Application Specification
114-7010
AMPMODU* 50/50 Grid Connectors
for SMT PC Board and IDC
LOC B
1
of 20
E
2008 Tyco Electronics Corporation, Harrisburg, PA
All International Rights Reserved
TE logo and Tyco Electronics are trademarks.
*Trademark. Other products, logos, and company names used are the property of their respective owners.
TOOLING ASSISTANCE CENTER 1-800-722-1111
PRODUCT INFORMATION 1-800-522-6752 This controlled document is subject to change.
For latest revision and Regional Customer Service,
visit our website at
www.tycoelectronics.com
Ribbon Cable Applications
10 OCT 08 Rev E
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and
inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2
_
.
Figures and illustrations are for identification only and are not drawn to scale.
1. INTRODUCTION
This specification covers the requirements for application of AMPMODU 50/50 Grid SMT (Surface Mount
Technology) printed circuit (pc) board connectors, and IDC (Insulation Displacement Contact) cable
connectors. The connectors have contacts with in–row spacing on 1.27 [.050] centers and row–to–row spacing
on 1.27 [.050] centers. They are available in 10–position increments from 10 through 100; the vertical SMT
connectors are also available with 16 positions.
The SMT connectors are available as receptacles, and as vertical or right–angle pin header assemblies. They
feature solderable hold–downs that help to stabilize the connector before and after soldering. There are
unpolarized connectors with two large or two medium hold–downs, and there are polarized connectors
containing a large hold–down at the end where the stack height marking is located and a small hold–down at
the opposite end. All connectors can be placed on the pc board by hand.
The IDC connectors are available as receptacle assemblies. Each consists of a housing with insulation
displacement contacts and two unassembled covers. These connectors are designed to terminate solid or
7–strand, 30 to 28 AWG ribbon cable with an insulation diameter range of 0.74 to 0.91 [.029 to .036]. They are
terminated using manually operated tools.
When corresponding with Tyco Electronics Representatives, use the terminology provided in this specification
to facilitate your inquiry for information. Basic terms and features of the connectors are provided in Figures 1
and 2.
Receptacle
Connector
Socket Contact
Polarization
Tab
Solder
Tine
Hold-Down
Support
Hold-Down
Hold-Down
Hold-Down
Support
Pin Contact
Polarizing
Slot
Stack Height
Dimension
Marking
Header
Connector
Stabilizing
Solder Tab
Right-Angle
Header Without
Locking Bar
Right-Angle Header
With Locking Bar
Locking
Bar
Standoff
SMT Connectors
Figure 1
Hold-Down
Hold-Down
Polarizing
Slot
Solder
Tine
NOTE
i
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IDC Connectors
IDC
Contact
Mating Face of
Receptacle
Guide
Post
Cover
Latch
Housing
Figure 2
2. REFERENCE MATERIAL
2.1. Revision Summary
This paragraph is reserved for a revision summary of changes covering the most recent additions and changes
made to this specification which include the following:
S
Updated format to corporate requirements
S
Changed dimensions in Figures 11 and 12
2.2. Customer Assistance
Reference Part Number 104652 and Product Code 5375 are representative numbers of AMPMODU 50/50 Grid
Connectors. Use of these numbers will identify the product line and expedite your inquiries through a service
network established to help you obtain product and tooling information. Such information can be obtained
through a local Tyco Electronics Representative or, after purchase, by calling the Tooling Assistance Center or
Product Information number at the bottom of page 1.
2.3. Drawings
Customer Drawings for specific products are available from the service network. The information contained in
Customer Drawings takes priority if there is a conflict with this specification or with any other technical
documentation supplied by Tyco Electronics.
2.4. Manuals
Manual 402–40 is available from the service network. This manual provides information on various flux types
and characteristics along with the commercial designation and flux removal procedures. A checklist is included
in the manual as a guide for information on soldering problems.
2.5. Specifications
A. Product Specifications
Product Specifications 108–1332 and 108–1443 cover test and performance requirements for the SMT
and IDC connectors respectively.
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B. Test Specifications
Test Specification 109–11 covers suggested test and evaluation methods.
C. Workmanship Specification
Workmanship Specification 101–21 provides requirements ands evaluation of solder fillets for surface
mounted connectors.
D. Commercial Specification
Commercial specification J–STD–001 provides solder joint requirements.
2.6. Instruction Material
The following Instruction Sheets (408) are available for tooling application and repair information for IDC
Connectors.
