Datasheet Single-Output LDO Regulators 35V Voltage Resistance 1A LDO Regulators BDxxC0A-C series BDxxC0AW-C series General Description The BDxxC0A-C series and the BDxxC0AW-C series are low-saturation regulators. This series feature variable and fixed voltage output with selectable Shutdown switch (referred to as SW); Vout-3.3V, 5.0V, 8.0V and 9.0V.Five conventional PKGs; TO252-3/5, HRP5 and TO263-3(F)/5 are available. This series has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a thermal Shutdown circuit that protects the IC from thermal damage due to overloading. Packages Features 1) Output current capability: 1A 2) Output voltage: Variable, 3.3V, 5.0V, 8.0V and 9.0V 3) High output voltage accuracy (Ta=25C, TO252-3/5, HRP5): 1% 4) Low saturation with PDMOS output 5) Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits 6) Built-in thermal Shutdown circuit for protecting the IC from thermal damage due to overloading 7) Low ESR Capacitor 8) TO252-3/5, HRP5, TO263-3(F)/5 package 9) AEC-Q100 Qualified (Note 1) (Note 1: Grade 1) Key Specifications Supply Voltage(Vo 3.0V): Vo+1.0V to 26.5V Supply Voltage(Vo < 3.0V): 4.0V to 26.5V Output Voltage(BD00C0AW): 1.0V to 15.0V Output Current: 1A Output Voltage Precision (Ta=25C): 1% (TO252-3/5, HRP5) (-40C Ta +125C): 3% Operating Temperature Range: -40C Ta +125C W(Typ) x D(Typ) x H(Max) TO252-5 6.50mm x 9.50mm x 2.50mm TO252-3 6.50mm x 9.50mm x 2.50mm HRP5 9.395mm x 10.540mm x 2.005mm TO263-5 10.16mm x 15.10mm x 4.70mm TO263-3(F) 10.16mm x 15.10mm x 4.70mm Applications Automotive (body, audio system, navigation system, etc.) Ordering part number B D x Output voltage 00: Variable 33: 3.3V 50: 5.0V 80: 8.0V 90: 9.0V x C 0 Current capacity C0A: 1A Product structureSilicon monolithic integrated circuit www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211114001 A W SW W: With SW None: Without SW x x x Package FP: TO252-3/5 HFP: HRP5 FP2: TO263-3(F)/5 - C x x Packaging and forming specification E2: Embossed tape and reel (TO252-3/5, TO263-3(F)/5) TR: Embossed tape and reel (HRP5) This product is not designed protection against radioactive rays. 1/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Lineup Articles Variable 3.3 5.0 8.0 9.0 Package BDxxC0AWFP-CE2 TO252-5 Reel of 2000 BDxxC0AFP-CE2 - TO252-3 Reel of 2000 BDxxC0AWHFP-CTR HRP5 Reel of 2000 BDxxC0AHFP-CTR - HRP5 Reel of 2000 BDxxC0AWFP2-CE2 TO263-5 Reel of 500 BDxxC0AFP2-CE2 - TO263-3(F) Reel of 500 Typical Application Circuits Output Voltage Variable Type (With SW) Vcc Vo R2 Vcc Cin CTL Cout ADJ GND R1 Figure 1. Typical Application Circuit Output Voltage Variable Type (With SW) Output Voltage Fixation Type (With SW) Vcc Vcc Vo CTL N.C. Cin Cout GND Figure 2. Typical Application Circuit Output Voltage Fixation Type (With SW) Output Voltage Fixation Type (Without SW) Vcc Vcc Vo Cin Cout GND Figure 3. Typical Application Circuit Output Voltage Fixation Type (Without SW) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Pin Configurations/Pin Descriptions With SW (TO252-5/HRP5/TO263-5) TO252-5 (TOP VIEW) TO263-5 (TOP VIEW) HRP5 (TOP VIEW) FIN FIN 1 2 1 2 3 4 5 3 4 5 1 2 3 4 5 HRP5 TO252-5 TO263-5 Figure 4. Pin Configurations (With SW) Pin No. Pin Name Function 1 CTL Output Control Pin 2 Vcc Power Supply Pin 3 N.C. (Note 1) GND N.C. Pin (TO252-5) GND (HRP5/TO263-5) 4 Vo Output Pin 5 ADJ N.C. (Note 1) Variable Pin (BD00C0AW) N.C. Pin (BD33/50/80/90C0AW) FIN GND GND (Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC. Without SW (TO252-3/TO263-3(F)) TO263-3(F) (TOP VIEW) TO252-3 (TOP VIEW) FIN 1 2 3 1 2 3 TO263-3(F) TO252-3 Figure 5. Pin Descriptions (Without SW) Pin No. Pin Name Function 1 Vcc Power Supply Pin 2 N.C. (Note 1) GND N.C. Pin (TO252-3) GND (TO263-3(F)) 3 Vo Output Pin FIN GND GND (Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Without SW (HRP5) HRP5 (TOP VIEW) FIN 1 2 3 4 5 HRP5 Figure 6. Pin Descriptions (Without SW) (HRP5) Pin No. Pin Name Function 1 Vcc Power Supply Pin 2 N.C. (Note 1) N.C. Pin 3 GND GND 4 N.C. N.C. Pin 5 Vo Output Pin FIN GND GND (Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Block Diagrams BD00C0AWFP/WHFP/WFP2-C (Output Voltage Variable Type, With SW) TO252-5/HRP5/TO263-5 FIN GND VREF OCP TSD Driver :Bandgap Reference :Over Current Protection Circuit :Thermal Shut Down Circuit :Power Transistor Driver VREF Driver OCP TSD 1 2 CTL Vcc 3 N.C.(TO252-5 GND(HRP5/TO263-5 4 5 Vo ADJ Figure 7. Block diagram BD00C0AWFP/WHFP/WFP2-C (Output Voltage Variable Type, With SW) BDxxC0AWFP/WHFP/WFP2-C (Output Voltage Fixation Type, With SW) TO252-5/HRP5/TO263-5 FIN GND VREF OCP TSD Driver :Bandgap Reference :Over Current Protection Circuit :Thermal Shut Down Circuit :Power Transistor Driver VREF Driver OCP TSD 1 2 CTL Vcc 3 N.C.