GE Data Sheet
April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 1
KHHD015A0F Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 12A/15A Output
Features
Compliant to RoHS II EU “Directive 2011/65/EU (-Z versions)
Compliant to REACH Directive (EC) No 1907/2006
Ultra-wide Input Voltage Range, 18Vdc to 75Vdc
No minimum load
High efficiency – 90.5% at full load (VIN=48Vdc)
Constant switching frequency
Low output ripple and noise
Small Size and low profile, follows DOSA standard 1/16th
footprint
33.0 mm x 22.9 mm x 9.3 mm
(1.30 in x 0.9 in x 0.37 in)
Surface mount (SMT) or Through hole (TH)
Reflow process compliant, both SMT and TH versions
Positive Remote On/Off logic
Output overcurrent/voltage protection (hiccup)
Over-temperature protection
Output Voltage adjust: 80% to 110% of Vo,nom
Wide operating temperature range (-40°C to 85°C)
UL*Recognized to UL60950-1, CAN/CSA† C22.2 No.60950-1,
and EN60950-1(VDE ‡ 0805-1) Licensed
CE mark meets 2006/95/EC directive§
Meets the voltage and current requirements for ETSI 300-
132-2 and complies with and licensed for Basic insulation
rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE 802.3¤
PoE standards
ISO** 9001 and ISO 14001 certified manufacturing facilities
Applications
Wireless Networks
Hybrid power architectures
Optical and Access Network Equipment
Enterprise Networks including Power over Ethernet (PoE)
Industrial markets
Options
Negative Remote On/Off logic (preferred)
Surface Mount/Tape and Reel (-SR Suffix)
Auto-restart Over current/Over voltage protections
(preferred)
Shorter through hole pin trim
Description
The KHHD015A0F series power modules are isolated DOSA compliant 1/16th brick dc-dc converters that operate over an ultra-
wide input voltage range of 18 Vdc -75Vdc and provide a single precisely regulated output voltage at 3.3Vdc. The output is fully
isolated from the input, allowing versatile polarity configurations and grounding connections. The modules exhibit high efficiency
of 90.5% typical at full load. Built-in filtering for both input and output minimizes the need for external filtering. The module is fully
self-protected with output over-current and over-voltage, over-temperature and input under voltage shutdown control. Optional
features include negative or positive on/off logic and SMT connections
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§ This product is intended for integration into end-user equipment. All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards.
RoHS Compliant
GE Data Sheet
KHHD015A0F Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 12A/15A Output
April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage (Continuous) All VIN -0.3 80 Vdc
Transient (100ms) All VIN, trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
Altitude* All
4000 m
I/O Isolation Voltage (100% factory Hi-Pot tested) All 2250 Vdc
* For higher altitude applications, contact your GE Sales Representative for alternative conditions of use.
Electrical Specifications
Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA = 25°C conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 18 24/48 75 Vdc
Input No Load Current All IIN,No load 40 50 mA
(VIN = 48Vdc IO = 0A, module enabled)
Input Stand-by Current All IIN,stand-by 6 8 mA
(VIN = 24 to 48Vdc, module disabled)
Maximum Input Current (VIN=18Vdc, IO= IO,MAX) All IIN, MAX 2.65 Adc
Inrush Transient All I2t 0.05 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 12μH source impedance; VIN=0V to 75Vdc, IO= IOmax ;
see Test configuration section)
All 30 mAp-p
Input Ripple Rejection (120Hz) All 60 dB
EMC, EN55022 See EMC Considerations section
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of
complex power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety
and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6A
(see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input
current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
GE Data Sheet
KHHD015A0F Hammerhead™ Series; DC-DC Converter
Power Modules
18-75Vdc Input; 3.3Vdc, 12A/15A Output
April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 3
Electrical Specifications (continued)
Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA = 25°C conditions.
