT valid
-
10
ns
DS6
DSPI_SCK to DSPI_SOUT invalid
-1.2
-
ns
DS7
DSPI_SIN to DSPI_SCK input setup
23.3
-
ns
DS8
DSPI_SCK to DSPI_SIN input hold
0
-
ns
13
The DSPI module can operate across the entire operating voltage for the processor,
but to run across the full voltage range the maximum frequency of operation is
reduced.
14
The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK].
15
The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC].
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 30
Figure 4 - Master mode DSPI timing.
Slave mode DSPI timing (compare Figure 5):
Symbol
Description
Min.
Max.
Unit
Operating voltage
1.71
3.6
V
Frequency of operation
-
6
MHz
DS9
DSPI_SCK output cycle time
4 x tBUS
-
ns
DS10
DSPI_SCK output high/low time
(tSCK/2)-4
(tSCK/2)+4
ns
DS11
DSPI_SCK to DSPI_SOUT valid
-
29.1
ns
DS12
DSPI_SCK to DSPI_SOUT invalid
0
-
ns
DS13
DSPI_SIN to DSPI_SCK input setup
3.2
-
ns
DS14
DSPI_SCK to DSPI_SIN input hold
7.0
-
ns
DS15
DSPI_SS active to DSPI_SOUT driven
-
25
ns
DS16
DSPI_SS inactive to DSPI_SOUT not driven
-
25
ns
Figure 5 - Slave mode DSPI timing.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 31
Carrier Modulator Timer (CMT) 4.6.4
Please see also Section 4.8 General switching specification.
Signal Name
Description
I/O
Pad
CMT_IRO
Carrier Modulator Transmitter Infrared Output
O
D2, E2
Touch Sensing Input (TSI) 4.6.5
Signal Name
Description
I/O
Pad
TSI0_CH[15:0]
Touch sensing input capacitive pins
I/O
TSI0_CH0 → F5
TSI0_CH1 → F8
TSI0_CH2 → E6
TSI0_CH3 → F7
TSI0_CH4 → B5
TSI0_CH5 → B4
TSI0_CH6 → A8
TSI0_CH7 → B3
TSI0_CH8 → C4
TSI0_CH9 → C5
TSI0_CH10 → B6
TSI0_CH11 → B2
TSI0_CH12 → C3
TSI0_CH13 → C2
TSI0_CH14 → E2
TSI0_CH15 → E1
TSI electrical specifications:
Symbol
Description
Min.
Typ
Max.
Unit
Ta
Ambient temperature
-30
-
85
°C
TSI_RUNF
Fixed power consumption in run mode
-
100
-
µA
TSI_RUNV
Variable power consumption in run mode
(depends on oscillator's current selection)
1.0
-
128
µA
TSI_EN
Power consumption in enable mode
-
100
-
µA
TSI_DIS
Power consumption in disable mode
-
1.2
-
µA
TSI_TEN
TSI analog enable time
-
66
-
µs
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 32
Symbol
Description
Min.
Typ
Max.
Unit
TSI_CREF
TSI reference capacitor
-
1.0
-
pF
TSI_DVOLT
Voltage variation of VP & VM around
nominal values
0.19
-
1.03
V
General Purpose Input/Output (GPIO) 4.6.6
Signal Name
Description
I/O
Pad
PTA[19:16][2:0]
General Purpose Input/Output
I/O
PTA0 → C4
PTA1 → C5
PTA2 → A3
PTA16 → B6
PTA17 → B2
PTA18 → C3
PTA19 → C2
PTB[18][3:0]
General Purpose Input/Output
I/O
PTB0 → D1
PTB1 → D2
PTB2 → D3
PTB3 → D4
PTB18 → F3
PTC[19:16][7:0]
General Purpose Input/Output
I/O
PTC0 → E5
PTC1 → A8
PTC2 → E2
PTC3 → E1
PTC4 → F5
PTC5 → F8
PTC6 → E6
PTC7 → F7
PTC16 → B5
PTC17 → B4
PTC18 → A8
PTC19 → B3
The maximum input voltage on PTC0/1/2/3 is VDD+0.3V.
Please see also 4.8 General switching specification.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 33
Low-Leakage Wakeup (LLWU) 4.6.7
Signal Name
Description
I/O
Pad
LLWU_P[15:0]
Wakeup inputs
I
LLWU_P0 → B5
LLWU_P1 → B4
LLWU_P2 → A8
LLWU_P3 → B3
LLWU_P4 → B6
LLWU_P5 → B2
LLWU_P6 → C3
LLWU_P7 → C2
LLWU_P8 → D1
LLWU_P9 → E5
LLWU_P10 → E2
LLWU_P11 → E1
LLWU_P12 → F5
LLWU_P13 → F8
LLWU_P14 → E6
LLWU_P15 → F7
Radio Module Signals 4.6.8
Signal Name
Description
I/O
Pad
DTM_RX
Direct test mode receive
I
B4, D2, E2
DTM_TX
Direct test mode transmit
O
A8, D3, E1
BSM_CLK
Bit streaming mode (BSM) clock signal,
802.15.4 packet data stream clock line
O
B3, F8
BSM_FRAME
Bit streaming mode frame signal, 802.15.4
packet data stream frame line
O
B4, E6
BSM_DATA
Bit streaming mode data signal, 802.15.4
packet data stream data line
I/O
A8, F5, F7
RF_RESET
Radio reset signal
I
B2
BLE_RF_ACTIVE
Signal to indicate future BLE activity.
