2015-2017 Microchip Technology Inc. DS20005474E-page 1
MCP1501
Features
• Maximum Temperature Coefficient: 50 ppm/°C
from –40°C to +125°C
• Initial Accuracy: 0.1%
• Operating Temperature Range: –40 to +125°C
• Low Typical Operating Current: 140 μA
• Line Regulation: 50 ppm/V Maximum
• Load Regulation: 40 ppm/mA Maximum
• 8 Voltage Variants Available:
- 1.024V
- 1.250V
- 1.800V
- 2.048V
- 2.500V
- 3.000V
- 3.300V
- 4.096V
• Output Noise: 27 µVRMS, 10 Hz to 10 kHz
(1.024V)
Applications
• Precision Data Acquisition Systems
• High-Resolution Data Converters
• Medical Equipment Applications
• Industrial Controls
• Battery-Powered Devices
General Description
The MCP1501 is a buffered voltage reference capable
of sinking and sourcing 20 mA of current. The voltage
reference is a low-drift bandgap-based reference. The
bandgap uses chopper-based amplifiers, effectively
reducing the drift to zero.
The MCP1501 is available in the following packages:
• 6-Lead SOT-23
• 8-Lead SOIC
• 8-Lead 2mmx2mm WDFN
Package Types
4
1
2
3
6VDD
SHDN
OUT
GND
GND
5GND
MCP1501
6-Lead SOT-23
FEEDBACK
GND
VDD
GND
SHDN
OUT
MCP1501
8-Lead SOIC
GND GND
MCP1501
2x2 WDFN*
SHDN
GND
GND
OUT
GND
1
2
3
4
8
7
6
5GND
FEEDBACKVDD
EP
9
*Includes Exposed Thermal Pad (EP). See Ta ble 3- 1
8
7
6
5
1
2
3
4
High-Precision Buffered Voltage Reference
MCP1501
DS20005474E-page 2 2015-2017 Microchip Technology Inc.
BLOCK DIAGRAM
Shutdown
Circuitry
Σ OUT
FEEDBACK
SHDN
GND
VDD
2015-2017 Microchip Technology Inc. DS20005474E-page 3
MCP1501
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†)
VDD.............................................................................................................................................................................5.5V
Maximum current into VDD pin ............................................................................................................................... 30 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD)...........................................................................................................±20 mA
Maximum output current sunk by OUTPUT pin ......................................................................................................30 mA
Maximum output current sourced by OUTPUT pin .................................................................................................30 mA
(HBM:CDM:MM)................................................................................................................................ (2 kV:±1.5 kV:200V)
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1: DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise specified, VDD(MIN) VDD 5.5V at –40C TA +125C.
Characteristic Sym. Min. Typ. Max. Units Conditions
Supply Voltage VDD 1.65 — 5.5 V MCP1501-10
VDD 1.65 — 5.5 V MCP1501-12
VDD 2.0 — 5.5 V MCP1501-18
VDD 2.25 — 5.5 V MCP1501-20
VDD 2.70 — 5.5 V MCP1501-25
VDD 3.2 — 5.5 V MCP1501-30
VDD 3.5 — 5.5 V MCP1501-33
VDD 4.3 — 5.5 V MCP1501-40
Power-on-Reset
Release Voltage
VPOR —1.45 — V
Power-on-Reset
Rearm Voltage
——0.8—V
Output Voltage MCP1501-10 VOUT 1.0230 1.0240 1.0250 V
MCP1501-12 1.2488 1.2500 1.2513 V
MCP1501-18 1.7982 1.800 1.8018 V
MCP1501-20 2.0460 2.0480 2.0500 V
MCP1501-25 2.4975 2.500 2.5025 V
MCP1501-30 2.9970 3.000 3.0030 V
MCP1501-33 3.2967 3.300 3.3033 V
MCP1501-40 4.0919 4.0960 4.1001 V
Temperature
Coefficient
MCP1501-XX TC— 10 50 ppm/C
Line
Regulation
VOUT /
VIN
— 5 50 ppm/V
Load
Regulation
VOUT /
IOUT
— 10 ppm –
sink
15 ppm –
source
40 ppm –
sink
70 ppm –
source
ppm/mA –5 mA < ILOAD <+5mA
Dropout
Voltage
VDO ——200mV–5mA<I
LOAD <+2mA
Power Supply
Rejection
Ratio
PSRR 94 dB 1.024V option, VIN =5.5V,
60 Hz at 100 mVP-P
MCP1501
DS20005474E-page 4 2015-2017 Microchip Technology Inc.
Shutdown VIL 1.35 VIN =5.5V
VIH 3.80
Output Voltage
Hysteresis
∆VOUT_HYST 300 µV Refer to Section 1.1.10
“Output Voltage
Hysteresis” for additional
details on testing conditions.
