MCP1501 High-Precision Buffered Voltage Reference Features General Description * Maximum Temperature Coefficient: 50 ppm/C from -40C to +125C * Initial Accuracy: 0.1% * Operating Temperature Range: -40 to +125C * Low Typical Operating Current: 140 A * Line Regulation: 50 ppm/V Maximum * Load Regulation: 40 ppm/mA Maximum * 8 Voltage Variants Available: - 1.024V - 1.250V - 1.800V - 2.048V - 2.500V - 3.000V - 3.300V - 4.096V * Output Noise: 27 VRMS, 10 Hz to 10 kHz (1.024V) The MCP1501 is a buffered voltage reference capable of sinking and sourcing 20 mA of current. The voltage reference is a low-drift bandgap-based reference. The bandgap uses chopper-based amplifiers, effectively reducing the drift to zero. The MCP1501 is available in the following packages: * 6-Lead SOT-23 * 8-Lead SOIC * 8-Lead 2 mm x 2 mm WDFN Package Types MCP1501 6-Lead SOT-23 OUT 1 6 VDD GND 2 5 GND GND 3 4 SHDN Applications * * * * * Precision Data Acquisition Systems High-Resolution Data Converters Medical Equipment Applications Industrial Controls Battery-Powered Devices MCP1501 8-Lead SOIC VDD 1 8 FEEDBACK GND 2 7 OUT SHDN 3 6 GND GND 4 5 GND MCP1501 2x2 WDFN* VDD 1 GND 2 SHDN 3 GND 4 EP 9 8 FEEDBACK 7 OUT 6 GND 5 GND *Includes Exposed Thermal Pad (EP). See Table 3-1 2015-2017 Microchip Technology Inc. DS20005474E-page 1 MCP1501 BLOCK DIAGRAM VDD OUT FEEDBACK Shutdown Circuitry SHDN GND DS20005474E-page 2 2015-2017 Microchip Technology Inc. MCP1501 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings() VDD.............................................................................................................................................................................5.5V Maximum current into VDD pin ............................................................................................................................... 30 mA Clamp current, IK (VPIN < 0 or VPIN > VDD)........................................................................................................... 20 mA Maximum output current sunk by OUTPUT pin ......................................................................................................30 mA Maximum output current sourced by OUTPUT pin .................................................................................................30 mA (HBM:CDM:MM)................................................................................................................................ (2 kV:1.5 kV:200V) Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Electrical Characteristics: Unless otherwise specified, VDD(MIN) VDD 5.5V at -40C TA +125C. Characteristic Supply Voltage Power-on-Reset Release Voltage Power-on-Reset Rearm Voltage Output Voltage MCP1501-10 MCP1501-12 MCP1501-18 MCP1501-20 MCP1501-25 MCP1501-30 MCP1501-33 MCP1501-40 Temperature MCP1501-XX Coefficient Line Regulation Load Regulation Dropout Voltage Power Supply Rejection Ratio 2015-2017 Microchip Technology Inc. Sym. Min. Typ. Max. Units VDD VDD VDD VDD VDD VDD VDD VDD VPOR 1.65 1.65 2.0 2.25 2.70 3.2 3.5 4.3 -- -- -- -- -- -- -- -- -- 1.45 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 -- V V V V V V V V V -- -- 0.8 -- V VOUT 1.0230 1.2488 1.7982 2.0460 2.4975 2.9970 3.2967 4.0919 -- 1.0240 1.2500 1.800 2.0480 2.500 3.000 3.300 4.0960 10 1.0250 1.2513 1.8018 2.0500 2.5025 3.0030 3.3033 4.1001 50 V V V V V V V V ppm/C VOUT / VIN VOUT / IOUT -- 5 50 ppm/V VDO -- TC PSRR -- 10 ppm - 40 ppm - sink sink 15 ppm - 70 ppm - source source -- 200 94 dB Conditions MCP1501-10 MCP1501-12 MCP1501-18 MCP1501-20 MCP1501-25 MCP1501-30 MCP1501-33 MCP1501-40 ppm/mA -5 mA < ILOAD < +5 mA mV -5 mA < ILOAD < +2 mA 1.024V option, VIN = 5.5V, 60 Hz at 100 mVP-P DS20005474E-page 3 MCP1501 TABLE 1-1: DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise specified, VDD(MIN) VDD 5.5V at -40C TA +125C. Characteristic Sym. Shutdown VIL VIH Output Voltage Hysteresis Output Noise MCP1501-10 eN MCP1501-40 eN TABLE 1-2: ILOAD IDD MCP1501-10 MCP1501-20 MCP1501-40 Typ. Max. Units 1.35 3.80 300 V VOUT_HYST Maximum Load Current Supply Current Shutdown Current Min. VIN = 5.5V -- -- -- -- -- 14 27 20 110 20 -- -- -- -- -- VRMS -- -- 140 -- 205 185 185 550 350 A ISHDN Conditions VRMS mA nA Refer to Section 1.1.10 "Output Voltage Hysteresis" for additional details on testing conditions. 