408–9817 – Applicator Frame Assembly
408–9909 – Cover Closing Tool
3. REQUIREMENTS
3.1. Material
The housings for all the connectors are made of glass–filled thermoplastic and the contacts of copper alloy, or
phosphor bronze nickel underplated with gold plated contact mating ends. Surface–mount solder tines are
tin–lead plated.
3.2. Storage
Connectors are packaged and shipped in antistatic tube containers. To prevent damage to the housings and
contacts, the connectors should remain in the container until ready for installation. Also, to prevent possible
storage contamination and insure maximum solderability for SMT solder tines, the connectors should be used
on a first in, first out basis.
3.3. Circuit Identification
The number 1 molded on the mating face of the housing provides circuit identification, and the number in the
rectangular block molded on the side of the vertical connector housing provides the stacking dimension (in
thousandths of an inch) between pc boards when two connectors are fully mated. See Figure 1.
3.4. Printed Circuit Boards for SMT Connectors
A. Tolerance
At the time of connector placement, the coplanarity of the pad pattern must be held to 0.05 [.002]
maximum. We recommend a solder mask to minimize solder bridging between pads. The mask must not
exceed the height of the pad by more than 0.05 [.002].
Since the connector housings may rest on top of the solder mask, an excessively high mask will allow too much space
between the solder tine and pad for a good solder joint. A solder joint under these conditions would be weak, and
would not provide long term performance for the connector.
B. Material
The pc board material shall be glass epoxy (FR–4 or G–10) and should be 1.58 + 0.18 [.062 + .007] thick
to ensure proper performance of the connector hold–downs. Consult Tyco Electronics Engineering for
suitability of other materials, or other board thicknesses. A solder mask is recommended when soldering
SMT connectors. Those most suitable are Liquid Photo Imageable and Dry Film.
CAUTION
!
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C. PC Board Layout
Recommended pc board patterns are provided in Figures 3 through 6. See Figure 3 for vertical
receptacles, Figure 4 for vertical headers, Figure 5 for right–angle headers, and Figure 6 for typical pc
board trace layouts.
NOTES:
1. Hold-down hole. Finish to be tin/lead over 0.03 [.001] minimum copper.
For large hold-down use 1.510 + 0.030 [.0595 + .0010] drilled hole (No. 53 drill bit).
For medium hold-down use 1.320 + 0.030 [.0520 + .0010] drilled hole (No. 55 drill bit).
For small hold-down use 1.070 + 0.030 [.0810 + .0010] drilled hole (No. 58 drill bit).
2. Optional polarization hole 2.060 + 0.030 [.0810 + .0010] drilled hole (No. 46 drill bit). This feature can be used to help
ensure proper orientation of the connector on the board. It will require the use of a polarized hand loading tool
(see Section 5).
3. Customer established datum.
Vertical Receptacle PC Board Layout
NUMBER OF
POSITIONS NUMBER OF
SPACES (A)
DIMENSIONS
BC
10 4 5.08 [0.200] 8.13 [0.320]
16 7 8.89 [0.350] 11.94 [0.470]
20 9 11.43 [0.450] 14.48 [0.570]
30 14 17.78 [0.700] 20.83 [0.820]
40 19 24.13 [0.950] 27.18 [1.070]
50 24 30.48 [1.200] 33.53 [1.320]
60 29 36.83 [1.450] 39.88 [1.570]
70 34 43.18 [1.700] 46.23 [1.820]
80 39 49.53 [1.950] 52.58 [2.070]
90 44 55.88 [2.200] 58.93 [2.320]
100 49 62.23 [2.450] 65.28 [2.570]
HOLD-DOWNS
LARGE MEDIUM SMALL
1.32 [.052]
Holes 1 and 2 in
Unpolarized
Connectors
with Large
Hold-downs
1.19 [.047]
Holes 1 and 2 in
Unpolarized
Connectors
with Medium
Hold-downs
0.94 [.037]
Hole 2 only in
Polarized
Connectors
(Other End has
Large
Hold-down)
0.23[.009] SNM
0.05[.002] S
1.52[.060]
DIM C
-N-
(Note 3)
.NNN
.MMM
-M- (Note 3)
1.65[.065]
3.30[.130]
0.74 + 0.03
[.029 + .001]
0.23[.009] SNM
0.05[.002] S
2.62 + 0.05
[.103 + .002]
A Spaces At
1.27
[.050] DIM B
=(Ref)
Hole 1 +0.05 -0.08
[+.002 - .003]
Plated Through Hole
(2 Places) (Note 1)
Centerline of Pattern
2.06 + 0.03
[.081 + .001]
0.15[.006] SNM
0.08[.003] S
2.79 + 0.05
[.110 + .002] (Typ)
0.23[.009] SNM
0.05[.002] S
Dia. (Note 2)
6.10
[.240]
(Ref)
For Medium Hold-down
1.65 + 0.03 [.065 + .001]
(Pad on Top Side)
1.55 [.065] (Min Pad on Under Side)
For Large Hold-down
1.78 + 0.02 [.070 + .001] Pad on Top Side
1.78 [.070] (Min on Under Side)
Hole 2 +0.05 -0.08
[+.002 - .003]
For Small Hold-down
1.40 + 0.05 [.055 + .002]
(Pad on Top Side)
1.40 [.055] (Min Pad on Under Side)
0.23[.009] SNM
0.05[.002] S
Figure 3
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Vertical Header PC Board Layout
NOTES:
