SMAJ5.0 THRU SMAJ170CA
SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR
Stand-off Voltage - 5.0 to 170 Volts Peak Pulse Power - 300 Watts
FEATURES
♦ Optimized for LAN protection applications
♦ Ideal for ESD protection of data lines in accordance
with IEC 1000-4-2 (IEC801-2)
♦ Ideal for EFT protection of data lines in accordance with
IEC1000-4-4 (IEC801-4)
♦ Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
♦ Glass passivated junction
♦ Excellent clamping capability
♦ Low incremental surge resistance
♦ Fast response time: typically less than 1.0ps from 0 Volts
to V(BR) min.
♦ 300W peak pulse power capability with a 10/1000µs
wavefor m, repetition rate (duty cycle): 0.01%
♦ High temperature soldering guaranteed:
250°C/10 seconds at terminals
MECHANICAL DATA
Case: JEDEC DO-214AC molded plastic body over
passivated chip
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes positive end (cathode)
Mounting Position: Any
Weight: 0.002 ounces, 0.064 gram
DEVICES FOR BIDIRECTIONAL APPLICATIONS
For bidirectional use suffix C or CA
Electrical characteristics apply in both directions.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS VALUE UNITS
Peak pulse power dissipation with a 10/1000µs wavefor m (NOTE 1,2,5, FIG.1) PPM Minimum 300 Watts
Peak forward surge current
(NOTE 4) IFSM 40.0 Amps
Peak pulse current with a 10/1000µs wavefor m (NOTE 1) IPPM SEE TABLE 1 Amps
Steady state power dissipation (NOTE 3) PM(AV) 1.0 Watts
Maximum instantaneous forward voltage at 25A (NOTE 4) VF3.5 Volts
Operating junction and storage temperature range TJ, TSTG -55 to +150 °C
NOTES:
(1) Non-repetitive current pulse, per Fig.3 and derated above TA=25°C per Fig. 2
(2) Mounted on 5.0mm2copper pads to each terminal (3) Lead temperature at 75°C=TLper Fig. 5
(4) Measured on 8.3ms single half sine-wave. For uni-directional devices only.
(5) Peak pulse power waveform is 10/1000µS
0.157 (3.99)
0.177 (4.50)
0.006 (0.152)
0.012 (0.305)
0.030 (0.76)
0.060 (1.52) 0.008 (0.203) MAX.
0.194 (4.93)
0.208 (5.28)
0.100 (2.54)
0.110 (2.79)
0.078 (1.98)
0.090 (2.29)
0.049 (1.25)
0.065 (1.65)
DO-214AC
Dimensions in inches and (millimeters)
ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
Maximum
Device Maximum Clamping Maximum Reverse
Marking Code Working Peak Breakdown Voltage Voltage at IPPM Peak Pulse Leakage
Reverse Voltage V(BR) (Volts) at ITVc (Volts) Surge Current IPPM a VWM
Device UNI BI VWM (Volts) Min. Max. (mA) (NOTE5) (NOTE 5) (Amps) ID (µµA)
SMAJ5.0 AD WD 5.0 6.40 7.81 10 9.6 31.3 800
SMAJ5.0A AE WE 5.0 6.40 7.08 10 9.2 32.6 800
SMAJ6.0 AF WF 6.0 6.67 8.15 10 11.4 26.3 800