0.1 Hz to 10 Hz, TA = +25C 10 Hz to 10 kHz, TA = +25C 0.1 Hz to 10 Hz, TA = +25C 10 Hz to 10 kHz, TA = +25C TA = +25C 2.048V option No Load No Load, TA = +25C TA = +25C TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD, DVDD = 2.7 to 3.6V. Parameters Sym. Min. Typ. Max. Units Operating Temperature Range TA -40 -- +125 C Storage Temperature Range TA -65 -- +150 C Thermal Resistance for SOT-23-6 JA -- +190.5 -- C/W Thermal Resistance for SOIC-8 JA -- +149.5 -- C/W Thermal Resistance for DFN-8 JA -- +141.3 -- C/W Conditions Temperature Ranges Thermal Package Resistance DS20005474E-page 4 2015-2017 Microchip Technology Inc. MCP1501 1.1 Terminology 1.1.1 OUTPUT VOLTAGE Output voltage is the reference voltage that is available on the OUT pin. 1.1.2 INPUT VOLTAGE The input voltage (VIN) is the range of voltage that can be applied to the VDD pin and still have the device produce the designated output voltage on the OUT pin. 1.1.3 TEMPERATURE COEFFICIENT (TCOUT) The output temperature coefficient or voltage drift is a measure of how much the output voltage will vary from its initial value with changes in ambient temperature. The value specified in the electrical specifications is measured as shown in Equation 1-1. EQUATION 1-1: TCOUTPUT CALCULATION V OUT MAX - V OUT MIN 6 TC OUT = --------------------------------------------------------------------------- 10 ppm/ C T V OUT NOM Where: VOUT(MAX) = Maximum output voltage over the temperature range VOUT(MIN) = Minimum output voltage over the temperature range VOUT(NOM) = Average output voltage over the temperature range T = Temperature range over which the data was collected 1.1.4 DROPOUT VOLTAGE The dropout voltage is defined as the voltage difference between VDD and VOUT under load. Equation 1-2 is used to calculate the dropout voltage. EQUATION 1-2: V DO = V IN - V OUT | I OUT = Cons tan t 1.1.5 EQUATION 1-3: V OUT -------------------- 100% = % Line Regulation V IN Line regulation may also be expressed as %/V or in ppm/V, as shown in Equation 1-4 and Equation 1-5, respectively. EQUATION 1-4: V OUT ----------------------------------- V OUT NOM % ----------------------------------------- 100% = ----- Line Regulation V IN V EQUATION 1-5: V OUT ----------------------------------- V OUT NOM 6 ppm ----------------------------------------- 10 = ----------- Line Regulation V IN V As an example, if the MCP1501-20 is implemented in a design and a 2 V change in output voltage is measured from a 250 mV change on the input, then the error in percent, ppm, percent/volt, and ppm/volt, as shown in Equation 1-6 - Equation 1-9. EQUATION 1-6: V OUT 2 V -------------------- 100% ------------------ 100% = .0008% V 250 mV IN EQUATION 1-7: V OUT 6 6 2 V -------------------- 10 ------------------ 10 = 8 ppm 250 mV V IN EQUATION 1-8: 2 V - --------------- 2.048V -------------------- 100% = ----------------------- 100% = 0.000390625 % ---- V IN V 250 mV V OUT LINE REGULATION An ideal voltage reference will maintain a constant output voltage regardless of any changes to the input voltage. However, when real devices are considered, a small error may be measured on the output when an input voltage change occurs. EQUATION 1-9: 2 V - --------------- V OUT 2.048V 6 6 ppm ------------------- 10 = ----------------------- 10 = 3.90625 ----------- V IN V 250 mV Line regulation is defined as the change in output voltage (VOUT) as a function of a change in input voltage (VIN), and expressed as a percentage, as shown in Equation 1-3. 