1. Hold-down hole. Finish to be tin/lead over 0.03 [.001] minimum copper.
For large hold-down use 1.510 + 0.030 [.0595 + .0010] drilled hole (No. 53 drill bit).
For medium hold-down use 1.320 + 0.030 [.0520 + .0010] drilled hole (No. 55 drill bit).
For small hold-down use 1.070 + 0.030 [.0810 + .0010] drilled hole (No. 58 drill bit).
2. Optional polarization hole 2.060 + 0.030 [.0810 + .0010] drilled hole (No. 46 drill bit). This feature can be used to help
ensure proper orientation of the connector on the board. It will require the use of a polarized hand loading tool
(see Section 5).
3. Customer established datum.
NUMBER OF
POSITIONS NUMBER OF
SPACES (A) DIMENSIONS
BC
10 4 5.08 [0.200] 8.13 [0.320]
16 7 8.89 [0.350] 11.94 [0.470]
20 9 11.43 [0.450] 14.48 [0.570]
30 14 17.78 [0.700] 20.83 [0.820]
40 19 24.13 [0.950] 27.18 [1.070]
50 24 30.48 [1.200] 33.53 [1.320]
60 29 36.83 [1.450] 39.88 [1.570]
70 34 43.18 [1.700] 46.23 [1.820]
80 39 49.53 [1.950] 52.58 [2.070]
90 44 55.88 [2.200] 58.93 [2.320]
100 49 62.23 [2.450] 65.28 [2.570]
HOLD-DOWNS
LARGE MEDIUM SMALL
1.32 [.052]
Holes 1 and 2 in
Unpolarized
Connectors
with Large
Hold-downs
1.19 [.047]
Holes 1 and 2 in
Unpolarized
Connectors
with Medium
Hold-downs
0.94 [.037]
Hole 2 only in
Polarized
Connectors
(Other End has
Large
Hold-down)
Centerline of Pattern
1.55[.061]
DIM C
2.54 + 0.05
[.100 + .002]
A Spaces At
1.27
[.050] DIM B
=
(Ref)
-N-
(Note 3)
.NNN
-M- (Note 3)
2.31[.091]
.MMM
4.62[.182]
0.74 + 0.03
[.029 + .001]
0.23[.009] SNM
0.05[.002] S
4.12 + 0.05
[.162 + .002] (Typ)
0.23[.009] SNM
0.05[.002] S
2.06 + 0.03
[.081 + .001] Dia. (Note 2)
8.76
[.345]
(Ref)
Hole 2 +0.05 -0.08
[+.002 - .003]
For Small Hold-down
1.40 + 0.05 [.055 + .002]
(Pad on Top Side)
1.40 [.055] (Min Pad on Under Side)
0.23[.009] SNM
0.05[.002] S
0.23[.009] SNM
0.05[.002] S
Hole 1 +0.05 -0.08
[+.002 - .003]
Plated Through Hole
(2 Places) (Note 1)
0.15[.006] SNM
0.08[.003] S
For Medium Hold-down
1.65 + 0.03 [.065 + .001]
(Pad on Top Side)
1.55 [.065] (Min Pad on Under Side)
For Large Hold-down
1.78 + 0.02 [.070 + .001] Pad on Top Side
1.78 [.070] (Min on Under Side)
Figure 4
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NOTES:
2. Hold-down hole. Use 1.32 + 0.03 [.052 + .001] drilled hole (No. 55 drill bit). Finish to be tin/lead over 0.03 [.001]
minimum copper.
