Application Specification AMPMODU* 50/50 Grid Connectors 114-7010 for SMT PC Board and IDC Ribbon Cable Applications 10 OCT 08 Rev E All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2 . Figures and illustrations are for identification only and are not drawn to scale. _ NOTE i 1. INTRODUCTION This specification covers the requirements for application of AMPMODU 50/50 Grid SMT (Surface Mount Technology) printed circuit (pc) board connectors, and IDC (Insulation Displacement Contact) cable connectors. The connectors have contacts with in-row spacing on 1.27 [.050] centers and row-to-row spacing on 1.27 [.050] centers. They are available in 10-position increments from 10 through 100; the vertical SMT connectors are also available with 16 positions. The SMT connectors are available as receptacles, and as vertical or right-angle pin header assemblies. They feature solderable hold-downs that help to stabilize the connector before and after soldering. There are unpolarized connectors with two large or two medium hold-downs, and there are polarized connectors containing a large hold-down at the end where the stack height marking is located and a small hold-down at the opposite end. All connectors can be placed on the pc board by hand. The IDC connectors are available as receptacle assemblies. Each consists of a housing with insulation displacement contacts and two unassembled covers. These connectors are designed to terminate solid or 7-strand, 30 to 28 AWG ribbon cable with an insulation diameter range of 0.74 to 0.91 [.029 to .036]. They are terminated using manually operated tools. When corresponding with Tyco Electronics Representatives, use the terminology provided in this specification to facilitate your inquiry for information. Basic terms and features of the connectors are provided in Figures 1 and 2. SMT Connectors Socket Contact Right-Angle Receptacle Header Without Connector Locking Bar Solder Tine Polarization Tab Polarizing Slot Solder Tine Hold-Down Polarizing Slot Right-Angle Header Hold-Down With Locking Bar Stabilizing Support Solder Tab Hold-Down Locking Pin Contact Bar Stack Height Dimension Marking Standoff Header Connector Hold-Down Support Hold-Down E 2008 Tyco Electronics Corporation, Harrisburg, PA All International Rights Reserved Hold-Down Figure 1 TOOLING ASSISTANCE CENTER 1-800-722-1111 This controlled document is subject to change. PRODUCT INFORMATION 1-800-522-6752 For latest revision and Regional Customer Service, TE logo and Tyco Electronics are trademarks. *Trademark. Other products, logos, and company names used are the property of their respective owners. visit our website at www.tycoelectronics.com 1 of 20 LOC B AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 IDC Connectors IDC Contact Cover Latch Housing Guide Post Mating Face of Receptacle Figure 2 2. REFERENCE MATERIAL 2.1. Revision Summary This paragraph is reserved for a revision summary of changes covering the most recent additions and changes made to this specification which include the following: S Updated format to corporate requirements S Changed dimensions in Figures 11 and 12 2.2. Customer Assistance Reference Part Number 104652 and Product Code 5375 are representative numbers of AMPMODU 50/50 Grid Connectors. Use of these numbers will identify the product line and expedite your inquiries through a service network established to help you obtain product and tooling information. Such information can be obtained through a local Tyco Electronics Representative or, after purchase, by calling the Tooling Assistance Center or Product Information number at the bottom of page 1. 2.3. Drawings Customer Drawings for specific products are available from the service network. The information contained in Customer Drawings takes priority if there is a conflict with this specification or with any other technical documentation supplied by Tyco Electronics. 