PTPS92612QDBVRQ1 - TEXAS INSTRUMENTS

February, 2014 − Rev. 3

1Publication Order Number:

MBR140ESF/D

MBR140ESF, NRVB140ESF

Surface Mount

Schottky Power Rectifier

Plastic SOD−123 Package

This device uses the Schottky Barrier principle with a large area

metal−to−silicon power diode. Ideally suited for low voltage, high

frequency rectification or as free wheeling and polarity protection

diodes in surface mount applications where compact size and weight

are critical to the system. This package also provides an easy to work

with alternative to leadless 34 package style. Because of its small size,

it is ideal for use in portable and battery powered products such as

cellular and cordless phones, chargers, notebook computers, printers,

PDAs and PCMCIA cards. Typical applications are AC−DC and

DC−DC converters, reverse battery protection, and “Oring” of

multiple supply voltages and any other application where performance

and size are critical.

Features

•Guardring for Stress Protection

•Low Reverse Leakage

•175°C Operating Junction Temperature

•Epoxy Meets UL 94 V−0 @ 0.125 in

•Package Designed for Optimal Automated Board Assembly

•ESD Rating:

♦Human Body Model = 3B

♦Machine Model = M4

•NRVB Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

•These Devices are Pb−Free and are RoHS Compliant*

Mechanical Characteristics

•Device Marking: E4F

•Polarity Designator: Cathode Band

•Weight: 11.7 mg (approximately)

•Case: Epoxy, Molded

•Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

•Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Device Package Shipping†

ORDERING INFORMATION

SOD−123FL

CASE 498

SCHOTTKY BARRIER

RECTIFIER

1.0 AMPERES

40 VOLTS

http://onsemi.com

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

MARKING DIAGRAM

E4F = Specific Device Code

M = Date Code

G= Pb−Free Package)

E4FMG

MBR140ESFT3G SOD−123FL

(Pb−Free)

10,000 /

Tape & Reel ***

MBR140ESFT1G SOD−123FL

(Pb−Free)

3,000 /

Tape & Reel **

(Note: Microdot may be in either location)

** 8 mm Tape, 7” Reel

*** 8 mm Tape, 13” Reel

NRVB140ESFT3G SOD−123FL

(Pb−Free)

10,000 /

Tape & Reel ***

NRVB140ESFT1G SOD−123FL

(Pb−Free)

3,000 /

Tape & Reel **

MBR140ESF, NRVB140ESF

http://onsemi.com

MAXIMUM RATINGS

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

40 V

Average Rectified Forward Current IO1.0 A

Peak Repetitive Forward Current IFRM 2.0 A

Non−Repetitive Peak Surge Current

(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz)

IFSM 30

Storage Temperature Tstg −55 to 175 °C

Operating Junction Temperature TJ−55 to 175 °C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

THERMAL CHARACTERISTICS

Characteristic Symbol Value Unit

Thermal Resistance, Junction−to−Lead (Note 1)

Thermal Resistance, Junction−to−Lead (Note 2)

Thermal Resistance, Junction−to−Ambient (Note 1)

Thermal Resistance, Junction−to−Ambient (Note 2)

Rtjl

Rtja

325

°C/W

1. Mounted with minimum recommended pad size, PC Board FR4.

2. Mounted with 1 in. copper pad (Cu area 700 mm2).

ELECTRICAL CHARACTERISTICS

Characteristic Symbol Value Unit

Maximum Instantaneous Forward Voltage (Note 3) VFTJ = 25°CV

(IF = 1.0 A) 0.56

Maximum Instantaneous Reverse Current (Note 3) IRTJ = 25°CmA

(VR = 40 V) 30

3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2%.

