NPN-Silizium-Fototransistor Silicon NPN Phototransistor Lead (Pb) Free Product - RoHS Compliant SFH 3010 Nicht fur Neuentwicklungen im Automobilbereich / not for new designs in automotive applications Vorlaufige Daten / Preliminary Data Wesentliche Merkmale Features * Sehr kleines SMT-Gehause: (LxBxH) 1,7 mm x 0,8 mm x 0,65 mm * Speziell geeignet fur Anwendungen im Bereich von 420 nm bis 1100 nm * groer Empfangswinkel 80 * Gegurtet lieferbar * Very small SMT package: (LxWxH) 1.7 mm x 0.8 mm x 0.65 mm * Especially suitable for applications from 420 nm to 1100 nm * large viewing angle 80 * Available on tape and reel Anwendungen Applications * Miniaturlichtschranken * Sensorik (z.B. Handy) * Messen/Steuern/Regeln" * Miniature photointerrupters * Sensor technology (eg mobile phone) * For control and drive circuits Typ Type Bestellnummer Ordering Code Fotostrom , (Ee=0,5mW/cm2, =950nm VCE = 5 V) Photocurrent Ipce (A) SFH 3010 Q65110A6458 > 25.0 2008-10-17 1 SFH 3010 Grenzwerte Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 100 C Kollektor-Emitterspannung Collector-emitter voltage VCE VCE (t < 2 min) 15 30 V Kollektorstrom Collector current IC 15 mA Kollektorspitzenstrom, < 10 s Collector surge current ICS 75 mA Emitter-Kollektorspannung Emitter-collector voltage VEC 7 V Verlustleistung, TA = 25 C Total power dissipation Ptot 130 mW 450 K/W 250 K/W Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 5 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 5 mm2 each RthJS Warmewiderstand Sperrschicht - Lotstelle bei Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block 2008-10-17 2 SFH 3010 Kennwerte (TA = 25 C, = 950 nm) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der max. Fotoempfindlichkeit Wavelength of max. sensitivity S max 860 nm Spektraler Bereich der Fotoempfindlichkeit S = 10% von Smax Spectral range of sensitivity S = 10% of Smax 420 ... 1100 nm Bestrahlungsempfindliche Flache Radiant sensitive area A 0.04 mm2 Abmessungen der Chipflache Dimensions of chip area LxB LxW 0.35 x 0.35 mm x mm Halbwinkel Half angle 80 Grad deg. Kapazitat Capacitance VCE = 5 V, f = 1 MHz, E = 0 CCE 1.3 pF Dunkelstrom Dark current VCE = 20 V, E = 0 ICEO 2 ( 50) nA Fotostrom Photocurrent Ee = 0.5 mW/cm2,VCE = 5 V IPCE >25.0 A Anstiegszeit/Abfallzeit Rise and fall time IC = 1 mA, VCC = 5 V, RL = 1 k tr,tf 7 s Kollektrr-Emitter-Sattigungsspannung Collector-emitter saturation voltage IC = 10A Ee = 0.5 mW/cm2, = 950 nm VCEsat 140 mV 2008-10-17 3 SFH 3010 Directional Characteristics Srel = f () 40 30 20 10 0 OHF00614 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 2008-10-17 0.8 0.6 0.4 0 20 40 60 80 4 100 120 SFH 3010 Rel. Spectral Sensitivity, Srel = f (), axial direction Dark Current ICEO = f (VCE), E = 0 OHF00593 100 % Srel 90 Dark Current ICEO = f (TA), VCE = 20 V, E = 0 OHF00380 10 3 nA OHF00383 10 1 nA CEO CEO 80 10 2 70 10 0 60 10 1 50 40 10 -1 30 10 0 20 10 0 400 500 600 700 800 900 10 -2 nm 1100 0 10 20 V 30 Photocurrent IPCE = f (TA), VCE = 5 V, normalized to 25 C Collector-Emitter Capacitance CCE = f (VCE), f = 1 MHz OHF01524 1.6 0 20 40 60 V CE PCE 10 -1 PCE 25 C CE 1.4 80 C 100 TA Total Power Dissipation Ptot = f (TA) OHF00592 3.0 pF OHF00613 140 mW Ptot 2.5 120 1.2 100 2.0 1.0 0.8 80 1.5 60 0.6 1.0 40 0.4 0.5 0.2 20 0 -25 0 25 50 75 C 100 0 -2 10 10 -1 10 0 Photocurrent IPCE = f (VCE), Ee = Parameter IPCE OHF00612 450 A 350 1 mW/cm 2 300 250 200 0.5 mW/cm 2 150 100 0.25 mW/cm 2 50 0.1 mW/cm 2 0 0 5 10 15 20 25 V 30 VCE 2008-10-17 10 1 V 10 2 VCE TA 5 0 0 20 40 60 80 C 100 TA SFH 3010 Mazeichnung Package Outlines Package marking 1.3 (0.051) 0.1 (0.004) 5 1.7 (0.067) 0.1 (0.004) Package marking 7 max (0.002) 0.125 (0.005) +0.05 -0.03 (0.001) 0.8 (0.031) 0.1 (0.004) (0.001) 0.65 (0.026) +0.02 -0.05 (0.002) 0.7 (0.028) 0.05 (0.002) GPLY7036 Mae in mm (inch) / Dimensions in mm (inch). . Gehause / Package Epoxydharz, diffus / Epoxy, diffuse Farbe / Colour Farblos / colourless Gehausemarkierung/ Package marking Kathode / Cathode Empfohlenes Lotpaddesign Recommended Solder Pad Reflow Loten Reflow Soldering 0.8 (0.031) 0.8 (0.031) Copper solder pad 0.8 (0.031) 0.8 (0.031) OHAPY606 Mae in mm (inch) / Dimensions in mm (inch). 2008-10-17 6 SFH 3010 0.7 (0.028) 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) Reflow Loten Reflow Soldering 0.05 (0.002) Alternatives Lotpaddesign Alternative Solder Pad 0.6 (0.024) 0.05 (0.002) Solder stencil aperture Copper solder pad OHPY3832 Mae in mm (inch) / Dimensions in mm (inch). Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering OHLA0687 300 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile C T Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020C) (acc. to J-STD-020C) 255 C 240 C 250 C 260 C +0 -5 C 245 C 5 C C 235 C +5 -0 C 217 C 10 s min 200 30 s max Ramp Down 6 K/s (max) 150 100 s max 120 s max 100 Ramp Up 3 K/s (max) 50 25 C 0 0 50 100 150 200 250 t 2008-10-17 7 s 300 SFH 3010 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2008-10-17 8