© Semiconductor Components Industries, LLC, 2013
September, 2013 Rev. 1
1Publication Order Number:
NLX1G74/D
NLX1G74
Single D Flip-Flop
The NLX1G74 is a high performance, full function edgetriggered
D FlipFlop in ultrasmall footprint. The NLX1G74 input structures
provide protection when voltages up to 7.0 V are applied, regardless of
the supply voltage.
Features
Extremely High Speed: tPD = 2.6 ns (typical) at VCC = 5.0 V
Designed for 1.65 V to 5.5 V VCC Operation
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
24 mA Balanced Output Sink and Source Capability at VCC = 3.0 V
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input Pins
Ultra Small Package
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ100
Qualified and PPAP Capable
This is a PbFree Device
TRUTH TABLE
Inputs Outputs
Operating Mode
PR CLR CP D Q Q
L
H
L
H
L
L
X
X
X
X
X
X
H
L
H
L
H
H
Asynchronous Set
Asynchronous Clear
Undetermined
H
H
H
H
h
l
H
L
L
HLoad and Read Register
H H X NC NC Hold
H = High Voltage Level
h = High Voltage Level One Setup Time Prior to the LowtoHigh
Clock Transition
L = Low Voltage Level
l = Low Voltage Level One Setup Time Prior to the LowtoHigh
Clock Transition
NC = No Change
X = High or Low Voltage Level and Transitions are Acceptable
= LowtoHigh Transition
= Not a LowtoHigh Transition
For ICC reasons, DO NOT FLOAT Inputs
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAM
PINOUT DIAGRAM
Q
PR
1
3
D6
CP 7
CLR
2
Q
5
VCC = 8, GND = 4
LOGIC DIAGRAM
UQFN8
MU SUFFIX
CASE 523AN
AA = Device Code
M = Date Code*
G= PbFree Package
(Note: Microdot may be in either location)
18
AA MG
G
1
CP
1
VCC
D
GND
23
8
76
4
5
Q
PR CLR Q
NLX1G74
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2
MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC DC Supply Voltage 0.5 to +7.0 V
VIDC Input Voltage 0.5 to +7.0 V
VODC Output Voltage Output in High or Low State (Note 1) 0.5 to VCC +0.5 V
IIK DC Input Diode Current VI < GND 50 mA
IOK DC Output Diode Current VO < GND 50 mA
IODC Output Sink Current ±50 mA
ICC DC Supply Current Per Supply Pin ±100 mA
IGND DC Ground Current Per Ground Pin ±100 mA
TSTG Storage Temperature Range 65 to +150 °C
TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C
TJJunction Temperature Under Bias +150 °C
qJA Thermal Resistance (Note 2) 250 °C/W
PDPower Dissipation in Still Air at 85°C 250 mW
MSL Moisture Sensitivity Level 1
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
VESD ESD Withstand Voltage Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
>2000
>200
N/A
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. IO absolute maximum rating must be observed.
2. Measured with minimum pad spacing on an FR4 board, using 10 mm X 1 inch, 2 ounce copper trace with no air flow.
3. Tested to EIA/JESD22A114A.
4. Tested to EIA/JESD22A115A.
5. Tested to JESD22C101A.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC Supply Voltage Operating
Data Retention Only
1.65
1.5
5.5
5.5
V
VIInput Voltage (Note 6) 0 5.5 V
VOOutput Voltage (HIGH or LOW State) 0 VCC V
TAOperating FreeAir Temperature 40 +85 °C
Dt/DVInput Transition Rise or Fall Rate VCC = 2.5 V ±0.2 V
VCC = 3.0 V ±0.3 V
VCC = 5.0 V ±0.5 V
0
0
0
20
10
5.0
ns/V
6. Unused inputs may not be left open. All inputs must be tied to a highlogic voltage level or a lowlogic input voltage level.