2015-2017 Microchip Technology Inc. DS20005474E-page 5 MCP1501 1.1.6 LOAD REGULATION An ideal voltage reference will maintain the specified output voltage regardless of the load's current demand. However, real devices experience a small error voltage that deviates from the specified output voltage when a load is present. Load regulation is defined as the voltage difference when under no load (VOUT @ IOUT|0) and under maximum load (VOUT @ IOUT|MAX), and is expressed as a percentage, as shown in Equation 1-10. EQUATION 1-10: V OUT @ I OUT|0 - V OUT @ I OUT|MAX -------------------------------------------------------------------------------------------------------------- 100% = % Load Regulation V OUT @ I OUT|0 Similar to line regulation, load regulation may also be expressed as %/mA or in ppm/mA as shown in Equation 1-11 and Equation 1-12, respectively. EQUATION 1-11: V OUT ----------------------------------- V OUT NOM % ----------------------------------------- 100% = -------- Load Regulation I OUT mA EQUATION 1-16: V OUT 10 V- ------------------------------------ --------------- V OUT NOM 2.048V 6 6 ------------------------------------------ 10 = ----------------------- 10 = 2.441 ppm ---------- I OUT mA 2 mA EQUATION 1-12: V OUT ----------------------------------- V OUT NOM 6 ppm ----------------------------------------- 10 = ----------- Load Regulation I OUT mA As an example, if the MCP1501-20 is implemented in a design and a 10 V change in output voltage is measured from a 2 mA change on the input, then the error in percent, ppm, percent/volt, ppm/volt, as shown in Equation 1-13 - Equation 1-16. EQUATION 1-13: 2.048V - 2.04799V--------------------------------------------- 100% = . 0004882% 2.04799V EQUATION 1-14: 6 6 2.048V - 2.04799V2.048V - 2.04799V --------------------------------------------- 10 = ----------------------------------------------- 10 = 4.882 ppm 2.04799V 2.04799V EQUATION 1-15: V OUT 10 V ------------------------------------ --------------- V OUT NOM 2.048V %------------------------------------------ 100% = ----------------------- 100% = 0.2441 ------2 mA I OUT mA DS20005474E-page 6 2015-2017 Microchip Technology Inc. MCP1501 1.1.7 INPUT CURRENT The input current (operating current) is the current that sinks from VIN to GND without a load current on the output pin. This current is affected by temperature, input voltage, output voltage, and the load current. 1.1.8 POWER SUPPLY REJECTION RATIO Power supply rejection ratio (PSRR) is a measure of the change in output voltage (VOUT) relative to the change in input voltage (VIN) over frequency. 1.1.9 LONG-TERM DRIFT The long-term output stability is measured by exposing the devices to an ambient temperature of +125C, as shown in Figure 2-18 while configured in the circuit shown in Figure 1-1. In this test, all electrical specifications of the devices are measured periodically at +25C. Power VIN GND FB VOUT Signal In FIGURE 1-1: 1.1.10 GND GND GND GND Long-Term Drift Test Circuit. OUTPUT VOLTAGE HYSTERESIS The output voltage hysteresis is a measure of the output voltage error after the powered devices are cycled over the entire operating temperature range. The amount of hysteresis can be quantified by measuring the change in the +25C output voltage after temperature excursions from +25C to +125C to +25C, and also from +25C to -40C to +25C. 2015-2017 Microchip Technology Inc. DS20005474E-page 7 MCP1501 2.0 TYPICAL OPERATING CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise specified, maximum values are: VDD(MIN) VDD 5.5V at -40C TA +125C. 40 1.024V 1.8V 2.5V 3.3V 35 Load Reg (ppm/mA) 4.098 Vout (V) 4.097 4.096 4.095 4.094 4.093 4.092 -40 5 25 85 30 1.25V 2.048V 3V 4.096V 25 20 15 10 5 125 0 Temperature (C) -40 FIGURE 2-1: VOUT vs. Temperature, No Load, 4.096V Option. 1.024V 2.5V 35 Load Reg (ppm/mA) 2.0485 Vout (V) 2.0475 2.047 2.0465 2.046 -40 5 25 85 125 1.25V 3V 1.8V 3.3V 2.048V 4.096V 30 25 20 15 10 5 0 Temperature (C) -40 FIGURE 2-2: VOUT vs. Temperature, No Load, 2.048V Option. 125 FIGURE 2-4: Load Regulation vs. Temperature, ILOAD 5mA Sink. 40 2.048 25 Temperature (C) 25 Temperature (C) 125 FIGURE 2-5: Load Regulation vs. Temperature, ILOAD 5mA Source. 300 1.0244 1.0242 250 1.024 IDD (A) Vout (V) V287 = 4.096V V287= 2.048V V287= 1.024V 275 1.0238 1.0236 1.0234 1.0232 225 200 175 1.023 -40 5 25 85 125 Temperature (C) FIGURE 2-3: VOUT vs. Temperature, No Load, 1.024V Option. DS20005474E-page 8 150 -40 FIGURE 2-6: Options. 5 25 Temperature (C) 85 125 IDD vs. Temperature, All 2015-2017 Microchip Technology Inc. MCP1501 450 260 Average +3 Sigma -3 Sigma 400 350 220 300 200 IDD (A) 250 200 150 180 160 140 100 120 50 IDD (A) 200 150 100 Average +3 Sigma -3 Sigma 50 Line Reg (ppm/V) 250 0 25 85 125 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 5.5 5 5.25 4.5 4.75 4.25 4 V287 = 1.024V V287 = 2.048V V287 = 3.3V -40 -25 -10 Temperature (C) FIGURE 2-8: IDD vs. Temperature for VOUT, 50 Units, No Load, 1.024V Option. FIGURE 2-11: Temperature. 