(TO252-5 GND(HRP5/TO263-5) 4 5 Vo N.C. Figure 8. Block diagram BDxxC0AWFP/WHFP/WFP2-C (Output Voltage Fixation Type, With SW) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series BDxxC0AFP/HFP/FP2-C (Output Voltage Fixation Type, Without SW) TO252-3/TO263-3(F) FIN GND VREF OCP TSD Driver VREF :Bandgap Reference :Over Current Protection Circuit :Thermal Shut Down Circuit :Power Transistor Driver Driver OCP TSD 1 2 Vcc 3 Vo N.C.(TO252-3 GND(TO263-3(F) Figure 9. Block diagram BDxxC0AFP/FP2-C (Output Voltage Fixation Type, Without SW) HRP5 FIN GND VREF OCP TSD Driver :Bandgap Reference :Over Current Protection Circuit :Thermal Shut Down Circuit :Power Transistor Driver VREF Driver OCP TSD 1 2 3 4 5 Vcc N.C. GND N.C. Vo Figure 10. Block diagram BDxxC0AHFP-C (Output Voltage Fixation Type, Without SW) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Absolute Maximum Ratings (Ta= 25C) Parameter Symbol Supply Voltage (Note 1) Vcc Output Control Voltage (With SW) (Note 2) VCTL Operating Temperature Range Topr Storage Temperature Range Tstg Maximum Junction Temperature Tjmax Ratings -0.3 to +35.0 -0.3 to +35.0 -40 to +125 -55 to +150 150 Unit V V C C C (Note 1) Do not exceed Pd (Please refer to Power Dissipation in P.27-29). (Note 2) The order of starting up power supply (Vcc) and CTL pin doesn't have either in the problem within the range of the operation power-supply voltage ahead. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (-40C Ta +125C) Parameter Symbol Min Supply Voltage (Vo 3.0V) Vcc Vo+1 Supply Voltage (Vo < 3.0V) Vcc 4.0 Startup Voltage (Io=0mA) Vcc Output Control Voltage (With SW) VCTL 0 Output Current Io 0 Output Voltage (BD00C0AW) (Note 1) Vo 1.0 Max. 26.5 26.5 3.8 26.5 1.0 15.0 Unit V V V V A V (Note 1) Please refer to Notes15 for use when you use BD00C0AW by output voltage 1.0V Vo < 3.0V. Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) JA 136 23 C/W JT 17 3 C/W JA 120 22 C/W JT 8 3 C/W JA 81 21 C/W JT 8 2 C/W TO252-3, TO252-5 Junction to Ambient Junction to Top Characterization Parameter(Note 2) HRP5 Junction to Ambient Junction to Top Characterization Parameter(Note 2) TO263-3(F), TO263-5 Junction to Ambient Junction to Top Characterization Parameter(Note 2) (Note 1)Based on JESD51-2A (Still-Air) (Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3)Using a PCB board based on JESD51-3. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70m (Note 4)Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Thermal Via(Note 5) Pitch Diameter 1.20mm 0.30mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70m 74.2mm x 74.2mm 35m 74.2mm x 74.2mm 70m (Note 5) This thermal via connects with the copper pattern of all layers. The placement and dimensions obey a land pattern. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Electrical Characteristics Unless otherwise specified, -40C Ta +125C, Vcc=13.5V, Io=0mA, VCTL=5.0V (With SW) The resistor of between ADJ and Vo =56.7k, ADJ and GND =10k (BD00C0AW) Guaranteed Limit Parameter Symbol Unit Min. Typ. Max. Conditions Shutdown Current (With SW) Isd - 0 5 A Circuit Current ADJ Terminal Voltage (BD00C0AWFP/WHFP) ADJ Terminal Voltage (BD00C0AW) Output Voltage (BD33/50C0A(W9FP/(W)HFP) Output Voltage (BD33/50C0A(W)) Output Voltage (BD80/90C0A(W)FP/(W)HFP) Output Voltage (BD80/90C0A(W)) Dropout Voltage (BD00/50/80/90C0A(W)) Ib - 0.5 2.5 mA VADJ 0.742 0.750 0.758 V Io=50mA, Ta=25C VADJ 0.727 0.750 0.773 V Io=50mA Vo Vox0.99 Vo Vox1.01 V Io=200mA, Ta=25C Vo Vox0.97 Vo Vox1.03 V Io=200mA Vo Vox0.99 Vo Vox1.01 V Io=500mA, Ta=25C Vo Vox0.97 Vo Vox1.03 V Io=500mA Vd - 0.3 0.5 V Vcc=Vox0.95,Io=500mA Ripple Rejection (BD00/33/50C0A(W)) R.R. 45 55 - dB Ripple Rejection (BD80/90C0A(W)) R.R. 40 50 - dB Line Regulation Reg.I - Reg.L - CTL ON Mode Voltage (With SW) VthH 2.0 80 Vo x0.020 mV Load Regulation 20 Vo x0.010 CTL OFF Mode Voltage (With SW) VthL 0.8 CTL Bias Current (With SW) ICTL 25 50 A www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/43 VCTL=0V f=120Hz, Input Voltage Ripple =1Vms, Io=100mA f=120Hz, Input Voltage Ripple =1Vms, Io=100mA Vo+1.0V VCC 26.5V V 5mA Io 1A V ACTIVE MODE V OFF MODE TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data BD00C0AW-C series(Vo=5.0V) Unless otherwise specified, -40C Ta +125C, Vcc=13.5V, VCTL=5.0V, Io=0mA, Vo=5.0V (The resistor of between ADJ and Vo =56.7k, ADJ and GND =10k) 18 1.0 0.8 0.6 0.4 Ta=-40 0.2 Shutdown Current:Isd [A] Circuit Current:Ib+IFEEDBACK_R [mA] Ta=-40 15 Ta=25 Ta=125 12 9 6 3 Ta=25 Ta=125 0 0.0 0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 2 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Supply Voltage:Vcc [V] Figure 11. Circuit Current (IFEEDBACK_R(Note 1) 75A) Figure 12. Shutdown Current (VCTL=0V) 6 6 5 5 Output Voltage:Vo [V] Output Voltage:Vo [V] (Note 1) IFEEDBACK_R is the current flowing into external feedback resistance. 