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TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
TSZ22111・14・001
www.rohm.com
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.
Single-Output LDO Regulators
35V Voltage Resistance
1A LDO Regulators
BDxxC0A-C series BDxxC0AW-C series
General Description
The BDxxC0A-C series and the BDxxC0AW-C series are
low-saturation regulators. This series feature variable and
fixed voltage output with selectable Shutdown switch
(referred to as SW); Vout-3.3V, 5.0V, 8.0V and 9.0V.Five
conventional PKGs; TO252-3/5, HRP5 and TO263-3(F)/5
are available. This series has a built-in over-current
protection circuit that prevents the destruction of the IC due
to output short circuits and a thermal Shutdown circuit that
protects the IC from thermal damage due to overloading.
Features
1) Output current capability: 1A
2) Output voltage: Variable, 3.3V, 5.0V, 8.0V and 9.0V
3) High output voltage accuracy
(Ta=25°C, TO252-3/5, HRP5): ±1%
4) Low saturation with PDMOS output
5) Built-in over-current protection circuit that prevents the
destruction of the IC due to output short circuits
6) Built-in thermal Shutdown circuit for protecting the IC
from thermal damage due to overloading
7) Low ESR Capacitor
8) TO252-3/5, HRP5, TO263-3(F)/5 package
9) AEC-Q100 Qualified (Note 1)
(Note 1: Grade 1)
Key Specifications
・Supply Voltage(Vo 3.0V): Vo+1.0V to 26.5V
・Supply Voltage(Vo < 3.0V): 4.0V to 26.5V
・Output Voltage(BD00C0AW): 1.0V to 15.0V
・Output Current: 1A
・Output Voltage Precision
(Ta=25°C): ±1% (TO252-3/5, HRP5)
(-40°C Ta +125°C): ±3%
・Operating Temperature Range: -40°C Ta +125°C
Packages W(Typ) x D(Typ) x H(Max)
TO252-5 6.50mm x 9.50mm x 2.50mm
TO252-3 6.50mm x 9.50mm x 2.50mm
HRP5 9.395mm x 10.540mm x 2.005mm
TO263-5 10.16mm x 15.10mm x 4.70mm
TO263-3(F) 10.16mm x 15.10mm x 4.70mm
Applications
Automotive
(body, audio system, navigation system, etc.)
Ordering part number
B
D
x
x
C
0
A
W
x
x
x
-
C x x
Output voltage
00: Variable
33: 3.3V
50: 5.0V
80: 8.0V
90: 9.0V
Current
capacity
C0A: 1A
SW
W: With SW
None: Without SW
Package
FP: TO252-3/5
HFP: HRP5
FP2: TO263-3(F)/5
Packaging and forming specification
E2: Embossed tape and reel
(TO252-3/5, TO263-3(F)/5)
TR: Embossed tape and reel
(HRP5)
Datashee
t
2/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Lineup
Articles
Variable
3.3
5.0
8.0
9.0
Package
BDxxC0AWFP-CE2
○
○
○
○
○
TO252-5
Reel of 2000
BDxxC0AFP-CE2
-
○
○
○
○
TO252-3
Reel of 2000
BDxxC0AWHFP-CTR
○
○
○
○
○
HRP5
Reel of 2000
BDxxC0AHFP-CTR
-
○
○
○
○
HRP5
Reel of 2000
BDxxC0AWFP2-CE2
○
○
○
○
○
TO263-5
Reel of 500
BDxxC0AFP2-CE2
-
○
○
○
○
TO263-3(F)
Reel of 500
Typical Application Circuits
〈Output Voltage Variable Type (With SW)〉
Figure 1. Typical Application Circuit
Output Voltage Variable Type (With SW)
〈Output Voltage Fixation Type (With SW)〉
Figure 2. Typical Application Circuit
Output Voltage Fixation Type (With SW)
〈Output Voltage Fixation Type (Without SW)〉
Figure 3. Typical Application Circuit
Output Voltage Fixation Type (Without SW)
Vcc
CTL
GND
N.C.
Vo
Cout
CinVcc
Vcc
GND
Vo
Cout
CinVcc
Vcc
CTL
GND
ADJ
Vo
Cout
CinVcc
R1
R2
3/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Pin Configurations/Pin Descriptions
〈With SW (TO252-5/HRP5/TO263-5)〉
Figure 4. Pin Configurations (With SW)
Pin No.
Pin Name
Function
1
CTL
Output Control Pin
2
Vcc
Power Supply Pin
3
N.C. (Note 1)
GND
N.C. Pin (TO252-5)
GND (HRP5/TO263-5)
4
Vo
Output Pin
5
ADJ
N.C. (Note 1)
Variable Pin (BD00C0AW)
N.C. Pin (BD33/50/80/90C0AW)
FIN
GND
GND
(Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC.
〈Without SW (TO252-3/TO263-3(F))〉
Figure 5. Pin Descriptions (Without SW)
Pin No.
Pin Name
Function
1
Vcc
Power Supply Pin
2
N.C. (Note 1)
GND
N.C. Pin (TO252-3)
GND (TO263-3(F))
3
Vo
Output Pin
FIN
GND
GND
(Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC.
TO252-5
(TOP VIEW)
TO252-5
1
2
3
4
5
TO263-5
(TOP VIEW)
HRP5
(TOP VIEW)
HRP5
TO263-5
FIN
1
2
3
4
5
1
2
3
4
5
FIN
TO252-3
1
2
3
TO252-3
(TOP VIEW)
TO263-3(F)
TO263-3(F)
(TOP VIEW)
1
2
3
FIN
4/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
〈Without SW (HRP5)〉
Figure 6. Pin Descriptions (Without SW) (HRP5)
Pin No.
Pin Name
Function
1
Vcc
Power Supply Pin
2
N.C. (Note 1)
N.C. Pin
3
GND
GND
4
N.C.