5 20 35 50 65 Temperature (C) V287 = 1.25V V287 = 2.5V V287 = 4.096V 80 V287 = 1.8V V287 = 3.0V 95 110 125 Line Regulation vs. 1000 350 250 200 150 100 Average +3 Sigma -3 Sigma 50 0 4.3 4.45 4.6 4.75 4.9 5.05 5.2 5.5 VDD (V) FIGURE 2-9: IDD vs. VDD, VOUT = 4.096V, 50 Units, No Load. 2015-2017 Microchip Technology Inc. Noise Density (uV/rtHz) 300 IDD (A) 3.5 FIGURE 2-10: IDD vs. VDD, VOUT = 1.024V, 50 Units, No Load. 300 5 3 VDD (V) FIGURE 2-7: IDD vs. Temperature for VOUT, 50 Units, No Load, 4.096V Option. -40 3.75 125 3.25 85 2.5 5 25 Temperature (C) 2.75 -40 2 1.65 100 0 2.25 IDD (A) Average -3 Sigma +3 Sigma 240 1.024V 4.096V 100 10 1 0.1 0.01 0.1 10 1000 Frequency (Hz) 100000 FIGURE 2-12: Noise vs. Frequency, No Load, TA = +25C. DS20005474E-page 9 MCP1501 120 0.18 0.16 Percentage of Total Units PSRR (dB) 100 80 60 40 V287 = 1.024, V,1 = 1.65V V287 = 1.024V, V,1 = 5.5V V287 = 4.096V, V,1 = 4.3V V287 = 4.096V, V,1 = 5.5V 20 0 1 10 100 1000 Frequency (Hz) 10000 100000 FIGURE 2-13: PSRR vs. Frequency, No Load, TA = +25C. 0.1 0.08 0.06 0.04 0.02 0 1 0.16 100 0.14 60 40 V287 = 1.024V, V,1 = 1.65V V287 = 1.024V, V,1 = 5.5V V287 = 4.096V, V,1 = 4.3V V287 = 4.096V, V,1 = 5.5V 20 0 1 10 100 1000 Frequency (Hz) 10000 0.12 0.1 0.08 0.06 0.04 0.02 0 1 100000 FIGURE 2-14: PSRR vs. Frequency, 1 k Load, TA = +25C. 1 120 0.8 VOUT Drift (mV) 1.2 140 80 60 40 20 3 5 7 9 11 13 15 17 19 21 23 25 27 29 Temperature Coefficient (ppm/&) FIGURE 2-17: Tempco Distribution, No Load, TA = +25C, VDD = 5.5V, 50 Units. 160 100 3 5 7 9 11 13 15 17 19 21 23 25 27 29 Temperature Coefficient (ppm/&) FIGURE 2-16: Tempco Distribution, No Load, TA = +25C, VDD = 2.7V, 50 Units. Percentage of Total Units PSRR (dB) 0.12 120 80 Dropout Voltage (mV) 0.14 Average +3 Sigma -3 Sigma 0.6 0.4 0.2 0 -0.2 -0.4 0 -0.6 -5 -2 0 2 5 Load (mA) FIGURE 2-15: Dropout Voltage vs. Load, TA = +25C, 2.048V Option. DS20005474E-page 10 0 48 Time (Hrs) 1008 FIGURE 2-18: VOUT Drift vs. Time, TA = +25C, No Load, 800 Units. 2015-2017 Microchip Technology Inc. VOUT (V) MCP1501 2.0485 2.0484 2.0483 2.0482 2.0481 2.048 2.0479 2.0478 2.0477 2.0476 2.0475 VOUT 2V/div 500 s/div VIN 2V/div 500 s/div -20 -10 0 10 Conditions: 20 Load (mA) VOUT vs. Load, TA = +25C, FIGURE 2-19: 2.048V Option. FIGURE 2-22: Turn On Transient, VDD = 5/5V, VIN = 2.048V Option, No Load. Percentage of Total Units 0.7 VIN 1V/div 5 ms/div 0.6 QC +25C 0.5 QC -40C 0.4 QC +125C 0.3 VOUT 10 mV /div 5 ms/div 0.2 0.1 0 Conditions: VOUT (V) FIGURE 2-20: VOUT at VDDMIN, VDD = 2.7V, 800 Units, 2.5V Option, No Load. FIGURE 2-23: Line Transient, VDD = 5.5V, VIN = 500 mVPP @ 5VDC, 2.048V Option, No Load. Percentage of Total Units 0.7 0.6 QC +25C 0.5 QC -40C 0.4 IOUT 10 mA/div QC +125C 0.3 0.2 0.1 0 2.495 2.496 2.497 2.498 2.499 2.500 2.501 2.502 2.503 2.504 VOUT 500 mV/div 200 s/div VOUT (V) FIGURE 2-21: VOUT Distribution at VDDMAX, VDD = 5.5V, 800 Units, 2.5V Option, No Load. 2015-2017 Microchip Technology Inc. FIGURE 2-24: Load Transient, VDD = 5.5, VIN = 2.5, 2.048V Option. DS20005474E-page 11 MCP1501 3KDVH0DUJLQ 135 1 10 100 1 k 90 45 0 &DSDFLWLYH/RDG ) FIGURE 2-25: Option Unloaded. RISO vs. CLOAD, 4.096V 135 1 10 100 1 k Capactive Load 90 45 0 Phase Margin () FIGURE 2-26: Option Loaded. DS20005474E-page 12 RISO vs. CLOAD, 4.096V 2015-2017 Microchip Technology Inc. MCP1501 3.0 PIN FUNCTION TABLE The pin functions are described in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE SOT-23 SOIC 2 x 2 WDFN Symbol 1 7 7 OUT -- 8 8 FEEDBACK 2, 3, 5 2, 4, 5, 6 2, 4, 5, 6 GND 4 3 3 SHDN 6 1 1 VDD Power Supply Input -- -- 9 EP Exposed Thermal Pad 3.1 Function Buffered VREF Output Buffered VREF Feedback System Ground Shutdown Pin Active Low Buffered VREF Output (OUT) This is the Buffered Reference Output. On the WDFN and SOIC package, this should be connected to the FEEDBACK pin at the device. The output driver is tristated when in shutdown. 