4 3 2 4 3 2 Ta=-40 Ta=-40 Ta=25 1 Ta=25 1 Ta=125 Ta=125 0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 0 Supply Voltage:Vcc [V] 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Figure 14. Line Regulation (Io=500mA) Figure 13. Line Regulation (Io=0mA) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2 9/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data - continued 1,000 6 Ta=-40 900 Dropout Voltage : Vd [mV] Output Voltage:Vo [V] 5 4 3 2 Ta=-40 1 Ta=25 Ta=25 800 Ta=125 700 600 500 400 300 200 100 Ta=125 0 0 0 400 800 1200 1600 2000 0 2400 200 400 600 800 Output Current:Io [mA] Output Current:Io [mA] Figure 15. Load Regulation Figure 16. Dropout Voltage (Vcc=Vox0.95=4.75V) 1000 5.15 80 Ta=-40 Ta=25 60 5.10 Output Voltage: Vo [V] Ripple Rejection:R.R. [dB] 70 Ta=125 50 40 30 5.05 5.00 4.95 20 4.90 10 0 10 100 1000 10000 100000 1000000 Frequency: f [Hz] -40 -20 0 20 40 60 80 100 120 Ambient Temperature: [] Figure 18. Output Voltage Temperature Characteristic Figure 17. Ripple Rejection (lo=100mA) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4.85 10/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data - continued 180 1.0 CTL Bias Current:ICTL [A] Circuit Current:Ib+IFEEDBACK_R [mA] 160 0.8 0.6 0.4 Ta=-40 0.2 Ta=25 140 120 100 80 60 Ta=-40 40 Ta=25 Ta=125 20 Ta=125 0.0 0 200 400 600 800 0 1000 0 Output Current:Io [mA] 2 4 6 8 10 12 14 16 18 20 22 24 26 Control Voltage: V CTL[V] Figure 20. CTL Current vs CTL Voltage 6 6 5 5 Output Voltage:Vo [V] Output Voltage:Vo [V] Figure 19. Circuit Current (0mA Io 1000mA, IFEEDBACK_R 75A) 4 3 2 4 3 2 Ta=-40 1 1 Ta=25 Ta=125 0 0 0 2 4 6 130 8 10 12 14 16 18 20 22 24 26 150 160 170 180 190 Figure 22. Thermal Shutdown Circuit Characteristic Figure 21. Output Voltage vs CTL Voltage www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 140 Ambient Temperature:Ta [] Control Voltage: VCTL[V] 11/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Measurement setup for reference data BD00C0AW-C series (Vo=5.0V) Vcc Vo Vcc Vcc Vo Vo 56.7k 1F 1F 56.7k CTL ADJ 1F 56.7k CTL 1F ADJ GND CTL 1F 5V ADJ GND GND 10k 1F 10k 5V 10k FEEDBACK _R Measurement setup for Figure 11 Vcc Measurement setup for Figure 12 Vcc Vo Vo Vcc 56.7k 1F 1F CTL ADJ GND 1F CTL 13.5V 1F ADJ GND 500mA 10k 5V 1F CTL 4.75V Measurement setup for Figure 14 1F 10k 5V Measurement setup for Figure 15 Vcc Vo Measurement setup for Figure 16 Vcc Vo Vo 56.7k 56.7k 56.7k 1Vrms ADJ GND 10k 5V Vcc Vo 56.7k 56.7k 1F 1F 1F CTL 13.5V V ADJ GND CTL 13.5V 1F 100mA 10k CTL 13.5V ADJ GND 1F ADJ 10k GND 1F 10k 5V FEEDBACK _R 5V 5V Measurement setup for Figure 17 Vcc Measurement setup for Figure 18 Vcc Vo Measurement setup for Figure 19 Vcc Vo 56.7k 1F 1F 1F CTL ADJ GND Vo 56.7k 56.7k 13.5V Measurement setup for Figure 13 1F 10k 13.5V CTL ADJ GND 1F CTL 13.5V ADJ GND 10k 1F 10k 5V Measurement setup for Figure 20 www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Measurement setup for Figure 21 12/43 Measurement setup for Figure 22 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data BD33C0A-C/ BD33C0AW-C series Unless otherwise specified, -40C Ta +125C, Vcc=13.5V, VCTL=5.0V (With SW), Io=0mA 1.0 18 0.8 Shutdown Current:Isd [A] Circuit Current:Ib [mA] Ta=-40 0.6 0.4 Ta=-40 0.2 Ta=25 15 Ta=25 Ta=125 12 9 6 3 Ta=125 0.0 0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 0 Supply Voltage:Vcc [V] 2 4 6 5 5 Output Voltage:Vo [V] Output Voltage:Vo [V] Figure 24. Shutdown Current (VCTL=0V) 6 4 3 2 Ta=-40 4 3 2 Ta=-40 Ta=25 Ta=25 1 Ta=125 Ta=125 0 0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 0 Supply Voltage:Vcc [V] 2 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Figure 26. Line Regulation (Io=500mA) Figure 25. Line Regulation (Io=0mA) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Figure 23. Circuit Current 1 6 13/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data - continued 6 80 Ta=-40 5 70 Ta=25 Ripple Rejection:R.R. [dB] Output Voltage:Vo [V] Ta=-40 Ta=125 4 3 2 1 Ta=25 60 Ta=125 50 40 30 20 10 0 0 0 400 800 1200 1600 2000 2400 10 100 Output Current:Io [mA] 1000 10000 100000 1000000 Frequency: f [Hz] Figure 27. Load Regulation Figure 28. Ripple Rejection (lo=100mA) 3.38 1.0 0.8 3.34 Circuit Current:Ib [mA] Output Voltage: Vo [V] 3.36 3.32 3.30 3.28 3.26 0.6 0.4 Ta=-40 0.2 Ta=25 3.24 Ta=125 3.22 -40 -20 0 20 40 60 80 100 0.0 120 0 Ambient Temperature: [] 400 600 800 1000 Output Current:Io [mA] Figure 29. Output Voltage Temperature Characteristic www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 200 14/43 Figure 30. Circuit Current TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data - continued 180 6 5 140 Output Voltage:Vo [V] CTL Bias Current:ICTL [A] 160 120 100 80 60 Ta=-40 40 3 2 Ta=-40 Ta=25 20 4 1 Ta=25 Ta=125 Ta=125 0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 0 Control Voltage: V CTL[V] 2 4 6 8 10 12 14 16 18 20 22 24 26 Control Voltage: VCTL[V] Figure 31. CTL Current vs CTL Voltage Figure 32. Output Voltage vs CTL Voltage 6 Output Voltage:Vo [V] 5 4 3 2 1 0 130 140 150 160 170 180 190 Ambient Temperature:Ta [] Figure 33. Thermal Shutdown Circuit Characteristic www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data BD50C0A-C/ BD50C0AW-C series Unless otherwise specified, -40C Ta +125C, Vcc=13.5V, VCTL=5.0V (With SW), Io=0mA 18 Ta=-40 Shutdown Current:Isd [A] Circuit Current:Ib [mA] 1.0 0.8 0.6 0.4 Ta=-40 0.2 Ta=25 15 Ta=25 Ta=125 12 9 6 3 Ta=125 0.0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Supply Voltage:Vcc [V] Figure 34. Circuit Current Figure 35. Shutdown Current (VCTL=0V) 6 6 5 5 Output Voltage:Vo [V] Output Voltage:Vo [V] 0 4 3 2 Ta=-40 Ta=25 1 4 3 2 Ta=-40 Ta=25 1 Ta=125 Ta=125 0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Supply Voltage:Vcc [V] Figure 36. Line Regulation (Io=0mA) Figure 37. Line Regulation (Io=500mA) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data - continued 6 1,000 Ta=-40 900 Dropout Voltage : Vd [mV] Output Voltage:Vo [V] 5 4 3 2 Ta=-40 1 Ta=25 Ta=25 800 Ta=125 700 600 500 400 300 200 100 Ta=125 0 0 0 400 800 1200 1600 2000 2400 0 200 Output Current:Io [mA] 400 600 800 1000 Output Current:Io [mA] Figure 38. Load Regulation Figure 39. Dropout Voltage (Vcc=Vox0.95V=4.75V) 80 5.15 Ta=-40 Ta=25 60 5.10 Output Voltage: Vo [V] Ripple Rejection:R.R. [dB] 70 Ta=125 50 40 30 5.05 5.00 4.95 20 4.90 10 4.85 0 10 100 1000 10000 100000 1000000 -20 0 20 40 60 80 100 120 Ambient Temperature: [] Frequency: f [Hz] Figure 41. Output Voltage Temperature Characteristic Figure 40. Ripple Rejection (lo=100mA) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 -40 17/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data - continued 1.0 180 CTL Bias Current:ICTL [A] 160 Circuit Current:Ib [mA] 0.8 0.6 0.4 Ta=-40 0.2 120 100 80 60 Ta=-40 40 Ta=25 Ta=25 20 Ta=125 Ta=125 0 0.0 0 200 400 600 800 1000 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Output Current:Io [mA] Control Voltage: V CTL[V] Figure 42. Circuit Current Figure 43. CTL Current vs CTL Voltage 6 6 5 5 Output Voltage:Vo [V] Output Voltage:Vo [V] 140 4 3 2 4 3 2 Ta=-40 1 Ta=25 1 Ta=125 0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 130 Control Voltage: VCTL[V] 150 160 170 180 190 Ambient Temperature:Ta [] Figure 45. Thermal Shutdown Circuit Characteristic Figure 44. Output Voltage vs CTL Voltage www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 140 18/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data BD80C0A-C/ BD80C0AW-C series Unless otherwise specified, -40C Ta +125C, Vcc=13.5V, VCTL=5.0V (With SW), Io=0mA 18 1.2 1.0 Shutdown Current:Isd [A] Circuit Current:Ib [mA] Ta=-40 0.8 0.6 0.4 Ta=-40 0.2 15 Ta=25 Ta=125 12 9 6 3 Ta=25 Ta=125 0 0.0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 2 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Supply Voltage:Vcc [V] Figure 46. Circuit Current Figure 47. Shutdown Current (VCTL=0V) 10 10 9 9 8 8 Output Voltage:Vo [V] Output Voltage:Vo [V] 0 7 6 5 4 3 Ta=-40 2 Ta=25 1 Ta=125 0 7 6 5 4 3 Ta=-40 2 Ta=25 1 Ta=125 0 0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 2 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Supply Voltage:Vcc [V] Figure 48. Line Regulation (Io=0mA) Figure 49. Line Regulation (Io=500mA) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 19/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data - continued 9 900 8 800 Dropout Voltage : Vd [mV] 1,000 Output Voltage:Vo [V] 10 7 6 5 4 3 Ta=-40 2 Ta=25 1 800 1200 1600 2000 Ta=125 700 600 500 400 300 200 0 400 Ta=25 100 Ta=125 0 Ta=-40 0 2400 0 200 Output Current:Io [mA] 600 800 1000 Figure 51. Dropout Voltage (Vcc=Vox0.95V=7.6V) Figure 50. Load Regulation 8.20 80 Ta=-40 8.15 70 Ta=25 60 Output Voltage: Vo [V] Ripple Rejection:R.R. [dB] 400 Output Current:Io [mA] Ta=125 50 40 30 8.10 8.05 8.00 7.95 20 7.90 10 7.85 7.80 0 10 100 1000 10000 100000 1000000 -20 0 20 40 60 80 100 120 Ambient Temperature: [] Frequency: f [Hz] Figure 52. Ripple Rejection (lo=100mA) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 -40 Figure 53. Output Voltage Temperature Characteristic 20/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data - continued 180 1.0 CTL Bias Current:ICTL [A] 160 Circuit Current:Ib [mA] 0.8 0.6 0.4 Ta=-40 0.2 140 120 100 80 60 Ta=25 Ta=25 20 Ta=125 Ta=125 0 0.0 0 200 400 600 800 1000 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Output Current:Io [mA] Control Voltage: VCTL[V] Figure 54. Circuit Current Figure 55. CTL Current vs CTL Voltage 10 10 9 9 8 8 Output Voltage:Vo [V] Output Voltage:Vo [V] Ta=-40 40 7 6 5 4 3 Ta=-40 2 6 5 4 3 2 Ta=25 1 7 1 Ta=125 0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 130 140 150 160 170 180 190 Control Voltage: VCTL[V] Ambient Temperature:Ta [] Figure 56. Output Voltage vs CTL Voltage Figure 57. Thermal Shutdown Circuit Characteristic www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 21/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data BD90C0A-C/ BD90C0AW-C series Unless otherwise specified, -40C Ta +125C, Vcc=13.5V, VCTL=5.0V (With SW), Io=0mA 18 1.2 Ta=-40 Shutdown Current:Isd [A] Circuit Current:Ib[mA] 1.0 0.8 0.6 0.4 Ta=-40 0.2 15 Ta=25 Ta=125 12 9 6 3 Ta=25 Ta=125 0.0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Supply