SMAJ6.0A AG WG 6.0 6.67 7.37 10 10.3 29.1 800
SMAJ6.5 AH WH 6.5 7.22 8.82 10 12.3 24.4 500
SMAJ6.5A AK WK 6.5 7.22 7.98 10 11.2 26.8 500
SMAJ7.0 AL WL 7.0 7.78 9.51 10 13.3 22.6 200
SMAJ7.0A AM WM 7.0 7.78 8.60 10 12.0 25.0 200
SMAJ7.5 AN WN 7.5 8.33 10.3 1.0 14.3 21.0 100
SMAJ7.5A AP WP 7.5 8.33 9.21 1.0 12.9 23.3 100
SMAJ8.0 AQ WQ 8.0 8.89 10.9 1.0 15.0 20.0 50.0
SMAJ8.0A AR WR 8.0 8.89 9.83 1.0 13.6 22.1 50.0
SMAJ8.5 AS WS 8.5 9.44 11.5 1.0 15.9 18.9 10.0
SMAJ8.5A AT WT 8.5 9.44 10.4 1.0 14.4 20.8 10.0
SMAJ9.0 AU WU 9.0 10.0 12.2 1.0 16.9 17.8 5.0
SMA J9.0A AV WV 9.0 10.0 11.1 1.0 15.4 19.5 5.0
SMAJ10 AW WW 10.0 11.1 13.6 1.0 18.8 16.0 5.0
SMAJ10A AX WX 10.0 11.1 12.3 1.0 17.0 17.6 5.0
SMAJ11 AY WY 11.0 12.2 14.9 1.0 20.1 14.9 5.0
SMAJ11A AZ WZ 11.0 12.2 13.5 1.0 18.2 16.5 5.0
SMAJ12 BD XD 12.0 13.3 16.3 1.0 22.0 13.6 5.0
SMAJ12A BE XE 12.0 13.3 14.7 1.0 19.9 15.1 5.0
SMAJ13 BF XF 13.0 14.4 17.6 1.0 23.8 12.6 5.0
SMAJ13A BG XG 13.0 14.4 15.9 1.0 21.5 14.0 5.0
SMAJ14 BH XH 14.0 15.6 19.1 1.0 25.8 11.6 5.0
SMAJ14A BK XK 14.0 15.6 17.2 1.0 23.2 12.9 5.0
SMAJ15 BL XL 15.0 16.7 20.4 1.0 26.9 11.2 5.0
SMAJ15A BM XM 15.0 16.7 18.5 1.0 24.4 12.3 5.0
SMAJ16 BN XN 16.0 17.8 21.8 1.0 28.8 10.4 5.0
SMAJ16A BP XP 16.0 17.8 19.7 1.0 26.0 11.5 5.0
SMAJ17 BQ XQ 17.0 18.9 23.1 1.0 30.5 9.8 5.0
SMAJ17A BR XR 17.0 18.9 20.9 1.0 27.6 10.9 5.0
SMAJ18 BS XS 18.0 20.0 24.4 1.0 32.2 9.3 5.0
SMAJ18A BT XT 18.0 20.0 22.1 1.0 29.2 10.3 5.0
SMAJ20 BU XU 20.0 22.2 27.1 1.0 35.8 8.4 5.0
SMAJ20A BV XV 20.0 22.2 24.5 1.0 32.4 9.3 5.0
SMAJ22 BW XW 22.0 24.4 29.8 1.0 39.4 7.6 5.0
SMAJ22A BX XX 22.0 24.4 26.9 1.0 35.5 8.5 5.0
SMAJ24 BY XY 24.0 26.7 32.6 1.0 43.0 7.0 5.0
SMAJ24A BZ XZ 24.0 26.7 29.5 1.0 38.9 7.7 5.0
SMAJ26 CD YD 26.0 28.9 35.3 1.0 46.6 6.4 5.0
SMAJ26A CE YE 26.0 28.9 31.9 1.0 42.1 7.1 5.0
SMAJ28 CF YF 28.0 31.1 38.0 1.0 50.0 6.0 5.0
SMAJ28A CG YG 28.0 31.1 34.4 1.0 45.4 6.6 5.0
SMAJ30 CH YH 30.0 33.3 40.7 1.0 53.5 5.6 5.0
SMAJ30A CK YK 30.0 33.3 36.8 1.0 48.4 6.2 5.0
SMAJ33 CL YL 33.0 36.7 44.9 1.0 59.0 5.1 5.0
SMAJ33A CM YM 33.0 36.7 40.6 1.0 53.3 5.6 5.0
SMAJ36 CN YN 36.0 40.0 48.9 1.0 64.3 4.7 5.0
SMAJ36A CP YP 36.0 40.0 44.2 1.0 58.1 5.2 5.0
SMAJ40 CQ YQ 40.0 44.4 54.3 1.0 71.4 4.2 5.0
SMAJ40A CR YR 40.0 44.4 49.1 1.0 64.5 4.7 5.0
SMAJ43 CS YS 43.0 47.8 58.4 1.0 76.7 3.9 5.0
SMAJ43A CT YT 43.0 47.8 52.8 1.0 69.4 4.3 5.0
SMAJ45 CU YU 45.0 50.0 61.1 1.0 80.3 3.7 5.0
Test
Current
IT
RECOMMENDED PAD LAYOUT
The pad dimensions should be 0.010” (2.5mm) longer than the
contact size in the lead axis. This allows a solder fillet to form, see
figure below. Contact factory for soldering methods.
