NLX1G74
http://onsemi.com
6
PACKAGE DIMENSIONS
UQFN8
MU SUFFIX
CASE 523AN
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
A
B
E
D
BOTTOM VIEW
b
e
8X
0.10 B
0.05
AC
CNOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
A
A1
(A3)
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
L
8X
1
35
8
DIM MIN MAX
MILLIMETERS
A0.45 0.60
A1 0.00 0.05
A3 0.13 REF
b0.15 0.25
D1.60 BSC
L1 −−− 0.15
E1.60 BSC
e0.50 BSC
L0.35 0.45
L1
DETAIL A
A1
A3
DETAIL B
OPTIONAL
MOLD CMPD
EXPOSED Cu
b
CONSTRUCTION
OPTIONAL
CONSTRUCTION
DETAIL B
DETAIL A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PITCH
0.35
7X
DIMENSIONS: MILLIMETERS
1
7
L3
0.25
1.70
1.70
0.50
L3 0.25 0.35
L3
(0.10) (0.15)
8X
0.53
8X
0.53
8X
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