O
B3, C6
RF_NOT_ALLOWED
Radio off signal, intended for Wi-Fi
coexistence control
I
D3, F8
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 34
Signal Name
Description
I/O
Pad
RX_SWITCH
Front end module receive mode signal
O
E1
TX_SWITCH
Front end module transmit mode signal
O
E2
Analog-to-Digital Converter (ADC) 4.6.9
Signal Name
Description
I/O
Pad
ADC0_DM0
ADC channel 0 differential input negative
I
F4
ADC0_DP0
ADC channel 0 differential input positive
I
F3
ADC0_SE[5:1]
ADC channel 0 single-ended input
I
ADC0_SE1 → D2
ADC0_SE2 → D4
ADC0_SE3 → D3
ADC0_SE4 → F6
ADC0_SE5 → C2
16-bit ADC operating conditions:
Symbol
Description
Min.
Typ16
Max.
Unit
VDDA
Supply voltage absolute
1.71
-
3.6
V
VREFH
ADC reference voltage high,
internally sourced and factory
trimmed
-
1.2
-
V
VREFL
ADC reference voltage low
-
GND
-
VADIN
Input voltage:
16-bit differential mode
All other modes
VREFL
VREFL
-
-
31/32∙VREFH
VREFH
V
V
CADIN
Input capacitance:
16-bit mode
8-bit / 10-bit / 12-bit modes
-
-
8
4
10
5
pF
pF
RADIN
Input series resistance
-
2
5
kΩ
RAS
Analog source resistance
(external) 13-bit / 12-bit modes
fADCK < 4 MHz
-
-
5
kΩ
fADCK
ADC conversion clock frequency17
16
Typical values assume VDDA = 3.0 V, Temp = 25 °C, fADCK = 1.0 MHz, unless otherwise
stated. Typical values are for reference only, and are not tested in production.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 35
Symbol
Description
Min.
Typ16
Max.
Unit
≤ 13-bit mode
16-bit mode
1.0
2.0
-
-
18.0
12.0
MHz
MHz
Crate
ADC conversion rate:
No ADC hardware averaging,
continuous conversions enabled,
subsequent conversion time
≤ 13-bit modes
16-bit mode
20.000
37.037
-
-
818.330
461.467
ksps
ksps
12-bit Digital-to-analog converter (DAC) 4.6.10
Signal Name
Description
I/O
Pad
DAC0_OUT
DAC output
O
F6
12-bit DAC operating requirements:
Symbol
Description
Min.
Max.
Unit
VDDA
Supply voltage
1.71
3.6
V
VDACR
Reference voltage18
1.2
3.6
V
CL
Output load capacitance19
-
100
pF
IL
Output load current
-
1
mA
12-bit DAC operating behaviors:
Symbol
Description
Min.
Typ
Max.
Unit
IDDA_DACLP
Supply current - low-power mode
-
-
250
µA
IDDA_DACHP
Supply current – high speed mode
-
-
900
µA
tDACLP
Full-scale settling time (0x080 to
0xF7F) - low-power mode20
-
100
200
µs
tDACHP
Full-scale settling time (0x080 to
0xF7F) - high-speed mode20
-
15
30
µs
17
To use the maximum ADC conversion clock frequency, CFG2[ADHSC] must be set
and CFG1[ADLPC] must be clear.
18
The DAC reference can be selected to be VDDA or VREFH=1.2 V.
19
A small load capacitance (47 pF) can improve the bandwidth performance of the DAC.
20
Settling within ±1 LSB.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 36
Symbol
Description
Min.
Typ
Max.
Unit
tCCDACLP
Code-to-code settling time (0xBF8
to 0xC08) - low-power mode and
high-speed mode20
-
0.7
1
µs
Vdacoutl
DAC output voltage range low -
high-speed mode, no load, DAC set
to 0x000
-
-
100
mV
Vdacouth
DAC output voltage range high –
high-speed mode, no load, DAC set
to 0xFFF
VDACR-100
-
VDACR
mV
INL
Integral non-linearity error – high-
speed mode21
-
-
±8
LSB
DNL
Differential non-linearity error -
VDACR > 2 V22
-
-
±1
LSB
DNL
Differential non-linearity error -
VDACR = VREF_OUT23
-
-
±1
LSB
VOFFSET
Offset error24
-
±0.4
±0.8
%FSR
EG
Gain error24
-
±0.1
±0.6
%FSR
PSRR
Power supply rejection ratio,
VDDA ≥ 2.4 V
60
-
90
dB
TCO
Temperature coefficient offset
voltage25
-
3.7
-
µV/C
TGE
Temperature coefficient gain error
-
0.00042
1
-
%FSR/
C
ROP
Output resistance (load = 3 kΩ)
-
-
250
Ω
SR
Slew rate:
High-power
Low-power
1.2
0.05
1.7
0.12
-
-
V/µs
V/µs
BW
3 dB bandwidth:
High-power
Low-power
550
40
-
-
-
-
kHz
kHz
21
The INL is measured for 0 + 100 mV to VDACR −100 mV.