2.4. Manuals Manual 402-40 is available from the service network. This manual provides information on various flux types and characteristics along with the commercial designation and flux removal procedures. A checklist is included in the manual as a guide for information on soldering problems. 2.5. Specifications A. Product Specifications Product Specifications 108-1332 and 108-1443 cover test and performance requirements for the SMT and IDC connectors respectively. 2 of 20 Tyco Electronics Corporation Rev E AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 B. Test Specifications Test Specification 109-11 covers suggested test and evaluation methods. C. Workmanship Specification Workmanship Specification 101-21 provides requirements ands evaluation of solder fillets for surface mounted connectors. D. Commercial Specification Commercial specification J-STD-001 provides solder joint requirements. 2.6. Instruction Material The following Instruction Sheets (408) are available for tooling application and repair information for IDC Connectors. 408-9817 - Applicator Frame Assembly 408-9909 - Cover Closing Tool 3. REQUIREMENTS 3.1. Material The housings for all the connectors are made of glass-filled thermoplastic and the contacts of copper alloy, or phosphor bronze nickel underplated with gold plated contact mating ends. Surface-mount solder tines are tin-lead plated. 3.2. Storage Connectors are packaged and shipped in antistatic tube containers. To prevent damage to the housings and contacts, the connectors should remain in the container until ready for installation. Also, to prevent possible storage contamination and insure maximum solderability for SMT solder tines, the connectors should be used on a first in, first out basis. 3.3. Circuit Identification The number 1 molded on the mating face of the housing provides circuit identification, and the number in the rectangular block molded on the side of the vertical connector housing provides the stacking dimension (in thousandths of an inch) between pc boards when two connectors are fully mated. See Figure 1. 3.4. Printed Circuit Boards for SMT Connectors A. Tolerance At the time of connector placement, the coplanarity of the pad pattern must be held to 0.05 [.002] maximum. We recommend a solder mask to minimize solder bridging between pads. The mask must not exceed the height of the pad by more than 0.05 [.002]. CAUTION Since the connector housings may rest on top of the solder mask, an excessively high mask will allow too much space between the solder tine and pad for a good solder joint. A solder joint under these conditions would be weak, and ! would not provide long term performance for the connector. B. Material The pc board material shall be glass epoxy (FR-4 or G-10) and should be 1.58 + 0.18 [.062 + .007] thick to ensure proper performance of the connector hold-downs. Consult Tyco Electronics Engineering for suitability of other materials, or other board thicknesses. A solder mask is recommended when soldering SMT connectors. Those most suitable are Liquid Photo Imageable and Dry Film. Rev E Tyco Electronics Corporation 3 of 20 AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 C. PC Board Layout Recommended pc board patterns are provided in Figures 3 through 6. See Figure 3 for vertical receptacles, Figure 4 for vertical headers, Figure 5 for right-angle headers, and Figure 6 for typical pc board trace layouts. Vertical Receptacle PC Board Layout 0.74 + 0.03 Hole 2 +0.05 -0.08 [.029 + .001] [+.002 - .003] 0.23[.009] S 0.05[.002] S Hole 1 +0.05 -0.08 M N [+.002 - .003] Plated Through Hole 2.62 + 0.05 2.79 + 0.05 (2 Places) (Note 1) [.103 + .002] [.110 + .002] (Typ) 0.23[.009] S 0.05[.002] S A Spaces At M N = DIM B 1.27 [.050] 0.15[.006] S 0.08[.003] S M N (Ref) Centerline of Pattern 6.10 [.240] 2.06 + 0.03 3.30[.130] [.081 + .001] Dia. (Note 2) (Ref) .MMM 1.65[.065] For Medium Hold-down -M- For Small Hold-down (Note 3) (Pad on Top Side) .NNN 1.40 + 0.05 [.055 + .002] 1.55 [.065] (Min Pad on Under Side) (Pad on Top Side) DIM C -N- 1.40 [.055] (Min Pad on Under Side) 0.23[.009] S 0.05[.002] S NUMBER OF POSITIONS SPACES (A) 1.78 + 0.02 [.070 + .001] Pad on Top Side 1.78 [.070] (Min on Under Side) DIMENSIONS B 5.08 [0.200] 0.23[.009] S 0.05[.002] S M N HOLD-DOWNS C 10 4 16 7 8.89 [0.350] 11.94 [0.470] 20 9 11.43 [0.450] 14.48 [0.570] 30 14 17.78 [0.700] 20.83 [0.820] 40 19 24.13 [0.950] 27.18 [1.070] 50 24 30.48 [1.200] 33.53 [1.320] 60 29 36.83 [1.450] 39.88 [1.570] 70 34 43.18 [1.700] 46.23 [1.820] 80 39 49.53 [1.950] 52.58 [2.070] LARGE MEDIUM 1.32 [.052] 1.19 [.047] SMALL 8.13 [0.320] 90 44 55.88 [2.200] 58.93 [2.320] 100 49 62.23 [2.450] 65.28 [2.570] 1. For Large Hold-down (Note 3) M N NUMBER OF NOTES: 1.65 + 0.03 [.065 + .001] 1.52[.060] 0.94 [.037] Holes 1 and 2 in Holes 1 and 2 in Unpolarized Unpolarized Polarized Connectors Connectors Connectors with Large with Medium (Other End has Hold-downs Hold-downs Hole 2 only in Large Hold-down) Hold-down hole. Finish to be tin/lead over 0.03 [.001] minimum copper. For large hold-down use 1.510 + 0.030 [.0595 + .0010] drilled hole (No. 53 drill bit). For medium hold-down use 1.320 + 0.030 [.0520 + .0010] drilled hole (No. 55 drill bit). For small hold-down use 1.070 + 0.030 [.0810 + .0010] drilled hole (No. 58 drill bit). 2. Optional polarization hole 2.060 + 0.030 [.0810 + .0010] drilled hole (No. 46 drill bit). This feature can be used to help ensure proper orientation of the connector on the board. It will require the use of a polarized hand loading tool (see Section 5). 3. Customer established datum. Figure 3 4 of 20 Tyco Electronics Corporation Rev E AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 Vertical Header PC Board Layout 0.74 + 0.03 [.029 + .001] 0.23[.009] S 0.05[.002] S M N 4.12 + 0.05 [.162 + .002] (Typ) Hole 1 +0.05 -0.08 2.54 + 0.05 0.23[.009] S 0.05[.002] S M N [+.002 - .003] [.100 + .002] Plated Through Hole (2 Places) (Note 1) A Spaces At Hole 2 +0.05 -0.08 = 1.27 [+.002 - .003] DIM B [.050] (Ref) 0.15[.006] S 0.08[.003] S M N Centerline of Pattern 8.76 4.62[.182] [.345] (Ref) 2.06 + 0.03 .MMM 2.31[.091] -M- (Note 3) For Medium Hold-down 1.55[.061] 1.65 + 0.03 [.065 + .001] .NNN (Pad on Top Side) 1.40 + 0.05 [.055 + .002] 1.55 [.065] (Min Pad on Under Side) DIM C -N- For Small Hold-down For Large Hold-down (Note 3) (Pad on Top Side) 1.78 + 0.02 [.070 + .001] Pad on Top Side 1.78 [.070] (Min on Under Side) 1.40 [.055] (Min Pad on Under Side) 0.23[.009] 0.05[.002] S M N S NUMBER OF NUMBER OF POSITIONS SPACES (A) B 4 16 7 8.89 [0.350] 11.94 [0.470] 20 9 11.43 [0.450] 14.48 [0.570] 30 14 17.78 [0.700] 20.83 [0.820] S 0.05[.002] S M N MEDIUM SMALL 8.13 [0.320] 40 19 24.13 [0.950] 27.18 [1.070] 50 24 30.48 [1.200] 33.53 [1.320] 60 29 36.83 [1.450] 39.88 [1.570] 70 34 43.18 [1.700] 46.23 [1.820] 80 39 49.53 [1.950] 52.58 [2.070] 90 44 55.88 [2.200] 58.93 [2.320] 100 49 62.23 [2.450] 65.28 [2.570] 1. LARGE C 5.08 [0.200] 0.23[.009] HOLD-DOWNS DIMENSIONS 10 NOTES: Dia. (Note 2) [.081 + .001] 1.32 [.052] 1.19 [.047] 0.94 [.037] Holes 1 and 2 in Holes 1 and 2 in Hole 2 only in Unpolarized Unpolarized Polarized Connectors Connectors Connectors with Large with Medium (Other End has Hold-downs Hold-downs Large Hold-down) Hold-down hole. Finish to be tin/lead over 0.03 [.001] minimum copper. For large hold-down use 1.510 + 0.030 [.0595 + .0010] drilled hole (No. 53 drill bit). For medium hold-down use 1.320 + 0.030 [.0520 + .0010] drilled hole (No. 55 drill bit). For small hold-down use 1.070 + 0.030 [.0810 + .0010] drilled hole (No. 58 drill bit). 2. Optional polarization hole 2.060 + 0.030 [.0810 + .0010] drilled hole (No. 46 drill bit). This feature can be used to help ensure proper orientation of the connector on the board. It will require the use of a polarized hand loading tool (see Section 5). 