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set-point
(VIN=24 to 48Vdc, IO=IO, max,) All VO, set 3.25 3.30 3.35 Vdc
Output Voltage
All VO -3.0 +3.0 % VO, set
(Over all operating input voltage, resistive load, and temperature
conditions until end of life)
Adjustment Range All VO, adj -20 +10 % VO, set
Selected by external resistor
Remote Sense Range All +10 % VO, set
Output Regulation
Line (VIN=VIN, min to VIN, max) All
0.05 0.2 % VO, set
Load (IO=IO, min to IO, max) All
0.05 0.2 % VO, set
Temperature (Tref=TA, min to TA, max) All
1.0 % VO, set
Output Ripple and Noise on nominal output
Measured with 10uF Tantalum||1uF ceramic
(VIN=24 to 48Vdc, IO=80%IO, max)
RMS (5Hz to 20MHz bandwidth) All 25 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) 75 mVpk-pk
External Capacitance (see Note 1 in Feature Specifications) All CO, max 0 5000 μF
Output Current
(VIN =36V to 75V) All Io 0 15.0 Adc
(VIN =18V to 36V) All Io 0 12.0 Adc
Output Current Limit Inception (Hiccup Mode)
(VIN =36V to 75V) All IO, lim 16.5 21 Adc
(VIN =18V to 36V) All IO, lim 13.2 16.5 Adc
Output Short-Circuit Current (VO ≤ 250 mV) All IO, s/c 2.5 Arms
Efficiency (VIN=24Vdc, IO=IO, max) All η 87.5 88.5
%
Efficiency (VIN=48Vdc, IO=IO, max) All η 89.5 90.5
%
Switching Frequency (Fixed) All fsw 450 kHz
VIN=24 to 48Vdc, IO= IO, max
Dynamic Load Response
(Io/t=0.1A/s)
Load Change from Io= 50% to 75% or 25% to 50% of Io,max:
Peak Deviation All Vpk 3.0 % VO, set
Settling Time (Vo<10% peak deviation) All ts 400 s
Isolation Specifications
Parameter Symbol Min Typ Max Unit
Isolation Capacitance Ciso 1000 pF
Isolation Resistance Riso 10 MΩ
I/O Isolation Voltage All 2250 Vdc
GE Data Sheet
KHHD015A0F Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 12A/15A Output
April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 4
General Specifications
Feature Specifications
Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA = 25°C conditions. See Feature Descriptions for
additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current (Von/off = -0.7Vdc) All Ion/off 0.15 mA
Logic Low - On/Off Voltage All Von/off -0.7 0.8 Vdc
Logic High Voltage (Ion/off = 0Adc) All Von/off 2.4 7 Vdc
Logic High maximum allowable leakage current All Ion/off 25 μA
Turn-On Delay and Rise Times
(IO=80% of IO, max)
Case 1: Input power is applied for at least 1second, and then the
On/Off input is set from OFF to ON (Tdelay = on/off pin transition until
VO = 10% of VO, set)
All Tdelay
Case1 35 50 ms
Case 2: On/Off input is set to Module ON, and then input power is
applied
(Tdelay = VIN reaches VIN, min until VO = 10% of VO,set)
All Tdelay
Case2 24 50 ms
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set) All Trise 30 50 ms
Output Voltage Overshoot 3 % VO, set
(IO=80% of IO, max, VIN= 24 to 48Vdc)
Output Overvoltage Protection All VO, limit 4.0 5.5 Vdc
Input Undervoltage Lockout
Turn-on Threshold All Vuv/on 17 18 Vdc
Turn-off Threshold All Vuv/off 14 15 Vdc
Hysterisis All Vhyst 2.0 Vdc
Note: 1.The module requires a minimum of 470 μF external output capacitor to avoid exceeding the OVP maximum limits during startup into open
loop fault conditions.
Parameter
Min Typ Max Unit
Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I Case 3
(IO=80%IO, max, TA=40°C, airflow = 200 lfm, 90% confidence)
FIT 274.7 109/Hours
MTBF 3,640,826 Hours
Weight 13 (0.46) g (oz.)
G
K
1
A
C
T
e
G
E
K
HHD0
1
1
8-75Vdc I
n
A
pril 1, 2013
C
haracteri
s
T
he following fi
e
ither positive
o
EFFICIENCY, (%)
Figure 1. Con
v
OUTPUT VOLTAGE
V
O
(V) (50mV/div)
Figure 3. Typ
i
V
On/Off
V) (2V/div) V
O
( (V) (1V/div)
Figure 5.Typi
c
logic version
1
5A0F H
a
n
put; 3.3V
d
s
tic Curve
s
gures provide
o
r negative re
m
OUTP
U
verter Efficie
n
TI
i
cal output rip
TI
M
c
al Start-up U
s
shown (VIN =
2
a
mmerh
d
c, 12A/15
A
©
2
s
typical charac
m
ote On/Off lo
g
U
T CURRENT, I
O
(
A
n
cy versus Ou
t
ME, t (1
s/div)
ple and noise
M
E, t (20ms/div)
s
ing Remote
O
2
4V or 48V, Io
=
ead™ S
e
A
Output
2
012 General El
e
teristics for th
e
g
ic.