22
The DNL is measured for 0 + 100 mV to VDACR −100 mV.
23
The DNL is measured for 0 + 100 mV to VDACR −100 mV with VDDA > 2.4 V.
24
Calculated by a best fit curve from VSS + 100 mV to VDACR – 100 mV.
25
VDDA = 3.0 V, reference select set for VDDA (DACx_CO:DACRFS = 1), high-power
mode (DACx_C0:LPEN = 0), DAC set to 0x800, temperature range is across the full
range of the device.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 37
Analog Comparator (CMP) 4.6.11
Signal Name
Description
I/O
Pad
CMP0_IN[5:0]
Analog voltage inputs
I
CMP0_IN0 → F3
CMP0_IN1 → F4
CMP0_IN2 → F6
CMP0_IN3 → D3
CMP0_IN4 → D4
CMP0_IN5 → D2
CMP0_OUT
Comparator output
O
D1
CMP and 6-bit DAC electrical specifications:
Symbol
Description
Min.
Typ
Max.
Unit
VDD
Supply voltage
1.71
-
3.6
IDDHS
Supply current, high-speed mode
(EN=1, PMODE=1)
-
-
200
µA
IDDLS
Supply current, low-speed mode
(EN=1, PMODE=0)
-
-
20
µA
VAIN
Analog input voltage
VSS-0.3
-
VDD
V
VAIO
Analog input offset voltage
-
-
20
mV
VH
Analog comparator hysteresis26
CR0[HYSTCTR] = 00
CR0[HYSTCTR] = 01
CR0[HYSTCTR] = 10
CR0[HYSTCTR] = 11
-
-
-
-
5
10
20
30
-
-
-
-
mV
mV
mV
mV
VCMPOh
Output high
VDD-0.5
-
-
V
VCMPOl
Output low
-
-
0.5
V
tDHS
Propagation delay, high-speed
mode (EN=1, PMODE=1)
20
50
200
ns
tDLS
Propagation delay, low-speed
mode (EN=1, PMODE=0)
80
250
600
ns
Analog comparator initialization
delay27
-
-
40
µs
26
Typical hysteresis is measured with input voltage range limited to 0.6 to VDD–0.6 V.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 38
Symbol
Description
Min.
Typ
Max.
Unit
IDAC6b
6-bit DAC current adder (enabled)
-
7
-
µA
INL
6-bit DAC integral non-linearity
-0.5
-
0.5
LSB28
DNL
6-bit DAC differential non-linearity
-0.3
-
0.3
LSB
Timer 4.6.12
Signal Name
Module
Description
I/O
Pad
TPM_CLKIN[1:0]
TPM0
External clock
I
TPM_CLKIN0 → F6
TPM_CLKIN1 → B2
TPM0_CH[3:0]
TPM0
TPM channel
I/O
TPM0_CH0 → F6, B6
TPM0_CH1 → D1, E1
TPM0_CH2 → C6, D2
TPM0_CH3 → A3, B5
TPM_CLKIN[1:0]
TPM1
External clock
I
TPM_CLKIN0 → F6
TPM_CLKIN1 → B2
TPM1_CH[1:0]
TPM1
TPM channel
I/O
TPM1_CH0 → C4, C5, F5
TPM1_CH1 → D3, D4, F8
TPM_CLKIN[1:0]
TPM2
External clock
I
TPM_CLKIN0 → F6
TPM_CLKIN1 → B2
TPM2_CH[1:0]
TPM2
TPM channel
I/O
TPM2_CH0 → C3, E6
TPM2_CH1 → C2, F7
LPTMR0_ALT[2:1]
LPTMR0
Pulse counter input
pin
I
LPTMR0_ALT1 → D2
LPTMR0_ALT2 → F8
RTC_CLKOUT
RTC Module
1 Hz square-wave
output
O
D4
27
Comparator initialization delay is defined as the time between software writes to
change control inputs (Writes to CMP_DACCR[DACEN], CMP_DACCR[VRSEL],
CMP_DACCR[VOSEL], CMP_MUXCR[PSEL], and CMP_MUXCR[MSEL]) and the
comparator output settling to a stable level.
28
1 LSB = Vreference/64
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 39
Clocks 4.6.13
Signal Name
Description
I/O
Pad
CLKOUT
Internal clocks monitor
O
D1, D4
XTAL_OUT_EN
32 MHz clock output enable
I
D1, E6
Serial Wire Debug (SWD) 4.6.14
Signal Name
Description
Comment
I/O
Pad
SWD_DIO
Serial wire debug data
Input/Output
Pulled up internally by default
I/O
C4
SWD_CLK
Serial wire clock
Pulled down internally by default
I
C5
SWD full voltage range electricals as shown in Figure 6 and Figure 7:
Symbol
Description
Min.