Output Noise MCP1501-10 eN— 14 — µVRMS 0.1 Hz to 10 Hz, TA=+25C
— 27 — 10 Hz to 10 kHz, TA=+25C
MCP1501-40 eN— 20 — µVRMS 0.1 Hz to 10 Hz, TA=+25C
— 110 — 10 Hz to 10 kHz, TA=+25C
Maximum
Load Current
ILOAD —±20 — mAT
A= +25°C
2.048V option
Supply
Current
IDD — 140 550 µA No Load
— — 350 No Load, TA=+25°C
Shutdown
Current
MCP1501-10 ISHDN 205 nA TA= +25°C
MCP1501-20 185
MCP1501-40 185
TABLE 1-1: DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise specified, VDD(MIN) VDD 5.5V at –40C TA +125C.
Characteristic Sym. Min. Typ. Max. Units Conditions
TABLE 1-2: TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD, DVDD = 2.7 to 3.6V.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operating Temperature Range TA–40 — +125 °C
Storage Temperature Range TA–65 — +150 °C
Thermal Package Resistance
Thermal Resistance for SOT-23-6 JA — +190.5 — °C/W
Thermal Resistance for SOIC-8 JA — +149.5 — °C/W
Thermal Resistance for DFN-8 JA — +141.3 — °C/W
2015-2017 Microchip Technology Inc. DS20005474E-page 5
MCP1501
1.1 Terminology
1.1.1 OUTPUT VOLTAGE
Output voltage is the reference voltage that is available
on the OUT pin.
1.1.2 INPUT VOLTAGE
The input voltage (VIN) is the range of voltage that can
be applied to the VDD pin and still have the device
produce the designated output voltage on the OUT pin.
1.1.3 TEMPERATURE COEFFICIENT
(TCOUT)
The output temperature coefficient or voltage drift is a
measure of how much the output voltage will vary from
its initial value with changes in ambient temperature.
The value specified in the electrical specifications is
measured as shown in Equation 1-1.
EQUATION 1-1: TCOUTPUT CALCULATION
1.1.4 DROPOUT VOLTAGE
The dropout voltage is defined as the voltage difference
between VDD and VOUT under load. Equation 1-2 is
used to calculate the dropout voltage.
EQUATION 1-2:
1.1.5 LINE REGULATION
An ideal voltage reference will maintain a constant out-
put voltage regardless of any changes to the input volt-
age. However, when real devices are considered, a
small error may be measured on the output when an
input voltage change occurs.
Line regulation is defined as the change in output volt-
age (VOUT) as a function of a change in input voltage
(VIN), and expressed as a percentage, as shown in
Equation 1-3.
EQUATION 1-3:
Line regulation may also be expressed as %/V or in
ppm/V, as shown in Equation 1-4 and Equation 1-5,
respectively.
EQUATION 1-4:
EQUATION 1-5:
As an example, if the MCP1501-20 is implemented in a
design and a 2 µV change in output voltage is mea-
sured from a 250 mV change on the input, then the
error in percent, ppm, percent/volt, and ppm/volt, as
shown in Equation 1-6 –Equation 1-9.
EQUATION 1-6:
EQUATION 1-7:
EQUATION 1-8:
EQUATION 1-9:
TCOUT
VOUT MAX
VOUT MIN
–
TV
OUT NOM
---------------------------------------------------------------------------106ppm/
C
=
Where:
VOUT(MAX) = Maximum output voltage over the
temperature range
VOUT(MIN) = Minimum output voltage over the
temperature range
VOUT(NOM) = Average output voltage over the
temperature range
T = Temperature range over which the
data was collected
VDO V
IN VOUT | IOUT Cons ttan=–=
VOUT
VIN
-------------------- 100%
% Line Regulation=
VOUT
VOUT NOM
-----------------------------------
VIN
----------------------------------------- 100%
%
V
----- Line Regulation=
VOUT
VOUT NOM
-----------------------------------
VIN
----------------------------------------- 106
ppm
V
----------- Line Regulation=
VOUT
VIN
-------------------- 100%
2
V
250 mV
------------------ 100%
.0008%=
VOUT
VIN
-------------------- 106
2
V
250 mV
------------------ 106
8 ppm=
VOUT
VIN
-------------------- 100%
2
V
2.048V
-----------------
250 mV
-----------------------
100%
0.000390625
%
V
-----
==
VOUT
VIN
-------------------- 106
2
V
2.048V
-----------------
250 mV
-----------------------
106
3.90625 ppm
V
------------
==
MCP1501
DS20005474E-page 6 2015-2017 Microchip Technology Inc.
1.1.6 LOAD REGULATION
An ideal voltage reference will maintain the specified
output voltage regardless of the load's current demand.
However, real devices experience a small error voltage
that deviates from the specified output voltage when a
load is present.
Load regulation is defined as the voltage difference
when under no load (VOUT @ IOUT|0) and under maxi-
mum load (VOUT @ IOUT|MAX), and is expressed as a
percentage, as shown in Equation 1-10.
EQUATION 1-10:
Similar to line regulation, load regulation may also be
expressed as %/mA or in ppm/mA as shown in
Equation 1-11 and Equation 1-12, respectively.
EQUATION 1-11:
EQUATION 1-12:
As an example, if the MCP1501-20 is implemented in a
design and a 10 µV change in output voltage is mea-
sured from a 2 mA change on the input, then the error
in percent, ppm, percent/volt, ppm/volt, as shown in
Equation 1-13 –Equation 1-16.