3.2 Buffered VREF Feedback (FEEDBACK) This is the buffer amplifier feedback pin. On the WDFN and SOIC package, this should be connected to the OUT pin at the device. This connection is internal on the SOT-23 package. Note that if there is routing impedance or IR-drop between the OUT and FEEDBACK pins, it is the FEEDBACK pin which accurately holds the output voltage. This can be used in an application to remove IR-drop effects on output voltage caused by the Printed Circuit Board (PCB) or interconnect resistance with a high-current load. 3.3 System Ground (GND) This is the power supply return and should be connected to system ground. 3.4 Shutdown Pin (SHDN) This is a digital input that will place the device in Shutdown. The device should be allowed to power up before using this feature. This pin is active low. 3.5 Power Supply Input (VDD) This power pin also serves as the input voltage for the voltage reference. Refer to the Electrical Tables to determine minimum voltage, based on the device. 3.6 Exposed Thermal Pad (EP) Not internally connected, but recommend grounding. 2015-2017 Microchip Technology Inc. DS20005474E-page 13 MCP1501 4.0 THEORY OF OPERATION The MCP1501 is a buffered voltage reference that is capable of operating over a wide input supply range while providing a stable output across the input supply range. The fundamental building block (see Block Diagram) of the MCP1501 is an internal bandgap reference circuit. As with all bandgap circuits, the internal reference sums together two voltages having an opposite temperature coefficient which allows a voltage reference that is practically independent from temperature. The bandgap of the MCP1501 is based on a second order temperature coefficient (TC) compensated bandgap circuit that allows the MCP1501 to achieve high initial accuracy and low temperature coefficient operation across supply and ambient temperature. The bandgap curvature compensation is determined during device characterization and is trimmed for optimal accuracy. The MCP1501 also includes a chopper-based amplifier architecture that ensures excellent low-noise operation, further reduces temperature dependent offsets that would otherwise increase the temperature coefficient of the MCP1501, and significantly improves long-term drift performance. Additional circuitry is included to eliminate the chopping frequency from the output of the device. After the bandgap voltage is compensated, it is amplified, buffered, and provided to the output drive circuit which has excellent performance when sinking or sourcing load currents (5 mA). DS20005474E-page 14 2015-2017 Microchip Technology Inc. MCP1501 5.0 APPLICATION CIRCUITS 5.1 Application Tips 5.1.1 BASIC APPLICATION CIRCUIT Figure 5-1 illustrates a basic circuit configuration of the MCP1501. 1.65 - 5.5V 1 VDD FEEDBACK 8 2 GND OUT 7 3 SHDN GND 6 4 GND GND 5 OUT 300 SF 0.1 - 2.2 F SOIC-8/DFN-8 FIGURE 5-1: Basic Circuit Configuration. An output capacitor is not required for stability of the voltage reference, but may be optionally added to provide noise filtering or act as a charge-reservoir for switching loads, e.g., successive approximation register (SAR) analog-to-digital converter (ADC). As shown, the input voltage is connected to the device at the VIN input, with an optional 2.2 f ceramic capacitor. This capacitor would be required if the input voltage has excessive noise. A 2.2 f capacitor would reject input voltage noise at approximately 1 to 2 MHz. Noise below this frequency will be amply rejected by the input voltage rejection of the voltage reference. Noise at frequencies above 2 MHz will be beyond the bandwidth of the voltage reference and, consequently, not transmitted from the input pin through the device to the output. If the noise at the output of these voltage references is too high for the particular application, it can be easily filtered with an external RC filter and op-amp buffer (see Figure 5-2). RFIL Output of V REF CFIL FIGURE 5-2: Filter. Output Noise-Reducing 2015-2017 Microchip Technology Inc. DS20005474E-page 15 MCP1501 The RC filter values are selected for a desired cutoff frequency, as shown in Equation 5-1. EQUATION 5-1: 1 f C = --------------------------------------2 R FIL C FIL The values that are shown in Figure 5-2 (10 k and 1 F) will create a first-order, low-pass filter at the output of the amplifier. The cutoff frequency of this filter is 15.9 Hz, and the attenuation slope is 20 dB/decade. The MCP6021 amplifier isolates the loading of this lowpass filter from the remainder of the application circuit. This amplifier also provides additional drive, with a faster response time than the voltage reference. 