Max.
Unit
Operating voltage
1.71
3.6
V
J1
SWD_CLK frequency of operation
-
25
MHz
J2
SWD_CLK cycle period
1/J1
-
ns
J3
SWD_CLK clock pulse width
20
-
ns
J4
SWD_CLK rise and fall times
-
3
ns
J9
SWD_DIO input data setup time to
SWD_CLK rise
10
-
ns
J10
SWD_DIO input data hold time after
SWD_CLK rise
0
-
ns
J11
SWD_CLK high to SWD_DIO data valid
-
32
ns
J12
SWD_CLK high to SWD_DIO high-Z
5
-
ns
Figure 6 - SWD clock input timing.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 40
Figure 7 - SWD data timing.
4.7 Flash electrical specifications
The following specifications represent the amount of time the internal charge pumps are active
and do not include command overhead.
Flash timing specifications - program and erase:
Symbol
Description
Min.
Typ
Max.
Unit
thvpgm4
Longword program high-voltage time
-
7.5
18
µs
thversscr
Sector erase high-voltage time29
-
13
113
ms
thversblk256k
Erase block high-voltage time for 256 KB29
-
104
904
ms
Flash timing specifications - commands:
Symbol
Description
Min.
Typ
Max.
Unit
trd1blk256k
Read 1s block execution time30
256 KB program flash
-
-
1.7
ms
trd1sec2k
Read 1s section execution time (flash sector)30
-
-
60
µs
tpgmchk
Program check execution time30
-
-
45
µs
trdrsrc
Read resource execution time30
-
-
30
µs
29
Maximum time based on expectations at cycling end-of-life.
30
Assumes 25 MHz flash clock frequency.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 41
Symbol
Description
Min.
Typ
Max.
Unit
tpgm4
Program longword execution time
-
65
145
µs
tersblk256k
Erase flash block execution time31
256 KB program flash
-
250
1500
ms
tersscr
Erase flash sector execution time31
-
14
114
ms
trd1all
Read 1s all blocks execution time30
-
-
1.8
ms
trdonce
Read once execution time30
-
-
30
µs
tpgmonce
Program once execution time
-
100
-
µs
tersall
Erase all blocks execution time31
-
500
3000
ms
tvfykey
Verify backdoor access key execution time30
-
-
30
µs
tersallu
Erase all blocks unsecure execution time31
-
500
3000
ms
Flash high voltage current behaviors:
Symbol
Description
Min.
Typ
Max.
Unit
IDD_PGM
Average current adder during high voltage
flash programming operation
-
2.5
6.0
mA
IDD_ERS
Average current adder during high voltage
flash erase operation
-
1.5
4.0
mA
4.8 General switching specification
These specifications apply to GPIO, LPUART, CMT, and I2C signals.
Description
Min.
Max.
Unit
GPIO pin interrupt pulse width (digital glitch filter disabled) -
Synchronous path32,33
1.5
-
Bus
clock
cycles
Reset pin interrupt pulse width (analog filter enabled) -
Asynchronous path34
200
-
ns
GPIO pin interrupt pulse width (digital glitch filter disabled, analog
filter disabled) - Asynchronous path5
20
-
ns
External RESET_b input pulse width (digital glitch filter disabled)
100
-
ns
31
Maximum times for erase parameters based on expectations at cycling end-of-life.
32
This is the minimum pulse width that is guaranteed to pass through the pin
synchronization circuitry in run modes.
33
The greater of synchronous and asynchronous timing must be met.
34
This is the minimum pulse width that is guaranteed to be recognized.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 42
Description
Min.
Max.
Unit
Port rise and fall time(low drive strength)35,36
Slew enabled:
1.71 ≤ VDD ≤ 2.7 V
2.7 ≤ VDD ≤ 3.6 V
Slew disabled:
1.71 ≤ VDD ≤ 2.7 V
2.7 ≤ VDD ≤ 3.6 V
-
-
-
-
25
16
8
6
ns
ns
ns
ns
Port rise and fall time(low drive strength)37,38
Slew enabled:
1.71 ≤ VDD ≤ 2.7 V
2.7 ≤ VDD ≤ 3.6 V
Slew disabled:
1.71 ≤ VDD ≤ 2.7 V
2.7 ≤ VDD ≤ 3.6 V
-
-
-
-
24
16
10
6
ns
ns
ns
ns
4.9 Transceiver Feature Summary
The PAN4620 module meets or exceeds all Bluetooth® Low Energy v4.2 and IEEE® 802.15.4
performance specifications applicable to 2.4 GHz ISM and MBAN (Medical Band Area Network)
bands.