EQUATION 1-13:
EQUATION 1-14:
EQUATION 1-15:
EQUATION 1-16:
VOUT @ IOUT|0 VOUT @ IOUT|MAX –
VOUT @ IOUT|0
-------------------------------------------------------------------------------------------------------------- 100%
% Load Regulation=
VOUT
VOUT NOM
-----------------------------------
IOUT
----------------------------------------- 100%
%
mA
-------- Load Regulation=
VOUT
VOUT NOM
-----------------------------------
IOUT
----------------------------------------- 106
ppm
mA
----------- Load Regulation=
2.048V 2.04799V–
2.04799V
-----------------------------------------------100% .=
0004882%
2.048V 2.04799V–
2.04799V
-----------------------------------------------1062.048V 2.04799V–
2.04799V
----------------------------------------------- 106
=
4.882 ppm=
VOUT
VOUT NOM
------------------------------------
IOUT
------------------------------------------ 100%
10
V
2.048V
-----------------
2 mA
-----------------------
100%
0.2441
%
mA
--------
==
VOUT
VOUT NOM
------------------------------------
IOUT
------------------------------------------ 106
10
V
2.048V
-----------------
2 mA
-----------------------
106
2.441
ppm
mA
-----------
==
2015-2017 Microchip Technology Inc. DS20005474E-page 7
MCP1501
1.1.7 INPUT CURRENT
The input current (operating current) is the current that
sinks from VIN to GND without a load current on the
output pin. This current is affected by temperature,
input voltage, output voltage, and the load current.
1.1.8 POWER SUPPLY REJECTION
RATIO
Power supply rejection ratio (PSRR) is a measure of
the change in output voltage (∆VOUT) relative to the
change in input voltage (∆VIN) over frequency.
1.1.9 LONG-TERM DRIFT
The long-term output stability is measured by exposing
the devices to an ambient temperature of +125°C, as
shown in Figure 2-18 while configured in the circuit
shown in Figure 1-1. In this test, all electrical specifica-
tions of the devices are measured periodically at
+25°C.
FIGURE 1-1: Long-Term Drift Test Circuit.
1.1.10 OUTPUT VOLTAGE HYSTERESIS
The output voltage hysteresis is a measure of the out-
put voltage error after the powered devices are cycled
over the entire operating temperature range. The
amount of hysteresis can be quantified by measuring
the change in the +25°C output voltage after tempera-
ture excursions from +25°C to +125°C to +25°C, and
also from +25°C to –40°C to +25°C.
VIN
GND
GND
GND GND
GND
FB
VOUT
Power
Signal In
MCP1501
DS20005474E-page 8 2015-2017 Microchip Technology Inc.
2.0 TYPIC AL OPERATING CURVES
Note: Unless otherwise specified, maximum values are: VDD(MIN) VDD 5.5V at –40C TA +125C.
FIGURE 2-1: VOUT vs. Temperature, No
Load, 4.096V Option.
FIGURE 2-2: VOUT vs. Temperature, No
Load, 2.048V Option.
FIGURE 2-3: VOUT vs. Temperature, No
Load, 1.024V Option.
FIGURE 2-4: Load Regulation vs.
Temperature, ILOAD 5mA Sink.
FIGURE 2-5: Load Regulation vs.
Temperature, ILOAD 5mA Source.
FIGURE 2-6: IDD vs. Temperature, All
Options.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
4.092
4.093
4.094
4.095
4.096
4.097
4.098
-40 5 25 85 125
Vout (V)
Temperature (°C)
2.046
2.0465
2.047
2.0475
2.048
2.0485
-40 5 25 85 125
Vout (V)
Temperature (°C)
1.023
1.0232
1.0234
1.0236
1.0238
1.024
1.0242
1.0244
-40 5 25 85 125
Vout (V)
Temperature (°C)
0
5
10
15
20
25
30
35
40
-40 25 125
Load Reg (ppm/mA)
Temperature (°C)
1.024V 1.25V
1.8V
2.048V
2.5V 3V
3.3V
4.096V
0
5
10
15
20
25
30
35
40
-40 25 125
Load Reg (ppm/mA)
Temperature (°C)
1.024V 1.25V 1.8V
2.048V
2.5V 3V 3.3V
4.096V
150
175
200
225
250
275
300
-40 5 25 85 125
I
DD
(µA)
Temperature (°C)
V287 = 4.096V
V287= 2.048V
V287= 1.024V
2015-2017 Microchip Technology Inc. DS20005474E-page 9
MCP1501
FIGURE 2-7: IDD vs. Temperature for
VOUT, 50 Units, No Load, 4.096V Option.
FIGURE 2-8: IDD vs. Temperature for
VOUT, 50 Units, No Load, 1.024V Option.
FIGURE 2-9: IDD vs. VDD, VOUT = 4.096V,
50 Units, No Load.
FIGURE 2-10: IDD vs. VDD, VOUT = 1.024V,
50 Units, No Load.
FIGURE 2-11: Line Regulation vs.
Temperature.
FIGURE 2-12: Noise vs. Frequency, No
Load, TA = +25°C.