ORDERING INFORMATION
Device Package Shipping
NLX1G74MUTCG UQFN8
(PbFree)
3000 / Tape & Reel
NLVX1G74MUTCG* UQFN8
(PbFree)
3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP
Capable.
NLX1G74
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3
DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Condition
VCC
(V)
TA = 25_C*40_C v TA v 85_C
Unit
Min Typ Max Min Max
VIH HighLevel Input Voltage 1.65 0.75 VCC 0.75 VCC V
2.3 to 5.5 0.7 VCC 0.7 VCC
VIL LowLevel Input Voltage 1.65 0.25 VCC 0.25 VCC V
2.3 to 5.5 0.3 VCC 0.3 VCC
VOH HighLevel Output Voltage
VIN = VIL or VIL
IOH = 100 mA
IOH = 3 mA
IOH = 8 mA
IOH = 12 mA
IOH = 16 mA
IOH = 24 mA
IOH = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
VCC 0.1
1.29
1.9
2.2
2.4
2.3
3.8
VCC
1.52
2.1
2.4
2.7
2.5
4.0
VCC 0.1
1.29
1.9
2.2
2.4
2.3
3.8
V
VOL LowLevel Output Voltage
VIN = VIH
IOL = 100 mA
IOL = 3 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
0.008
0.10
0.12
0.15
0.19
0.30
0.30
0.1
0.24
0.3
0.4
0.4
0.55
0.55
0.1
0.24
0.3
0.4
0.4
0.55
0.55
V
IIN Input Leakage Current VIN = VCC or GND 5.5 $0.1 $1.0 mA
IOFF Power off Input
Leakage Current
5.5V or VIN = GND 0 1.0 10 mA
ICC Quiescent Supply Current VIN = VCC or GND 5.5 1.0 10 mA
NLX1G74
http://onsemi.com
4
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Symbol
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Parameter
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC (V)
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
Test Conditions
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
TA = 25°C
ÎÎÎÎÎ
ÎÎÎÎÎ
TA = 40 to 85°C
ÎÎÎ
ÎÎÎ
ÎÎÎ
Unit
Min
Typ
Max
ÎÎÎ
ÎÎÎ
Min
ÎÎÎ
ÎÎÎ
Max
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
fMAX
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Maximum Clock
Frequency
(50% Duty Cycle)
(Waveform 1)
ÎÎÎÎÎ
1.8 ± 0.15
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 15 pF
RD = 1 MW
S1 = Open
75
ÎÎÎ
75
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
MHz
ÎÎÎÎÎ
ÎÎÎÎÎ
2.5 ± 0.2
150
ÎÎÎ
ÎÎÎ
150
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
3.3 ± 0.3
200
ÎÎÎ
ÎÎÎ
200
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
250
ÎÎÎ
ÎÎÎ
250
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
3.3 ± 0.3
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 50 pF,
RD = 500 W, S1 = Open
175
ÎÎÎ
175
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
200
ÎÎÎ
ÎÎÎ
200
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
tPLH,
tPHL
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Propagation Delay,
CP to Q or Q
(Waveform 1)
ÎÎÎÎÎ
ÎÎÎÎÎ
1.8 ± 0.15
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 15 pF
RD = 1 MW
S1 = Open
2.5
6.5
12.5
ÎÎÎ
ÎÎÎ
2.5
ÎÎÎ
ÎÎÎ
13
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ns
ÎÎÎÎÎ
ÎÎÎÎÎ
2.5 ± 0.2
1.5
3.8
7.5
ÎÎÎ
ÎÎÎ
1.5
ÎÎÎ
ÎÎÎ
8.0
ÎÎÎÎÎ
3.3 ± 0.3
1.0
2.8
6.5
ÎÎÎ
1.0
ÎÎÎ
7.0
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
0.8
2.2
4.5
ÎÎÎ
ÎÎÎ
0.8
ÎÎÎ
ÎÎÎ
5.0
ÎÎÎÎÎ
ÎÎÎÎÎ
3.3 ± 0.3