Channel Plan 4.9.1
Channel Plan for Bluetooth® Low Energy:
Band
Carrier frequency [MHz]39
Channel number k
ISM
2402 + k ∙ 2
k = [0,1,…,38,39]
Channel Plan for IEEE® 802.15.4:
Band
Carrier frequency [MHz]40
Channel number k
ISM
2405 + (k-11) ∙ 5
k = [11,12,…,25,26]
35
PTB0, PTB1, PTC0, PTC1, PTC2, PTC3, PTC6, PTC7, PTC17, PTC18.
36
75 pF load.
37
Ports A, B, and C.
38
25 pF load.
39
All the RX parameters are measured at the PAN4620 RF bottom pad.
40
All the RX parameters are measured at the PAN4620 RF bottom pad.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 43
Band
Carrier frequency [MHz]40
Channel number k
MBAN
2363 + k ∙ 5
k = [0,1,2,3,4,5,6]
2367 + (k-7) ∙ 5
k = [7,8,9,10,11,12,14]
Receiver Feature Summary 4.9.2
The current consumption and sensitivity depend on the user scenario.
Assume VDD = 3.6 V, Tamb = 25 °C, if nothing else is stated.
Symbol
Description40
Min.
Typ.
Max.
Units
IRXon
Supply current Rx On (VDD = 3.6 V)41
-
8.4
-
mA
fIN
Input RF frequency
2.36
-
2.4835
GHz
SENSGFSK
GFSK Rx sensitivity
(250 kbps GFSK-BT=0.5, h=0.5)
-
-98
-
dBm
SENSBLE
BLE Rx sensitivity42
-
-93
-
dBm
SENS15.4
IEEE® 802.15.4 Rx sensitivity43
-
-98
-
dBm
RSSIRange
Receiver signal strength indicator range44
tbd
-
tbd
dBm
RSSIRes
Receiver signal strength indicator resolution
-
1
-
dBm
Typical RSSI variation over frequency
tbd
-
tbd
dB
Typical RSSI variation over temperature
tbd
-
tbd
dB
RSSIACC
Narrowband RSSI accuracy45
-3
-
3
dBm
BLEco-channel
BLE Co-channel Interference (Wanted signal at
-67 dBm, BER <0.1 %. Measurement resolution
1 MHz)
-
tbd
-
dB
15.4co-channel
IEEE® 802.15.4 Co-channel Interference
(Wanted signal 3 dB over reference sensitivity
level)
-
tbd
-
dB
Adjacent/Alternate channel performance
46
:
41
Transceiver power consumption.
42
Measured at 0.1 % BER using 37 byte long packets in max gain mode and nominal
conditions.
43
In max. gain mode and nominal conditions.
44
RSSI performance in narrowband mode.
45
With one point calibration over frequency and temperature.
46
BLE adjacent and block parameters are measured with modulated interference
signals.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 44
Symbol
Condition
Min.
Typ.
Max.
Units
SELBLE, 1 MHz
BLE Adjacent +/- 1 MHz Interference offset
(Wanted signal at -67 dBm, BER <0.1 %.
Measurement resolution 1 MHz.)
-
tbd
-
dB
SELBLE, 2 MHz
BLE Adjacent +/- 2 MHz Interference offset
(Wanted signal at -67 dBm, BER <0.1 %.
Measurement resolution 1 MHz.)
-
tbd
-
dBm
SELBLE, 3 MHz
BLE Alternate ≥ +/-3 MHz Interference offset
(Wanted signal at -67 dBm, BER <0.1 %.
Measurement resolution 1 MHz.)
-
tbd
-
dB
SEL15.4, 5 MHz
IEEE® 802.15.4 Adjacent +/- 5 MHz Interference
offset (Wanted signal 3 dB over reference
sensitivity level, PER <1 %)
-
tbd
-
dB
SEL15.4, 5 MHz
IEEE® 802.15.4 Alternate ≥ +/- 10 MHz
Interference offset (Wanted signal 3 dB over
reference sensitivity level, PER <1 %.)
-
tbd
-
dBm
Intermodulation performance:
Condition
Min.
Typ.
Max.
Units
BLE Intermodulation with continuous wave interferer at ± 3MHz
and modulated interferer is at ± 6 MHz
(Wanted signal at -67 dBm, BER <0.1 %.)
-
tbd
-
dBm
BLE Intermodulation with continuous wave interferer at ± 5 MHz
and modulated interferer is at ± 10 MHz
(Wanted signal at -67 dBm, BER <0.1 %.)
-
tbd
-
dBm
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 45
Blocking performance46:
Condition49
Min.
Typ.
Max.
Units
BLE Out of band blocking from 30 MHz to 1000 MHz and
4000 MHz to 5000 MHz (Wanted signal at -67 dBm, BER <0.1 %.
Interferer continuous wave signal.)47
-
tbd
-
dBm
BLE Out of band blocking from 1000 MHz to 2000 MHz and
3000 MHz to 4000 MHz (Wanted signal at -67 dBm, BER <0.1 %.
Interferer continuous wave signal.)
-
tbd
-
dBm
BLE Out of band blocking from 2001 MHz to 2339 MHz and
2484 MHz to 2999 MHz (Wanted signal at -67 dBm, BER <0.1 %.
Interferer continuous wave signal.)