0
50
100
150
200
250
300
350
400
450
-40 5 25 85 125
I
DD
(µA)
Temperature (°C)
Average
+3 Sigma
-3 Sigma
0
50
100
150
200
250
300
-40 5 25 85 125
I
DD
(µA)
Temperature (°C)
Average
+3 Sigma
-3 Sigma
0
50
100
150
200
250
300
350
4.3 4.45 4.6 4.75 4.9 5.05 5.2
5.5
I
DD
(µA)
VDD (V)
Average
+3 Sigma
-3 Sigma
100
120
140
160
180
200
220
240
260
1.65
2
2.25
2.5
2.75
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
I
DD
(µA)
VDD (V)
Average
-3 Sigma
+3 Sigma
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
-40 -25 -10 5 20 35 50 65 80 95 110
125
Line Reg (ppm/V)
Temperature (°C)
V
287
= 1.8V
V
287
= 3.0V
V
287
= 1.024V
V
287
= 2.048V
V
287
= 3.3V
V
287
= 1.25V
V
287
= 2.5V
V
287
= 4.096V
0.01
0.1
1
10
100
1000
0.1 10 1000
100000
Noise Density (uV/rtHz)
Frequency (Hz)
1.024V
4.096V
MCP1501
DS20005474E-page 10 2015-2017 Microchip Technology Inc.
FIGURE 2-13: PSRR vs. Frequency, No
Load, TA = +25°C.
FIGURE 2-14: PSRR vs. Frequency, 1 kΩ
Load, TA = +25°C.
FIGURE 2-15: Dropout Voltage vs. Load,
TA = +25°C, 2.048V Option.
FIGURE 2-16: Tempco Distribution, No
Load, TA = +25°C, VDD = 2.7V, 50 Units.
FIGURE 2-17: Tempco Distribution, No
Load, TA = +25°C, VDD = 5.5V, 50 Units.
FIGURE 2-18: VOUT Drift vs. Time,
TA = +25°C, No Load, 800 Units.
0
20
40
60
80
100
120
1 10 100 1000 10000
100000
PSRR (dB)
Frequency (Hz)
V287 = 1.024, V,1 = 1.65V
V287 = 1.024V, V,1 = 5.5V
V287 = 4.096V, V,1 = 4.3V
V287 = 4.096V, V,1 = 5.5V
0
20
40
60
80
100
120
1 10 100 1000 10000
100000
PSRR (dB)
Frequency (Hz)
V287 = 1.024V, V,1 = 1.65V
V287 = 1.024V, V,1 = 5.5V
V287 = 4.096V, V,1 = 4.3V
V287 = 4.096V, V,1 = 5.5V
0
20
40
60
80
100
120
140
160
-5 -2 0 2 5
Dropout Voltage (mV)
Load (mA)
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
1 3 5 7 9 111315171921232527
29
Percentage of Total Units
Temperature Coefficient (ppm/&)
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
13579111315171921232527
29
Percentage of Total Units
Temperature Coefficient (ppm/&)
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1
1.2
0481008
V
OUT
Drift (mV)
Time (Hrs)
Average
+3 Sigma
-3 Sigma
2015-2017 Microchip Technology Inc. DS20005474E-page 11
MCP1501
FIGURE 2-19: VOUT vs. Load, TA = +25°C,
2.048V Option.
FIGURE 2-20: VOUT at VDDMIN,
VDD = 2.7V, 800 Units, 2.5V Option, No Load.
FIGURE 2-21: VOUT Distribution at
VDDMAX, VDD = 5.5V, 800 Units, 2.5V Option, No
Load.
FIGURE 2-22: Turn On Transient,
VDD = 5/5V, VIN = 2.048V Option, No Load.
FIGURE 2-23: Line Transient, VDD = 5.5V,
VIN = 500 mVPP @ 5VDC, 2.048V Option, No
Load.
FIGURE 2-24: Load Transient, VDD = 5.5,
VIN = 2.5, 2.048V Option.
2.0475
2.0476
2.0477
2.0478
2.0479
2.048
2.0481
2.0482
2.0483
2.0484
2.0485
-20 -10 0 10 20
V
OUT
(V)
Load (mA)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Percentage of Total Units
VOUT (V)
QC +25°C
QC -40°C
QC +125°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
2.495
2.496
2.497
2.498
2.499
2.500
2.501
2.502
2.503
2.504
Percentage of Total Units
VOUT (V)
QC +25°C
QC -40°C
QC +125°C
Conditions:
VOUT
2V/div
500 µs/div
VIN
2V/div
500 µs/div
Conditions:
VIN
1V/div
5 ms/div
VOUT
10 mV
5 ms/div
/div
I
OUT
10 mA/div
V
OUT
500 mV/div
200 µs/div
MCP1501
DS20005474E-page 12 2015-2017 Microchip Technology Inc.
FIGURE 2-25: RISO vs. CLOAD, 4.096V
Option Unloaded.
FIGURE 2-26: RISO vs. CLOAD, 4.096V
Option Loaded.
0
45
90
135
3KDVH0DUJLQ
&DSDFLWLYH/RDG)
1Ω
10Ω
100Ω
1 kΩ
0
45
90
135
Capactive Load
Phase Margin (°)
1Ω
10Ω
100Ω
1 kΩ
2015-2017 Microchip Technology Inc. DS20005474E-page 13
MCP1501
3.0 PIN FUNCTION TABLE
The pin functions are described in Ta bl e 3- 1.
