Agilent HSMx-C177, HSMx-C197
Low Profile Chip LEDs
Data Sheet
Features
• Small size with extremely low
profile
• 0805 or 0603 industry standard
footprint with 0.4 mm height
• Diffused optics
• Operating temperature range of
–30°C to +85°C
• Compatible with IR soldering
• Available in 7 colors
• Available in 8 mm tape on 7"
diameter reel
• Reel sealed in zip locked
moisture barrier bags
Applications
• Membrane switch indicator
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbol backlighting
• Keypad backlighting
Description
The HSMx-C177 and HSMx-C197
ChipLEDs are designed specifically
for the membrane switch applica-
tion. The request is to have the
height as low as possible while re-
taining the footprint at the optimal
size of a 0805 (2.0 x 1.25 mm) or
0603 (1.6 x 0.8 mm) device. Apart
from the membrane switch applica-
tion, the HSMx-C177 is also suit-
able for use in applications where
low height is required.
Seven different colors are avail-
able: green, red, yellow, orange,
deep red, blue, and amber. All
parts are intensity binned and
color binned (except for red
color). They come in 8 mm tape
on a 7 inch diameter reel with
4000 units per reel which makes
them compatible for automatic
placement.
Device Selection Guide
AS AlInGaP
Product Number Color Package Description
HSMA-C177/C197 Amber Untinted, Diffused
HSMT-C177/C197 Deep Red Untinted, Diffused
HSMC-C177/C197 Red Untinted, Diffused
HSML-C177/C197 Orange Untinted, Diffused
GaP
Product Number Color Package Description
HSMG-C177/C197 Green Untinted, Diffused
HSMD-C177/C197 Orange Untinted, Diffused
HSMS-C177/C197 HER Untinted, Diffused
HSMY-C177/C197 Yellow Untinted, Diffused
InGaN
Product Number Color Package Description
HSMQ-C177/C197 Green Untinted, Diffused
HSMR-C177/C197 Blue Untinted, Diffused
2
Package Dimensions
HSMx-C177 HSMx-C197
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
CATHODE MARK
LED DIE
0.80
(0.031) 0.40
(0.016)
1.60 (0.063)
DIFFUSED
EPOXY
PC BOARD 0.40 (0.016)
0.16 (0.006)
POLARITY
0.70 (0.028) MIN.
SOLDERING
TERMINAL
0.30 (0.012)
CATHODE LINE
CATHODE MARK
LED DIE
1.25
(0.049)
0.62
(0.025)
2.00 (0.079)
DIFFUSED EPOXY
PC BOARD
0.40 (0.016)
0.16 (0.006)
POLARITY
1.10 (0.043) MIN.
0.40 (0.016)
SOLDERING
TERMINAL
0.40 (0.016)
CATHODE LINE
3
Absolute Maximum Ratings at TA = 25˚C
HSMA/C/L-C177/C197,
Parameter HSMT-C177/C197 HSMG/D/S/Y-C177/C197 HSMQ/R-C177/C197 Units
DC Forward Current [1] 25 20 20 mA
Peak Pulsing Current[2] 100 100 100 mA
Power Dissipation 64 54 78 mW
Reverse Voltage (IR = 100 µA) 5 5 5 V
LED Junction Temperature 95 95 95 ˚C
Operating Temperature Range –30 to +85 –30 to +85 –30 to +85 ˚C
Storage Temperature Range –40 to +85 –40 to +85 –40 to +85 ˚C
Soldering Temperature See IR soldering profile (Figure 7)
Notes:
1. Derate linearly as shown in Figure 4.
2. Pulse condition of 1/10 duty and 0.1 ms width.
Electrical Characteristics at TA = 25˚C
Forward Voltage Reverse Breakdown Capacitance C Thermal
VF (Volts) VR (Volts) (pF), VF = 0, Resistance
@ IF = 20 mA @ IR = 100 µA f = 1 MHz RθJ–PIN (˚C/W)
Part Number Typ. Max. Min. Typ. Typ.
HSMA-C177/197 1.9 2.4 5 11 300
HSMC-C177/197 1.9 2.4 5 15 300
HSML-C177/197 1.9 2.4 5 20 300
HSMT-C177/197 1.9 2.4 5 15 300
HSMG-C177/197 2.2 2.6 5 9 250
HSMD-C177/197 2.2 2.6 5 7 250
HSMS-C177/197 2.1 2.6 5 5 250
HSMY-C177/197 2.1 2.6 5 6 250
HSMQ-C177/197 3.4 3.9 5 110 350
HSMR-C177/197 3.4 3.9 5 110 350
VF Tolerance: ± 0.1 V
4
Optical Characteristics at TA = 25˚C
Luminous Color, Viewing Luminous
Intensity Peak Dominant Angle Efficacy
IV (mcd) Wavelength Wavelength 2 θ1/2 ηV
@ 20 mA[1] λpeak (nm) λd[2] (nm) Degrees[3] (lm/w)
Part Number Color Min. Typ. Typ. Typ. Typ. Typ.