-
tbd
-
dBm
BLE Out of band blocking from 5000 MHz to 12750 MHz (Wanted
signal at -67 dBm, BER <0.1 %. Interferer continuous wave
signal.)47
-
tbd
-
dBm
IEEE® 802.15.4 Out of band blocking for frequency offsets
> 10 MHz and <= 80 MHz (Wanted signal 3 dB over reference
sensitivity level, PER <1 %. Interferer continuous wave signal.)48
-
tbd
-
dBm
IEEE® 802.15.4 Out of band blocking from carrier frequencies in
1 GHz to 4 GHz range excluding frequency offsets < ±80 MHz
(Wanted signal 3 dB over reference sensitivity level, PER <1 %.
Interferer continuous wave signal.)
-
tbd
-
dBm
IEEE® 802.15.4 Out of band blocking frequency from carrier
frequencies < 1 GHz and > 4 GHz (Wanted signal 3 dB over
reference sensitivity level, PER <1 %. Interferer continuous wave
signal.)47
-
tbd
-
dBm
Transmitter Feature Summary 4.9.3
The current consumption and output power depend on the user scenario.
Assume VDD = 3.6 V, Tamb = 25 °C, if nothing else is stated.
Symbol
Description49
Min.
Typ.
Max.
Units
ITXon
Supply current TX On with PRF = 0 dBm (VDD =
3.6 V)
-
7.6
-
mA
fc
Output Frequency
2.36
-
2.4835
GHz
PRFmax
Maximum RF Output power
-
3
-
dBm
PRFmin
Minimum RF Output power
-
-30
-
dBm
47
Exceptions allowed for carrier frequency harmonics.
48
Exception to the 10 MHz > frequency offset <= 80 MHz out-of-band blocking limit
allowed for frequency offsets of twice the reference frequency.
49
All the TX parameters are measured at the PAN4620 RF bottom pad.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 46
Symbol
Description49
Min.
Typ.
Max.
Units
PRFCR
RF Output power control range
-
33
-
dB
Fdev15.4
IEEE® 802.15.4 Peak frequency deviation
-
tbd
-
kHz
EVM15.4
IEEE® 802.15.4 Error Vector Magnitude (EVM)
-
tbd
-
%
OEVM15.4
IEEE® 802.15.4 Offset Error Vector Magnitude
-
tbd
-
%
TXPSD15.4
IEEE® 802.15.4 TX spectrum level at 3.5 MHz
offset
-
-
tbd
dBc
Δf1avg,BLE
BLE average frequency deviation using a
00001111 modulation sequence
-
tbd
-
kHz
Δf2avg,BLE
BLE average frequency deviation using a
01010101 modulation sequence
-
tbd
-
kHz
Fcdev,BLE
BLE Maximum Deviation of the Center
Frequency
-
tbd
-
kHz
PRF2MHz,BLE
BLE Adjacent Channel Transmit Power at 2MHz
offset
-
-
tbd
dBm
PRF3MHz,BLE
BLE Adjacent Channel Transmit Power at >=
3 MHz offset
-
-
tbd
dBm
BLE Frequency Hopping Support
Yes
TXH2
2nd Harmonic of Transmit Carrier Frequency (for
Pout = PRF,max),
-
tbd
-
dBm/
MHz
TXH3
3rd Harmonic of Transmit Carrier Frequency (for
Pout = PRF,max),
-
tbd
-
dBm/
MHz
TXH4
4rd Harmonic of Transmit Carrier Frequency (for
Pout = PRF,max),
-
tbd
-
dBm/
MHz
TXH5
5rd Harmonic of Transmit Carrier Frequency (for
Pout = PRF,max),
-
tbd
-
dBm/
MHz
TXH6
6rd Harmonic of Transmit Carrier Frequency (for
Pout = PRF,max),
-
tbd
-
dBm/
MHz
Transmitter output power temperature dependence:
Symbol
Description50
-40 °C
25 °C
85 °C
Units
PRF,max
Typical maximum RF Output power
tbd
3
tbd
dBm
PRF,min
Typical minimum RF Output power
tbd
-30
tbd
dBm
50
All the TX parameters are measured at the PAN4620 RF bottom pad.
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 47
4.10 Reliability Tests
The measurement should be done after the test device has been exposed to room temperature
and humidity for one hour.
No.