N.C. Pin
5
Vo
Output Pin
FIN
GND
GND
(Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC.
FIN
HRP5
(TOP VIEW)
HRP5
1
2
3
4
5
5/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Block Diagrams
〈BD00C0AWFP/WHFP/WFP2-C (Output Voltage Variable Type, With SW) 〉
■TO252-5/HRP5/TO263-5
Figure 7. Block diagram
BD00C0AWFP/WHFP/WFP2-C (Output Voltage Variable Type, With SW)
〈BDxxC0AWFP/WHFP/WFP2-C (Output Voltage Fixation Type, With SW) 〉
■TO252-5/HRP5/TO263-5
Figure 8. Block diagram
BDxxC0AWFP/WHFP/WFP2-C (Output Voltage Fixation Type, With SW)
FIN
1 2
OCP
VREF
TSD
Driver
4 53
GND
CTL Vcc N.C.(TO252-5）Vo ADJ
:Over Current Protection Circuit
:Thermal Shut Down Circuit
:Power Transistor Driver
VREF
OCP
TSD
Driver
:Bandgap Reference
GND(HRP5/TO263-5）
FIN
1 2
OCP
VREF
TSD
Driver
4 53
GND
CTL Vcc N.C.(TO252-5）
GND(HRP5/TO263-5)
Vo N.C.
:Over Current Protection Circuit
:Thermal Shut Down Circuit
:Power Transistor Driver
VREF
OCP
TSD
Driver
:Bandgap Reference
6/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
〈BDxxC0AFP/HFP/FP2-C (Output Voltage Fixation Type, Without SW) 〉
■TO252-3/TO263-3(F)
Figure 9. Block diagram
BDxxC0AFP/FP2-C (Output Voltage Fixation Type, Without SW)
■HRP5
Figure 10. Block diagram
BDxxC0AHFP-C (Output Voltage Fixation Type, Without SW)
FIN
1 2
OCP
VREF
TSD
Driver
3
GND
Vcc Vo
:Over Current Protection Circuit
:Thermal Shut Down Circuit
:Power Transistor Driver
VREF
OCP
TSD
Driver
:Bandgap Reference
N.C.(TO252-3）
GND(TO263-3(F)）
FIN
1 3
OCP
VREF
TSD
Driver
5
Vcc Vo
2 4
N.C. GND N.C.
:Over Current Protection Circuit
:Thermal Shut Down Circuit
:Power Transistor Driver
VREF
OCP
TSD
Driver
:Bandgap Reference
GND
7/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Absolute Maximum Ratings (Ta= 25°C)
Parameter
Symbol
Ratings
Unit
Supply Voltage (Note 1)
Vcc
-0.3 to +35.0
V
Output Control Voltage (With SW) (Note 2)
VCTL
-0.3 to +35.0
V
Operating Temperature Range
Topr
-40 to +125
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Maximum Junction Temperature
Tjmax
150
°C
(Note 1) Do not exceed Pd (Please refer to Power Dissipation in P.27-29).
(Note 2) The order of starting up power supply (Vcc) and CTL pin doesn't have either in the problem within
the range of the operation power-supply voltage ahead.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage
can either be a short circuit between pins or an open circuit between pins and the internal circuitry.
Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case
the IC is operated over the absolute maximum ratings.
Recommended Operating Conditions (-40°C ≤ Ta ≤ +125°C)
Parameter
Symbol
Min
Max.
Unit
Supply Voltage (Vo 3.0V)
Vcc
Vo+1
26.5
V
Supply Voltage (Vo < 3.0V)
Vcc
4.0
26.5
V
Startup Voltage (Io=0mA)
Vcc
-
3.8
V
Output Control Voltage (With SW)
VCTL
0
26.5
V
Output Current
Io
0
1.0
A
Output Voltage (BD00C0AW) (Note 1)
Vo
1.0
15.0
V
(Note 1) Please refer to Notes15 for use when you use BD00C0AW by output voltage 1.0V Vo < 3.0V.
Thermal Resistance (Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 3)
2s2p(Note 4)
TO252-3, TO252-5
Junction to Ambient
JA
136
23
°C/W
Junction to Top Characterization Parameter(Note 2)
JT
17
3
°C/W
HRP5
Junction to Ambient
JA
120
22
°C/W
Junction to Top Characterization Parameter(Note 2)
JT
8
3
°C/W
TO263-3(F), TO263-5
Junction to Ambient
JA
81
21
°C/W
Junction to Top Characterization Parameter(Note 2)
JT
8
2
°C/W
(Note 1)Based on JESD51-2A (Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70m
(Note 4)Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
Board Size
Thermal Via(Note 5)
Pitch
Diameter
4 Layers
FR-4
114.3mm x 76.2mm x 1.6mmt
1.20mm
0.30mm
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70m
74.2mm x 74.2mm
35m
74.2mm x 74.2mm
70m
(Note 5) This thermal via connects with the copper pattern of all layers. The placement and dimensions obey a land pattern.
8/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Electrical Characteristics
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, Io=0mA, VCTL=5.0V (With SW)
The resistor of between ADJ and Vo =56.7k, ADJ and GND =10k (BD00C0AW)
Parameter
Symbol
Guaranteed Limit
Unit
Conditions
Min.
Typ.
Max.