5.1.2 LOAD CAPACITOR The maximum capacitive load is 300 pF. However, larger capacitors may be implemented if a resistor is used in series with a larger load capacitor. Refer to Figure 2-25 and Figure 2-26 to ensure adequate phase margin when selecting a resistor/capacitor combination. 5.1.3 PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS Mechanical stress due to Printed Circuit Board (PCB) mounting can cause the output voltage to shift from its initial value. Devices in the SOT-23-6 package are generally more prone to assembly stress than devices in the WDFN package. To reduce stress-related output voltage shifts, mount the reference on low-stress areas of the PCB (i.e., away from PCB edges, screw holes and large components). DS20005474E-page 16 2015-2017 Microchip Technology Inc. MCP1501 5.2 5.2.1 Since the noninverting input of the amplifier is biased to ground, the inverting input will also be close to ground potential. The second 10 kresistor is placed around the feedback loop of the amplifier. Since the inverting input of the amplifier is high-impedance, the current generated through R1 will also flow through R2. As a consequence, the output voltage of the amplifier is equal to -2.5V for the MCP1501-25 and -4.096V for the MCP1501-40. Typical Applications Circuits NEGATIVE VOLTAGE REFERENCE A negative voltage reference can be generated using any of the devices in the MCP1501 family. A typical application is shown in Figure 5-3. In this circuit, the voltage inversion is implemented using the MCP6061 and two equal resistors. The voltage at the output of the MCP1501 voltage reference drives R1, which is connected to the inverting input of the MCP6061 amplifier. MCP1501-;; 2.7 - 5.5V 10 k 0.1% 1 VDD FEEDBACK 8 2 GND OUT 7 3 SHDN GND 6 4 GND GND 5 10 k 0.1% -2.500V 2.2 F + 1 nF -5V MCP6061 FIGURE 5-3: 5.2.2 Negative Voltage Reference. A/D CONVERTER REFERENCE The MCP1501 product family was carefully designed to provide a precision, low noise voltage reference for the Microchip families of ADCs. The circuit shown in Figure 5-4 shows a MCP1501-25 configured to provide the reference to the MCP3201, a 12-bit ADC. 1 VDD FEEDBACK 8 2 GND OUT 7 3 SHDN GND 6 4 GND GND 5 50 MCP1501-;; 5.0V 2.2 F 2.2 F 5.0V VREF VIN IN+ MCP3201 0.1 F 10 F IN- FIGURE 5-4: ADC Example Circuit. 2015-2017 Microchip Technology Inc. DS20005474E-page 17 MCP1501 MCP1501-25 5.0V FEEDBACK 10 VDD GND OUT SHDN GND GND GND 10 k 2.2 F 2.2 F (Ta) 5.0V VIN IN+ 14/16-bit SAR ADC IN- FIGURE 5-5: 0.1 F 10 F SAR ADC Example Circuit. The circuit shown in Figure 5-5 shows a MCP1501-25 configured to provide the reference to a 14-bit or 16-bit SAR ADC. DS20005474E-page 18 2015-2017 Microchip Technology Inc. MCP1501 6.0 PACKAGE INFORMATION 6.1 Package Markings Example 6-Lead SOT-23 Device XXXXY XXNN WWNNN Code MCP1501T-10E/CHY AABTY MCP1501T-12E/CHY AABUY MCP1501T-18E/CHY AABVY MCP1501T-20E/CHY AABWY MCP1501T-25E/CHY AABXY MCP1501T-30E/CHY AABYY MCP1501T-33E/CHY AABZY MCP1501T-40E/CHY AACAY 8-Lead SOIC Example Device MCP1501T-10E/SN NNN Code 150110 MCP1501T-12E/SN 150112 MCP1501-18E/SN 150118 MCP1501-20E/SN 150120 MCP1501T-25E/SN 150125 MCP1501T-30E/SN 150130 MCP1501T-33E/SN 150133 MCP1501T-40E/SN 150140 8-Lead WDFN (2 x2 mm) Legend: XX...X Y YY WW NNN e3 * Note: AABTY 50256 150110 SN^^^1550 e3 256 Example Device Code MCP1501T-10E/RW AAQ MCP1501T-12E/RW AAR MCP1501-18E/RW AAS MCP1501-20E/RW AAT MCP1501T-25E/RW AAU MCP1501T-30E/RW AAV MCP1501T-33E/RW AAW MCP1501T-40E/RW AAX AAQ 256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC(R) designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2015-2017 Microchip Technology Inc. DS20005474E-page 19 MCP1501 6-Lead Plastic Small Outline Transistor (CH, CHY) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.15 