MBR140ESF, NRVB140ESF

http://onsemi.com

TYPICAL CHARACTERISTICS

Figure 1. Typical Instantaneous Forward

Characteristics

, INSTANTANEOUS FORWARD

CURRENT (A)

, INSTANTANEOUS FORWARD VOLTAGE (V)

TA = 150°C

TA = 25°C

TA = 125°C

0.10

1.0

10.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

TA = 85°C

0.10

1.0

10.0

0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.0

Figure 2. Maximum Instantaneous Forward

Characteristics

, INSTANTANEOUS FORWARD

CURRENT (A)

, INSTANTANEOUS FORWARD VOLTAGE (V)

TA = 150°C

TA = 25°C

TA = 125°C

TA = 85°C

Figure 3. Typical Reverse Characteristics

1.E−03

VR, INSTANTANEOUS REVERSE VOLTAGE (V)

IR, INSTANTANEOUS REVERSE CURRENT (mA)

TA = 150°C

TA = 25°C

TA = 125°C

1.E−04

1.E−05

1.E−06

1.E−07

TA = 85°C

Figure 4. Maximum Reverse Characteristics

1.E−03

0 5 10 15 20 25 30 35 40

VR, INSTANTANEOUS REVERSE VOLTAGE (V)

IR, INSTANTANEOUS REVERSE CURRENT (mA)

1.E−04

1.E−05

1.E−06

1.E−02

TA = 150°C

TA = 25°C

TA = 125°C

TA = 85°C

0 5 10 15 20 25 30 35 40

1.E−01

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

1.80

2.00

0 20 40 60 80 100 120 140

100

110

Figure 5. Typical Junction Capacitance

VR, REVERSE VOLTAGE (V)

C, JUNCTION CAPACITANCE (pF)

TJ = 25°C

Figure 6. Current Derating, Case

TC, CASE TEMPERATURE (°C)

SQUARE WAVE

RqJA = 82°C/W

IF(AV), AVERAGE FORWARD

CURRENT (A)

MBR140ESF, NRVB140ESF

http://onsemi.com

TYPICAL CHARACTERISTICS

0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40

Figure 7. Forward Power Dissipation

IF(AV), AVERAGE FORWARD CURRENT (A)

PF(AV), AVERAGE FORWARD POW-

ER DISSIPATION (W)

SQUARE

WAVE

TA = 150°C

IPK/IAV = 5

IPK/IAV = 10

IPK/IAV = 20

r(t), TRANSIENT THERMAL RESISTANCE

Figure 8. Thermal Response

10000.10.00001

t1, TIME (sec)

1000

0.0001 0.001 0.01 1 10 1000.000001

0.1

100

P(pk)

DUTY CYCLE, D = t1/t2

qJA = 321.8 °C/W

Test Type > Min Pad < Die Size 38x38 @ 75% mils

D = 0.5

SINGLE PULSE

0.2

0.1

0.05

0.01

MBR140ESF, NRVB140ESF

http://onsemi.com

PACKAGE DIMENSIONS

SOD−123FL

CASE 498

ISSUE D

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.

4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION

OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.

POLARITY INDICATOR

OPTIONAL AS NEEDED

ÉÉÉÉ

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

MIN NOM MAX MIN

MILLIMETERS

0.90 0.95 0.98 0.035

INCHES

A1 0.00 0.05 0.10 0.000

b0.70 0.90 1.10 0.028

c0.10 0.15 0.20 0.004

D1.50 1.65 1.80 0.059

E2.50 2.70 2.90 0.098

L0.55 0.75 0.95 0.022

0.037 0.039

0.002 0.004

0.035 0.043

0.006 0.008

0.065 0.071

0.106 0.114

0.030 0.037

NOM MAX

3.40 3.60 3.80 0.134 0.142 0.150

− −

0°8°0°8°

TOP VIEW

BOTTOM VIEW

SIDE VIEW

END VIEW

RECOMMENDED

DIMENSIONS: MILLIMETERS

1.25

4.20

1.22

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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

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USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

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Phone: 81−3−5817−1050

MBR140ESF/D

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