DATA SHEE
T
CHIP RESISTORS
RC1210
5%; 1%
Product Specification – Sep. 30, 2003 V.5 Supersedes Date of Feb. 13, 2003
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Chip Resistor Surface Mount
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7
SERIES
RC
1210
RC1210 X X X XX XXXX
(1) (2) (3) (4) (5)
(1) TOLERANCE
F = ±1%
J = ±5%
(2) PACKAGING TYPE
R = Paper taping reel
(3) TEMPERATURE
CHARACTERISTIC OF
RESISTANCE
F = ±100ppm/°C
G = ±200ppm/°C
I = ±300ppm/°C
– = Base on spec
(4) SPECIAL TYPE
07 = 7 inch dia. Reel
(5) RESISTANCE VALUE:
5R6, 56R, 560R, 5K6, 56K, 22M.
SCOPE
This specification describes RC 1210 series chip resistors made by thick film process.
ORDERING INFORMATION
Part number is identified by the series, size, tolerance, packing style, temperature coefficient, special type and
resistance value.
RC1210
E-24 series: 3 digits
First two digits for significant figure and 3rd
digit for number of zeros
Both E-24 and E-96 series: 4 digits
First three digits for significant figure and
4th digit for number of zeros
MARKING
b
ook, 4 columns
protective coat
resistor layer
inner electrode
end termination
ceramic substrate
MBE940_
a
H
I2
Fig. 3 Chip resistor construction
Fig. 2 Value=10KΩ
ynsc004
Fig. 1 Value=10KΩ
ynsc001
CONSTRUCTION
The resistors are constructed out of a high-grade ceramic body. Internal
metal electrodes are added at each end and connected by a resistive
paste. The composition of the paste is adjusted to give the approximate
required resistance and laser cutting of this resistive layer that achieves
tolerance trims the value. The resistive layer is covered with a protective
coat and printed with the resistance value. Finally, the two external
terminations are added. See fig. 3
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Sep. 30, 2003 V.5
Chip Resistor Surface Mount
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SERIES
RC
1210
TYPE RC1210
L (mm) 3.10±0.10
W (mm) 2.60±0.15
H (mm) 0.50±0.10
I1 (mm) 0.45±0.15
I2 (mm) 0.50±0.20
Table 1
DIMENSION
MBE940_a
protective coat
W
L
I
1
Fig. 4 Chip resistor dimension
For dimension see Table 1
CHARACTERISTICS RC1210 1/2 W
Operating Temperature Range –55°C to +155°C
Maximum Working Voltage 200V
Maximum Overload Voltage 400V
Dielectric Withstanding Voltage 500V
Resistance Range
1Ω to 22MΩ (E24)
1Ω to 10MΩ (E96)
Zero Ohm Jumper<0.05Ω
10Ω< R ≤10MΩ±100ppm/°C
Temperature Coefficient R≤10Ω; R>10MΩ±200ppm/°C
Rated Current 2.0A
Jumper Criteria Maximum Current 10.0A
ELECTRICAL CHARACTERISTICS POWER RATING
R
RA
AT
TE
ED
D
P
PO
OW
WE
ER
R
A
AT
T
7
70
0°
°C
C,
,
R
RC
C1
12
21
10
0
1
1/
/2
2W
W
R
R
A
A
T
TE
ED
D
V
V
O
OL
LT
T
A
A
G
GE
E:
:
The DC or AC (rms) continuous
working voltage corresponding to
the rated power is determined by
the following formula:
V=√(P X R)
Where
V=Continuous rated DC
or AC (rms) working voltage (V)
P=Rated power (W)
R=Resistance value (X)
Table 2
umns
MRA632
70 10055 50 Tamb( C)
o
(%P )
rated
00
50
100
155
Pmax
Fig. 5 Maximum dissipation (Pmax) in
percentage of rated power as
a function of the operating
ambient temperature (Tamb)
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Sep. 30, 2003 V.5
Chip Resistor Surface Mount
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SERIES
RC
1210
PACKING METHOD
L
LE
EA
AD
DE
ER
R/
/T
TR
RA
AI
IL
LE
ER
R
T
TA
AP
PE
E
S
SP
PE
EC
CI
IF
FI
IC
CA
AT
TI
IO
ON
N
C0.821 B A
W
T
MSA284_a
FW
P0
P2
D0
B
AP1
E
MBD123_a
T
cover tape
DIMENSION RC1210
A (mm) 2.80±0.1
B (mm) 3.5±0.1
W (mm) 8.0±0.2
E (mm) 1.75±0.1
F (mm) 3.5±0.05
P0 (mm) 4.0±0.1
P1 (mm) 4.0±0.05
P2 (mm) 2.0±0.05
ØD0 (mm) 1.5+0.1/–0
T (mm) 0.85±0.10
PAPER TAPE SPECIFIC
A
TION
TAPING REEL
DIMENSION RC1210
Tape Width 8mm
ØA (mm) 180+0/–3
ØB (mm) 60+1/–0
ØC (mm) 13.0±0.2
W (mm) 9.0±0.3
T (mm) 11.4±1
Fig. 6 Reel dimension
Fig. 7 Paper tape dimension
Table 3
Table 4
For dimension see Table 3
For dimension see Table 4
CCB325
empty compartments
with cover tape
(min. 240 mm) cover tape only
leader ≥400 mm
trailer (max. 260 mm)
trailer end
leader end
Fig. 8 Leader and trailer tape dimension
PACKING STYLE REEL DIMENSION RC1210
Paper Taping Reel (R) 7" (178 mm) 5,000
Table 5 Packing style and packaging quantity
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Chip Resistor Surface Mount
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SERIES
RC
1210
TYPE TEST METHOD ACCEPTANCE STANDARD
Formula
Temperature
Coefficient o
f
Resistance
(T.C.R.)