A
)
t
put Current.
(I
o
= I
o,max
).
O
n/Off, negati
v
=
I
o,max
).
e
ries; D
C
e
ctric Company.
A
e
KHHD015A0
F
INPUT CURRENT, I
IN
(A)
Figur
e
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (2A/div) V
O
(V) (100mV/div)
Figur
e
Chan
g
INPUT VOLTAGE OUTPUT VOLTAGE
V
IN
(V) (20V/div) V
O
(V) (1V/div)
v
e Figur
e
I
o,max
).
C
-DC Co
n
A
ll rights reserv
e
F
(3.3V, 12A/15
e
2. Converte
r
e
4. Transient
g
e from 50% t
o
e
6. Typical St
a
n
verter
P
e
d.
A) at 25
o
C. Th
e
INPUT VO
L
r
Input Curren
t
TIME, t (
5
Response to
0
o
75% to 50
%
TIME, t (
2
a
rt-up Using I
n
Data S
h
P
ower M
o
e
figures are i
d
L
TAGE, V
IN
(V)
t
versus Input
5
00
s/div)
0
.1A/µS Dyna
m
%
of full load,
V
2
0ms/div)
n
put Voltage (
h
eet
o
dules
Page
5
d
entical for
Voltage.
m
ic Load
V
in=48V.
V
IN
= 48V, I
o
=
5
GE Data Sheet
KHHD015A0F Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 12A/15A Output
April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 6
Test Configurations
TO OSCILLOSCOPE CURRENT PROBE
LTEST
12μH
BATTERY
CS 220μF
E.S.R.<0.1
@ 20°C 100kHz
33μF
Vin+
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 7. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
V O
(
–
)
1uF
.
RESI STIV E
LO A D
SC O P E
C O PPER STRIP
GROUND PLANE
10uF
Figure 8. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test Setup.
=
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
Input Source Impedance
The power module should be connected to a low
ac-impedance source. Highly inductive source impedance can
affect the stability of the power module. For the test
configuration in Figure 7, a 33μF electrolytic capacitor
(ESR<0.7 at 100kHz), mounted close to the power module
helps ensure the stability of the unit. Consult the factory for
further application guidelines.
Safety Considerations
For safety-agency approval of the system in which the power
module is used, the power module must be installed in
compliance with the spacing and separation requirements of
the end-use safety agency standard, i.e., UL 60950-1-3, CSA
C22.2 No. 60950-00, and VDE 0805 (IEC60950, 3rd Edition).
If the input source is non-SELV (ELV or a hazardous voltage
greater than 60 Vdc and less than or equal to 75Vdc), for the
module’s output to be considered as meeting the requirements
for safety extra-low voltage (SELV), all of the following must be
true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages, including
the ac mains.
One VIN pin and one VOUT pin are to be grounded, or both
the input and output pins are to be kept floating.
The input pins of the module are not operator accessible.
Another SELV reliability test is conducted on the whole
system (combination of supply source and subject
module), as required by the safety agencies, to verify that
under a single fault, hazardous voltages do not appear at
the module’s output.
Note: Do not ground either of the input pins of the module
without grounding one of the output pins. This may
allow a non-SELV voltage to appear between the output
pins and ground.
The power module has extra-low voltage (ELV) outputs when all
inputs are ELV.
For input voltages exceeding –60 Vdc but less than or equal to
–75 Vdc, these converters have been evaluated to the
applicable requirements of BASIC INSULATION between
secondary DC MAINS DISTRIBUTION input (classified as TNV-2
in Europe) and unearthed SELV outputs.
The input to these units is to be provided with a maximum 6A
fast acting fuse in the ungrounded lead.
GE Data Sheet
KHHD015A0F Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 12A/15A Output
April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 7
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic turns
the module on during a logic high voltage on the on/off pin,
and off during a logic low. Negative logic remote on/off, device
code suffix “1”, turns the module off during a logic high and on
during a logic low.
ON/OFF
Vin+
Vin-
Ion/off
Von/off
Vout+
TRIM
Vout-
Figure 10. Circuit configuration for using Remote On/Off
Implementation.
To turn the power module on and off, the user must supply a
switch (open collector or equivalent) to control the voltage
(Von/off) between the ON/OFF terminal and the VIN(-) terminal.