MODIFIED J-BEND
0.060 MIN
(1.52 MIN)
0.050 MIN
(1.27 MIN) 0.220 REF
0.094 MAX
(2.38 MAX)
Dimensions in inches and (millimeters
)
ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
Maximum
Device Maximum Clamping Maximum Reverse
Marking Code Working Peak Breakdown Voltage Voltage at IPPM Peak pulse Leakage
Reverse Voltage V(BR) (Volts) at ITVc (Volts) Surge Current IPPM at VWM
Device UNI BI VWM (Volts) Min. Max. (mA) (NOTE5) (NOTE 5) (Amps) ID (µµA)
SMAJ45A CV YV 45 50.0 55.3 1.0 72.7 4.1 5.0
SMAJ48 CW YW 48 53.3 65.1 1.0 85.5 3.5 5.0
SMAJ48A CX YX 48 53.3 58.9 1.0 77.4 3.9 5.0
SMAJ51 CY YY 51 56.7 69.3 1.0 91.1 3.3 5.0
SMAJ51A CZ YZ 51 56.7 62.7 1.0 82.4 3.6 5.0
SMAJ54 RD ZD 54 60.0 73.3 1.0 96.3 3.1 5.0
SMAJ54A RE ZE 54 60.0 66.3 1.0 87.1 3.4 5.0
SMAJ58 RF ZF 58 64.4 78.7 1.0 103.0 2.9 5.0
SMAJ58A RG ZG 58 64.4 71.2 1.0 93.6 3.2 5.0
SMAJ60 RH ZH 60 66.7 81.5 1.0 107.0 2.8 5.0
SMAJ60A RK ZK 60 66.7 73.7 1.0 96.8 3.1 5.0
SMAJ64 RL ZL 64 71.1 86.4 1.0 114.0 2.6 5.0
SMAJ64A RM ZM 64 71.1 78.6 1.0 103.0 2.9 5.0
SMAJ70 RN ZN 70 77.8 95.1 1.0 125 2.4 5.0
SMAJ70A RP ZP 70 77.8 86.0 1.0 113 2.7 5.0
SMAJ75 RQ ZQ 75 83.3 102 1.0 134 2.2 5.0
SMAJ75A RR ZR 75 83.3 92.1 1.0 121 2.5 5.0
SMAJ78 RS ZS 78 86.7 106 1.0 139 2.2 5.0
SMAJ78A RT ZT 78 86.7 95.8 1.0 126 2.4 5.0
SMAJ85 RU ZU 85 94.4 115 1.0 151 2.0 5.0
SMAJ85A RV ZV 85 94.4 104 1.0 137 2.2 5.0
SMAJ90 RW ZW 90 100 122 1.0 160 1.9 5.0
SMAJ90A RX ZX 90 100 111 1.0 146 2.1 5.0
SMAJ100 RY ZY 100 111 136 1.0 179 1.7 5.0
SMAJ100A RZ ZZ 100 111 123 1.0 162 1.9 5.0
SMAJ110 SD VD 110 122 149 1.0 196 1.5 5.0
SMAJ110A SE VE 110 122 135 1.0 177 1.7 5.0
SMAJ120 SF VF 120 133 163 1.0 214 1.4 5.0
SMAJ120A SG VG 120 133 147 1.0 193 1.6 5.0
SMAJ130 SH VH 130 144 176 1.0 231 1.3 5.0
SMAJ130A SK VK 130 144 159 1.0 209 1.4 5.0
SMAJ150 SL VL 150 167 204 1.0 268 1.1 5.0
SMAJ150A SM VM 150 167 185 1.0 243 1.2 5.0
SMAJ160 SN VN 160 178 218 1.0 287 1.0 5.0
SMAJ160A SP VP 160 178 197 1.0 259 1.2 5.0
SMAJ170 SQ VQ 170 189 231 1.0 304 0.99 5.0
SMAJ170A SR VR 170 189 209 1.0 275 1.09 5.0
This device is designed specifically for transient volt-
age suppression from threats generated by ESD for
board level load switching components.