3.1 Buffered VREF Output (OUT)
This is the Buffered Reference Output. On the WDFN
and SOIC package, this should be connected to the
FEEDBACK pin at the device. The output driver is
tristated when in shutdown.
3.2 Buffered VREF Feedback
(FEEDBACK)
This is the buffer amplifier feedback pin. On the WDFN
and SOIC package, this should be connected to the
OUT pin at the device. This connection is internal on
the SOT-23 package. Note that if there is routing
impedance or IR-drop between the OUT and
FEEDBACK pins, it is the FEEDBACK pin which accu-
rately holds the output voltage. This can be used in an
application to remove IR-drop effects on output voltage
caused by the Printed Circuit Board (PCB) or
interconnect resistance with a high-current load.
3.3 System Ground (GND)
This is the power supply return and should be
connected to system ground.
3.4 Shutdown Pin (SHDN)
This is a digital input that will place the device in
Shutdown. The device should be allowed to power up
before using this feature. This pin is active low.
3.5 Power Supply Input (VDD)
This power pin also serves as the input voltage for the
voltage reference. Refer to the Electrical Tables to
determine minimum voltage, based on the device.
3.6 Exposed Thermal Pad (EP)
Not internally connected, but recommend grounding.
TABLE 3-1: PIN FUNCTION TABLE
SOT-23 SOIC 2 x 2 WDFN Symbol Function
17 7 OUTBuffered V
REF Output
— 8 8 FEEDBACK Buffered VREF Feedback
2, 3, 5 2, 4, 5, 6 2, 4, 5, 6 GND System Ground
4 3 3 SHDN Shutdown Pin Active Low
61 1 V
DD Power Supply Input
— — 9 EP Exposed Thermal Pad
MCP1501
DS20005474E-page 14 2015-2017 Microchip Technology Inc.
4.0 THEORY OF OPERATION
The MCP1501 is a buffered voltage reference that is
capable of operating over a wide input supply range
while providing a stable output across the input supply
range. The fundamental building block (see Block Dia-
gram) of the MCP1501 is an internal bandgap refer-
ence circuit. As with all bandgap circuits, the internal
reference sums together two voltages having an oppo-
site temperature coefficient which allows a voltage ref-
erence that is practically independent from
temperature.
The bandgap of the MCP1501 is based on a second
order temperature coefficient (TC) compensated band-
gap circuit that allows the MCP1501 to achieve high ini-
tial accuracy and low temperature coefficient operation
across supply and ambient temperature. The bandgap
curvature compensation is determined during device
characterization and is trimmed for optimal accuracy.
The MCP1501 also includes a chopper-based amplifier
architecture that ensures excellent low-noise opera-
tion, further reduces temperature dependent offsets
that would otherwise increase the temperature coeffi-
cient of the MCP1501, and significantly improves
long-term drift performance. Additional circuitry is
included to eliminate the chopping frequency from the
output of the device.
After the bandgap voltage is compensated, it is ampli-
fied, buffered, and provided to the output drive circuit
which has excellent performance when sinking or
sourcing load currents (±5 mA).
2015-2017 Microchip Technology Inc. DS20005474E-page 15
MCP1501
5.0 APPLICATION CIRCUITS
5.1 Application Tips
5.1.1 BASIC APPLICATION CIRCUIT
Figure 5-1 illustrates a basic circuit configuration of the
MCP1501.
FIGURE 5-1: Basic Circuit Configuration.
An output capacitor is not required for stability of the
voltage reference, but may be optionally added to pro-
vide noise filtering or act as a charge-reservoir for
switching loads, e.g., successive approximation regis-
ter (SAR) analog-to-digital converter (ADC). As shown,
the input voltage is connected to the device at the VIN
input, with an optional 2.2 μf ceramic capacitor. This
capacitor would be required if the input voltage has
excessive noise. A 2.2 μf capacitor would reject input
voltage noise at approximately 1 to 2 MHz. Noise
below this frequency will be amply rejected by the input
voltage rejection of the voltage reference. Noise at fre-
quencies above 2 MHz will be beyond the bandwidth of
the voltage reference and, consequently, not transmit-
ted from the input pin through the device to the output.
If the noise at the output of these voltage references is
too high for the particular application, it can be easily fil-
tered with an external RC filter and op-amp buffer (see
Figure 5-2).
FIGURE 5-2: Output Noise-Reducing
Filter.
V
DD
SHDN
GND
1
2
3
45
8
7
6
SOIC-8/DFN-8
GND
FEEDBACK
OUT
GND
GND
0.1 – 2.2 µF
1.65 – 5.5V
300 SF
OUT
RFIL
CFIL
Output
of VREF
MCP1501
DS20005474E-page 16 2015-2017 Microchip Technology Inc.
The RC filter values are selected for a desired cutoff
frequency, as shown in Equation 5-1.