Right-Angle Header PC Board Layout
NUMBER OF
POSITIONS NUMBER OF
SPACES (B)
DIMENSIONS
CD
10 9 5.72 [0.225] 13.97 [0.550]
20 19 12.07 [0.475] 20.32 [0.800]
30 29 18.42 [0.725] 26.67 [1.050]
40 39 24.77 [0.975] 33.02 [1.300]
50 49 31.12 [1.225] 39.37 [1.550]
60 59 37.47 [1.475] 45.72 [1.800]
70 69 43.82 [1.725] 52.07 [2.050]
80 79 50.17 [1.975] 58.42 [2.300]
90 89 56.52 [2.225] 64.77 [2.550]
100 99 62.87 [2.475] 71.12 [2.800]
Recommended Board Layout
Figure 5
8.64
[.340] 7.75
[.305]
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Tyco Electronics Corporation
NOTES:
1. Plated through hole for solderable hold-down.
2. Optional polarization hole for vertical connectors. This feature can be used to help ensure proper orientation of the
connector on the board. It will require the use of a polarized hand loading tool (see Section 5).
Typical Wiring Arrangements
Trace
Trace on Internal Layer of
Multi-Layer PC Board or Opposite
Side of Double-Layer PC Board
Trace
0.18 [.007]
(Typ)
Space
0.18 [.007]
(Typ)
1.19 [.047] Dia.
(Typ) (Note 1)
2.06 [.081] Dia.
(Typ) (Note 2)
Figure 6
3.5. Spacing
A. On PC Board Spacing
Connectors can be placed in close proximity to each other on the pc board. The dimensions provided do
not include space needed for other pc board components. Check spacing requirements for other
components before making your placement layout on the pc board. See Figure 7.
The use of more than one vertical connector pair to interconnect two pc boards is not recommended due to tolerance
build-up.
NOTE
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AMPMODU 50/50 Grid SMT and IDC Connectors
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Receptacle
Placement
Header
Placement
6.35 [.250] Minimum Between Center
of End Pads (For
UNPOLARIZED
Hand Loading Tool Application)
1.40 [.055] Minimum Between
Adjacent Pad Patterns
8.26 [.325] Minimum Between Adjacent
Pad Patterns (For
POLARIZED
Hand Loading Tool Application)
Through Hole for Polarized
Loading Tool Application 6.35 [.250] Minimum Between Center
of End Pads (For
UNPOLARIZED
Hand Loading Tool Application)
8.26 [.325] Minimum Between Adjacent
Pad Patterns (For
POLARIZED
Hand Loading Tool Application)
Through Hole for Polarized
Loading Tool Application
1.40 [.055] Minimum Between
Adjacent Pad Patterns
12.07 [.500] Minimum Between
Adjacent Pad Patterns
Figure 7
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B. Between PC Board Spacing
Board–to–board stacking dimensions for the three vertical header configurations are provided in Figure 8.
NOTE:
Connector housings must be bottomed on each other to ensure full contact engagement. When fully mated, dimension
between boards will be within the range shown.
Header
(Typ)
Receptacle
(Typ)
6.35 [.250]
Stacking
Header
8.13 [.320]
Stacking
Header
9.91 [.390]
Stacking
Header
6.35
.250
8.13
.320
9.91
.390
+0.38
-0.15
+.015
-.006
+0.38
-0.15
+.015
-.006
+0.38
-0.15
+.015
-.006
Figure 8
3.6. Polarization and Position Locator
The vertical headers have a polarizing slot and the vertical receptacles have a polarizing tab to ensure proper
orientation of mating connectors. These features provide a reference location of the number one contact
position. See Figure 1.
3.7. Stack Height Indicator
Each vertical header has a dimensional marking on the shroud of 250, 320, or 390 to indicate the nominal
spacing in thousandths of an inch between parallel stacked pc boards. See Figure 1.
3.8. Mechanical Supports
A. Integral Hold-Downs
Hold–downs are an integral part of each connector. They go into plated through holes in the pc board to
help stabilize the connectors prior to and during soldering, and they provide some strain relief after
soldering. They are soldered into the plated through holes in the pc board during the soldering of the
solder tines. The hold–downs are designed for 1.58 [.062] pc boards.
B. Packaging Hardware
The system should be designed with support for the pc boards to minimize stress on the solder tines of
surface–mounted connectors.
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AMPMODU 50/50 Grid SMT and IDC Connectors
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The vertical header and receptacle inherently function as a standoff; however, they must not be used as the only
standoff support between two pc boards.
3.9. Processing
The pc board pads must be solderable in accordance with Test Specification 109–11–1.
A. Typical Solder Paste Characteristics
1. Alloy type shall be either 63 Sn/37 Pb or 60 Sn/40 Pb.
2. Flux shall be RMA type.
3. Solids by weight shall be 85% minimum.
4. Mesh designation –200 to +325 (74 to 44 square micron openings, respectively).
5. Minimum viscosity of screen print shall be 5 x 10% cp (centipoise).
6. Minimum viscosity of stencil print shall be 7.5 x 10% cp (centipoise).
B. Solder Volume
Solder volume for each component shall be:
Receptacle 0.17 mm3 [.0000106 in.3] per contact. . . . . . . . . . . . . . . . . . . .