Logic low is 0V ≤ Von/off ≤ 0.8V. The maximum Ion/off during a
logic low is 0.15mA, the switch should be maintain a logic low
level whilst sinking this current.
During a logic high, the typical Von/off generated by the module
is 4.0V, and the maximum allowable leakage current at Von/off =
4.0V is 25μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Overcurrent Protection
To provide protection in a fault (output overload) condition, the
unit is equipped with internal current-limiting circuitry and can
endure current limiting continuously. At the point of
current-limit inception, the unit enters hiccup mode. If the unit
is not configured with auto–restart, then it will latch off
following the over current condition. The module can be
restarted by cycling the dc input power or by toggling the
remote on/off signal. If the unit is configured with the auto-
restart option (4), it will remain in the hiccup mode as long as
the overcurrent condition exists; it operates normally, once the
output current is brought back into its specified range.
Overtemperature Protection
To provide protection under certain fault conditions, the unit is
equipped with a thermal shutdown circuit. The unit will shut
down if the thermal reference point Tref (Figure 16), exceeds
135oC (typical), but the thermal shutdown is not intended as a
guarantee that the unit will survive temperatures beyond its
rating. The module will automatically restart upon cool-down
to a safe temperature.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit,
the module operation is disabled. The module will only begin to
operate once the input voltage is raised above the
undervoltage lockout turn-on threshold, VUV/ON.
Once operating, the module will continue to operate until the
input voltage is taken below the undervoltage turn-off
threshold, VUV/OFF.
Over Voltage Protection
The output overvoltage protection shall consist of circuitry that
independently monitors the output voltage, and shuts the
module down if the output voltage exceeds specified limits.
This protection feature latches in the event of over voltage
across the output. Cycling the on/off pin or input voltage resets
the latching protection feature. If the auto-restart option (4) is
ordered, the module will automatically restart upon an
internally programmed time elapsing.
Output Voltage Programming
Trimming allows the user to increase or decrease the output
voltage set point of the module. This is accomplished by
connecting an external resistor between the TRIM pin and
either the Vout+ pin or the Vout- pin.
Trim Down – Decrease Output Voltage
By connecting an external resistor (Radj-down) between the
TRIM pin and VO(-) or SENSE(-) pin (see figure 11), the output
voltage set point decreases. The following equation
determines the external resistor value to obtain an output
voltage change from Vo,set to the desired Vo,desired:
kR downadj 22.10
%
511
Where 100%
,
,,
seto
desiredoseto V
VV
Figure 11. Circuit Configuration to Decrease Output Voltage.
Trim Up – Increase Output Voltage
By connecting an external resistor (Radj-up) between the TRIM
pin and VO(+) or SENSE(+) pin (see figure 12), the output voltage
set point increases. The following equation determines the
external resistor value to obtain an output voltage change
from Vo,set to the desired Vo,desired:
G
K
1
A
F
R
W
F
T
o
t
m
T
p
a
P
T
w
w
f
o
G
E
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HHD0
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1
8-75Vdc I
n
A
pril 1, 2013
F
eature D
e
R
upadj
11.5
W
here
%
F
igure 12. Circ
u
T
he combinati
o
o
utput voltage
rim range of 8
0
m
easured bet
w
T
he KHHD015
A
p
oint. Therefo
r
a
vailable outp
u
P
re-bias Vin
U
T
he module sh
a
w
ithout protec
t
w
hen subject
e
o
llowing condi
Vin(V)
48
48
48
48
48
48
48
48
60
60
60
60
60
60
60
60
Vin
Tfall
1
5A0F H
a
n
put; 3.3V
d
e
scriptions
V
seto
%225.1
100(
,
,
,,
seto
odesiredo
V
VV
u
it Configura
t
o
n of the outp
u
initial toleran
c
0
% to 110% o
f
w
een the Vout
+
A
0F power mo
d
r
e, as the outp
u
u
t power is red
u
U
nder Volta
g
a
ll recover fro
m
t
ive shutdown
e
d to Vin Un
d
tions:
Tdip (ms)
5
5
10
10
5
5
10
10
5
5
10
10
5
5
10
10
5V
= 10us
a
mmerh
d
c, 12A/15
A
©
(continued)
%
511
%)
100
set
t
ion to Increa
s
u
t voltage adju
s
c
e must not ex
c
f
the nominal
o
+
and Vout- pi
n
d
ules have a fi
x
u
t voltage is a
d
u
ced.