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 50 pF,
RD = 500 W, S1 = Open
1.0
3.4
7.0
ÎÎÎ
ÎÎÎ
1.0
ÎÎÎ
ÎÎÎ
7.5
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
1.0
2.6
5.0
ÎÎÎ
ÎÎÎ
1.0
ÎÎÎ
ÎÎÎ
5.5
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
tPLH,
tPHL
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Propagation Delay,
PR or CLR to Q or Q
(Waveform 2)
ÎÎÎÎÎ
1.8 ± 0.15
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 15 pF
RD = 1 MW
S1 = Open
2.5
6.5
14
ÎÎÎ
2.5
ÎÎÎ
14.5
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ns
ÎÎÎÎÎ
ÎÎÎÎÎ
2.5 ± 0.2
1.5
3.8
9.0
ÎÎÎ
ÎÎÎ
1.5
ÎÎÎ
ÎÎÎ
9.5
ÎÎÎÎÎ
ÎÎÎÎÎ
3.3 ± 0.3
1.0
2.8
6.5
ÎÎÎ
ÎÎÎ
1.0
ÎÎÎ
ÎÎÎ
7.0
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
0.8
2.2
5.0
ÎÎÎ
ÎÎÎ
0.8
ÎÎÎ
ÎÎÎ
5.5
ÎÎÎÎÎ
3.3 ± 0.3
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 50 pF,
RD = 500 W, S1 = Open
1.0
3.4
7.0
ÎÎÎ
1.0
ÎÎÎ
7.5
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
1.0
2.6
5.0
ÎÎÎ
ÎÎÎ
1.0
ÎÎÎ
ÎÎÎ
5.5
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
tS
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Setup Time, D to CP
(Waveform 1)
ÎÎÎÎÎ
ÎÎÎÎÎ
1.8 ± 0.15
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 15 pF
RD = 1 MW
S1 = Open
6.5
ÎÎÎ
ÎÎÎ
6.5
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ns
ÎÎÎÎÎ
ÎÎÎÎÎ
2.5 ± 0.2
3.5
ÎÎÎ
ÎÎÎ
3.5
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
3.3 ± 0.3
2.0
ÎÎÎ
2.0
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
1.5
ÎÎÎ
ÎÎÎ
1.5
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
3.3 ± 0.3
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 50 pF,
RD = 500 W, S1 = Open
2.0
ÎÎÎ
ÎÎÎ
2.0
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
1.5
ÎÎÎ
ÎÎÎ
1.5
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
tH
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Hold Time, D to CP
(Waveform 1)
ÎÎÎÎÎ
1.8 ± 0.15
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 15 pF
RD = 1 MW
S1 = Open
0.5
ÎÎÎ
0.5
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ns
ÎÎÎÎÎ
ÎÎÎÎÎ
2.5 ± 0.2
0.5
ÎÎÎ
ÎÎÎ
0.5
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
3.3 ± 0.3
0.5
ÎÎÎ
ÎÎÎ
0.5
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
0.5
ÎÎÎ
ÎÎÎ
0.5
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
3.3 ± 0.3
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 50 pF,
RD = 500 W, S1 = Open
0.5
ÎÎÎ
0.5
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
0.5
ÎÎÎ
ÎÎÎ
0.5
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
tW
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Pulse Width,
CP, CLR, PR
(Waveform 3)
ÎÎÎÎÎ
ÎÎÎÎÎ
1.8 ± 0.15
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 15 pF
RD = 1 MW
S1 = Open
6.0
ÎÎÎ
ÎÎÎ
6.0
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ns
ÎÎÎÎÎ
ÎÎÎÎÎ
2.5 ± 0.2
4.0
ÎÎÎ
ÎÎÎ
4.0
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
3.3 ± 0.3
3.0
ÎÎÎ
3.0
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
2.0
ÎÎÎ
ÎÎÎ
2.0
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