Vertical Header 0.71 mm3 [.0000432 in.3] per contact. . . . . . . . . . . . . . . . .
Vertical Hold–down 1.34 mm3 [.0000819 in.3] per vertical header hold–down. . . . . . . . . . . . .
Right–Angle Header 0.22 mm3 [.0000134 in.3] per contact. . . . . . . . . . . .
Right–Angle Hold–Down Barb 1.50 mm3 [.0000914 in.3] per right–angle header hold–down. . . .
Right–Angle Hold–Down Pad 2.41 mm3 [.0001470 in.3] per right–angle header hold–down. . . . .
Solder volume may vary depending on solder paste composition.
C. Stencil
Stencil aperture will be determined by the thickness of the stencil being used. Generally, the thinner
stencils will have a larger aperture to maintain a given volume of solder paste. Solder deposition should be
within the pad area of the contact solder tines. Typical aperture openings are provided in Figures 9, 10,
and 11.
All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create
a short, or wick solder away from the solder tines, producing a weak solder joint.
If a hold-down aperture is required other than that specified, the design must ensure that the connector housing will
not sit on the solder deposit.
The recommended aperture width is 0.64 [.025] for the vertical receptacles and right-angle headers, and
0.69 [.027] for the vertical headers. It may be wider; however, care must be given to ensure against solder bridging
during processing.
CAUTION
!
NOTE
i
CAUTION
!
CAUTION
!
NOTE
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Tyco Electronics Corporation
Vertical Receptacle Stencil
1.65[.065]
Typ 1.52[.060]
Typ
E Spaces at
1.27[.050] =F
.NNN
-N-
-M-
.MMM
C
Lof Pattern
C
Lof Aperture
Aperture
Opening
(Typ)
0.10[.004] MS
MS
N
0.15[.006] SS
MS
N
C+0.05 [.002]
Typ
D+0.05 [.002]
Typ
0.15[.006] SS
MS
N
A+0.05 [.002]
Typ
B+0.05 [.002]
Typ 0.10[.004] MS
MS
N
NOMINAL
PAD SIZE
STENCIL
THICKNESS
PAD APERTURE DIMENSION HOLD-DOWN APERTURE DIMENSION
PAD SIZE THICKNESS A B C D
0.74 X 2.79
[ 029 X 110]
0.20 [.008] 0.64 [.025] 1.35 [.053] 2.01 [.079] 3.30 [.130]
[.029 X .110] 0.23 [.009] 0.64 [.025] 1.19 [.047] 1.78 [.070] 3.30 [.130]
0.25 [.010] 0.64 [.025] 1.09 [.043] 2.01 [.079] 3.30 [.130]
NO. OF POSN
(10 0)
E F NO. OF POSN
60 100
E F
(10 - 50) (Spaces) (Center to Center) 60 - 100 (Spaces) (Center to Center)
10 4 5.08 [0.200] 60 29 36.83 [1.450]
16 7 8.89 [0.350] 70 34 43.18 [1.700]
20 9 11.43 [0.450] 60 39 49.53 [1.950]
30 14 17.78 [0.700] 90 44 55.88 [2.200]
40 19 24.13 [0.950] 100 49 62.23 [2.450]
50 24 30.48 [1.200] -- -- --
Figure 9
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Vertical Header Stencil
2.57 [.101]
Typ
E Spaces at
1.27 [.050] =F
.NNN
.MMM -M-
-N-
Aperture
Opening
(Typ)
0.15[.006] SS
MS
N
D+0.05 [.002]
Typ
C+0.05 [.002]
Typ 0.15[.006] SS
MS
N
2.57 [.101]
Typ
A+0.05 [.002]
Typ
0.10[.004] MS
MS
N
0.10[.004] MS
MS
N
B+0.05 [.002]
Typ
C
Lof Pattern
C
Lof Aperture
NOMINAL
PAD SIZE
STENCIL
THICKNESS
PAD APERTURE DIMENSION HOLD-DOWN APERTURE DIMENSION
PAD SIZE
THICKNESS
A B C D
0.74 X 4.11
[ 029 X 162]
0.20 [.008] 0.74 [.029] 4.72 [.186] 1.40 [.055] 4.72 [.186]
[
.
029 X
.