g
e Test
m
UVLO [Und
e
from OCP or
d
er Voltage
t
Co (uF)
0
2200
0
2200
0
2200
0
2200
0
2200
0
2200
0
2200
0
2200
Tdip
T
ead™ S
e
A
Output
©
2012 General
E
k22.10
s
e Output Volt
a
s
tment and th
e
c
eed the allow
a
o
utput voltage
n
s.
x
ed current-li
m
d
justed down,
t
e
r Voltage Loc
k
OVP or hard f
a
t
ransients wit
h
Load (A)
0
0
0
0
15
15
15
15
0
0
0
0
15
15
15
15
rise = 5us
e
ries; D
C
lectric Compan
y
a
ge.
e
a
ble
as
m
it set
t
he
k
Out]
a
ilure,
h
the
Th
e
The
p
envi
r
to h
e
Con
s
pow
e
redu
resu
l
The
t
mea
s
ther
m
tem
p
cera
con
d
tem
p
mod
com
p
tem
p
repe
a
fami
Figu
r
Hea
t
Incr
e
via c
curr
e
amb
3m/
s
Curv
Plea
s
Proc
e
deta
devi
c
C
-DC Co
n
y
. All rights reser
v
e
rmal Con
s
p
ower module
s
r
onments; ho
w
e
lp ensure reli
a
s
iderations incl
e
r dissipation,
a
ction in the op
l
t in an increa
s
t
hermal data
p
s
urements tak
m
o-couple ins
t
p
eratures: FET
s
mic capacitor
s
d
uctors, while
c
p
erature. For a
ule output po
w
p
onents reach
p
erature, as d
e
a
ted for a diff
e
ly of module o
u
r
e 13. Therma
t
Transfer vi
a
e
ased airflow
o
onvection. De
e
nt that can b
e
ient temperat
u
s
(600 ft./min)
a
es section.
s
e refer to the
A
e
ss For Open-
F
iled discussio
n
c
e temperatur
e
n
verter
P
v
ed.
s
ideration
s
s
operate in a
v
w
ever, sufficien
t
a
ble operation.
ude ambient t
a
nd the need
f
erating tempe
e in reliability.
p
resented here
en in a wind t
u
t
rumentation t
o
s
, diodes, cont
r
s
, opto-isolato
r
c
ontrolling the
given airflow
a
w
er is increase
d
es its maximu
m
e
fined in IPC-9
5
e
rent airflow o
r
u
tput derating
l Test Setup .
a
Convectio
n
o
ver the modul
rating figures
s
e
delivered by
e
u
re (T
A
) for nat
u
a
re shown in t
h
A
pplication N
o
F
rame Board-
M
n
of thermal as
p
e
s.
Data Sh
e
P
ower M
o
s
v
ariety of ther
m
t
cooling shou
l
e
mperature, a
f
or increased r
e
rature of the
m
is based on p
h
u
nnel, using au
o
monitor key
c
r
ol ICs, magne
t
r
s, and module
ambient airflo
w
a
nd ambient t
e
d
, until one (or
m
derated op
e
5
92A. This pro
c
r
ambient tem
p
curves is obt
a
n
e enhances th
e
s
howing the
m
e
ach module v
u
ral convectio
n
h
e respective
C
o
te “Thermal C
h
M
ounted Powe
p
ects includin
g
e
et
o
dules
Pag
e
m
al
l
d be provided
irflow, module
e
liability. A
m
odule will
h
ysical
tomated
c
omponent
t
ic cores,
pwb
w
rate and
e
mperature, t
h
more) of the
e
rating
c
edure is then
p
erature until
a
a
ined.
e
heat transfe
r
m
aximum outp
u
ersus local
n
and up to
C
haracteristics
h
aracterizatio
n
r Modules” for
g
maximum
e
8
h
e
a
r
u
t
n
a
G
K
1
A
T
()
F
K
D
()
F
K
D
T
s
s
F
E
F
c
G
E
K
HHD0
1
1
8-75Vdc I
n
A
pril 1, 2013
T
hermal C
o
OUTPUT CURRENT, I
O
(
A
)
L
O
F
igure 14. Out
p
K
HHD015A0F i
D
irection from
OUTPUT CURRENT, I
O
(
A
)
L
O
F
igure 15. Out
p
K
HHD015A0F i
D
irection from
T
he thermal re
f
s
hown in Figur
e
s
hould not exc
e
F
igure 16. T
ref
T
E
MC Requi
r
F
igure 17 sho
w
c
onducted emi
s
1
5A0F H
a
n
put; 3.3V
d
o
nsiderati
o
O
CAL AMBIEN
T
p
ut Current D
e
n the Transve
Vin(+) to Vin(
-
O
CAL AMBIEN
T
p
ut Current D
e
n the Transve
Vin(+) to Vin(
-
f
erence point,
T
e
16. For relia
b
e
ed 117
o
C.