3. Customer established datum. Figure 4 Rev E Tyco Electronics Corporation 5 of 20 AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 Right-Angle Header PC Board Layout 8.64 7.75 [.340] [.305] Recommended Board Layout NUMBER OF NUMBER OF POSITIONS SPACES (B) DIMENSIONS C D 10 9 5.72 [0.225] 13.97 [0.550] 20 19 12.07 [0.475] 20.32 [0.800] 30 29 18.42 [0.725] 26.67 [1.050] 40 39 24.77 [0.975] 33.02 [1.300] 50 49 31.12 [1.225] 39.37 [1.550] 60 59 37.47 [1.475] 45.72 [1.800] 70 69 43.82 [1.725] 52.07 [2.050] 80 79 50.17 [1.975] 58.42 [2.300] 90 89 56.52 [2.225] 64.77 [2.550] 100 99 62.87 [2.475] 71.12 [2.800] NOTES: 2. Hold-down hole. Use 1.32 + 0.03 [.052 + .001] drilled hole (No. 55 drill bit). Finish to be tin/lead over 0.03 [.001] minimum copper. Figure 5 6 of 20 Tyco Electronics Corporation Rev E AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 Typical Wiring Arrangements Trace Trace on Internal Layer of Trace Space 0.18 [.007] 0.18 [.007] (Typ) (Typ) Multi-Layer PC Board or Opposite Side of Double-Layer PC Board 1.19 [.047] Dia. (Typ) (Note 1) 2.06 [.081] Dia. (Typ) (Note 2) NOTES: 1. 2. Plated through hole for solderable hold-down. Optional polarization hole for vertical connectors. This feature can be used to help ensure proper orientation of the connector on the board. It will require the use of a polarized hand loading tool (see Section 5). Figure 6 3.5. Spacing A. On PC Board Spacing Connectors can be placed in close proximity to each other on the pc board. The dimensions provided do not include space needed for other pc board components. Check spacing requirements for other components before making your placement layout on the pc board. See Figure 7. NOTE The use of more than one vertical connector pair to interconnect two pc boards is not recommended due to tolerance build-up. i Rev E Tyco Electronics Corporation 7 of 20 AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 6.35 [.250] Minimum Between Center of End Pads (For Receptacle Placement UNPOLARIZED Hand Loading Tool Application) 1.40 [.055] Minimum Between Adjacent Pad Patterns 8.26 [.325] Minimum Between Adjacent Pad Patterns (For POLARIZED Hand Loading Tool Application) Through Hole for Polarized 6.35 [.250] Minimum Between Center Loading Tool Application of End Pads (For UNPOLARIZED Hand Loading Tool Application) Header Placement 1.40 [.055] Minimum Between Adjacent Pad Patterns 8.26 [.325] Minimum Between Adjacent Pad Patterns (For POLARIZED Hand Loading Tool Application) Through Hole for Polarized Loading Tool Application 12.07 [.500] Minimum Between Adjacent Pad Patterns Figure 7 8 of 20 Tyco Electronics Corporation Rev E AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 B. Between PC Board Spacing Board-to-board stacking dimensions for the three vertical header configurations are provided in Figure 8. Header (Typ) 6.35 Receptacle (Typ) .250 +0.38 -0.15 +.015 -.006 6.35 [.250] Stacking Header 8.13 [.320] 8.13 Stacking .320 Header 9.91 [.390] 9.91 Stacking Header NOTE: .390 +0.38 -0.15 +.015 -.006 +0.38 -0.15 +.015 -.006 Connector housings must be bottomed on each other to ensure full contact engagement. When fully mated, dimension between boards will be within the range shown. Figure 8 3.6. Polarization and Position Locator The vertical headers have a polarizing slot and the vertical receptacles have a polarizing tab to ensure proper orientation of mating connectors. These features provide a reference location of the number one contact position. See Figure 1. 3.7. Stack Height Indicator Each vertical header has a dimensional marking on the shroud of 250, 320, or 390 to indicate the nominal spacing in thousandths of an inch between parallel stacked pc boards. See Figure 1. 3.8. Mechanical Supports A. Integral Hold-Downs Hold-downs are an integral part of each connector. They go into plated through holes in the pc board to help stabilize the connectors prior to and during soldering, and they provide some strain relief after soldering. They are soldered into the plated through holes in the pc board during the soldering of the solder tines. The hold-downs are designed for 1.58 [.062] pc boards. B. Packaging Hardware The system should be designed with support for the pc boards to minimize stress on the solder tines of surface-mounted connectors. Rev E Tyco Electronics Corporation 9 of 20 AMPMODU 50/50 Grid SMT and IDC Connectors CAUTION 114-7010 The vertical header and receptacle inherently function as a standoff; however, they must not be used as the only standoff support between two pc boards. ! 