MAS1016BTB1 - Micro Analog Systems

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MAS1016B

AM Receiver IC

• High Sensitivity

• Very Low Power Consumption

• Wide Supply Voltage Range

• Power Down Control

• Control for AGC On

• High Selectivity by Crystal Filter

DESCRIPTION

The MAS1016B AM-Receiver chip is a highly

sensitive, simple to use AM receiver specially

intended to receive time signals in the frequency

range from 40 kHz to 100 kHz. There are only a few

external components needed. The circuit has a

preamplifier, wide range automatic gain control,

demodulator and output comparator built in. The

output signal can be processed directly with an

additional digital circuitry to extract the data from the

received signal. The control for AGC (automatic gain

control) can be used to switch AGC on or off if

necessary.

FEATURES APPLICATIONS

• Highly Sensitive AM Receiver, 0.5µVRMS typ.

• Wide Supply Voltage Range from 1.1 V to 3.6 V

• Very Low Power Consumption 50µA typ.

• Power Down Control

• Only a Few External Components Necessary

• Control for AGC On

• Wide Frequency Range from 40 kHz to 100kHz

• High Selectivity by Quartz Crystal Filter

• Die and TSSOP-14 Package

• Time Signal Receiver Designed for WWVB (USA),

MSF (UK), JJY (Japan) and DCF77 (Germany)

• Receiver for ASK Modulated Data Signals

BLOCK DIAGRAM

AGC Amplifier Demodulator

&

Comparator

Power Supply/Biasing

RFI OUT

QI

QO

PDN

VDD VSS AGC DEC

AON (=AGC on)

Example

implementation

Antenna

Receiver board

Crystal

This data sheet is preliminary and subject

to change without notice.

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PAD LAYOUT

DIE size = 1.79 x 1.79 mm; PAD size = 100 x 100 µm

Substrate is connected to Vdd.

Note: Coordinates are pad center points where origin has been located in the center of VDD pad

Pad Identification Name X-coordinate Y-coordinate Note

Power Supply Voltage VDD 0 µm 0 µm

Quartz Filter Output QO 306 µm 19 µm

Quartz Filter Input QI 587 µm 19 µm

AGC Capacitor AGC 866 µm 19 µm

Receiver Output OUT 1143 µm 19 µm 1

Demodulator Capacitor DEC 1111 µm 1436 µm

AGC On Control AON 868 µm 1436 µm 2

Power Down Input PDN 551 µm 1436 µm 3

Receiver Input RFI 309 µm 1436 µm

Power Supply Ground VSS 16 µm 1415 µm

Notes:

1) OUT = VDD when carrier amplitude at maximum; OUT = VSS when carrier amplitude is reduced

(modulated)

- the output is a current source/sink with |IOUT| > 5 µA

- at power down the output is high impedance

2) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working)

- Internal pull-up with current < 1 µA which is switched off in power down

3) PDN = VSS means receiver on; PDN = VDD means receiver off

MAS1016

VDD QO QI AGC OUT

VSS RFI PDN AON DEC

1788 µm

1786 µm

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ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Conditions Min Max Unit

Supply Voltage VDD-VSS -0.3 5.0 V

Input Voltage VIN V

SS-0.3 VDD+0.3 V

Power Dissipation PMAX 100 mW

Operating Temperature TOP -20 70

oC

Storage Temperature TST -40 120

oC

ELECTRICAL CHARACTERISTICS Operating Conditions: VDD = 1.4V, Temperature = 25°C

Parameter Symbol Conditions Min Typ Max Unit

Operating Voltage VDD 1.10 3.60 V

Current Consumption IDD 50 100

µA

Stand-By Current IDDoff 0.1

µA

Input Frequency Range fIN 40 100 kHz

Minimum Input Voltage VIN min 0.5 1

µVrms

Maximum Input Voltage VIN max 20 mVrms

Input Levels |lIN|<0.5 µA VIL

VIH

0.8 VDD 0.2 VDD V

Output Current

VOL<0.2 VDD;VOH >0.8 VDD |IOUT| 5

µA

Output Pulse T0 1µVrms ≤ VIN ≤

20mVrms 50 140 ms

T

1 1µVrms ≤ VIN ≤

20mVrms 150 230 ms

Startup Time TStart 8 s

Output Delay Time TDelay 50 100 ms

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TYPICAL APPLICATION

Note 1: Crystal

The Crystal as well as ferrite antenna frequencies are chosen according to the time-signal system. Ferrite

antenna frequencies and recommended crystal frequencies are presented in table 1. For more details about

crystal selection see DAEV1016B.

Table 1 Time-Signal System Frequencies

Time-Signal System Location Frequency Recommended Crystal Frequency

DCF77 Germany 77.5kHz 77.503kHz

MSF United Kingdom 60kHz 60.003kHz

WWVB USA 60kHz 60.003kHz

JJY Japan 40kHz and 60kHz 40.003kHz and 60.003kHz

Note 2: AGC Capacitor

The AGC capacitor value is also chosen according to time-signal system. Recommended capacitor values are

presented in table 2. WWVB and JJY systems require external control of AON (=AGC on) pin to receive pulses

correctly. For more details about required control of AON in WWVB and JJY systems see DAEV1016B.

The AGC and DCF capacitors should have low leakage currents due to very small 40nA signal currents through

the capacitors.

