BB1660™, BB1660T™ Large BreadBoards
1660 tie point solderless plug-in breadboards provide a quick way to build
and test circuits for experimentation or when learning electronics.
BB1660 - 1660 tie-point plug-in Solderless BreadBoard
ABS plastic with color legend
2 IC/Circuit Areas, 2 x 630 tie-points
4 Distribution strips, 400 tie-points
Size: 6.5 x 4.4 x 0.3in
(165.1 x 109.2 x 8.5mm)
BB1660T – Transparent 1660 tie-point plug-in Solderless BreadBoard
Transparent ABS plastic with color legend
2 IC/Circuit Areas, 2 x 630 tie-points
4 Distribution strips, 400 tie-points
Size: 6.5 x 4.4 x 0.3in
(165.1 x 109.2 x 8.5mm)
The transparent breadboard is great for
beginners because they can see their circuit
connections.
BusBoard Prototype Systems - Built for designers
www.BusBoard.com sales@busboard.com BPS-DAT-(BB1660)-0001 Rev 1.00 Datasheet.doc
©2014 BusBoard Prototype Systems Ltd. “BB830” and “BB830T” are trademarks of BPS. All rights reserved.
Solderless Plug-in BreadBoards
Solderless BreadBoard Specifications
BB300 Body Material: White ABS Plastic with Black Printed Legend
BB400/BB830/BB1660 Body Material: White ABS Plastic with Color Printed Legend
BB400T/BB830T/BB1660T Body Material: Transparent ABS Plastic with Color Printed Legend
Hole Pitch/Style: 0.1" (2.54 mm), Square Wire Holes
ABS Heat Distortion Temperature: 84 C. (183 F.)
Spring Clip Contact: Phosphor Bronze with Plated Nickel Finish
Contact Life: 50,000 insertions
Rating: 36 Volts, 2 Amps
Insertion Wire Size: 21 to 26 AWG wire, or 0.025” Square post headers
0.016 to 0.028 inches diameter (0.4 to 0.7mm diameter)
Backing: Peelable adhesive tape for attaching to a surface.
Metal back plates provided with 1660 tie point breadboards.
Metal Back Plate Thickness: 0.031 inches (0.8mm)
All BPS BreadBoards are Lead-Free and RoHS Compliant.
Internal Connections
The BB1660 and BB1660T
breadboards have four rows of 63
vertical columns. Each column
has 5 connected holes each (the
green lines). This is the circuit
area. The are also 8 “rails” (or
distribution strips) for power and
ground running horizontally (the
red and blue lines).
A distribution strip can be used to
carry a signal if it is not needed
for power or ground.
BusBoard Prototype Systems - Built for designers
www.BusBoard.com sales@busboard.com BPS-DAT-(BB1660)-0001 Rev 1.00 Datasheet.doc
©2014 BusBoard Prototype Systems Ltd. “BB830” and “BB830T” are trademarks of BPS. All rights reserved.
Solderless BreadBoard FAQ
Q: What circuit frequencies can I use with a plug-in solderless breadboard?
A: Due to large stray capacitance (from 2-25pF per contact point), the inductance of connections, and a
relatively high and not very reproducible contact resistance, solderless breadboards are limited to operate at
relatively low frequencies, usually less than 10 MHz, depending on the nature of the circuit. The relatively
high contact resistance can also be a problem for some DC and very low frequency circuits.
Source http://en.wikipedia.org/wiki/Breadboard
Higher frequency operation may be possible in some cases, depending upon the circuit requirements.
Note: Solderable PC BreadBoards, such as the BPS BR1, SB300, SB400, SB404, SB830, and SB1660 will
provide lower stray capacitance and lower connection resistance which may allow higher frequency
operation for some circuits.
For circuits sensitive to small changes in values, component adjustments may be needed when the circuit is
moved from a plug-in breadboard to a Solderable PC BreadBoard, due to these small differences.
Q: Can I plug DIL or SIL connector headers into the breadboard?
A: Yes. The square pin of a standard 0.1” spacing header is typically 0.025 inches wide. This is within the
0.016 to 0.028 inch diameter wire insertion size range recommended for the breadboard.
Solderless BreadBoard NSFAQ
Q: Who invented the solderless breadboard?
A: US Patent #203938 was awarded to Ronald J. Portugal of EI Instruments Inc. in 1971.
Q: Why is phosphorus added to the bronze used in the contacts?
A: Phosphor bronze is an alloy of copper with 3.5 to 10% of tin and a significant phosphorus content of up to
1%. The phosphorus is added as deoxidizing agent during melting.
These alloys are notable for their toughness, strength, low coefficient of friction, and fine grain. The
phosphorus also improves the fluidity of the molten metal and thereby improves the castability, and improves
mechanical properties by cleaning up the grain boundaries.
Source http://en.wikipedia.org/wiki/Phosphor_bronze
BusBoard Prototype Systems - Built for designers
www.BusBoard.com sales@busboard.com BPS-DAT-(BB1660)-0001 Rev 1.00 Datasheet.doc
©2014 BusBoard Prototype Systems Ltd. “BB830” and “BB830T” are trademarks of BPS. All rights reserved.