3.9. Processing The pc board pads must be solderable in accordance with Test Specification 109-11-1. A. Typical Solder Paste Characteristics 1. Alloy type shall be either 63 Sn/37 Pb or 60 Sn/40 Pb. 2. Flux shall be RMA type. 3. Solids by weight shall be 85% minimum. 4. Mesh designation -200 to +325 (74 to 44 square micron openings, respectively). 5. Minimum viscosity of screen print shall be 5 x 10% cp (centipoise). 6. Minimum viscosity of stencil print shall be 7.5 x 10% cp (centipoise). B. Solder Volume Solder volume for each component shall be: Receptacle . . . . . . . . . . . . . . . . . . . . 0.17 mm3 [.0000106 in.3] per contact Vertical Header . . . . . . . . . . . . . . . . . 0.71 mm3 [.0000432 in.3] per contact Vertical Hold-down . . . . . . . . . . . . . 1.34 mm3 [.0000819 in.3] per vertical header hold-down Right-Angle Header . . . . . . . . . . . . 0.22 mm3 [.0000134 in.3] per contact Right-Angle Hold-Down Barb . . . . 1.50 mm3 [.0000914 in.3] per right-angle header hold-down Right-Angle Hold-Down Pad . . . . . 2.41 mm3 [.0001470 in.3] per right-angle header hold-down NOTE Solder volume may vary depending on solder paste composition. i C. Stencil Stencil aperture will be determined by the thickness of the stencil being used. Generally, the thinner stencils will have a larger aperture to maintain a given volume of solder paste. Solder deposition should be within the pad area of the contact solder tines. Typical aperture openings are provided in Figures 9, 10, and 11. CAUTION All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create a short, or wick solder away from the solder tines, producing a weak solder joint. ! CAUTION If a hold-down aperture is required other than that specified, the design must ensure that the connector housing will not sit on the solder deposit. ! NOTE The recommended aperture width is 0.64 [.025] for the vertical receptacles and right-angle headers, and 0.69 [.027] for the vertical headers. It may be wider; however, care must be given to ensure against solder bridging i 10 of 20 during processing. Tyco Electronics Corporation Rev E AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 Vertical Receptacle Stencil D + 0.05 [.002] 0.15[.006] S S M N S Typ 1.65[.065] C + 0.05 [.002] Typ Typ 1.52[.060] Typ 0.15[.006] S M S S N E Spaces at Aperture = 1.27[.050] Opening F (Typ) .NNN A + 0.05 [.002] Typ 0.10[.004] M M S N S CL of Aperture B + 0.05 [.002] 0.10[.004] M Typ M S N -N- S CL of Pattern .MMM -M- NOMINAL STENCIL PAD SIZE THICKNESS 0.74 X 2.79 [ 029 X .110] [.029 110] NO. OF POSN (10 - 50) 0) PAD APERTURE DIMENSION HOLD-DOWN APERTURE DIMENSION A B C D 0.20 [.008] 0.64 [.025] 1.35 [.053] 2.01 [.079] 3.30 [.130] 0.23 [.009] 0.64 [.025] 1.19 [.047] 1.78 [.070] 3.30 [.130] 0.25 [.010] 0.64 [.025] 1.09 [.043] 2.01 [.079] 3.30 [.130] E F NO. OF POSN 60 - 100 E F (Spaces) (Center to Center) (Spaces) (Center to Center) 10 4 5.08 [0.200] 60 29 36.83 [1.450] 16 7 8.89 [0.350] 70 34 43.18 [1.700] 20 9 11.43 [0.450] 60 39 49.53 [1.950] 30 14 17.78 [0.700] 90 44 55.88 [2.200] 40 19 24.13 [0.950] 100 49 62.23 [2.450] 50 24 30.48 [1.200] -- -- -- Figure 9 Rev E Tyco Electronics Corporation 11 of 20 AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 Vertical Header Stencil 2.57 [.101] Typ C + 0.05 [.002] D + 0.05 [.002] Typ S 0.15[.006] Typ M S S N 2.57 [.101] Typ 0.15[.006] S M S N S E Spaces at 1.27 [.050] = F Aperture Opening (Typ) A + 0.05 [.002] Typ 0.10[.004] M M S 0.10[.004] M N M S S CL of Aperture N S .NNN CL of Pattern B + 0.05 [.002] Typ -N.MMM -M- NOMINAL STENCIL PAD SIZE THICKNESS 0.74 X 4.11 [ 029 X .162] [.029 162] NO. OF POSN (10 - 50) PAD APERTURE DIMENSION HOLD-DOWN APERTURE DIMENSION A B C D 0.20 [.008] 0.74 [.029] 4.72 [.186] 1.40 [.055] 4.72 [.186] 0.23 [.009] 0.69 [.027] 4.52 [.178] 1.27 [.050] 4.62 [.182] 0.25 [.010] 0.69 [.027] 4.06 [.160] 1.27 [.050] 4.17 [.164] E F NO. OF POSN 60 - 100 E F (Spaces) (Center to Center) (Spaces) (Center to Center) 10 4 5.08 [0.200] 60 29 36.83 [1.450] 16 7 8.89 [0.350] 70 34 43.18 [1.700] 20 9 11.43 [0.450] 60 39 49.53 [1.950] 30 14 17.78 [0.700] 90 44 55.88 [2.200] 40 19 24.13 [0.950] 100 49 62.23 [2.450] 50 24 30.48 [1.200] -- -- -- Figure 10 12 of 20 Tyco Electronics Corporation Rev E AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 Right-Angle Header Assembly Stencil NOMINAL STENCIL PAD SIZE THICKNESS 0.74 X 2.79 [ 029 X .110] [.029 110] PAD APERTURE DIMENSION HOLD-DOWN APERTURE DIMENSION A B C D1 D2 0.20 [.008) 0.64 [.025] 1.83 [.072] 1.78 [.070] 4.14 [.163] 3.43 [.135] 0.23 [.009] 0.64 [.025] 1.65 [.065] 1.78 [.070] 3.68 [.145] 3.05 [.120] 0.25 [.010] 0.64 [.025] 1.50 [.059] 1.78 [.070] 3.33 [.131] 2.74 [.108] NO. OF POSN (10 - 50) E F NO. OF POSN 60 - 100 E F (Spaces) (Center-to-Center) (Spaces) (Center-to-Center) 10 9 5.76 [.225] 60 59 37.76 [1.475] 20 19 2.16 [.475] 70 69 44.16 [1.725] 30 29 18.56 [.725] 80 79 50.55 [1.975] 40 39 24.96 [.975] 90 89 56.96 [2.225] 50 49 31.36 [1.225] 100 99 63.36 [2.475] Figure 11 D. Solder Screen Generally, we do not recommend screen application of solder paste because of the limited volume of paste that can be deposited. If a screen application is required, we recommend removal of all screen from the solder tine and hold-down pad areas. Consult your supplier for compatibility of screen and paste, and for application techniques. E. Solder Mask Solder mask is recommended between all pads. If a trace is run between adjacent pads on the solder side of the pc board, a solder mask must be applied over the trace to prevent bridging and wicking of solder away from the contact solder tines. Additionally, there should be solder mask covering any traces in the area of the hold-down solder deposit. Liquid photo imageable or dry film solder masks are recommended. Rev E Tyco Electronics Corporation 13 of 20 AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 F. Connector Placement Connectors can be placed on the pc board by hand. When doing so, grip the connector at the ends of the housing without touching the contact to prevent contamination and deformation of the solder tines. Vertical connectors can be placed on the pc board with a hand loading tool. When using the tool, the connectors should be emptied from the shipping tube into a feeder device and picked up with the tool as described in the instructions packaged with the tool. NOTE Optimally, the connector solder tines should be aligned on the pc board pads. However, misregistration is permissible for certain performance classifications as specified in J-STD-001. See Figure 12. i Connector Tine Centered on PC Board Pad is Preferable Solder Tine Tine Overhang is Acceptable for Some Performance Classifications Per J-STD-001 PC Board Pad PC Board Figure 12 G. Solder 1. Parameters The connectors will withstand temperatures of 260_C [500_F] for a maximum of three minutes. Higher temperatures can be withstood for short periods of time as indicated in Figure 13 for the infrared (IR) reflow. Refer to the recommendations provided in Figure 13 for typical reflow parameters. Due to the many variables involved with the reflow process (ie, component density, orientation, etc), we recommend that the user conduct trial runs under actual manufacturing conditions to ensure product and process compatibility. Preheat 350_C [662_F] ZONE 1 ZONE 2 ZONE 3 TOP HEATER 285_ [545_] 265_ [509_] 310_ [590_] BOTTOM HEATER 285_ [545_] 265_ [509_] 310_ [590_] Figure 13 2. Process We recommend that connectors be soldered using vapor phase (VPR), double sided non-focused infrared (IR), or equivalent soldering technique. We have had success using Vitronics} IR (Model SMD 718) equipment. } Manufactured by Vitronics Corporation, Newburyport, MA 14 of 20 Tyco Electronics Corporation Rev E AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 H. Cleaning Removal of fluxes, residues, and activators