EQUATION 5-1:
The values that are shown in Figure 5-2 (10 kΩand
1μF) will create a first-order, low-pass filter at the out-
put of the amplifier. The cutoff frequency of this filter is
15.9 Hz, and the attenuation slope is 20 dB/decade.
The MCP6021 amplifier isolates the loading of this low-
pass filter from the remainder of the application circuit.
This amplifier also provides additional drive, with a
faster response time than the voltage reference.
5.1.2 LOAD CAPACITOR
The maximum capacitive load is 300 pF. However,
larger capacitors may be implemented if a resistor is
used in series with a larger load capacitor. Refer to
Figure 2-25 and Figure 2-26 to ensure adequate phase
margin when selecting a resistor/capacitor
combination.
5.1.3 PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Mechanical stress due to Printed Circuit Board (PCB)
mounting can cause the output voltage to shift from its
initial value. Devices in the SOT-23-6 package are gen-
erally more prone to assembly stress than devices in
the WDFN package. To reduce stress-related output
voltage shifts, mount the reference on low-stress areas
of the PCB (i.e., away from PCB edges, screw holes
and large components).
fC1
2
RFILCFIL
---------------------------------------=
2015-2017 Microchip Technology Inc. DS20005474E-page 17
MCP1501
5.2 Typical Applications Circuits
5.2.1 NEGATIVE VOLTAGE REFERENCE
A negative voltage reference can be generated using
any of the devices in the MCP1501 family. A typical
application is shown in Figure 5-3. In this circuit, the
voltage inversion is implemented using the MCP6061
and two equal resistors. The voltage at the output of the
MCP1501 voltage reference drives R1, which is con-
nected to the inverting input of the MCP6061 amplifier.
Since the noninverting input of the amplifier is biased to
ground, the inverting input will also be close to ground
potential. The second 10 kΩresistor is placed around
the feedback loop of the amplifier. Since the inverting
input of the amplifier is high-impedance, the current
generated through R1 will also flow through R2. As a
consequence, the output voltage of the amplifier is
equal to –2.5V for the MCP1501-25 and –4.096V for
the MCP1501-40.
FIGURE 5-3: Negative Voltage Reference.
5.2.2 A/D CONVERTER REFERENCE
The MCP1501 product family was carefully designed to
provide a precision, low noise voltage reference for the
Microchip families of ADCs. The circuit shown in
Figure 5-4 shows a MCP1501-25 configured to provide
the reference to the MCP3201, a 12-bit ADC.
FIGURE 5-4: ADC Example Circuit.
VDD
SHDN
GND
1
2
3
45
8
7
6
GND
FEEDBACK
OUT
GND
GND
2.2 µF
2.7 – 5.5V
-
+
10 kΩ
0.1%
10 kΩ
0.1%
-5V
-2.500V
MCP1501-;;
MCP6061
1nF
VDD
SHDN
GND
1
2
3
45
8
7
6
GND
FEEDBACK
OUT
GND
GND
2.2 µF
5.0V
2.2 µF
MCP1501-;;
MCP3201
5.0V
10 µF
VREF
VIN
0.1 µF
IN+
IN-
50Ω
MCP1501
DS20005474E-page 18 2015-2017 Microchip Technology Inc.
FIGURE 5-5: SAR ADC Example Circuit.
The circuit shown in Figure 5-5 shows a MCP1501-25
configured to provide the reference to a 14-bit or 16-bit
SAR ADC.
VDD
GND
SHDN
GND
FEEDBACK
OUT
GND
GND
10 kΩ
10Ω
2.2 µF (Ta)
0.1 µF 10 μF
5.0V
5.0V
VIN
IN-
IN+
MCP1501-25
14/16-bit
SAR ADC
2.2 µF
2015-2017 Microchip Technology Inc. DS20005474E-page 19
MCP1501
6.0 PACKAGE INFORMATION
6.1 Package Markings
XXNN
6-Lead SOT-23 Example
8-Lead SOIC Example
NNN
150110
SN^^^1550
256
3
e
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
XXXXY
WWNNN AABTY
50256
8-Lead WDFN (2 x2 mm) Example
AAQ
256
Device Code
MCP1501T-10E/RW AAQ
MCP1501T-12E/RW AAR
MCP1501-18E/RW AAS
MCP1501-20E/RW AAT
MCP1501T-25E/RW AAU
MCP1501T-30E/RW AAV
MCP1501T-33E/RW AAW
MCP1501T-40E/RW AAX
Device Code
MCP1501T-10E/CHY AABTY
MCP1501T-12E/CHY AABUY
MCP1501T-18E/CHY AABVY
MCP1501T-20E/CHY AABWY
MCP1501T-25E/CHY AABXY
MCP1501T-30E/CHY AABYY
MCP1501T-33E/CHY AABZY
MCP1501T-40E/CHY AACAY
Device Code
MCP1501T-10E/SN 150110
MCP1501T-12E/SN 150112
MCP1501-18E/SN 150118
MCP1501-20E/SN 150120
MCP1501T-25E/SN 150125
MCP1501T-30E/SN 150130
MCP1501T-33E/SN 150133
MCP1501T-40E/SN 150140
MCP1501
DS20005474E-page 20 2015-2017 Microchip Technology Inc.