C A-B D e1 A D E 2 E1 E E1 2 2X 0.15 C D 2X 0.20 C A-B e 6X b B 0.20 C A-B D TOP VIEW C A A2 SEATING PLANE 6X A1 0.10 C SIDE VIEW R1 L2 R c GAUGE PLANE L (L1) END VIEW Microchip Technology Drawing C04-028C (CH) Sheet 1 of 2 DS20005474E-page 20 2015-2017 Microchip Technology Inc. MCP1501 6-Lead Plastic Small Outline Transistor (OT, OTY) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits N Number of Leads e Pitch Outside lead pitch e1 Overall Height A Molded Package Thickness A2 Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Foot Length L Footprint L1 Seating Plane to Gauge Plane L1 Foot Angle c Lead Thickness Lead Width b MIN 0.90 0.89 0.00 0.30 0 0.08 0.20 MILLIMETERS NOM 6 0.95 BSC 1.90 BSC 1.15 2.80 BSC 1.60 BSC 2.90 BSC 0.45 0.60 REF 0.25 BSC - MAX 1.45 1.30 0.15 0.60 10 0.26 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-028C (OT) Sheet 2 of 2 2015-2017 Microchip Technology Inc. DS20005474E-page 21 MCP1501 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A-B D A D NOTE 5 N E 2 E1 2 E1 E NOTE 1 2 1 e B NX b 0.25 C A-B D NOTE 5 TOP VIEW 0.10 C C A A2 SEATING PLANE 8X A1 SIDE VIEW 0.10 C h R0.13 h R0.13 H SEE VIEW C VIEW A-A 0.23 L (L1) VIEW C Microchip Technology Drawing No. C04-057-SN Rev D Sheet 1 of 2 DS20005474E-page 22 2015-2017 Microchip Technology Inc. MCP1501 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Molded Package Thickness A2 Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Chamfer (Optional) h Foot Length L L1 Footprint Foot Angle c Lead Thickness b Lead Width Mold Draft Angle Top Mold Draft Angle Bottom MIN 1.25 0.10 0.25 0.40 0 0.17 0.31 5 5 MILLIMETERS NOM 8 1.27 BSC 6.00 BSC 3.90 BSC 4.90 BSC 1.04 REF - MAX 1.75 0.25 0.50 1.27 8 0.25 0.51 15 15 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 5. Datums A & B to be determined at Datum H. Microchip Technology Drawing No. C04-057-SN Rev D Sheet 2 of 2 2015-2017 Microchip Technology Inc. DS20005474E-page 23 MCP1501 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging SILK SCREEN C Y1 X1 E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 MIN MILLIMETERS NOM 1.27 BSC 5.40 MAX 0.60 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2057-SN Rev B DS20005474E-page 24 2015-2017 Microchip Technology Inc. MCP1501 8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (RW) - 2x2 mm Body [WDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.05 C 1 2X 2 TOP VIEW 0.05 C 0.05 C C (A3) A SEATING PLANE SIDE VIEW A1 0.05 C D2 2X CH 1 2 NOTE 1 0.05 C A B E2 (K) L N 8X b e BOTTOM VIEW 0.10 0.05 C A B C Microchip Technology Drawing C04-261A Sheet 1 of 2 2015-2017 Microchip Technology Inc. DS20005474E-page 25 MCP1501 8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (RW) - 2x2 mm Body [WDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Terminals N e Pitch Overall Height A Standoff A1 (A3) Terminal Thickness Overall Width E Exposed Pad Width E2 Overall Length D Exposed Pad Length D2 Exposed Pad Chamfer CH Terminal Width b Terminal Length L (K) Terminal-to-Exposed-Pad MIN 0.70 0.00 0.70 1.10 0.20 0.25 0.30 MILLIMETERS NOM 8 0.50 BSC 0.75 0.02 0.10 REF 2.00 BSC 0.80 2.00 BSC 1.20 0.25 0.25 0.30 - MAX 0.80 0.05 0.90 1.30 0.30 0.35 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-261A Sheet 2 of 2 DS20005474E-page 26 2015-2017 Microchip Technology Inc. MCP1501 8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (RW) - 2x2 mm Body [WDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging C 2X CH OV 8 1 2 E X2 X1 G SILK SCREEN (G2) Y2 Y1 RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Optional Center Pad Width Y2 Optional Center Pad Length X2 Contact Pad Spacing C Center Pad Chamfer CH Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 Contact Pad to Contact Pad (X6) G1 Contact Pad to Center Pad (X8) G1 Thermal Via Diameter V MIN MILLIMETERS NOM 0.50 BSC MAX 0.90 1.30 2.10 0.28 0.30 0.70 0.20 0.25 REF 0.30 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerances, for reference only. Microchip Technology Drawing C04-2261A 2015-2017 Microchip Technology Inc. DS20005474E-page 27 MCP1501 NOTES: DS20005474E-page 28 2015-2017 Microchip Technology Inc. MCP1501 APPENDIX A: REVISION HISTORY