T
emperature
M
r
ements
w
s a maximum
s
sion limits of
E
a
mmerh
d
c, 12A/15
A
©
2
o
ns (contin
T
TEMPERATUR
e
rating for th
e
rse Orientati
o
-
); Vin = 24V.
T
TEMPERATUR
e
rating for th
e
rse Orientati
o
-
); Vin = 48V.
T
ref,
used in the
b
le operation t
h
M
easuremen
t
filter configur
a
E
N55022 Clas
s
ead™ S
e
A
Output
2
012 General El
e
ued)
E, T
A
(
C)
e
Open Frame
o
n; Airflow
E, T
A
(
C)
e
Open Frame
o
n; Airflow
specifications
h
is temperatu
r
t
Location.
a
tion to meet t
h
s
B.
e
ries; D
C
e
ctric Company.
A
is
r
e
h
e
Not
e
Ci
C1,
C2,
C5,
Figu
r
Figu
r
For f
plea
s
La
y
The
K
to b
e
com
p
mod
cop
p
mod
pow
e
For
a
she
e
The
K
eith
e
Thr
o
The
R
SAC
(
com
p
singl
C
-DC Co
n
A
ll rights reserv
e
e
s: C1 and C4
See Fig
u
C4 2.2uF, 1
0
C3 1210Y1
K
RDHX2
2
C6
GRM32
D
RDHX3
3
202S48
W
r
e 17. Sugges
t
r
e 18. EMC sig
urther inform
a
s
e refer to the
y
out Consi
d
K
HHD015A0F
p
e
used in fine p
p
onent cleara
n
ule and the m
o
p
er areas on th
ule. Also avoi
d
e
r module.
a
dditional layo
u
e
t.
K
HHD015A0F
f
e
r Through-Hol
o
ugh-Hole
S
R
oHS-complia
n
(
Sn/Ag/Cu) Pb
-
p
onents. The
y
e or dual wav
e
n
verter
P
e
d.
are low imped
u
re 7
0
0V, 1210
K
50103KXTD
W
2
3K302HKT, 22
D
R73A153KW
0
3
3K302HKT, 33
W
334KT, 33nF
,
t
ed Configura
t
nature using
a
a
tion on desig
n
FLTR100V10 d
d
erations
p
ower module
itch system c
a
n
ce between t
h
o
unting board
e outer layer
d
d
placing via in
u
t guide-lines,
f
amily of powe
e (TH) or Surfa
c
S
oldering I
n
n
t (Z codes) th
r
-
free solder an
d
y
are designed
e
soldering ma
Data S
h
P
ower M
o
ance SMT cer
a
W
V, 10nF, 1500
V
nF, 3000V (Hol
0
1L, 15nF, 100
0
nF, 3000V (Hol
,
2000V (Joha
n
t
ion for EN55
0
a
bove filter, K
n
ing for EMC c
o
ata sheet (FDS
series are low
a
rd architectur
e
h
e bottom of t
h
is limited. Avoi
d
irectly undern
terconnects u
n
refer to the FL
T
r modules is a
v
c
e Mount (SM
T
n
formation
r
ough-hole pr
o
d
RoHS-compl
i
to be process
e
chines. The pi
n
h
eet
o
dules
Page
9
a
mics.
V
(*2)
ystone)
0
V (*2)
ystone)
n
son)
0
22 Class B.
HHD015A0.
o
mpliance,
01-043EPS).
profile in orde
e
s. As such,
h
e power
d placing
eath the pow
e
n
derneath the
T
R100V10 dat
a
v
ailable for
T
) soldering.
o
ducts use the
i
ant
e
d through
n
s have an
9
r
e
r
a
GE Data Sheet
KHHD015A0F Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 12A/15A Output
April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 10
Layout Considerations (continued)
RoHS-compliant finish that is compatible with both Pb and Pb-
free wave soldering processes. A maximum preheat rate of
3C/s is suggested. The wave preheat process should be such
that the temperature of the power module board is kept below
210C. For Pb solder, the recommended pot temperature is
260C, while the Pb-free solder pot is 270C max. Not all RoHS-
compliant through-hole products can be processed with paste-
through-hole Pb or Pb-free reflow process. If additional
information is needed, please consult with your GE
representative for more details.