Shutdown Current (With SW)
Isd
-
0
5
µA
VCTL=0V
Circuit Current
Ib
-
0.5
2.5
mA
ADJ Terminal Voltage
(BD00C0AWFP/WHFP)
VADJ
0.742
0.750
0.758
V
Io=50mA, Ta=25°C
ADJ Terminal Voltage (BD00C0AW)
VADJ
0.727
0.750
0.773
V
Io=50mA
Output Voltage
(BD33/50C0A(W9FP/(W)HFP)
Vo
Vo×0.99
Vo
Vo×1.01
V
Io=200mA, Ta=25°C
Output Voltage (BD33/50C0A(W))
Vo
Vo×0.97
Vo
Vo×1.03
V
Io=200mA
Output Voltage
(BD80/90C0A(W)FP/(W)HFP)
Vo
Vo×0.99
Vo
Vo×1.01
V
Io=500mA, Ta=25°C
Output Voltage (BD80/90C0A(W))
Vo
Vo×0.97
Vo
Vo×1.03
V
Io=500mA
Dropout Voltage
(BD00/50/80/90C0A(W))
-
0.3
0.5
V
Vcc=Vo×0.95,Io=500mA
Ripple Rejection (BD00/33/50C0A(W))
R.R.
45
55
-
dB
f=120Hz,
Input Voltage Ripple =1Vms,
Io=100mA
Ripple Rejection (BD80/90C0A(W))
R.R.
40
50
-
dB
f=120Hz,
Input Voltage Ripple =1Vms,
Io=100mA
Line Regulation
Reg.I
-
20
80
mV
Vo+1.0V CC V
Load Regulation
Reg.L
-
Vo
×0.010
Vo
×0.020
V
5mA Io 1A
CTL ON Mode Voltage (With SW)
VthH
2.0
－
－
V
ACTIVE MODE
CTL OFF Mode Voltage (With SW)
VthL
－
－
0.8
V
OFF MODE
CTL Bias Current (With SW)
ICTL
－
25
50
9/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Reference Data
■BD00C0AW-C series(Vo=5.0V)
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V, Io=0mA, Vo=5.0V
(The resistor of between ADJ and Vo =56.7k, ADJ and GND =10k)
Figure 11. Circuit Current
(IFEEDBACK_R(Note 1) 75µA)
(Note 1) IFEEDBACK_R is the current flowing into
external feedback resistance.
Figure 12. Shutdown Current
(VCTL=0V)
Figure 13. Line Regulation
(Io=0mA)
Figure 14. Line Regulation
(Io=500mA)
0.0
0.2
0.4
0.6
0.8
1.0
0246810 12 14 16 18 20 22 24 26
Circuit Current:Ib+IFEEDBACK_R [mA]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
3
6
9
12
15
18
0246810 12 14 16 18 20 22 24 26
Shutdown Current:Isd [A]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
1
2
3
4
5
6
0 2 4 6 8 10 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
1
2
3
4
5
6
0 2 4 6 8 10 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
10/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
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TSZ22111・15・001
Reference Data - continued
Figure 15. Load Regulation
Figure 16. Dropout Voltage
(Vcc=Vo×0.95=4.75V)
Figure 17. Ripple Rejection
(lo=100mA)
Figure 18. Output Voltage
Temperature Characteristic
0
1
2
3
4
5
6
0 400 800 1200 1600 2000 2400
Output Voltage:Vo [V]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
0
100
200
300
400
500
600
700
800
900
1,000
0 200 400 600 800 1000
Dropout Voltage : Vd [mV]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
0
10
20
30
40
50
60
70
80
10 100 1000 10000 100000 1000000
Ripple Rejection:R.R. [dB]
Frequency: f [Hz]
Ta=-40℃
Ta=25℃
Ta=125℃
4.85
4.90
4.95
5.00
5.05
5.10
5.15
-40 -20 0 20 40 60 80 100 120
Output Voltage: Vo [V]
Ambient Temperature: [℃]
11/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Reference Data - continued
Figure 21. Output Voltage vs CTL Voltage
Figure 22. Thermal Shutdown
Circuit Characteristic
0
20
40
60
80
100
120
140
160
180
0246810 12 14 16 18 20 22 24 26
CTL Bias Current:ICTL [A]
Control Voltage: VCTL[V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
1
2
3
4
5
6
0246810 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Control Voltage: VCTL[V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
1
2
3
4
5
6
130 140 150 160 170 180 190
Output Voltage:Vo [V]
Ambient Temperature:Ta [℃]
0.0
0.2
0.4
0.6
0.8
1.0
0 200 400 600 800 1000
Circuit Current:Ib+IFEEDBACK_R [mA]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
Figure 19. Circuit Current
(0mA, IFEEDBACK_R 75µA)
Figure 20. CTL Current vs CTL Voltage
12/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Measurement setup for reference data
■BD00C0AW-C series (Vo=5.0V)
Measurement setup for Figure 11
Measurement setup for Figure 12
Measurement setup for Figure 13
Measurement setup for Figure 14
Measurement setup for Figure 15
Measurement setup for Figure 16
Measurement setup for Figure 17
Measurement setup for Figure 18
Measurement setup for Figure 19
Measurement setup for Figure 20
Measurement setup for Figure 21
Measurement setup for Figure 22
5V
Vcc
CTL GND ADJ
Vo
1µF
FEEDBACK _R
56.7kΩ
10kΩ
1µF
Vcc
CTL GND ADJ
Vo
1µF 56.7kΩ
10kΩ
1µF
5V
Vcc
CTL GND ADJ
Vo
1µF
1µF
56.7kΩ
10kΩ
5V
Vcc
CTL GND ADJ
Vo
1µF
1µF
56.7kΩ
10kΩ500mA
5V
Vcc
CTL GND ADJ
Vo
1µF
1µF
56.7kΩ
10kΩ
13.5V
5V
Vcc
CTL GND ADJ
Vo
1µF
1µF
56.7kΩ
10kΩ
4.75V
5V
Vcc
CTL GND ADJ
Vo
1µF
1µF
56.7kΩ
10kΩ
13.5V
1Vrms
100mA
V
5V
Vcc
CTL GND ADJ
Vo
1µF
1µF
56.7kΩ
10kΩ
13.5V
FEEDBACK _R
5V
Vcc
CTL GND ADJ
Vo
1µF
1µF 56.7kΩ
10kΩ
13.5V
Vcc
CTL GND ADJ
Vo
1µF
1µF
56.7kΩ
10kΩ
13.5V
Vcc
CTL GND ADJ
Vo
1µF
1µF
56.7kΩ
10kΩ
13.5V
Vcc
CTL GND ADJ
Vo
1µF
1µF
56.7kΩ
10kΩ
13.5V
5V