3.3 ± 0.3
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 50 pF,
RD = 500 W, S1 = Open
3.0
ÎÎÎ
ÎÎÎ
3.0
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
2.0
ÎÎÎ
ÎÎÎ
2.0
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
tREC
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Recover Time
PR; CLR to CP
(Waveform 3)
ÎÎÎÎÎ
1.8 ± 0.15
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 15 pF
RD = 1 MW
S1 = Open
8.0
ÎÎÎ
8.0
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
MHz
ÎÎÎÎÎ
ÎÎÎÎÎ
2.5 ± 0.2
4.5
ÎÎÎ
ÎÎÎ
4.5
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
3.3 ± 0.3
3.0
ÎÎÎ
ÎÎÎ
3.0
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
3.0
ÎÎÎ
ÎÎÎ
3.0
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
3.3 ± 0.3
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
CL = 50 pF,
RD = 500 W, S1 = Open
3.0
ÎÎÎ
3.0
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
5.0 ± 0.5
3.0
ÎÎÎ
ÎÎÎ
3.0
ÎÎÎ
ÎÎÎ
7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 2 (per flipflop). CPD is used to determine the
noload dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
CAPACITANCE (Note 8)
Symbol Parameter Condition Typical Unit
CIN Input Capacitance VCC = 5.5 V 7.0 pF
COUT Output Capacitance VCC = 5.5 V 7.0 pF
CPD Power Dissipation Capacitance (Note 9)
Frequency = 10 MHz
VCC = 3.3 V
VCC = 5.0 V
16
21
pF
8. TA = +25°C, f = 1 MHz
9. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. (See Figure 1) CPD is related to ICCD dynamic operating current by the expression:
ICCD = CPD VCC fin + ICC(static).
NLX1G74
http://onsemi.com
5
trec
WAVEFORM 3 RECOVERY TIME
tR = tF = 3.0 ns from 10% to 90%; f = 1 MHz; tw = 500 ns
Output Reg: VOL 0.8 V, VOH 2.0 V
Vcc
0 V
Vcc
0 V
50%
50%
Figure 1. AC Waveforms
WAVEFORM 2 PROPAGATION DELAYS
tR = tF = 3.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
PR, CLR
CP
Vcc
0 V
PR
CLR 50%
Q
Vcc
0 V
VOH
50%
Q
VOL
50%
50%
50%
tPLH tPHL
tPHL
tPLH
WAVEFORM 1 PROPAGATION DELAYS, SETUP AND HOLD TIMES
tR = tF = 3.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Vcc
0 V
D
CP
50%
Q,
Q
Vcc
0 V
VOH
VOL
tPLH, tPHL
th
ts
50%
50%
fmax
tw
tw
tw
50%
PULSE
GENERATOR
RT
DUT
VCC
RL
CL
Figure 2. Test Circuit
NLX1G74
http://onsemi.com
6
PACKAGE DIMENSIONS
UQFN8
MU SUFFIX
CASE 523AN
ISSUE O
ÉÉÉ
ÉÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
A
B
E
D
BOTTOM VIEW
b
e
8X
0.10 B
0.05
AC
CNOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
A
A1
(A3)
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
L
8X
1
35
8
DIM MIN MAX
MILLIMETERS
A0.45 0.60
A1 0.00 0.05
A3 0.13 REF
b0.15 0.25
D1.60 BSC
L1 −−− 0.15
E1.60 BSC
e0.50 BSC
L0.35 0.45
L1
DETAIL A
ÇÇÇ
ÇÇÇ
ÉÉÉ
A1
A3
DETAIL B
OPTIONAL
MOLD CMPD
EXPOSED Cu
b
CONSTRUCTION
OPTIONAL
CONSTRUCTION
DETAIL B
DETAIL A
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PITCH
0.35
7X
DIMENSIONS: MILLIMETERS
1
7
L3
0.25
1.70
1.70
0.50
L3 0.25 0.35
L3
(0.10) (0.15)
8X
0.53
8X
0.53
8X
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