162]
0.23 [.009] 0.69 [.027] 4.52 [.178] 1.27 [.050] 4.62 [.182]
0.25 [.010] 0.69 [.027] 4.06 [.160] 1.27 [.050] 4.17 [.164]
NO. OF POSN
(10 50)
E F NO. OF POSN
60 100
E F
(10
-
50)
(Spaces) (Center to Center)
60
-
100
(Spaces) (Center to Center)
10 4 5.08 [0.200] 60 29 36.83 [1.450]
16 7 8.89 [0.350] 70 34 43.18 [1.700]
20 9 11.43 [0.450] 60 39 49.53 [1.950]
30 14 17.78 [0.700] 90 44 55.88 [2.200]
40 19 24.13 [0.950] 100 49 62.23 [2.450]
50 24 30.48 [1.200] -- -- --
Figure 10
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Right-Angle Header Assembly Stencil
NOMINAL
PAD SIZE
STENCIL
THICKNESS
PAD APERTURE DIMENSION HOLD-DOWN APERTURE DIMENSION
PAD SIZE
THICKNESS
A B C D1 D2
0.74 X 2.79
[ 029 X 110]
0.20 [.008) 0.64 [.025] 1.83 [.072] 1.78 [.070] 4.14 [.163] 3.43 [.135]
[
.
029 X
.
110]
0.23 [.009] 0.64 [.025] 1.65 [.065] 1.78 [.070] 3.68 [.145] 3.05 [.120]
0.25 [.010] 0.64 [.025] 1.50 [.059] 1.78 [.070] 3.33 [.131] 2.74 [.108]
NO. OF POSN
(10 50)
E F NO. OF POSN
60 100
E F
(10
-
50)
(Spaces
)
(Center-to-Center)
60
-
100
(Spaces) (Center-to-Center)
10 9 5.76 [.225] 60 59 37.76 [1.475]
20 19 2.16 [.475] 70 69 44.16 [1.725]
30 29 18.56 [.725] 80 79 50.55 [1.975]
40 39 24.96 [.975] 90 89 56.96 [2.225]
50 49 31.36 [1.225] 100 99 63.36 [2.475]
Figure 11
D. Solder Screen
Generally, we do not recommend screen application of solder paste because of the limited volume of
paste that can be deposited. If a screen application is required, we recommend removal of all screen from
the solder tine and hold–down pad areas. Consult your supplier for compatibility of screen and paste, and
for application techniques.
E. Solder Mask
Solder mask is recommended between all pads. If a trace is run between adjacent pads on the solder side
of the pc board, a solder mask must be applied over the trace to prevent bridging and wicking of solder
away from the contact solder tines. Additionally, there should be solder mask covering any traces in the
area of the hold–down solder deposit. Liquid photo imageable or dry film solder masks are recommended.
114-7010
AMPMODU 50/50 Grid SMT and IDC Connectors
Rev
E14
of 20 Tyco Electronics Corporation
F. Connector Placement
Connectors can be placed on the pc board by hand. When doing so, grip the connector at the ends of the
housing without touching the contact to prevent contamination and deformation of the solder tines. Vertical
connectors can be placed on the pc board with a hand loading tool. When using the tool, the connectors
should be emptied from the shipping tube into a feeder device and picked up with the tool as described in
the instructions packaged with the tool.
Optimally, the connector solder tines should be aligned on the pc board pads. However, misregistration is permissible
for certain performance classifications as specified in J-STD-001. See Figure 12.
Connector
Solder Tine
PC Board Pad
PC Board
Tine Centered on PC
Board Pad is Preferable
Tine Overhang is
Acceptable for
Some Performance
Classifications Per
J-STD-001
Figure 12
G. Solder
1. Parameters
The connectors will withstand temperatures of 260
_
C [500
_
F] for a maximum of three minutes. Higher
temperatures can be withstood for short periods of time as indicated in Figure 13 for the infrared (IR)
reflow. Refer to the recommendations provided in Figure 13 for typical reflow parameters. Due to the
many variables involved with the reflow process (ie, component density, orientation, etc), we
recommend that the user conduct trial runs under actual manufacturing conditions to ensure product
and process compatibility.
Preheat 350
_
C [662
_
F] ZONE 1 ZONE 2 ZONE 3
TOP HEATER 285
_
[545
_
] 265
_
[509
_
] 310
_
[590
_
]
BOTTOM HEATER 285
_
[545
_
] 265
_
[509
_
] 310
_
[590
_
]
Figure 13
2. Process
We recommend that connectors be soldered using vapor phase (VPR), double sided non–focused
infrared (IR), or equivalent soldering technique. We have had success using Vitronics
}
IR (Model
SMD 718) equipment.