13/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Reference Data
■BD33C0A-C/ BD33C0AW-C series
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V (With SW), Io=0mA
0.0
0.2
0.4
0.6
0.8
1.0
0246810 12 14 16 18 20 22 24 26
Circuit Current:Ib [mA]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
3
6
9
12
15
18
0246810 12 14 16 18 20 22 24 26
Shutdown Current:Isd [A]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
Figure 23. Circuit Current
Figure 24. Shutdown Current
(VCTL=0V)
Figure 25. Line Regulation
(Io=0mA)
Figure 26. Line Regulation
(Io=500mA)
0
1
2
3
4
5
6
0246810 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
1
2
3
4
5
6
0246810 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
14/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
3.22
3.24
3.26
3.28
3.30
3.32
3.34
3.36
3.38
-40 -20 0 20 40 60 80 100 120
Output Voltage: Vo [V]
Ambient Temperature: [℃]
Reference Data - continued
0.0
0.2
0.4
0.6
0.8
1.0
0 200 400 600 800 1000
Circuit Current:Ib [mA]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
Figure 27. Load Regulation
Figure 28. Ripple Rejection
(lo=100mA)
Figure 29. Output Voltage Temperature Characteristic
Figure 30. Circuit Current
0
10
20
30
40
50
60
70
80
10 100 1000 10000 100000 1000000
Ripple Rejection:R.R. [dB]
Frequency: f [Hz]
Ta=-40℃
Ta=25℃
Ta=125℃
0
1
2
3
4
5
6
0 400 800 1200 1600 2000 2400
Output Voltage:Vo [V]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
15/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Reference Data - continued
0
1
2
3
4
5
6
130 140 150 160 170 180 190
Output Voltage:Vo [V]
Ambient Temperature:Ta [℃]
0
1
2
3
4
5
6
0246810 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Control Voltage: VCTL[V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
20
40
60
80
100
120
140
160
180
0246810 12 14 16 18 20 22 24 26
CTL Bias Current:ICTL [A]
Control Voltage: VCTL[V]
Ta=-40℃
Ta=25℃
Ta=125℃
Figure 31. CTL Current vs CTL Voltage
Figure 32. Output Voltage vs CTL Voltage
Figure 33. Thermal Shutdown Circuit Characteristic
16/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Reference Data
■BD50C0A-C/ BD50C0AW-C series
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V (With SW), Io=0mA
0
1
2
3
4
5
6
0246810 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
1
2
3
4
5
6
0246810 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
0.0
0.2
0.4
0.6
0.8
1.0
0246810 12 14 16 18 20 22 24 26
Circuit Current:Ib [mA]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
3
6
9
12
15
18
0246810 12 14 16 18 20 22 24 26
Shutdown Current:Isd [A]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
Figure 34. Circuit Current
Figure 35. Shutdown Current
(VCTL=0V)
Figure 36. Line Regulation
(Io=0mA)
Figure 37. Line Regulation
(Io=500mA)
17/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Reference Data - continued
0
1
2
3
4
5
6
0 400 800 1200 1600 2000 2400
Output Voltage:Vo [V]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
Figure 38. Load Regulation
Figure 39. Dropout Voltage
(Vcc=Vo×0.95V=4.75V)
Figure 40. Ripple Rejection
(lo=100mA)
Figure 41. Output Voltage
Temperature Characteristic
0
100
200
300
400
500
600
700
800
900
1,000
0 200 400 600 800 1000
Dropout Voltage : Vd [mV]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
0
10
20
30
40
50
60
70
80
10 100 1000 10000 100000 1000000
Ripple Rejection:R.R. [dB]
Frequency: f [Hz]
Ta=-40℃
Ta=25℃
Ta=125℃
4.85
4.90
4.95
5.00
5.05
5.10
5.15
-40 -20 0 20 40 60 80 100 120
Output Voltage: Vo [V]
Ambient Temperature: [℃]
18/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Reference Data - continued
0.0
0.2
0.4
0.6
0.8
1.0
0 200 400 600 800 1000
Circuit Current:Ib [mA]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
0
1
2
3
4
5
6
0246810 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Control Voltage: VCTL[V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
1
2
3
4
5
6
130 140 150 160 170 180 190
Output Voltage:Vo [V]
Ambient Temperature:Ta [℃]
0
20
40
60
80
100
120
140
160
180
0246810 12 14 16 18 20 22 24 26
CTL Bias Current:ICTL [A]
Control Voltage: VCTL[V]
Ta=-40℃
Ta=25℃
Ta=125℃
Figure 42. Circuit Current
Figure 43. CTL Current vs CTL Voltage
Figure 44. Output Voltage vs CTL Voltage
Figure 45. Thermal Shutdown Circuit Characteristic
19/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Reference Data
■BD80C0A-C/ BD80C0AW-C series
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V (With SW), Io=0mA
0
1
2
3
4
5
6
7
8
9
10
0246810 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
1
2
3
4
5
6
7
8
9
10
0246810 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0246810 12 14 16 18 20 22 24 26
Circuit Current:Ib [mA]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