is necessary. Consult with the supplier of the solder paste and flux for recommended cleaning solvents. The following is a listing of common cleaning solvents that will not affect the receptacle and header connectors. The connectors will be unaffected by any of these solvents for five minutes at 105_C [221_F]. See Figure 14. CLEANER TIME NAME TEMPERATURES (Maximum) (Mi (Minutes) ) TYPE CELSIUS FAHRENHEIT Alpha 2110H Aqueous 1 132 270 Bioact EC-7z Solvent 5 100 212 Butyl CarbitolD Solvent 1 Isopropyl Alcohol Solvent 5 100 212 Kester 5778s Aqueous 5 100 212 Kester 5779s Aqueous 5 100 212 Loncoterge 520D Aqueous 5 100 212 Loncoterge 530D Aqueous 5 100 212 Terpene Solvent Solvent 5 100 212 H Product of Fry's Metals, Inc. z Product of Petroferm, Inc. Room Ambient D Product of Union Carbide Corp. s Product of Litton Systems, Inc. Figure 14 DANGER Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer. Trichloroethylene and Methylene Chloride can be used with no harmful affect to the connectors; however, Tyco Electronics does not recommend them because of the harmful occupational and environmental affects. Both are carcinogenic (cancer-causing) and Trichloroethylene is harmful to the earth's ozone layer. NOTE If you have a particular solvent that is not listed, contact Tyco Electronics Engineering by calling the Tooling Assistance Center toll-free number on page 1. i I. Checking Installed Connector All solder joints should conform to those specified in Workmanship Specification 101-21. The housing must seat on the pc board to within the tolerance provided in Figure 15. Pad Length Standoff Tolerance Pad Width 0.13 [.005] Max. Figure 15 Rev E Tyco Electronics Corporation 15 of 20 AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 3.10. IDC Ribbon Cable Preparation The only preparation for the cable is to be sure it is cut squarely. We recommend the use a guillotine-type cutter with a cable guide at a right-angle to the cutting blade. See Figure 16. Straight Edge of Cover Ribbon Cable Housing _ 90 Figure 16 3.11. IDC Cover Placement The covers are symmetrical and must be started into the housing before positioning the cable for termination. The straight edge of the cover must be toward the housing. See Figure 16. NOTE Refer to Section 5 for the tooling recommended to terminate the connectors. i 3.12. Inspection of Terminated IDC Connectors External and internal inspections can be made on terminated connectors. All terminated connectors can be inspected externally. Internal inspections should be made during setup and periodically to ensure that the connectors are being properly applied. Connectors used for internal inspection must be discarded after inspection. A. External Inspection (Figure 17) 1. Check the terminated connector for electrical continuity. 2. Connector must be perpendicular to edge of cable within the tolerance provided. 3. The straight edge of both covers must be toward the housing. 4. The terminated cable end must be visible between the cover and housing. 5. Terminated covers must be seated within the dimension provided. External Inspection Cable End Must _ + 2_ 90 be Visible Termination Dimension 7.62 [.300] Maximum Straight Edge of Cover Figure 17 16 of 20 Tyco Electronics Corporation Rev E AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 B. Internal Inspection (Figure 18) 1. Carefully remove both covers and check that each conductor is terminated. 2. Make sure that all contacts have penetrated the cable and that none are bent or deformed. 