Surface Mount Information
Pick and Place
The KHHD-SR series of DC-to-DC power converters use an
open-frame construction and are designed for surface mount
assembly within a fully automated manufacturing process.
The KHHD-SR series modules are designed to use the main
magnetic component surface to allow for pick and place.
Note: All dimensions in mm [in].
Figure 19. Pick and Place Location.
Z Plane Height
The ‘Z’ plane height of the pick and place location is 7.50mm
nominal with an RSS tolerance of +/-0.25 mm.
Nozzle Recommendations
The module weight has been kept to a minimum by using open
frame construction. Even so, they have a relatively large mass
when compared with conventional SMT components.
Variables such as nozzle size, tip style, vacuum pressure and
placement speed should be considered to optimize this
process.
The minimum recommended nozzle diameter for reliable
operation is 5mm. The maximum nozzle outer diameter, which
will safely fit within the allowable component spacing, is
6.5mm.
Oblong or oval nozzles up to 11 x 6 mm may also be used
within the space available.
For further information please contact your local GE Technical
Sales Representative.
Reflow Soldering Information
These power modules are large mass, low thermal
resistance devices and typically heat up slower than other
SMT components. It is recommended that the customer
review data sheets in order to customize the solder reflow
profile for each application board assembly.
The following instructions must be observed when SMT
soldering these units. Failure to observe these instructions
may result in the failure of or cause damage to the modules,
and can adversely affect long-term reliability.
There are several types of SMT reflow technologies currently
used in the industry. These surface mount power modules
can be reliably soldered using natural forced convection, IR
(radiant infrared), or a combination of convection/IR. The
recommended linear reflow profile using Sn/Pb solder is
shown in Figure 20 and 21. For reliable soldering the solder
reflow profile should be established by accurately measuring
the module’s pin connector temperatures.
REFLOW TEMP (C)
REFLOW TIME (S)
Figure 20. Recommended Reflow Profile for Sn/Pb solder.
MAX TEMP SOLDER (C)
TIME LIMIT (S)
Figure 21. Time Limit, Tlim, Curve Above 205oC Reflow.
Lead Free Soldering
The –Z version SMT modules of the KHHD015A0F series are
lead-free (Pb-free) and RoHS compliant and are compatible in a
Pb-free soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to the
modules and can adversely affect long-term reliability.
0
50
10 0
15 0
200
250
300
Preheat zone
max 4
o
Cs
-1
So ak zone
30-240s
Heat zone
max 4
o
Cs
-1
Peak Temp 235
o
C
Co oling
zo ne
1- 4
o
Cs
-1
T
lim
above
205
o
C
200
205
210
215
220
225
230
235
240
0 10 203040 5060
GE Data Sheet
KHHD015A0F Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 12A/15A Output
April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 11
Surface Mount Information (continued)
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow profile
based on the volume and thickness of the package (table 4-2).
The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Figure 22.
Figure 22. Recommended linear reflow profile using
Sn/Ag/Cu solder.
MSL Rating
The KHHD015A0F series SMT modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are required for
MSL ratings of 2 or greater. These sealed packages should not
be broken until time of use. Once the original package is
broken, the floor life of the product at conditions of 30°C and
60% relative humidity varies according to the MSL rating (see
J-STD-033A). The shelf life for dry packed SMT packages will be
a minimum of 12 months from the bag seal date, when stored
at the following conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to GE Board Mounted
Power Modules: Soldering and Cleaning Application Note
(AP01-056EPS).
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Re flow Time (Se c o nds)
Reflow Temp (°C)
Heating Zone
1°C/Second
Peak Temp 260 °C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Se c onds
Cooling
Zone
G
K
1
A
M
D
T
G
E
K
HHD0
1
1
8-75Vdc I
n
A
pril 1, 2013
M
echanica
D
imensions ar
e
T
olerances: x.x
x.xx
Top
View
Side
View
Bottom
View
PIN FUNCTI
O
1 V
IN(+)
2 On/Of
f
3 V
IN(-)
4 V
o(-)
5 Sense
(
-
6 Trim
7 Sense
(
+
8 Vo
(+)
1
5A0F H
a
n
put; 3.3V
d
l Outline f
o
e
in millimeter
s
mm
0.5 mm
mm
0.25 m
m
O
N
f
-
)
+
)
a
mmerh
d
c, 12A/15
A
©
o
r KHHD0
1
s
and [inches].