3
6
9
12
15
18
0246810 12 14 16 18 20 22 24 26
Shutdown Current:Isd [A]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
Figure 46. Circuit Current
Figure 47. Shutdown Current
(VCTL=0V)
Figure 48. Line Regulation
(Io=0mA)
Figure 49. Line Regulation
(Io=500mA)
20/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
7.80
7.85
7.90
7.95
8.00
8.05
8.10
8.15
8.20
-40 -20 0 20 40 60 80 100 120
Output Voltage: Vo [V]
Ambient Temperature: [℃]
Reference Data - continued
0
1
2
3
4
5
6
7
8
9
10
0 400 800 1200 1600 2000 2400
Output Voltage:Vo [V]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
0
100
200
300
400
500
600
700
800
900
1,000
0 200 400 600 800 1000
Dropout Voltage : Vd [mV]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
Figure 50. Load Regulation
Figure 51. Dropout Voltage
(Vcc=Vo×0.95V=7.6V)
Figure 52. Ripple Rejection
(lo=100mA)
Figure 53. Output Voltage Temperature Characteristic
0
10
20
30
40
50
60
70
80
10 100 1000 10000 100000 1000000
Ripple Rejection:R.R. [dB]
Frequency: f [Hz]
Ta=-40℃
Ta=25℃
Ta=125℃
21/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Reference Data - continued
0
20
40
60
80
100
120
140
160
180
0 2 4 6 8 10 12 14 16 18 20 22 24 26
CTL Bias Current:ICTL [A]
Control Voltage: VCTL[V]
Ta=-40℃
Ta=25℃
Ta=125℃
0.0
0.2
0.4
0.6
0.8
1.0
0 200 400 600 800 1000
Circuit Current:Ib [mA]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
0
1
2
3
4
5
6
7
8
9
10
0246810 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Control Voltage: VCTL[V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
1
2
3
4
5
6
7
8
9
10
130 140 150 160 170 180 190
Output Voltage:Vo [V]
Ambient Temperature:Ta [℃]
Figure 56. Output Voltage vs CTL Voltage
Figure 57. Thermal Shutdown Circuit Characteristic
Figure 54. Circuit Current
Figure 55. CTL Current vs CTL Voltage
22/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Reference Data
■BD90C0A-C/ BD90C0AW-C series
Unless otherwise specified, -40°C ≤Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V (With SW), Io=0mA
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0246810 12 14 16 18 20 22 24 26
Circuit Current:Ib[mA]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
1
2
3
4
5
6
7
8
9
10
0246810 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
3
6
9
12
15
18
0246810 12 14 16 18 20 22 24 26
Shutdown Current:Isd [A]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
Figure 59. Shutdown Current
(VCTL=0V)
Figure 58. Circuit Current
0
1
2
3
4
5
6
7
8
9
10
0246810 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Supply Voltage:Vcc [V]
Ta=-40℃
Ta=25℃
Ta=125℃
Figure 60. Line Regulation
(Io=0mA)
Figure 61. Line Regulation
(Io=500mA)
23/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Reference Data - continued
0
1
2
3
4
5
6
7
8
9
10
0 400 800 1200 1600 2000 2400
Output Voltage:Vo [V]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
0
100
200
300
400
500
600
700
800
900
1,000
0 200 400 600 800 1000
Dropout Voltage : Vd [mV]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
Figure 62. Load Regulation
Figure 63. Dropout Voltage
(Vcc=Vo×0.95V=8.55V)
Figure 64. Ripple Rejection
(Io =100mA)
Figure 65. Output Voltage
Temperature Characteristic
0
10
20
30
40
50
60
70
80
10 100 1000 10000 100000 1000000
Ripple Rejection:R.R. [dB]
Frequency: f [Hz]
Ta=-40℃
Ta=25℃
Ta=125℃
8.80
8.85
8.90
8.95
9.00
9.05
9.10
9.15
9.20
-40 -20 0 20 40 60 80 100 120
Output Voltage: Vo [V]
Ambient Temperature: [℃]
24/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Reference Data - continued
0
1
2
3
4
5
6
7
8
9
10
130 140 150 160 170 180 190
Output Voltage:Vo [V]
Ambient Temperature:Ta [℃]
0
1
2
3
4
5
6
7
8
9
10
0246810 12 14 16 18 20 22 24 26
Output Voltage:Vo [V]
Control Voltage: VCTL[V]
Ta=-40℃
Ta=25℃
Ta=125℃
0
20
40
60
80
100
120
140
160
180
0246810 12 14 16 18 20 22 24 26
CTL Bias Current:ICTL [A]
Control Voltage: VCTL[V]
Ta=-40℃
Ta=25℃
Ta=125℃
0.0
0.2
0.4
0.6
0.8
1.0
0 200 400 600 800 1000
Circuit Current:Ib [mA]
Output Current:Io [mA]
Ta=-40℃
Ta=25℃
Ta=125℃
Figure 68. Output Voltage vs CTL Voltage
Figure 69. Thermal Shutdown
Circuit Characteristic
Figure 66. Circuit Current
Figure 67. CTL Current vs CTL Voltage
25/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Measurement setup for reference data
■BDxxC0AW-C series(Output Voltage Fixation Type)
Vcc
CTL GND N.C.
Vo
1µF
(1.0µF)
2.2µF
13.5V
Vcc
CTL GND N.C.
Vo
1µF
13.5V
(1.0µF)
2.2µF
5V
Vcc
CTL GND N.C.
Vo
1µF
13.5V
(1.0µF)
2.2µF
5V
Vcc
CTL GND N.C.
Vo
1µF
100mA
(1.0µF)
2.2µF V
13.5V
5V
Vcc
CTL GND N.C.
Vo
1µF
13.5V
(1.0µF)
2.2µF
5V
Vcc
CTL GND N.C.
Vo
1µF
13.5V
(1.0µF)
2.2µF
5V
Vcc
CTL GND N.C.
Vo
1µF
13.5V
(1.0µF)
2.2µF
5V
Vcc
CTL GND N.C.