The wide leads assure a large surface contact for
good heat dissipation, and a low resistance path for
surge current flow to ground.
This series is designed to optimize board space and
for use with surface mount technology automated
assembly equipment.
They can be easily mounted on printed circuit boards
and ceramic substrates to protect sensitive compo-
nents from transient voltage damage.
APPLICATION NOTES
Test
Current
IT
0 1.0 2.0 3.0 4.0
0
100
150
50
110100
0
10
20
30
40
50
0.1
µ
s1.0
µ
s10
µ
s 100
µ
s1.0ms 10ms
0.1
1.0
10
100
0 50 100 150 200
0
25
50
75
100
25 75 125 175
0 25 50 75 100 125 150 175 200
0
0.25
0.50
0.75
1.00
1 10 100 200
10
100
1,000
10,000
MAXIMUM RATINGS AND CHARACTERISTIC CURVES SMAJ5.0 THRU SMAJ170CA
105
84
63
42
21
0V
-21
-42
-63
-84
-105 010 20 30 40 50 60 70
FIG. 7 - Typical Response to 8KV Positive Going ESD Pulse
Per IEC1000 - 4-2 (IEC801-2)
t, TIME, nsec
LET THROUGH VOLTAGE, VOLTS
FIG. 1 - PEAK PULSE POWER RATING CURVE
PPPM, PEAK PULSE POWER, kW
td, PULSE WIDTH, sec.
TA, AMBIENT TEMPERATURE, °C
FIG. 4 - TYPICAL JUNCTION CAPACITANCE
FIG. 3 - PULSE WAVEFORM
t, TIME, ms
V(BR), BREAKDOWN VOLTAGE, VOLTS
TL, LEAD TEMPERATURE,°C
NUMBER OF CYCLES AT 60 HZ
IPPM, PEAK PULSE CURRENT, %
PEAK PULSE POWER (Ppp) or CURRENT (IPPM)
DERATING IN PERCENTAGE, %
CJ, JUNCTION CAPACITANCE, pF
IFSM, PEAK FORWARD SURGE CURRENT,
AMPERES
NON-REPETITIVE
PULSE WAVEFORM
SHOWN in FIG. 3
TA=25°C
PULSE WIDTH (td) is DEFINED
as the POINT WHERE the PEAK
CURRENT DECAYS
to 50% of IPPM
tr=10µsec.
TJ=25°C
f=1.0 MHZ
Vsig=50mVp-p
Measured at
Stand-off
Voltage, VWM
UNI-DIRECTIONAL
BI-DIRECTIONAL
1.6 x 1.6 x .040”
(40 x 40 x 1mm.)
COPPER HEAT SINKS
Device Used:
SMAJ15C
TJ=TJmax.
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
td
PEAK VALUE
IPPM
HALF VALUE - IPPM
2
10/1000µsec. WAVEFORM
as DEFINED by R.E.A.
FIG. 6 - MAXIMUM NON-REPETITIVE FORWARD SURGE
CURRENT UNIDIRECTIONAL ONLY
FIG. 5 - STEADY STATE POWER DERATING CURVE
PM(AV), STEADY STATE POWER DISSIPATION,
WATTS
FIG. 2 - PULSE DERATING CURVE
60 HZ
RESISTIVE OR INDUCTIVE LOAD
= 0.375”(9.5mm)
LEAD LENGTHS
L