Revision E (August 2017) Revision A (December 2015) The following is the list of modifications: Original Release of this Document. * Updated Features. * Updated Package Types. * Updated Section 1.0, Electrical Characteristics, Table 1-1. * Updated Figure 2-12, Figure 2-20 and Figure 2-21. * Updated Table 3-1. * Updated Section 3.4, Shutdown Pin (SHDN). * Updated Section 5.1.2, LOAD CAPACITOR. * Corrected Figure 5-3 and Figure 5-4. * Added Figure 5-5. * Minor typographical corrections. Revision D (March 2017) The following is the list of modifications: * Updated Table 1-1. * Updated Equation 1-1, Equation 1-4, Equation 1-5, Equation 1-10, Equation 1-11, Equation 1-12 and Equation 1-16. * Updated Figure 2-11, Figure 2-20, Figure 2-21, Figure 2-25 and Figure 2-26. * Updated Figure 5-1 and Figure 5-4. * Updated "Product Identification System" section. * Minor typographical corrections. Revision C (May 2016) The following is the list of modifications: * Updated Section 1.0, Electrical Characteristics, Section 4.0, Theory of Operation, Section 5.0, Application Circuits. * Updated Features section, General Description section, Section 3.1, Buffered VREF Output (OUT). * Updated"Product Identification System" section. * Updated Figure 2-12, Figure 2-20, Figure 2-21, Figure 5-1 and Figure 5-4. * Updated Equation 1-10 and Equation 1-16. * Minor typographical corrections. Revision B (January 2016) The following is the list of modifications: * Updated Section 6.0, Package Information. * Updated "Product Identification System" section. * Minor typographical corrections. 2015-2017 Microchip Technology Inc. DS20005474E-page 29 MCP1501 NOTES: DS20005474E-page 30 2015-2017 Microchip Technology Inc. MCP1501 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO.Device Tape and Reel X Output Voltage Option /XX Package Device: MCP1501 - 50 ppm maximum thermal drift buffered reference Tape and Reel Option: Blank = Standard packaging (tube or tray) T = Tape and Reel (1) Output Voltage Option: 10 12 18 20 25 30 33 40 = = = = = = = = 1.024V 1.200V 1.800V 2.048V 2.500V 3.000V 3.300V 4.096V Package: CHY* SN = = RW = 6-Lead Plastic Small Outline Transistor (SOT-23) 8-Lead Plastic Small Outline - Narrow, 3.90 mm Body (SOIC) 8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package - 2 x 2 mm Body (WDFN) *Y = Nickel palladium gold manufacturing designator. Only available on the SOT-23 package. 2015-2017 Microchip Technology Inc. Examples: a) MCP1501T-10E/CHY: 1.024V, 6-lead SOT-23 package, Tape and Reel b) MCP1501-12E/SN: 1.2V, 8-lead SOIC package c) MCP1501T-18E/SN: 1.8V, 8-lead SOIC package, Tape and Reel d) MCP1501T-20E/RW: 2.048V, 8-lead WDFN package, Tape and Reel Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip sales office for package availability for the Tape and Reel option. DS20005474E-page 31 MCP1501 NOTES: DS20005474E-page 32 2015-2017 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2015-2017 Microchip Technology Inc. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2015-2017, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-2100-9 DS20005474E-page 33 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 Finland - Espoo Tel: 358-9-4520-820 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Austin, TX Tel: 512-257-3370 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 DS20005474E-page 34 China - Dongguan Tel: 86-769-8702-9880 China - Guangzhou Tel: 86-20-8755-8029 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-3326-8000 Fax: 86-21-3326-8021 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 France - Saint Cloud Tel: 33-1-30-60-70-00 India - Pune Tel: 91-20-3019-1500 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Germany - Heilbronn Tel: 49-7131-67-3636 Germany - Karlsruhe Tel: 49-721-625370 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Germany - Rosenheim Tel: 49-8031-354-560 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Taiwan - Kaohsiung Tel: 886-7-213-7830 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Israel - Ra'anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7289-7561 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 2015-2017 Microchip Technology Inc. 11/07/16