Vo
1µF
Vo×
0.95V
(1.0µF)
2.2µF
5V
Vcc
CTL GND N.C.
Vo
1µF
500mA
(1.0µF)
2.2µF
Measurement setup for
Figure 23, 34, 46 and 58
Measurement setup for
Figure 24, 35, 47 and 59
Measurement setup for
Figure 25, 36, 48 and 60
Measurement setup for
Figure 26, 37, 49 and 61
Measurement setup for
Figure 27, 38, 50 and 62
Measurement setup for
Figure 39, 51 and 63
Measurement setup for
Figure 28, 40, 52 and 64
Measurement setup for
Figure 29, 41, 53 and 65
Measurement setup for
Figure 30, 42, 54 and 66
Measurement setup for
Figure 31, 43, 55 and 67
Measurement setup for
Figure 32, 44, 56 and 68
Measurement setup for
Figure 33, 45, 57 and 69
5V
Vcc
CTL GND N.C.
Vo
1µF
(1.0µF)
2.2µF
(1.0µF)
2.2µF
Vcc
CTL GND N.C.
Vo
1µF
5V
Vcc
CTL GND N.C.
Vo
1µF
(1.0µF)
2.2µF
26/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Vcc
GND
Vcc
GND
Application Examples
・Applying positive surge to the Vcc pin
If the possibility exists that surges higher than 35.0V will be applied to the Vcc pin, a zenar diode should be placed
between the Vcc pin and GND pin as shown in the Figure below.
・Applying negative surge to the Vcc pin
If the possibility exists that negative surges lower than the GND are applied to the Vcc pin, a schottky diode should be
place between the Vcc pin and GND pin as shown in the Figure below.
・Implementing a protection diode
If the possibility exists that a large inductive load is connected to the output pin resulting in back-EMF at time of startup
and Shutdown, a protection diode should be placed as shown in the Figure below.
Figure 70
Figure 71
Figure 72
Vo
27/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
①0.92 W
②5.43 W
0.0
2.0
4.0
6.0
8.0
10.0
025 50 75 100 125 150
Power Dissipation: Pd[W]
Ambient Temperature: Ta [C]
Thermal Design
■TO252-3
IC mounted on ROHM standard board based on JEDEC.
① : 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
② : 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
Condition①JA = 81 JT (top center) = 8 °C / W
Condition②JA = 21 JT (top center) = 2 °C / W
■TO252-5
IC mounted on ROHM standard board based on JEDEC.
① : 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
② : 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
Condition①JA JT (top center) = 17 °C / W
Condition②JA = 23 °C JT (top center) = 3 °C / W
①0.92 W
②5.43 W
0.0
2.0
4.0
6.0
8.0
10.0
025 50 75 100 125 150
Power Dissipation: Pd[W]
Ambient Temperature: Ta [C]
Figure 74. TO252-5 Package Data
Figure 73. TO252-3 Package Data
28/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
①1.04 W
②5.68 W
0.0
2.0
4.0
6.0
8.0
10.0
025 50 75 100 125 150
Power Dissipation: Pd[W]
Ambient Temperature: Ta [C]
Thermal Design – continued
■HRP5
IC mounted on ROHM standard board based on JEDEC.
① : 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
② : 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
Condition①JA = 120 JT (top center) = 8 °C / W
Condition②JA = 22 JT (top center) = 3 °C / W
Figure 75. HRP5 Package Data
29/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Thermal Design – continued
■TO263-3(F)
IC mounted on ROHM standard board based on JEDEC.
① : 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
② : 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
Condition①JA = 81 JT (top center) = 8 °C / W
Condition②JA = 21 JT (top center) = 2 °C / W
■TO263-5
IC mounted on ROHM standard board based on JEDEC.
① : 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
② : 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
Condition①JA = 81 JT (top center) = 8 °C / W
Condition②JA = 21 JT (top center) = 2 °C / W
①1.54 W
②5.95 W
0.0
2.0
4.0
6.0
8.0
10.0
025 50 75 100 125 150
Power Dissipation: Pd[W]
Ambient Temperature: Ta [C]
Figure 76. TO263-3 Package Data
①1.54 W
②5.95 W
0.0
2.0
4.0
6.0
8.0
10.0
025 50 75 100 125 150
Power Dissipation: Pd[W]
Ambient Temperature: Ta [C]
Figure 77. TO263-5 Package Data
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www.rohm.com
TSZ22111・15・001
When operating at temperature more than Ta=25°C, please refer to the power dissipation characteristic curve shown in Figure 73
to 77.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature Tjmax.
Figure. 73 to 77 shows the acceptable power dissipation characteristic curves of the TO252-3/5, HRP5 and TO263-3(F)/5
packages. Even when the ambient temperature (Ta) is at normal temperature (25°C), the chip junction temperature (Tj) may be
quite high so please operate the IC at temperatures less than the acceptable power dissipation.
The calculation method for power consumption Pc(W) is as follows
Pc=(Vcc－Vo)×Io+Vcc×Ib
Acceptable loss Pd Pc
Solving this for load current Io in order to operate within the acceptable loss
(Please refer to 19, 30, 42, 54 and 66 about Ib.)
It is then possible to find the maximum load current Iomax with respect to the applied voltage Vcc at the time of thermal design.
Calculation Example) When TO252-3 / TO252-5, 4-layer PCB, Ta=85°C, Vcc=13.5V, Vo=5.0V
Calculation Example) When HRP5, 4-layer PCB, Ta=85°C, Vcc=13.5V, Vo=5.0V
Calculation Example) When TO263-3(F) / TO263-5, 4-layer PCB, Ta=85°C, Vcc=13.5V, Vo=5.0V
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature
ranges.