}
Manufactured by Vitronics Corporation, Newburyport, MA
NOTE
i
114-7010
AMPMODU 50/50 Grid SMT and IDC Connectors
Rev
E 15
of 20
Tyco Electronics Corporation
H. Cleaning
Removal of fluxes, residues, and activators is necessary. Consult with the supplier of the solder paste and
flux for recommended cleaning solvents. The following is a listing of common cleaning solvents that will
not affect the receptacle and header connectors. The connectors will be unaffected by any of these
solvents for five minutes at 105
_
C [221
_
F]. See Figure 14.
CLEANER TIME
(Mi )
TEMPERATURES (Maximum)
NAME TYPE (Minutes) CELSIUS FAHRENHEIT
Alpha 2110
H
Aqueous 1 132 270
Bioact EC-7
z
Solvent 5 100 212
Butyl Carbitol
D
Solvent 1 Room Ambient
Isopropyl Alcohol Solvent 5 100 212
Kester 5778
s
Aqueous 5 100 212
Kester 5779
s
Aqueous 5 100 212
Loncoterge 520
D
Aqueous 5 100 212
Loncoterge 530
D
Aqueous 5 100 212
Terpene Solvent Solvent 5 100 212
H
Product of Fry’s Metals, Inc.
z
Product of Petroferm, Inc.
D
Product of Union Carbide Corp.
s
Product of Litton Systems, Inc.
Figure 14
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Trichloroethylene and Methylene Chloride can be used with no harmful affect to the connectors; however, Tyco
Electronics does not recommend them because of the harmful occupational and environmental affects. Both are
carcinogenic (cancer-causing) and Trichloroethylene is harmful to the earth's ozone layer.
If you have a particular solvent that is not listed, contact Tyco Electronics Engineering by calling the Tooling Assistance
Center toll-free number on page 1.
I. Checking Installed Connector
All solder joints should conform to those specified in Workmanship Specification 101–21. The housing
must seat on the pc board to within the tolerance provided in Figure 15.
Pad Length
Pad Width 0.13 [.005]
Max.
Standoff Tolerance
Figure 15
DANGER
NOTE
i
114-7010
AMPMODU 50/50 Grid SMT and IDC Connectors
Rev
E16
of 20 Tyco Electronics Corporation
3.10. IDC Ribbon Cable Preparation
The only preparation for the cable is to be sure it is cut squarely. We recommend the use a guillotine–type
cutter with a cable guide at a right–angle to the cutting blade. See Figure 16.
90
_
Ribbon
Cable
Housing
Straight Edge
of Cover
Figure 16
3.11. IDC Cover Placement
The covers are symmetrical and must be started into the housing before positioning the cable for termination.
The straight edge of the cover must be toward the housing. See Figure 16.
Refer to Section 5 for the tooling recommended to terminate the connectors.
3.12. Inspection of Terminated IDC Connectors
External and internal inspections can be made on terminated connectors. All terminated connectors can be
inspected externally. Internal inspections should be made during setup and periodically to ensure that the
connectors are being properly applied. Connectors used for internal inspection must be discarded after
inspection.
A. External Inspection
(Figure 17)
1. Check the terminated connector for electrical continuity.
2. Connector must be perpendicular to edge of cable within the tolerance provided.
3. The straight edge of both covers must be toward the housing.
4. The terminated cable end must be visible between the cover and housing.
5. Terminated covers must be seated within the dimension provided.
External Inspection
90
_
+ 2
_
Cable End Must
be Visible
Straight Edge
of Cover
Termination Dimension
7.62 [.300] Maximum
Figure 17
NOTE
i
114-7010
AMPMODU 50/50 Grid SMT and IDC Connectors
Rev
E 17
of 20
Tyco Electronics Corporation
B. Internal Inspection
(Figure 18)
1. Carefully remove both covers and check that each conductor is terminated.
2. Make sure that all contacts have penetrated the cable and that none are bent or deformed.
3. Make sure the conductors and contacts are placed in accordance with requirements provided.
Internal Inspection
Each Contact Must
be Aligned With a
Single Conductor
All Contacts Must
Penetrate Cable
Cover Must Fully
Seat on Housing at
Cover End
Contacts Must Not be Bent After
Termination and Must Fit Within
the Termination Cover Slots
0.76 [.030] Min.