3. Make sure the conductors and contacts are placed in accordance with requirements provided. Internal Inspection Contacts Must Not be Bent After Termination and Must Fit Within Each Contact Must be Aligned With a the Termination Cover Slots All Contacts Must Cover Must Fully Seat on Housing at Cover End Penetrate Cable Single Conductor Remove Wire From Slot 0.76 [.030] Min. (Conductor Must be Exposed and Wire Protrusion Deformed on Both Sides to be Considered a Good Termination) Strand Closest to Transition Must be a Minimum of One Full Strand Diameter, to a Maximum of Three Insulation Must be Intact, Full Strand Diameters from the Except in Area of Slot Transition (Tooling Marks on Wire Contact Base Metal Must Insulation are Acceptable) Not be Exposed or Deformed During Termination Figure 18 3.13. Mating and Unmating CAUTION The use of uneven or off-angle forces during mating and unmating of the connectors could cause over-stress and damage to the contacts and/or housings. Do NOT use the peel-back" method of unmating one end and pulling it until ! the other end is unmated. Also, do NOT use a severe side-to-side rocking motion to unmate connectors. Connectors must be pushed straight in when mating and pulled straight out when unmating. A slight side-to-side motion may be used to start extraction, but it must not continue through full extraction cycle. Miniaturization is a design feature of these connectors and the systems in which they are used. Component density, connector location, and pc board size may make it difficult to hold one connector in place while extracting the other. Two methods are recommended to facilitate removal. The preferred method is to have one of the pc boards securely fastened and adequately supported to withstand the pulling force applied to the other pc board. The second method is to construct a tool for your system design that will produce a straight-away separation of the connectors. 4. QUALIFICATIONS The AMPMODU 50/50 Grid SMT and IDC Connectors are listed by the following agencies. 4.1. Underwriters Laboratories Inc. (UL) The connectors are listed under UL File Number E28476. 4.2. Canadian Standards Association (CSA) The connectors are certified under File Number LR 7189-A00255. Rev E Tyco Electronics Corporation 17 of 20 AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 5. TOOLING A manual miniature arbor frame assembly and cover closing kit have been designed to terminate ribbon cable to IDC connectors. The tool and applicable instruction sheet are shown in Figure 19. Manual Miniature Applicator Frame Assembly 91295-1 (408-9817) Termination Cover Closing Tooling 543518-1 (408-9909) Tube Container Configurations Vertical Headers Stack Height (Typ) 9.91 8.13 [.390] 6.35 [.320] Vertical Right-Angle Receptacles Headers [.250] 12.95 11.18 [.510] 558.8 [22.00] 9.40 [.440] [.370] 8.31 11.48 [.327] [.452] 10.41 10.41 10.41 8.51 9.22 [.410] [.410] [.410] [.335] [.363] (Typ) Figure 19 18 of 20 Tyco Electronics Corporation Rev E AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 6. VISUAL AID Figure 20 shows typical surface mount and insulation displacement connectors, and are intended for use by production personnel to visually ensure suitable applications. Installations which appear visually incorrect should be dimensional inspected using the information given in the preceding pages of this application specification. 6.1. Surface Mount Technology (SMT) Connectors POLARIZING TAB MUST ALIGN WITH POLARIZING SLOT IN HEADER SOLDER FILLET SHOULD BE FORMED EVENLY AROUND SOLDER TINE SOLDER TINE SHOULD BE CENTERED ON TRACE PAD SHROUD MUST NOT BE POLARIZING SLOT MUST CHIPPED, CRACKED, OR ALIGN WITH POLARIZING DAMAGED IN ANY WAY TAB ON RECEPTACLE STANDOFFS SHOULD BE STANDOFFS SHOULD BE SEATED ON PC BOARD SEATED ON PC BOARD SOLDER FILLETS MUST BE EVENLY FORMED AROUND SOLDER TINES HOLD-DOWN BARBS SHOULD ENGAGE THE PC BOARD AND BE SOLDERED INTO PLACE HOLD-DOWN BARBS MUST ENGAGE THE PC BOARD AND BE SOLDERED IN PLACE STABILIZING SOLDER TAB STANDOFFS SHOULD BE MUST BE SOLDERED IN PLACE SEATED ON PC BOARD FIGURE 20. VISUAL AID (cont'd) Rev E Tyco Electronics Corporation 19 of 20 AMPMODU 50/50 Grid SMT and IDC Connectors 114-7010 6.2. Insulation Displacement Connectors (IDC) STRAIGHT EDGE OF COVER MUST BE TOWARD HOUSING CABLE END MUST BE VISIBLE BETWEEN HOUSING AND COVER COVER MUST BE SEATED ON HOUSING LOCKING LATCH MUST ENGAGE UNDERSIDE OF LOCKING BAR STANDOFFS MUST SEAT ON PC BOARD FIGURE 20. VISUAL AID (end) 20 of 20 Tyco Electronics Corporation Rev E