Io
Pd－Vcc×Ib
Vcc－Vo
Vcc : Input voltage
Vo : Output voltage
Io : Load current
Ib : Circuit current
Io 331.3mA (Ib：0.6mA)
Io
2.824－13.5×Ib
8.5
Figure 75 ②ja=22°C /W →-45.5mW/°C
25°C =5.68W → 85°C =2.954W
Io 346.6mA (Ib: 0.6mA)
Io
2.954－13.5×Ib
8.5
Figure 76, 77 ②ja=21°C /W →-47.6mW/°C
25°C =5.95W → 85°C =3.094W
Io 363mA (Ib: 0.6mA)
Io
3.094－13.5×Ib
8.5
Figure 73, 74 ②a=23°C /W → -43.5mW/°C
25°C = 5.43W → 85°C =2.824W
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BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
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www.rohm.com
TSZ22111・15・001
I/O equivalence circuit
Figure 78
Output Voltage Configuration Method (BD00C0AW)
Please connect resistors R1 and R2 (which determines the output voltage) as shown in Figure 79.
Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistor values are
large. Due to this, rmended for R1.
Vo ADJ × (R1+R2) / R1
The circuit current dependents on the resistance value of R1 and R2.
Please determine the constant considering the actual application.
Figure 79
Vcc Terminal
CTL Terminal (With SW)
Vo Terminal BD33/50/80/90C0A(W)
R1
(Typ)
R2
(Typ)
R3
(Typ)
BD33C0A(W)
10
34
15
BD50C0A(W)
56.6
BD80C0A(W)
5
48.3
20
BD90C0A(W)
55
BD00C0AW
Vo Terminal
ADJ Terminal
Vcc
IC
CTL
200kΩ
(Typ)
200kΩ
(Typ)
1kΩ
(Typ)
Vcc
Vo
R3
R2
R1
Vcc
Vo
15kΩ
(Typ)
IC
ADJ
pin
Vo
R2
R1
ADJ ≈ 0.75V
(Typ)
Vo
ADJ
1kΩ
(Typ)
20kΩ
(Typ)
1kΩ
(Typ)
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BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the ICs power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. Power dissipation in the Thermal Design is the value when the IC is mounted
on a 114.3mm x 76.2mm x 1.57mm/1.6mm glass epoxy board. And in case this exceeds, take the measures like
enlarge the size of board; make copper foil area for heat dissipation big; and do not exceed the power dissipation.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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TSZ02201-G1G0AN00640-1-2
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TSZ22111・15・001
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
11. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
14. Vcc Pin
Insert a capacitor (Vo 5.0V:capacitor 1µF, 1.0 Vo < 5.0V:capacitor 2.2µF) between the Vcc and GND pins.
Choose the capacitance according to the line between the power smoothing circuit and the Vcc pin. Selection of the
capacitance also depends on the application. Verify the application and allow for sufficient margins in the design. We
recommend using a capacitor with excellent voltage and temperature characteristics.
N N
P+PN N
P+
P Substrate
GND
NP+N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
EParasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
Ceramic capacitor, Low ESR capacitor
Electric capacitor
IC
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BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Operational Notes – continued
15. Output Pin
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a
capacitor with a capacitance of more than 1(3.0V Vo 15.0V). Electrolytic, tantalum and ceramic capacitors can
be used. We recommend a capacitor with a capacitance of more than 4.7(1.0V Vo < 3.0V). Ceramic capacitors
can be used. If electrolytic and tantalum capacitors of more than 4.7uF with a high ESR characteristic are used(1.0V
Vo < 3.0V), 10 µF ceramic capacitor needs to be connected in parallel. When selecting the capacitor ensure that the
capacitance of more than 1(3.0V Vo 15.0V) or more than 4.7(1.0V Vo < 3.0V) is maintained at the intended
applied voltage and temperature range. Due to changes in temperature, the capacitance can fluctuate possibly
resulting in oscillation. For selection of the capacitor refer to the Cout_ESR vs Io data. The stable operation range
given in the reference data is based on the standalone IC and resistive load. For actual applications the stable
operating range is influenced by the PCB impedance, input supply impedance and load impedance. Therefore
verification of the final operating environment is needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying
that the actual application meets with the required specification.
Operation Note 15 Measurement circuit (BD00C0AW)
0.001
0.01
0.1
1
10
100
0200 400 600 800 1000
Io(mA)
Cout _ ESR( Ω）
Stable operating region
Unstable operating region
0.5
Cin vs Cout
3.0V
(Reference data)
Cout_ESR vs Io
3.0V
(Reference data)
4.0V Vcc 26.5V
3.0V
-
1
Cin=2.
4.0V Vcc 26.5V
1.0V Vo < 1.5V
- Ta +125°C
R1
2.2µF Cin 100µF
4.7µF Cout 100µF
4.0V Vcc 26.5V
3.0V Vo 15.0V
- Ta +125°C
1A
R1
26.5V
15.0V
- +125°C
1A
R1
4.0V Vcc 26.5V
1.0V Vo < 3.0V
- Ta +125°C
0A Io 1A
R1
4.0V Vcc 26.5V
1.5V Vo < 3.0V
- Ta +125°C
R1 10
2.2µF Cin 100µF
4.7µF Cout 100µF
Stable
operating region
1
10
100
110 100
Cout（）
Cin（）
Stable
operating region
Unstable
operating region
2.2
4.7
0.001
0.01
0.1
1
10
100
0200 400 600 800 1000
Io(mA)
Cout_ESR(Ω）
Unstable operating region
Stable operating region
1
10
100
110 100
Cout（）
Cin（）
Stable operating region
2.2
Unstable
operating region
1
10
100
110 100
Cout(µF)
Cin（µF）
Stable operating region
0.001
0.01
0.1
1
10
100
0200 400 600 800 1000
Io(mA)
Cout _ ESR( Ω）
Stable operating region
Unstable operating region
Cout_ESR vs Io
1.0V Vo < 3.0V
(Reference data)
Cin vs Cout
1.0V Vo < 3.0V
(Reference data)
Vcc
CTL GND ADJ
Vo
VCTL
(5.0V)
R2
Cin
(1µF or higher) Cout
(1µF or higher)
ESR
(0.001Ω
or higher)
Io
(Rout)
R1
(5k to 10kΩ)
VCC
(4.0V to 26.5V)
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BDxxC0A-C series BDxxC0AW-C series
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TSZ22111・15・001
Operational Notes – continued
Operation Note 15 Measurement circuit (BD00C0AW)
16. CTL Pin
Do not set the voltage level on the IC's enable pin in between VthH and VthL. Do not leave it floating or unconnected,
otherwise, the output voltage would be unstable.