Voltage:Vcc [V] Figure 58. Circuit Current Figure 59. Shutdown Current (VCTL=0V) 10 10 9 9 8 8 Output Voltage:Vo [V] Output Voltage:Vo [V] 0 7 6 5 4 3 Ta=-40 2 Ta=25 1 Ta=125 0 7 6 5 4 3 Ta=-40 2 Ta=25 1 Ta=125 0 0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 Figure 60. Line Regulation (Io=0mA) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Supply Voltage:Vcc [V] Figure 61. Line Regulation (Io=500mA) 22/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data - continued 9 900 8 800 Dropout Voltage : Vd [mV] 1,000 Output Voltage:Vo [V] 10 7 6 5 4 3 Ta=-40 2 Ta=25 1 800 1200 1600 2000 Ta=125 700 600 500 400 300 200 0 400 Ta=25 100 Ta=125 0 Ta=-40 0 2400 0 200 400 600 800 Output Current:Io [mA] Output Current:Io [mA] Figure 62. Load Regulation Figure 63. Dropout Voltage (Vcc=Vox0.95V=8.55V) 1000 9.20 80 Ta=-40 70 9.15 60 Output Voltage: Vo [V] Ripple Rejection:R.R. [dB] Ta=25 Ta=125 50 40 30 9.10 9.05 9.00 8.95 20 8.90 10 8.85 0 8.80 10 100 1000 10000 100000 1000000 -40 -20 0 20 40 60 80 Frequency: f [Hz] Ambient Temperature: [] Figure 64. Ripple Rejection (Io =100mA) Figure 65. Output Voltage Temperature Characteristic www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 23/43 100 120 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Reference Data - continued 180 1.0 CTL Bias Current:ICTL [A] Circuit Current:Ib [mA] 160 0.8 0.6 0.4 Ta=-40 0.2 140 120 100 80 60 Ta=-40 40 Ta=25 Ta=25 20 Ta=125 Ta=125 0 0.0 0 200 400 600 800 0 1000 2 4 6 Output Current:Io [mA] Control Voltage: V CTL[V] Figure 66. Circuit Current Figure 67. CTL Current vs CTL Voltage 10 10 9 9 8 8 Output Voltage:Vo [V] Output Voltage:Vo [V] 8 10 12 14 16 18 20 22 24 26 7 6 5 4 3 7 6 5 4 3 Ta=-40 2 2 Ta=25 1 1 Ta=125 0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 130 Control Voltage: VCTL[V] 150 160 170 180 190 Ambient Temperature:Ta [] Figure 69. Thermal Shutdown Circuit Characteristic Figure 68. Output Voltage vs CTL Voltage www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 140 24/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Measurement setup for reference data BDxxC0AW-C series(Output Voltage Fixation Type) Vcc Vcc Vo (1.0F) 2.2F (1.0F) 2.2F 1F CTL Vo 1F CTL N.C. CTL N.C. GND GND GND 5V Measurement setup for Figure 23, 34, 46 and 58 Vcc Measurement setup for Figure 24, 35, 47 and 59 Measurement setup for Figure 25, 36, 48 and 60 Vo (1.0F) 2.2F 1F CTL Vcc Vo CTL N.C. (1.0F) 2.2F N.C. GND 500mA Vcc Vo CTL N.C. (1.0F) 2.2F GND Vcc Vo CTL N.C. (1.0F) 2.2F V Measurement setup for Figure 39, 51 and 63 Measurement setup for Figure 28, 40, 52 and 64 GND GND Vcc Vo CTL N.C. (1.0F) 2.2F 1F N.C. N.C. 5V Measurement setup for Figure 29, 41, 53 and 65 Vo CTL CTL 1F 13.5V 5V (1.0F) 2.2F Vo GND 100mA 5V Vcc Vcc (1.0F) 2.2F 1F 13.5V N.C. 5V Measurement setup for Figure 27, 38, 50 and 62 1F CTL GND 5V Measurement setup for Figure 26, 37, 49 and 61 Vo 1F Vox 0.95V GND Vcc (1.0F) 2.2F 1F 13.5V 5V 13.5V Vo 1F N.C. 5V 13.5V Vcc (1.0F) 2.2F 13.5V Measurement setup for Figure 30, 42, 54 and 66 Vcc Vo CTL N.C. (1.0F) 2.2F 1F 1F 13.5V GND GND 5V Measurement setup for Figure 31, 43, 55 and 67 www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Measurement setup for Figure 32, 44, 56 and 68 25/43 Measurement setup for Figure 33, 45, 57 and 69 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Application Examples Applying positive surge to the Vcc pin If the possibility exists that surges higher than 35.0V will be applied to the Vcc pin, a zenar diode should be placed between the Vcc pin and GND pin as shown in the Figure below. Vcc GND Figure 70 Applying negative surge to the Vcc pin If the possibility exists that negative surges lower than the GND are applied to the Vcc pin, a schottky diode should be place between the Vcc pin and GND pin as shown in the Figure below. Vcc GND Figure 71 Implementing a protection diode If the possibility exists that a large inductive load is connected to the output pin resulting in back-EMF at time of startup and Shutdown, a protection diode should be placed as shown in the Figure below. Vo Figure 72 www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 26/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Thermal Design TO252-3 10.0 IC mounted on ROHM standard board based on JEDEC. : 1 - layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.57 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. Power Dissipation: Pd[W] 8.0 5.43 W 6.0 4.0 2.0 0.92 W 0.0 0 25 50 75 100 125 150 Ambient Temperature: Ta [ C] Figure 73. TO252-3 Package Data : 4 - layer PCB (2 inner layers and Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.60 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of PCB : 74.2 mm x 74.2 mm, 1 oz. copper. Copper foil area on the reverse side of PCB : 74.2 mm x 74.2 mm, 2 oz. copper. Condition: JA = 81 C / W, JT (top center) = 8 C / W Condition: JA = 21 C / W, JT (top center) = 2 C / W TO252-5 10.0 IC mounted on