Measure resistance at
+25°C or specified room
temperature as R1, then
measure at –55°C or
+155°C respectively as R2.
Determine the
temperature coefficient of
resistance from the
following formula:
T.C.R. = ------------------------- × 106 (ppm/°C)
Where
t1=+25°C or specified room temperature
t2=–55°C or +155°C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
Refer to table 2
Thermal
Shoc
k
At –55±3°C for 2 minutes and at +155±2°C for 2 minutes as one cycle. After 5
cycles, the specimen shall be stabilized at room temp.
Measure the resistance to determine ΔR/R(%) after one more hour.
±(0.5%+0.05Ω) for 1% tol.
±(1%+0.05Ω) for 5% tol.
Low
Temperature
Operation
Place the specimen in a test chamber maintained at –65 (+0/–5)°C. After one hour
stabilization at this temperature, full rated working voltage shall be applied for 45
(+5/–0) minutes. Have15 (+5/–0 ) minutes after remove the voltage, the specimen
shall be removed from the chamber and stabilized at room temperature for 24 hrs.
Measure the resistance to determine ΔR/R(%).
±(0.5%+0.05Ω) for 1% tol .
±(1.0%+0.05Ω) for 5% tol.
No visible damage
Short
Time
Overload
Apply 2.5 times of rated voltage but not exceeding the maximum overload voltage
for 5 seconds. Have the specimen stabilized at room temperature for 30 minutes
minimum.
Measure the resistance to determine ΔR/R(%).
±(1.0%+0.05Ω) for 1% tol.
±(2.0%+0.05Ω) for 5% tol.
No visible damage
Insulation
Resistance
Place the specimen in the jig and apply a rated
continues overload voltage (R.C.O.V) for one
minute as shown.
Measure the insulation resistance.
Type (DC) RC1210
Voltage 400V
≥10,000MΩ
Dielectric
Withstand
Voltage
Place the specimen in the jig and apply a
specified value continuous overload voltage as
shown for one minute.
Type (AC) RC1210
Voltage 500Vrms
Breakdown voltage>
specification and without
open/short
Resistance
To Soldering
Heat
Immerse the specimen in the solder pot at 260±5°C. for 10±1 seconds. Have the
specimen stabilized at room temperature for 30 minutes minimum.
Measure the resistance to determine R/R(%).Δ
±(0.5%+0.05Ω) for 1% tol.
±(1.0%+0.05Ω) for 5% tol.
No visible damage
R2–R1
R1(t2–t1)
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Sep. 30, 2003 V.5
Chip Resistor Surface Mount
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SERIES
RC
1210
TYPE TEST METHOD ACCEPTANCE STANDARD
Moisture
Resistance
Place the specimen in the test chamber and subject to 42 damp heat cycles. Each
one of which consists of the steps 1 to 7 as figure 10. The total length of test is
1,000 hours. Have the specimen stabilized at room temperature for 24 hours after
testing.
Measure the resistance to determine R/R(%).Δ
±(0.5%+0.05Ω) for 1% tol.
±(2.0%+0.05Ω) for 5% tol.
No visible damage
Life Place the specimen in the oven at 70±2°C. Apply the rated voltage to the specimen
at the 1.5 hours on and 0.5 hour off cycle. The total length of test is 1,000 hours.
Have the specimen stabilized at room temperature for one hour minimum after
testing.
Measure the R/R(%).Δ
±(1%+0.05Ω) for 1% tol.
±(3%+0.05Ω) for 5% tol.
No visible damage
Solderabilit
y
Immerse the specimen in the solder pot at 235±5°C for 2 sec. At least 95% solder coverage on
the termination
Bending
Strength
Mount the specimen on a test board as
shown in the figure 9. Slowly apply the force
till the board is bent for 5±1 sec.
Measure the R/R(%) at this position.Δ
Type RC1210
Bent Distance (d) 2mm
±(1.0%+0.05Ω) for 1% tol.
±(1.0%+0.05Ω) for 5% tol.
No visible damage
Fig. 9 Principle of the bending
test
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Sep. 30, 2003 V.5
Chip Resistor Surface Mount
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7
SERIES
RC
1210
75
initial drying
24 hours
90 − 98% RH 80 − 98%
RH
temperature
tolerance
±2 °C (±3.6 °F)
unless otherwise
specified
initial measurements
as specified in 2.2
0
STEP1 STEP3STEP2
prior to first
cycle only
STEP4
one cycle 24 hours; repeat as specified in 2.5
voltage applied as specified in 2.4
circulation of conditioning air shall be at a
minimum cubic rate per minute equivalent to
10 times the volume of the chamber
STEP6 STEP7
HBK073
STEP5
51015
end of final cycle;
measurements
as specified in 2.7
optional sub-cycle if specified
(2.3); sub-cycle performed during
any 5 of the first 9 cycles; humidity
uncontrolled during sub-cycle
20 time [h]
temperature
[°C]
25
50
25
0
90 − 98% RH 90 − 98% RH
+10 °C (+18 °F)
−2 °C (−3.6 °F)
80 − 98%
RH
rate of change of temperature is unspecified,
however, specimens shall not be subjected to
radiant heating from chamber conditioning processes
Fig. 10 Conditions by change of temperature