17. Rapid variation in Vcc Voltage and load Current CTL Pin
In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as
output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output
current and temperature are also possible causes. In case problems arise within the actual operating range, use
countermeasures such as adjusting the output capacitance.
18. Minute variation in output voltage
In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and
load current, etc., use countermeasures such as implementing filters.
19. In some applications, the Vcc and pin potential might be reversed, possibly resulting in circuit internal damage or
damage to the elements. For example, while the external capacitor is charged, the Vcc shorts to the GND. Use a
bypass between all pins and the Vcc pin.
1
10
100
110 100
Cout（）
Cin（）
安定領域
2.2
発振領域
0.001
0.01
0.1
1
10
100
0200 400 600 800 1000
Io(mA)
Cout_ESR(Ω）
発振領域
安定領域
4.0V Vcc 26.5V
1.0V Vo < 3.0V
(Cout and Ceramic capacitor 10µF is connected in parallel.)
-40°C Ta +125°C
R1 (BD00C0AW)
2.2µF Cin 100µF
1µF Cout 100µF
4.0V Vcc 26.5V
1.0V Vo < 3.0V
(Cout and Ceramic capacitor 10µF is connected in parallel.)
-40°C Ta +125°C
0A Io 1A
R1 (BD00C0AW)
Cout_ESR vs Io
1.0V Vo < 3.0V
Cout and Ceramic capacitor 10µF is
connected in parallel.
(Reference data)
Cin vs Cout
1.0V Vo < 3.0V
Cout and Ceramic capacitor 10µF is
connected in parallel.
(Reference data)
Vcc
CTL GND ADJ
Vo
Cin
(1µF or higher)
VCTL
(5.0V)
VCC
(4.0V to 26.5V)
R1
(5k to 10kΩ)
R2
出力負荷
Io(Rout)
Cout
(1µF
or higher)
ESR
(0.001Ω
or higher)
10µF
41/43
BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Marking Diagrams (TOP VIEW)
Output
Voltage(V)
Part Number
Marking
3.3
33C0AC
5.0
50C0AC
8.0
80C0AC
9.0
90C0AC
Output
Voltage(V)
Part Number
Marking
Variable
00C0AWC
3.3
33C0AWC
5.0
50C0AWC
8.0
80C0AWC
9.0
90C0AWC
Output
Voltage(V)
Output Control Pin
Part Number
Marking
Variable
With SW
00C0AWHFPC
3.3
With SW
33C0AWHFPC
Without SW
33C0AHFPC
5.0
With SW
50C0AWHFPC
Without SW
50C0AHFPC
8.0
With SW
80C0AWHFPC
Without SW
80C0AHFPC
9.0
With SW
90C0AWHFPC
Without SW
90C0AHFPC
TO252-3
TO252-3
(TOP VIEW)
Part Number Marking
LOT Number
TO252-5
TO252-5
(TOP VIEW)
Part Number Marking
LOT Number
HRP5
HRP5 (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
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BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Output
Voltage(V)
Part Number
Marking
3.3
33C0AC
5.0
50C0AC
8.0
80C0AC
9.0
90C0AC
Output
Voltage(V)
Part Number
Marking
Variable
00C0AWC
3.3
33C0AWC
5.0
50C0AWC
8.0
80C0AWC
9.0
90C0AWC
TO263-5 (TOP VIEW)
Part Number Marking
LOT Number
1PIN
TO263-5
TO263-3(F) (TOP VIEW)
Part Number Marking
LOT Number
1PIN
TO263-3(F)
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BDxxC0A-C series BDxxC0AW-C series
TSZ02201-G1G0AN00640-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
27.Jan.2017 Rev.005
www.rohm.com
TSZ22111・15・001
Revision History
Date
Revision
Changes
16.Nov.2012
001
New Release
07.Mar.2013
002
The condition of output pin is changed on Operational Note 11.
The mention of Status of this document is removed.
2.Sep.2013
003
・ Error in writing were corrected
・ New release TO263-3F, TO263-5F, packages.
・ Thermal Resistance and Power Dissipation are changed to be compliant with JEDEC
standard.
・ All characters were conformed to the Chicago manual.
・ The sign in the annotation part was changed from ※n (Note n).
・ NOTE under the absolute maximum rating of P.2 was deleted because it had
overlapped with P.1.
・ Sentences of "Power consumption Pc of IC when short-circuited" that exists in P.30 are
deleted.
・ Operational Notes were updated.
11.Oct.2013
004
・ Page. 31 Error in writing were corrected
27.Jan.2017
005
・ TO263-3 and TO263-5 were added.
・ The description method of thermal Resistance was changed to unify.
・ AEC-Q100 (Note1:Grade1) was appended.
・ Drop voltage figure was corrected. (P.12, 25)
・ Figure 78 I/O equivalent was corrected. (P.31)
・ Error in direction of feed was corrected. (P.39, 40)
Notice-PAA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccur acy or errors of or
concerning such information.