HSMA-C177/197 AS Amber 25 90 595 592 130 480
HSMC-C177/197 AS Red 25 90 637 626 130 155
HSML-C177/197 AS Orange 25 90 609 605 130 370
HSMT-C177/197 AS Deep Red 10 30 660 639 130 70
HSMG-C177/197 GaP Green 4.0 15 570 572 130 595
HSMD-C177/197 GaP Orange 2.5 8 605 604 130 380
HSMS-C177/197 HER 2.5 10 630 626 130 145
HSMY-C177/197 GaP Yellow 2.5 8 589 586 130 500
HSMQ-C177/197 InGaN Green 40 145 520 527 130 510
HSMR-C177/197 InGaN Blue 16 55 469 473 130 88
Notes:
1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Color Bin Limits
Green Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 561.5 564.5
B 564.5 567.5
C 567.5 570.5
D 570.5 573.5
E 573.5 576.5
Tolerance: ± 0.5 nm
Blue Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Tolerance: ± 1 nm
5
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd)
Bin ID Min. Max.
A 0.11 0.18
B 0.18 0.29
C 0.29 0.45
D 0.45 0.72
E 0.72 1.10
F 1.10 1.80
G 1.80 2.80
H 2.80 4.50
J 4.50 7.20
K 7.20 11.20
L 11.20 18.00
M 18.00 28.50
N 28.50 45.00
P 45.00 71.50
Q 71.50 112.50
R 112.50 180.00
S 180.00 285.00
T 285.00 450.00
U 450.00 715.00
V 715.00 1125.00
W 1125.00 1800.00
X 1800.00 2850.00
Y 2850.00 4500.00
Note:
1. Bin categories are established for classifica-
tion of products. Products may not be avail-
able in all categories. Please contact your
Agilent representative for information on
currently available bins.
Yellow/Amber Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Orange Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
F 612.0 615.0
InGaN Green Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Tolerance: ± 0.5 nm
Tolerance: ± 1 nm
Note:
1. Bin categories are established for classification of products. Products may not be available in all
categories. Please contact your Agilent representative for information on currently available bins.
Tolerance: ± 1 nm
Tolerance: ± 15%
6
Figure 1b. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage.
Figure 1a. Relative intensity vs. wavelength.
WAVELENGTH – nm
RELATIVE INTENSITY
1.0
0650 725
575500
0.8
0.6
0.4
0.2
525 550 600 625 675 700
GaP ORANGE
HER
GaP YELLOW
GaP GREEN
100
10
1
01.5 1.7 1.9 2.1 2.3
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
LPE GREEN
HER
1.6 1.8 2.0 2.2
AS AlInGaP
GaP YELLOW
GaP ORANGE
100
90
80
70
60
50
40
30
20
10
0400 450 500 550 600 650 700
WAVELENGTH – nm
RELATIVE INTENSITY – %
InGaN
BLUE
AS
AMBER
InGaN
GREEN
AS
DEEP
RED
AS
RED
AS
ORANGE
100
10
1
01.5 3.0 4.0
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
2.0 2.5 3.5
InGan
7
Figure 5. Relative intensity vs. angle. Figure 6. Recommended reflow soldering profile.
Figure 7. Recommended soldering pattern for HSMx-C177.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
–3°C/SEC. MAX.
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
CENTERING
BOARD
0.8 (0.031)
0.8
(0.031) 0.7
(0.028)
0.8
(0.031)
CENTERING
BOARD
Figure 8. Recommended soldering pattern for HSMx-C197.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 4. Maximum forward current vs.
ambient temperature.
Figure 3. Luminous intensity vs. forward current.
05 15
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
0.6
0.2
0.8
10 30
1.4
25
1.2
AS AMBER
AS ORANGE, RED,
and DEEP RED
05 15
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
0.6
0.2
0.8
10 25
1.2
GaP
InGaN
0
020 60 80 100
5
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
T
A
– AMBIENT TEMPERATURE – °C
40
15
30
10
20
InGaN
25 AlInGaP
10 30 50 70 90
GaP
8
Figure 9. Reeling orientation.
Figure 10. Reel dimensions.
CATHODE SIDE
USER FEED DIRECTION
PRINTED LABEL
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020) 5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
9
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
Storage Condition:
5 to 30°C @ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been open for
more than 1 week
Baking recommended condition:
60 ± 5°C for 20 hours.
Figure 11. Tape dimensions.
Figure 12. Tape leader and trailer dimensions.
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (± 0.004) DIM. B
± 0.10 (± 0.004)PART NUMBER DIM. C
± 0.10 (± 0.004)
HSMx-C177 SERIES 2.40 (0.094) 1.60 (0.063) 0.65 (0.025)
HSMx-C197 SERIES 1.80 (0.071) 0.95 (0.037) 0.60 (0.024)
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Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes 5988-3043EN
January 27, 2002
5988-5501EN