Table 2 Recommended AGC Capacitor Value

Time-Signal System Recommended AGC Capacitor Value

DCF77 470nF

MSF 1uF

WWVB 220nF + Special AGC Control

JJY 220nF + Special AGC Control

AGC Amplifier Demodulator

&

Comparator

Power Sup p ly/Bia s ing

RFI OUT

QI

QO

VSS AGC DEC

Receiver

output

Ferrite-

Antenna

Note 1

AON (=AG C on)

VDD

1.4 V

PDN

Note 2

X1

CAGC

0.47…1 uF

CDEM

47 nF

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PACKAGE OPTIONS

PDIP-20 for samples TSSOP-16 (preliminary)

Contact us for details

NC 1

VDD 2

NC 3

QO 4

NC 5

QI 6

AGC 7

OUT 8

NC 9

NC 10

20 VSS

19 NC

18 RFI

17 PDN

16 AON

15 DEC

14 NC

13 NC

12 NC

11 NC

The pins which are not connected (“NC”) should be grounded to VSS

PIN DESCRIPTION

Pin Name PDIP Pin TSSOP Pin

(Preliminary) Type Function Note

VDD 2 1 P Positive Power Supply

QO 4 3 AO Quartz Filter Output

QI 6 5 AI Quartz Filter Input

AGC 7 6 AO AGC Capacitor

OUT 8 8 DO Receiver Output 1

DEC 15 9 AO Demodulator Capacitor

AON 16 11 DI AGC On Control 2

PDN 17 12 AI Power Down Input 3

RFI 18 14 AI Receiver Input

VSS 20 16 G Power Supply Ground

Notes:

1) OUT = VDD when carrier amplitude at maximum; OUT = VSS when carrier amplitude is reduced

(modulated)

- the output is a current source/sink with |IOUT| > 5 µA

- at power down the output is high impedance

2) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working)

- Internal pull-up (to AGC on) with current < 1 µA which is switched off in power down

3) PDN = VSS means receiver on; PDN = VDD means receiver off

VDD 1

NC 2

Q0 3

NC 4

Q1 5

AGC 6

NC 7

OUT 8

16 VSS

15 NC

14 RFI

13 NC

12 PDN

11 AON

10 NC

9 DEC

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PACKAGE (TSSOP-14) OUTLINES

Symbol Min Nom Max Unit

A -- -- 1.10 mm

A1 0.05 -- 0.15 mm

A2 0.85 0.90 0.95 mm

b 0.19 -- 0.30 mm

b1 0.19 0.22 0.25 mm

c 0.09 -- 0.20 mm

c1 0.09 -- 0.16 mm

D 4.90 5.00 5.10 mm

E 6.4 BSC mm

E1 4.30 4.40 4.50 mm

e 0.65 BSC mm

L 0.50 0.60 0.75 mm

L1 1.00 REF

R 0.09 -- -- mm

S -- 0.20 -- mm

Dimensions do not include mold or interlead flash, protrusions or gate burrs.

Reference Standard : JEDEC MO-153 .

b

R

A

VIEW A-A

B

EE1

e

AA2

A1

D

b

c

c1

b1

GAUGE PLANE

0.25

VIEW B-B

INDEX AREA

12° REF

12° REF L

L1

S

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EMBOSSED TAPE SPECIFICATIONS

Dimension Min Max Unit

A0 6.50 6.70 mm

B0 5.20 5.40 mm

D0 1.50 +0.10 / -0.00 mm

D1 1.50 mm

E1 1.65 1.85 mm

F1 7.20 7.30 mm

K0 1.20 1.40 mm

P 11.90 12.10 mm

P0 4.0 mm

P2 1.95 2.05 mm

S1 0.6 mm

T 0.25 0.35 mm

W 11.70 12.30 mm

P0

P

P2

A0

D1

D0

A

Section A - A

E1F1W

Tape Feed Direction

B0

T

K0

S1

Tape Feed Direction

Pin 1 Designator

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REEL SPECIFICATIONS

Other Dimensions according to EIA-481 Standard

Dimension Min Max Unit

A 330 mm

B 1.5 mm

C 12.80 13.50 mm

D 20.2 mm

N 50 mm

W1 (measured at hub) 12.4 14.4 mm

W2 (measured at hub) 18.4 mm

W3 (includes flange distortion at outer

edge) 11.9 15.4 mm

Trailer 160 mm

Leader 390,

of which minimum 160

mm of empty carrier

tape sealed with cover

tape

mm

A

B

D

W3

W2

C

W1

N

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ORDERING INFORMATION

Product Code Product Package Comments

MAS1016BTB1 MAS1016B AM-Receiver IC Wafer, EWS-tested Thickness 480 µm

MAS1016BTC1 MAS1016B AM-Receiver IC Wafer, EWS-tested Thickness 400 µm

MAS1016BUA1 MAS1016B AM-Receiver IC TSSOP-14 Available Q1 2002

Please contact Micro Analog Systems Oy for other wafer thickness options.

Offered in North America by

Evox Rifa, Inc.

300 Tri-State International, Suite 375

Lincolnshire, IL 60069 USA

Tel: 1 847 948 9511

Fax: 1 847 948 9320

Email: service@evox-rifa.com

Web: http://www.evox-rifa.com/n_america

MICRO ANALOG SYSTEMS OY CONTACTS

Micro Analog Systems Oy

Kamreerintie 2, P.O. Box 51

FIN-02771 Espoo, FINLAND

http://www.mas-oy.com

Tel. (09) 80 521

Tel. Int. +358 9 80 521

Telefax +358 9 805 3213

E-mail: info@mas-oy.com

NOTICE

Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or

performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown

in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that

the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog

Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.