ROHM standard board based on JEDEC. : 1 - layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.57 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. Power Dissipation: Pd[W] 8.0 6.0 5.43 W 4.0 2.0 0.92 W 0.0 0 25 50 75 100 125 Ambient Temperature: Ta [ C] Figure 74. TO252-5 Package Data 150 : 4 - layer PCB (2 inner layers and Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.60 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of PCB : 74.2 mm x 74.2 mm, 1 oz. copper. Copper foil area on the reverse side of PCB : 74.2 mm x 74.2 mm, 2 oz. copper. Condition: JA = 136 C / W, JT (top center) = 17 C / W Condition: JA = 23 C / W, JT (top center) = 3 C / W www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 27/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Thermal Design - continued HRP5 10.0 IC mounted on ROHM standard board based on JEDEC. : 1 - layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.57 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. Power Dissipation: Pd[W] 8.0 6.0 5.68 W 4.0 2.0 1.04 W 0.0 0 25 50 75 100 125 Ambient Temperature: Ta [ C] Figure 75. HRP5 Package Data 150 : 4 - layer PCB (2 inner layers and Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.60 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of PCB : 74.2 mm x 74.2 mm, 1 oz. copper. Copper foil area on the reverse side of PCB : 74.2 mm x 74.2 mm, 2 oz. copper. Condition: JA = 120 C / W, JT (top center) = 8 C / W Condition: JA = 22 C / W, JT (top center) = 3 C / W www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 28/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Thermal Design - continued TO263-3(F) 10.0 IC mounted on ROHM standard board based on JEDEC. : 1 - layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.57 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. Power Dissipation: Pd[W] 8.0 5.95 W 6.0 4.0 1.54 W 2.0 0.0 0 25 50 75 100 125 150 Ambient Temperature: Ta [ C] Figure 76. TO263-3 Package Data : 4 - layer PCB (2 inner layers and Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.60 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of PCB : 74.2 mm x 74.2 mm, 1 oz. copper. Copper foil area on the reverse side of PCB : 74.2 mm x 74.2 mm, 2 oz. copper. Condition: JA = 81 C / W, JT (top center) = 8 C / W Condition: JA = 21 C / W, JT (top center) = 2 C / W TO263-5 10.0 IC mounted on ROHM standard board based on JEDEC. : 1 - layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.57 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. Power Dissipation: Pd[W] 8.0 5.95 W 6.0 4.0 1.54 W 2.0 0.0 0 25 50 75 100 125 Ambient Temperature: Ta [ C] Figure 77. TO263-5 Package Data 150 : 4 - layer PCB (2 inner layers and Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.60 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of PCB : 74.2 mm x 74.2 mm, 1 oz. copper. Copper foil area on the reverse side of PCB : 74.2 mm x 74.2 mm, 2 oz. copper. Condition: JA = 81 C / W, JT (top center) = 8 C / W Condition: JA = 21 C / W, JT (top center) = 2 C / W www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 29/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series When operating at temperature more than Ta=25C, please refer to the power dissipation characteristic curve shown in Figure 73 to 77. The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at temperatures less than the maximum junction temperature Tjmax. Figure. 73 to 77 shows the acceptable power dissipation characteristic curves of the TO252-3/5, HRP5 and TO263-3(F)/5 packages. Even when the ambient temperature (Ta) is at normal temperature (25C), the chip junction temperature (Tj) may be quite high so please operate the IC at temperatures less than the acceptable power dissipation. The calculation method for power consumption Pc(W) is as follows Pc=(VccVo)xIo+VccxIb Acceptable loss Pd Pc Vcc Vo Io Ib Solving this for load current Io in order to operate within the acceptable loss Io PdVccxIb VccVo (Please refer to 19, 30, 42, 54 and 66 about Ib.) : Input voltage : Output voltage : Load current : Circuit current It is then possible to find the maximum load current Iomax with respect to the applied voltage Vcc at the time of thermal design. Calculation Example) When TO252-3 / TO252-5, 4-layer PCB, Ta=85C, Vcc=13.5V, Vo=5.0V Io 2.82413.5xIb 8.5 Io 331.3mA (Ib0.6mA) Figure 73, 74 ja=23C /W -43.5mW/C 25C = 5.43W 85C =2.824W Calculation Example) When HRP5, 4-layer PCB, Ta=85C, Vcc=13.5V, Vo=5.0V 2.95413.5xIb 8.5 Io 346.6mA (Ib: 0.6mA) Io Figure 75 ja=22C /W -45.5mW/C 25C =5.68W 85C =2.954W Calculation Example) When TO263-3(F) / TO263-5, 4-layer PCB, Ta=85C, Vcc=13.5V, Vo=5.0V 3.09413.5xIb 8.5 Io 363mA (Ib: 0.6mA) Io Figure 76, 77 ja=21C /W -47.6mW/C 25C =5.95W 85C =3.094W Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature ranges. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 30/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series I/O equivalence circuit Vcc Terminal CTL Terminal (With SW) 200k (Typ) Vcc 1k (Typ) CTL 200k (Typ) IC Vo Terminal BD33/50/80/90C0A(W) Vcc R1 (k) (Typ) R3 Vo R2 BD33C0A(W) BD50C0A(W) BD80C0A(W) BD90C0A(W) 10 5 R2 (k) (Typ) 34 56.6 48.3 55 R3 (k) (Typ) 15 20 R1 BD00C0AW Vo Terminal ADJ Terminal Vcc 1k (Typ) Vo 15k (Typ) ADJ Vo 20k (Typ) 1k (Typ) Figure 78 Output Voltage Configuration Method (BD00C0AW) Please connect resistors R1 and R2 (which determines the output voltage) as shown in Figure 79. Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistor values are large. Due to this, resistance ranging from 5k to 10k is highly recommended for R1. Vo R2 ADJ 0.75V (Typ) IC ADJ pin R1 Vo ADJ x (R1+R2) / R1 The circuit current dependents on the resistance value of R1 and R2. Please determine the constant considering the actual application. Figure 79 www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 31/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. Power dissipation in the Thermal Design is the value when the IC is mounted on a 114.3mm x 76.2mm x 1.57mm/1.6mm glass epoxy board. And in case this exceeds, take the measures like enlarge the size of board; make copper foil area for heat dissipation big; and do not exceed the power dissipation. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 32/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Operational Notes - continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by avoided. 11. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 14. Vcc Pin Insert a capacitor (Vo 5.0V:capacitor 1F, 1.0 Vo < 5.0V:capacitor 2.2F) between the Vcc and GND pins. Choose the capacitance according to the line between the power smoothing circuit and the Vcc pin. Selection of the capacitance also depends on the application. Verify the application and allow for sufficient margins in the design. We recommend using a capacitor with excellent voltage and temperature characteristics. Electric capacitor IC Ceramic capacitor, Low ESR capacitor www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 33/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Operational Notes - continued 15. Output Pin In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a capacitor with a capacitance of more than 1F(3.0V Vo 15.0V). Electrolytic, tantalum and ceramic capacitors can be used. We recommend a capacitor with a capacitance of more than 4.7F(1.0V Vo < 3.0V). Ceramic capacitors can be used. If electrolytic and tantalum capacitors of more than 4.7uF with a high ESR characteristic are used(1.0V Vo < 3.0V), 10 F ceramic capacitor needs to be connected in parallel. When selecting the capacitor ensure that the capacitance of more than 1F(3.0V Vo 15.0V) or more than 4.7F(1.0V Vo < 3.0V) is maintained at the intended applied voltage and temperature range. Due to changes in temperature, the capacitance can fluctuate possibly resulting in oscillation. For selection of the capacitor refer to the Cout_ESR vs Io data. The stable operation range given in the reference data is based on the standalone IC and resistive load. For actual applications the stable operating range is influenced by the PCB impedance, input supply impedance and load impedance. Therefore verification of the final operating environment is needed. When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and DC-biasing characteristics and high voltage tolerance. Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that the actual application meets with the required specification. 4.0V Vcc 26.5V 3.0V Vo 15.0V -40 C Ta +125 C 5k R1 10k (BD00C0AW) Cin=2.2F Cin 100F 1F Cout 100F 6.0V Vcc 26.5V 5.0V Vo 15.0V -40 C Ta +125C 0A Io 1A 5k R1 10k (BD00C0AW) 4.0V Vcc 26.5V 3.0V Vo 15.0V -40 C Ta +125C 0A Io 1A 5k R1 10k (BD00C0AW) 100 100 100 Unstable operating region Stable operating region 0.1 0.01 CinF 1 CinF Cout_ESR( 10 Stable operating region 10 10 Stable operating region 2.2 Unstable operating region 0.001 1 1 0 200 400 600 800 1000 1 10 Io(mA) 4.0V Vcc 26.5V 1.5V Vo < 3.0V -40 C Ta +125C 5k R1 10k (BD00C0AW) 2.2F Cin 100F 4.7F Cout 100F 100 4.0V Vcc 26.5V 1.0V Vo < 3.0V -40 C Ta +125C 0A Io 1A 5k R1 10k (BD00C0AW) 100 100 Unstable operating region 10 1 0.5 0.1 Stable operating region 0.01 1 CinF Cout_ ESR( Unstable operating region Stable operating region 0.1 0.01 0.001 200 400 600 800 1000 2.2 1 0 200 Io(mA) 400 600 800 1000 1 4.7 Io(mA) 10 100 CoutF Cout_ESR vs Io 1.0V Vo < 3.0V (Reference data) Cin vs Cout 1.0V Vo < 3.0V (Reference data) Vcc VCC (4.0V to 26.5V) Stable operating region Stable operating region Unstable operating region 10 0.001 0 100 Cout(F) Cin vs Cout 3.0V Vo 15.0V (Reference data) 4.0V Vcc 26.5V 1.0V Vo < 1.5V -40 C Ta +125C 5k R1 10k (BD00C0AW) 2.2F Cin 100F 4.7F Cout 100F 10 10 CoutF Cout_ESR vs Io 3.0V Vo 15.0V (Reference data) Cout_ ESR( 1 100 Vo Cin (1F or higher) R2 CTL Cout (1F or higher) Io (Rout) ADJ GND VCTL (5.0V) R1 (5k to 10k) ESR (0.001 or higher) Operation Note 15 