[x.xx in.
0.02
m
[x.xxx in
0.
0
ead™ S
e
A
Output
©
2012 General
E
1
5A0F Surf
a
in.] (Unless ot
h
0
10 in.]
e
ries; D
C
lectric Compan
y
a
ce-Moun
t
h
erwise indica
t
C
-DC Co
n
y
. All rights reser
v
t
Module
t
ed)
n
verter
P
v
ed.
Data Sh
e
P
ower M
o
e
et
o
dules
Page
1
1
2
GE Data Sheet
KHHD015A0F Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 12A/15A Output
April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 13
Mechanical Outline for KHHD015A0F Through Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View
Side
View
* Optional PIN Lengths shown In Device Option Table
Bottom View
PIN FUNCTION
1 VIN(+)
2 On/Off
3 VIN(-)
4 Vo(-)
5 Sense(-)
6 Trim
7 Sense(+)
8 Vo(+)
G
K
1
A
R
D
T
G
E
K
HHD0
1
1
8-75Vdc I
n
A
pril 1, 2013
R
ecomme
n
D
imensions ar
e
T
olerances: x.x
x.xx
1
5A0F H
a
n
put; 3.3V
d
n
ded Pad L
a
e
in millimeter
s
mm
0.5 mm
mm
0.25 m
m
F
a
mmerh
d
c, 12A/15
A
©
a
yout for
S
s
and [inches].
[x.xx in.
0.02
m
[x.xxx in
0.
0
F
or .025 x .03
0
For .062 d
ead™ S
e
A
Output
©
2012 General
E
S
urface M
o
in.] (Unless ot
h
0
10 in.]
Surfa
Thro
u
0
rectangular
p
iameter pin,
u
e
ries; D
C
lectric Compan
y
o
unt and T
h
h
erwise indica
t
ce Mount Pad
u
gh-Hole Pad
p
in, use a .05
0
u
se a .076 dia
m
C
-DC Co
n
y
. All rights reser
v
h
rough Ho
l
t
ed)
Layout
Layout
0
diameter pl
a
m
eter plated t
n
verter
P
v
ed.
l
e Module
a
ted through
h
hrough hole.
Data Sh
e
P
ower M
o
h
ole
e
et
o
dules
Page
1
1
4
GE Data Sheet
KHHD015A0F Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 12A/15A Output
April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 15
Packaging Details
The KHHD015A0F series SMT versions are supplied in tape & reel as standard. Details of tape dimensions are shown below.
Modules are shipped in quantities of 140 modules per reel.
Tape Dimensions
Dimensions are in millimeters
.
Reel Dimensions
Outside Diameter: 330mm
Inside Diameter: 178mm
Tape Width: 56mm
Tray Dimensions
The KHHD015A0F - series Through Hole versions are supplied in trays as standard. Details of tray dimensions are shown
below. Modules are shipped in quantities of 75 modules per box.
Dimensions are in millimeters.
Tolerances: x.x mm 0.5 mm (unless otherwise indicated)
x.xx mm 0.25 mm
Material PET (1mm)
Max surface
resistivity 109 -1011/PET
Color Clear
Capacity 25power modules
Min order
quantity
75pcs (1 box of 3 full
trays + 1 empty top
tray)
GE Data Sheet
KHHD015A0F Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 12A/15A Output
Contact Us
For more information, call us at
USA/Canada:
+1 888 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.878067-280
India:
+91.80.28411633
www.ge.com/powerelectronics
April 1, 2013 ©2012 General Electric Company. All rights reserved. Version 1.01
Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product codes Input Voltage Output Current Output
Voltage
Remote On/Off
Logic
Connector
Type Comcodes
KHHD015A0F41Z 24V/48V (18-75Vdc) 12A (18-36VIN)
15A (36-75VIN) 3.3V Negative Through hole CC109172994
KHHD015A0F41-SRZ 24V/48V (18-75Vdc) 12A (18-36VIN)
15A (36-75VIN) 3.3V Negative Surface mount CC109173002
Table 2. Device Options