Item
Limit
Condition
1
Variable
Vibration Test
(VVT)
Electrical parameter should be in
specification
Freq.: 20~2000 Hz, Acc.: 17-50 G,
Sweep: 8 min, 2 hours each of XYZ
axis
2
Shock Drop
Test (DT)
Electrical parameter should be in
specification
Drop parts on concrete from a height
of 1 m for 3 times
3
Heat-Shock/
Temperature
Cycling Test
(TC)
Electrical parameter should be in
specification
at -40 °C and +85 °C for 1 h/cycle
Total = 300 cycles
4
Temperature
Humidity Bias
Test (THB)
Electrical parameter should be in
specification
at +60 °C, 85 °% r.H., 300 h
5
Low
Temperature
Storage Life
Test (LTSL)
Electrical parameter should be in
specification
at -40 °C, 300 h
6
High
Temperature
Storage Life
Test (HTSL)
Electrical parameter should be in
specification
at +85 °C, 300 h
PAN4620 802.15.4 and BLE Module
4 Specification
Product Specification Rev. 0.1 Page 48
4.11 Recommended Soldering Profile
Reflow permissible cycle: 2
Opposite side reflow is prohibited due to module weight
More than 75 percent of the soldering area shall be coated by solder
The soldering profiles should be adhered to in order to prevent
electrical or mechanical damage
Soldering profile assumes lead-free soldering
PAN4620 802.15.4 and BLE Module
5 Cautions
Product Specification Rev. 0.1 Page 49
5 Cautions
Failure to follow the guidelines set forth in this document may result in
degrading of the module functions and damage to the module.
5.1 Design Notes
1. Follow the conditions written in this specification, especially the control signals of this
module.
2. The supply voltage should abide by the maximum ratings ( 4.2 Absolute Maximum
Ratings).
3. The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for
example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF
directly at the module).
4. This module should not be mechanically stressed when installed.
5. Keep this module away from heat. Heat is the major cause of decreasing the life time of
these modules.
6. Avoid assembly and use of the target equipment in conditions where the module
temperature may exceed the maximum tolerance.
7. Keep this module away from other high frequency circuits.
8. Refer to the recommended pattern when designing a board.
5.2 Installation Notes
1. Reflow soldering is possible twice based on the conditions set forth in 4.11
Recommended Soldering Profile. Set up the temperature at the soldering portion of this
module according to this reflow profile.
2. Carefully position the module so that the heat will not burn into printed circuit boards or
affect other components that are susceptible to heat.
3. Carefully locate the module, to avoid an increased temperature caused by heat
generated by neighboring components.
4. If a vinyl-covered wire comes into contact with the module, the wire cover will melt and
generate toxic gas, damaging the insulation. Never allow contact between a vinyl cover
and these modules to occur.
5. This module should not be mechanically stressed or vibrated when reflowed.
6. To repair the board by hand soldering, follow the conditions set forth in this chapter.
7. Do not wash this product.
8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage
to the module.
PAN4620 802.15.4 and BLE Module
5 Cautions
Product Specification Rev. 0.1 Page 50
5.3 Usage Condition Notes
1. Take measures to protect the module against static electricity.
If pulses or transient loads (a large load, which is suddenly applied) are applied to the
modules, check and evaluate their operation before assembly of the final products.
2. Do not use dropped modules.
3. Do not touch, damage, or soil the pins.
4. Follow the recommended condition ratings about the power supply applied to this
module.
5. Electrode peeling strength: Do not apply a force of more than 4.9 N in any direction on
the soldered module.
6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause
damage.
7. These modules are intended for general purpose and standard use in general electronic
equipment, such as home appliances, office equipment, information, and communication
equipment.
5.4 Storage Notes
1. The module should not be stressed mechanically during storage.
2. Do not store these modules in the following conditions or the performance characteristics
of the module, such as RF performance will be adversely affected:
– Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX,
– Storage in direct sunlight,
– Storage in an environment where the temperature may be outside the range of 5 °C to
35 °C, or where the humidity may be outside the 45 % to 85 % range,
– Storage of the modules for more than one year after the date of delivery storage period:
Please check the adhesive strength of the embossed tape and soldering after 6 months
of storage.
3. Keep this module away from water, poisonous gas, and corrosive gas.
4. This module should not be stressed or shocked when transported.
5. Follow the specification when stacking packed crates (max. 10).
5.5 Safety Cautions
These specifications are intended to preserve the quality assurance of products and individual
components.
Before use, check and evaluate the operation when mounted on your products. Abide by these
specifications without deviation when using the products. These products may short-circuit. If
electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a
short circuit occurs, provide the following failsafe functions as a minimum:
PAN4620 802.15.4 and BLE Module
5 Cautions
Product Specification Rev. 0.1 Page 51
1. Ensure the safety of the whole system by installing a protection circuit and a protection
device.
2. Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
5.6 Other Cautions
1. Do not use the module for other purposes than those listed in section 5.3 Usage
Condition Notes.
2. Be sure to provide an appropriate fail-safe function on your product to prevent any
additional damage that may be caused by the abnormal function or the failure of the
module.
3. This module has been manufactured without any ozone chemical controlled under the
Montreal Protocol.
4. These modules are not intended for use under the special conditions shown below.
Before using these modules under such special conditions, carefully check their
performance and reliability under the said special conditions to determine whether or not
they can be used in such a manner:
– In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where
liquid may splash,
– In direct sunlight, outdoors, or in a dusty environment,
– In an environment where condensation occurs,
– In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2,
SO2, H2S, NH3, and NOX).