B
A
0.15 C A-B
0.15 C D
0.20 C A-B D
2X
TOP VIEW
SIDE VIEW
END VIEW
0.10 C
Microchip Technology Drawing C04-028C (CH) Sheet 1 of 2
2X
6X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
6-Lead Plastic Small Outline Transistor (CH, CHY) [SOT-23]
D
EE1
e
e1
6X b
E
2
E1
2
D
AA2
A1
L2
Ĭ
L
(L1)
R
R1
c
0.20 C A-B
2X
C
SEATING PLANE
GAUGE PLANE
2015-2017 Microchip Technology Inc. DS20005474E-page 21
MCP1501
Microchip Technology Drawing C04-028C (OT) Sheet 2 of 2
6-Lead Plastic Small Outline Transistor (OT, OTY) [SOT-23]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
protrusions shall not exceed 0.25mm per side.
1.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2.
Notes:
REF: Reference Dimension, usually without tolerance, for information purposes only.
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
Dimensioning and tolerancing per ASME Y14.5M
Foot Angle
Number of Leads
Pitch
Outside lead pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Lead Width
L1
φ
b
c
Dimension Limits
E
E1
D
L
e1
A
A2
A1
Units
N
e
0°
0.08
0.20 -
-
-
10°
0.26
0.51
MILLIMETERS
0.95 BSC
1.90 BSC
0.30
0.90
0.89
0.00
0.60 REF
2.90 BSC
0.45
2.80 BSC
1.60 BSC
1.15
-
-
MIN
6
NOM
1.45
1.30
0.15
0.60
MAX
Seating Plane to Gauge Plane L1 0.25 BSC
MCP1501
DS20005474E-page 22 2015-2017 Microchip Technology Inc.
0.25 CA–B D
C
SEATING
PLANE
TOP VIEW
SIDE VIEW
VIEW A–A
0.10 C
0.10 C
Microchip Technology Drawing No. C04-057-SN Rev D Sheet 1 of 2
8X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
12
N
h
h
A1
A2
A
A
B
e
D
E
E
2
E1
2
E1
NOTE 5
NOTE 5
NX b
0.10 CA–B
2X
H0.23
(L1)
L
R0.13
R0.13
VIEW C
SEE VIEW C
NOTE 1
D
2015-2017 Microchip Technology Inc. DS20005474E-page 23
MCP1501
Microchip Technology Drawing No. C04-057-SN Rev D Sheet 2 of 2
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Foot Angle 0° - 8°
15°-5°
Mold Draft Angle Bottom
15°-5°
Mold Draft Angle Top
0.51-0.31
b
Lead Width
0.25-0.17
c
Lead Thickness
1.27-0.40LFoot Length
0.50-0.25hChamfer (Optional)
4.90 BSCDOverall Length
3.90 BSCE1Molded Package Width
6.00 BSCEOverall Width
0.25-0.10
A1
Standoff
--1.25A2Molded Package Thickness
1.75--AOverall Height
1.27 BSC
e
Pitch
8NNumber of Pins
MAXNOMMINDimension Limits
MILLIMETERSUnits
protrusions shall not exceed 0.15mm per side.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
4. Dimensioning and tolerancing per ASME Y14.5M
Notes:
§
Footprint L1 1.04 REF
5. Datums A & B to be determined at Datum H.
MCP1501
DS20005474E-page 24 2015-2017 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Microchip Technology Drawing C04-2057-SN Rev B
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC]
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M1.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
CContact Pad Spacing
Contact Pitch
MILLIMETERS
1.27 BSC
MIN
E
MAX
5.40
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
1.55
0.60
NOM
E
X1
C
Y1
SILK SCREEN
2015-2017 Microchip Technology Inc. DS20005474E-page 25
MCP1501
B
A
0.05 C
0.05 C
0.10 C A B
0.05 C
(DATUM A)
(DATUM B)
C
SEATING
PLANE
NOTE 1
12
N
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
NOTE 1
0.05 C A B
0.05 C
Microchip Technology Drawing C04-261A Sheet 1 of 2
8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (RW) - 2x2 mm Body [WDFN]
2X
E
D
12
N
E2
D2
2X CH
(K)
8X b
e
L
A(A3)
0.05 C
A1
MCP1501
DS20005474E-page 26 2015-2017 Microchip Technology Inc.
Microchip Technology Drawing C04-261A Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Length
Terminal Length
Exposed Pad Width
Exposed Pad Length
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E2
D2
(A3)
e
L
E
N
0.50 BSC
0.10 REF
0.70
1.10
0.25
0.20
0.70
0.00
0.25
2.00 BSC
0.30
1.20
0.80
0.75
0.02
2.00 BSC
MILLIMETERS
MIN NOM
8
0.90
1.30
0.35
0.30
0.80
0.05
MAX
(K) -0.30 -
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (RW) - 2x2 mm Body [WDFN]
Exposed Pad Chamfer CH - 0.25 -
2015-2017 Microchip Technology Inc. DS20005474E-page 27
MCP1501
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
CH
Optional Center Pad Width
Center Pad Chamfer
Optional Center Pad Length
Contact Pitch
X2
Y2
1.30
0.90
MILLIMETERS
0.50 BSC
MIN
E
MAX
0.28
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
0.70
0.30
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-2261A
NOM
8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (RW) - 2x2 mm Body [WDFN]
CContact Pad Spacing 2.10
Contact Pad to Contact Pad (X6) G1 0.20
C
E
G
X1
Y1
Y2
X2
2X CH
(G2)
SILK SCREEN
1
2
8
Contact Pad to Center Pad (X8) G1 0.25 REF
REF: Reference Dimension, usually without tolerances, for reference only.