Wire Protrusion
Strand Closest to Transition Must
be a Minimum of One Full Strand
Diameter, to a Maximum of Three
Full Strand Diameters from the
Transition
Contact Base Metal Must
Not be Exposed or Deformed
During Termination
Insulation Must be Intact,
Except in Area of Slot
(Tooling Marks on Wire
Insulation are Acceptable)
Remove Wire From Slot
(Conductor Must be Exposed and
Deformed on Both Sides to be
Considered a Good Termination)
Figure 18
3.13. Mating and Unmating
The use of uneven or off-angle forces during mating and unmating of the connectors could cause over-stress and
damage to the contacts and/or housings. Do NOT use the peel-back" method of unmating one end and pulling it until
the other end is unmated. Also, do NOT use a severe side-to-side rocking motion to unmate connectors.
Connectors must be pushed straight in when mating and pulled straight out when unmating. A slight
side–to–side motion may be used to start extraction, but it must not continue through full extraction cycle.
Miniaturization is a design feature of these connectors and the systems in which they are used. Component
density, connector location, and pc board size may make it difficult to hold one connector in place while
extracting the other. Two methods are recommended to facilitate removal. The preferred method is to have one
of the pc boards securely fastened and adequately supported to withstand the pulling force applied to the other
pc board. The second method is to construct a tool for your system design that will produce a straight–away
separation of the connectors.
4. QUALIFICATIONS
The AMPMODU 50/50 Grid SMT and IDC Connectors are listed by the following agencies.
4.1. Underwriters Laboratories Inc. (UL)
The connectors are listed under UL File Number E28476.
4.2. Canadian Standards Association (CSA)
The connectors are certified under File Number LR 7189–A00255.
CAUTION
!
114-7010
AMPMODU 50/50 Grid SMT and IDC Connectors
Rev
E18
of 20 Tyco Electronics Corporation
5. TOOLING
A manual miniature arbor frame assembly and cover closing kit have been designed to terminate ribbon cable
to IDC connectors. The tool and applicable instruction sheet are shown in Figure 19.
558.8
[22.00]
(Typ)
[.410]
Vertical Headers
Stack Height
(Typ)
Tube Container Configurations
10.41 [.410]
10.41 [.410]
10.41 [.335]
12.95
[.510] 11.18
[.440] 9.40
[.370] 8.31
[.327]
9.91
[.390] 8.13
[.320] 6.35
[.250]
Vertical
Receptacles
11.48
[.452]
[.363]
Right-Angle
Headers
Termination Cover
Closing Tooling
543518-1 (408-9909)
Manual Miniature
Applicator Frame
Assembly 91295-1
(408-9817)
8.51 9.22
Figure 19
114-7010
AMPMODU 50/50 Grid SMT and IDC Connectors
Rev
E 19
of 20
Tyco Electronics Corporation
6. VISUAL AID
Figure 20 shows typical surface mount and insulation displacement connectors, and are intended for use by
production personnel to visually ensure suitable applications. Installations which appear visually incorrect
should be dimensional inspected using the information given in the preceding pages of this application
specification.
6.1. Surface Mount Technology (SMT) Connectors
FIGURE 20. VISUAL AID (cont’d)
POLARIZING TAB MUST ALIGN WITH
POLARIZING SLOT IN HEADER
SOLDER FILLET SHOULD BE FORMED
EVENLY AROUND SOLDER TINE
SOLDER TINE SHOULD BE
CENTERED ON TRACE PAD
STANDOFFS SHOULD BE
SEATED ON PC BOARD
SOLDER FILLETS MUST BE
EVENLY FORMED AROUND
SOLDER TINES
STANDOFFS SHOULD BE
SEATED ON PC BOARD
HOLD-DOWN BARBS MUST ENGAGE THE PC
BOARD AND BE SOLDERED IN PLACE
STABILIZING SOLDER TAB
MUST BE SOLDERED IN PLACE
POLARIZING SLOT MUST
ALIGN WITH POLARIZING
TAB ON RECEPTACLE
SHROUD MUST NOT BE
CHIPPED, CRACKED, OR
DAMAGED IN ANY WAY
STANDOFFS SHOULD BE
SEATED ON PC BOARD
HOLD-DOWN BARBS SHOULD
ENGAGE THE PC BOARD AND
BE SOLDERED INTO PLACE
114-7010
AMPMODU 50/50 Grid SMT and IDC Connectors
Rev
E20
of 20 Tyco Electronics Corporation
6.2. Insulation Displacement Connectors (IDC)
FIGURE 20. VISUAL AID (end)
STRAIGHT EDGE OF COVER
MUST BE TOWARD HOUSING
CABLE END MUST BE
VISIBLE BETWEEN
HOUSING AND COVER
COVER MUST BE
SEATED ON HOUSING
LOCKING LATCH MUST ENGAGE
UNDERSIDE OF LOCKING BAR
STANDOFFS MUST
SEAT ON PC BOARD