Measurement circuit (BD00C0AW) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 34/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Operational Notes - continued 4.0V Vcc 26.5V 1.0V Vo < 3.0V (Cout and Ceramic capacitor 10F is connected in parallel.) -40C Ta +125C 0A Io 1A 5k R1 10k (BD00C0AW) 4.0V Vcc 26.5V 1.0V Vo < 3.0V (Cout and Ceramic capacitor 10F is connected in parallel.) -40C Ta +125C 5k R1 10k (BD00C0AW) 2.2F Cin 100F 1F Cout 100F 100 100 1 CinF Cout_ESR( 10 0.1 0.01 10 2.2 1 0.001 0 200 400 600 800 1 1000 10 100 CoutF Io(mA) Cin vs Cout 1.0V Vo < 3.0V Cout and Ceramic capacitor 10F is connected in parallel. (Reference data) Cout_ESR vs Io 1.0V Vo < 3.0V Cout and Ceramic capacitor 10F is connected in parallel. (Reference data) Vcc VCC (4.0V to 26.5V) Vo Cin (1F or higher) R2 CTL ADJ Cout (1F or higher) 10F GND R1 (5k to 10k) VCTL (5.0V) ESR (0.001 or higher) Io(Rout) Operation Note 15 Measurement circuit (BD00C0AW) 16. CTL Pin Do not set the voltage level on the IC's enable pin in between VthH and VthL. Do not leave it floating or unconnected, otherwise, the output voltage would be unstable. 17. Rapid variation in Vcc Voltage and load Current CTL Pin In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output current and temperature are also possible causes. In case problems arise within the actual operating range, use countermeasures such as adjusting the output capacitance. 18. Minute variation in output voltage In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and load current, etc., use countermeasures such as implementing filters. 19. In some applications, the Vcc and pin potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. For example, while the external capacitor is charged, the Vcc shorts to the GND. Use a capacitor with a capacitance with less than 1000F. We also recommend using reverse polarity diodes in series or a bypass between all pins and the Vcc pin. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 35/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 TO252-3 36/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 TO252-5 37/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 HRP5 38/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 TO263-3(F) 39/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 TO263-5 40/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Marking Diagrams (TOP VIEW) TO252-3 TO252-3 (TOP VIEW) Part Number Marking Output Voltage(V) Part Number Marking 3.3 33C0AC 5.0 50C0AC 8.0 80C0AC 9.0 90C0AC LOT Number TO252-5 TO252-5 (TOP VIEW) Part Number Marking Output Voltage(V) Part Number Marking Variable 00C0AWC 3.3 33C0AWC 5.0 50C0AWC 8.0 80C0AWC 9.0 90C0AWC LOT Number HRP5 HRP5 (TOP VIEW) Part Number Marking Output Voltage(V) Output Control Pin Part Number Marking Variable With SW 00C0AWHFPC With SW 33C0AWHFPC LOT Number 3.3 5.0 8.0 1PIN MARK 9.0 www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 41/43 Without SW 33C0AHFPC With SW 50C0AWHFPC Without SW 50C0AHFPC With SW 80C0AWHFPC Without SW 80C0AHFPC With SW 90C0AWHFPC Without SW 90C0AHFPC TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series TO263-3(F) TO263-3(F) (TOP VIEW) Part Number Marking LOT Number Output Voltage(V) Part Number Marking 3.3 33C0AC 5.0 50C0AC 8.0 80C0AC 9.0 90C0AC 1PIN TO263-5 TO263-5 (TOP VIEW) Part Number Marking LOT Number Output Voltage(V) Part Number Marking Variable 00C0AWC 3.3 33C0AWC 5.0 50C0AWC 8.0 80C0AWC 9.0 90C0AWC 1PIN www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 42/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 BDxxC0A-C series BDxxC0AW-C series Revision History Date Revision 16.Nov.2012 001 New Release 07.Mar.2013 002 The condition of output pin is changed on Operational Note 11. The mention of "Status of this document" is removed. 2.Sep.2013 003 Error in writing were corrected New release TO263-3F, TO263-5F, packages. Thermal Resistance and Power Dissipation are changed to be compliant with JEDEC standard. All characters were conformed to the Chicago manual. The sign in the annotation part was changed from "n" into "(Note n)." NOTE under the absolute maximum rating of P.2 was deleted because it had overlapped with P.1. Sentences of "Power consumption Pc of IC when short-circuited" that exists in P.30 are deleted. "Operational Notes" were updated. 11.Oct.2013 004 27.Jan.2017 005 www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Changes Page. 31 Error in writing were corrected TO263-3 and TO263-5 were added. The description method of thermal Resistance was changed to unify. AEC-Q100 (Note1:Grade1) was appended. Drop voltage figure was corrected. (P.12, 25) Figure 78 I/O equivalent was corrected. (P.31) Error in direction of feed was corrected. (P.39, 40) 43/43 TSZ02201-G1G0AN00640-1-2 27.Jan.2017 Rev.005 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bd33c0awhfp-c - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bd33c0awhfp-c HRP5 2000 2000 Taping inquiry Yes