5. If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these modules with new modules, because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
6. When you have any question or uncertainty, contact Panasonic.
5.7 Life Support Policy
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support
appliances, devices, or systems where malfunction can reasonably be expected to result in a
significant personal injury to the user, or as a critical component in any life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
Panasonic customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any
damages resulting.
PAN4620 802.15.4 and BLE Module
6 Regulatory and Certification Information
Product Specification Rev. 0.1 Page 52
6 Regulatory and Certification Information
6.1 Federal Communications Commission (FCC) for US
Certification is pending.
6.2 Innovation, Science, and Economic Development (ISED) for
Canada
Certification is pending.
6.3 European Conformity According to RED (2014/53/EU)
Certification is pending.
6.4 Bluetooth®
Certification is pending.
6.5 RoHS and REACH Declaration
The latest declaration of environmental compatibility (Restriction of Hazardous Substances,
RoHS and Registration, Evaluation, Authorisation and Restriction of Chemicals, REACH) for
supplied products can be found on the Panasonic website in the “Downloads” section of the
respective product 7.3.2 Product Information.
PAN4620 802.15.4 and BLE Module
7 Appendix
Product Specification Rev. 0.1 Page 53
7 Appendix
7.1 Ordering Information
Variants and Versions
Order Number
Brand Name
Description
MOQ51
ENWC9B01A1EF
PAN4620
IEEE® 802.15.4 and Bluetooth® Low Energy Module
1 500
51
The default MOQ for mass production is 1 500 pieces, fewer only on customer demand. Samples for
evaluation can be delivered at any quantity via the distribution channels.
PAN4620 802.15.4 and BLE Module
7 Appendix
Product Specification Rev. 0.1 Page 54
7.2 List of Acronyms
ADC ....................................................................................................................... Analog-to-digital converter
AES ................................................................................................................ Advanced encryption standard
BLE ............................................................................................................................. Bluetooth® low energy
BT ................................................................................................................................................... Bluetooth®
CMP ................................................................................................................................. Analog comparator
CMT ........................................................................................................................... Carrier modulator timer
DAC .......................................................................................................................Digital-to-analog converter
DSPI .............................................................................................................. DMA Serial peripheral interface
DT .......................................................................................................................................... Shock drop test
EVM ........................................................................................................................... Error vector magnitude
GPIO ............................................................................................................... General purpose Input/Output
HTSL .......................................................................................................... High temperature storage life test
I2C ................................................................................................................................ Inter-integrated circuit
ISM ............................................................................................................... Industrial, scientific and medical
LDO ............................................................................................................................................ Low drop out
LE ................................................................................................................................................ Low energy
LLWU ............................................................................................................................ Low-leakage wakeup
LPO ................................................................................................................................ Low power oscillator
LPTMR ................................................................................................................................. Low power timer
LPUART .................................................................. Low power universal asynchronous receiver transmitter
LTSL ........................................................................................................... Low temperature storage life test
LVD ................................................................................................................................... Low voltage detect
LVW ............................................................................................................................... Low voltage warning
MAC .......................................................................................................................... Media access controller
MBAN ...................................................................................................................Medical band area network
MCU ................................................................................................................................. Microcontroller unit
MOQ .......................................................................................................................... Minimum order quantity
PIT .................................................................................................................... Programmable interrupt timer
POR .......................................................................................................................Integrated power-on reset
RAM ........................................................................................................................ Random access memory
RTC ........................................................................................................................................ Real-time clock
SMAC ............................................................................................................ Simple media access controller
SPI ......................................................................................................................... Serial peripheral interface
SRAM ............................................................................................................. Static random-access memory
SWD .................................................................................................................................... Serial wire debug
TC ........................................................................................................ Heat-shock/ temperature cycling test
THB ............................................................................................................... Temperature humidity bias test
TPM ......................................................................................................................................... Timers module
TRNG ............................................................................................................ True random number generator
TSI .................................................................................................................................. Touch sensing input
VLPR ................................................................................................................................ Very low power run
VLPS .............................................................................................................................. Very low power stop
VVT .............................................................................................................................. Variable vibration test
PAN4620 802.15.4 and BLE Module
7 Appendix
Product Specification Rev. 0.1 Page 55
7.3 Contact Details
Contact Us 7.3.1
Please contact your local Panasonic Sales office for details on additional product options and
services:
For Panasonic Sales assistance in the EU, visit
https://eu.industrial.panasonic.com/about-us/contact-us
Email: wireless@eu.panasonic.com
For Panasonic Sales assistance in North America, visit the Panasonic Sales & Support Tool to
find assistance near you at
https://na.industrial.panasonic.com/distributors
Please visit the Panasonic Wireless Technical Forum to submit a question at
https://forum.na.industrial.panasonic.com
Product Information 7.3.2
For further information please also refer to the MKW41Z512CAT4 datasheet and reference
manual from NXP®.
Please refer to the Panasonic Wireless Connectivity website for further information on our
products and related documents:
For complete Panasonic product details in the EU, visit
http://pideu.panasonic.de/products/wireless-modules.html
For complete Panasonic product details in North America, visit
http://www.panasonic.com/rfmodules