Thermal Via Diameter V 0.30
ØV
MCP1501
DS20005474E-page 28 2015-2017 Microchip Technology Inc.
NOTES:
2015-2017 Microchip Technology Inc. DS20005474E-page 29
MCP1501
APPENDIX A: REVISION HISTORY
Revision E (August 2017)
The following is the list of modifications:
• Updated Features.
• Updated Package Types.
• Updated Section 1.0, Electrical Characteristics,
Table 1-1.
• Updated Figure 2-12, Figure 2-20 and Figure 2-21.
• Updated Table 3-1.
• Updated Section 3.4, Shutdown Pin (SHDN).
• Updated Section 5.1.2, LOAD CAPACITOR.
• Corrected Figure 5-3 and Figure 5-4.
• Added Figure 5-5.
• Minor typographical corrections.
Revision D (March 2017)
The following is the list of modifications:
• Updated Table 1-1.
• Updated Equation 1-1, Equation 1-4, Equation 1-5,
Equation 1-10, Equation 1-11, Equation 1-12 and
Equation 1-16.
• Updated Figure 2-11, Figure 2-20, Figure 2-21,
Figure 2-25 and Figure 2-26.
• Updated Figure 5-1 and Figure 5-4.
• Updated “Product Identifica tion System ” section.
• Minor typographical corrections.
Revision C (May 2016)
The following is the list of modifications:
• Updated Section 1.0, Electrical Characteristics,
Section 4.0, Theory of Operation, Section 5.0,
Application Circuits.
• Updated Features section, General Description
section, Section 3.1, Buffered VREF Output
(OUT).
• Updated“Product Id entification System”
section.
• Updated Figure 2-12, Figure 2-20,
Figure 2-21, Figure 5-1 and Figure 5-4.
• Updated Equation 1-10 and Equation 1-16.
• Minor typographical corrections.
Revision B (January 2016)
The following is the list of modifications:
• Updated Section 6.0, Package Information.
• Updated “Product Identification System”
section.
• Minor typographical corrections.
Revision A (December 2015)
Original Release of this Document.
MCP1501
DS20005474E-page 30 2015-2017 Microchip Technology Inc.
NOTES:
2015-2017 Microchip Technology Inc. DS20005474E-page 31
MCP1501
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.- X/XX
PackageOutput Voltage
Option
Device
Device: MCP1501 – 50 ppm maximum thermal drift buffered reference
Tape and Reel
Option: Blank = Standard packaging (tube or tray)
T = Tape and Reel (1)
Output Voltage
Option: 10 = 1.024V
12 = 1.200V
18 = 1.800V
20 = 2.048V
25 = 2.500V
30 = 3.000V
33 = 3.300V
40 = 4.096V
Package: CHY* = 6-Lead Plastic Small Outline Transistor (SOT-23)
SN = 8-Lead Plastic Small Outline – Narrow, 3.90 mm
Body (SOIC)
RW = 8-Lead Very, Very Thin Plastic Dual Flat, No Lead
Package – 2 x 2 mm Body (WDFN)
*Y = Nickel palladium gold manufacturing designator.
Only available on the SOT-23 package.
Examples:
a) MCP1501T-10E/CHY: 1.024V, 6-lead SOT-23
package, Tape and Reel
b) MCP1501-12E/SN: 1.2V, 8-lead SOIC package
c) MCP1501T-18E/SN: 1.8V, 8-lead SOIC package,
Tape and Reel
d) MCP1501T-20E/RW: 2.048V, 8-lead WDFN
package, Tape and Reel
Note 1: Tape and Reel identifier only appears in
the catalog part number description.
This identifier is used for ordering pur-
poses and is not printed on the device
package. Check with your Microchip
sales office for package availability for
the Tape and Reel option.
[X](1)
Tape and
Reel
MCP1501
DS20005474E-page 32 2015-2017 Microchip Technology Inc.
NOTES:
2015-2017 Microchip Technology Inc. DS20005474E-page 33
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015-2017, Microchip Technology Incorporated, All Rights
Reserved.
ISBN: 978-1-5224-2100-9
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS20005474E-page 34 2015-2017 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
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Tel: 512-257-3370
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Tel: 774-760-0087
Fax: 774-760-0088
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Fax: 630-285-0075
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Tel: 972-818-7423
Fax: 972-818-2924
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Tel: 248-848-4000
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Tel: 281-894-5983
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Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Dongguan
Tel: 86-769-8702-9880
China - Guangzhou
Tel: 86-20-8755-8029
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-3326-8000
Fax: 86-21-3326-8021
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
ASIA/PACIFIC
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Finland - Espoo
Tel: 358-9-4520-820
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
France - Saint Cloud
Tel: 33-1-30-60-70-00
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7289-7561
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
11/07/16
