BD81002MUVE2 - ROHM SEMICONDUCTOR

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TSZ22111・14・001

TSZ02201-0313AAF00290-1-2

09. Nov. 2012 Rev.001

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

Power supply IC for TFT-LCD Panels

For Large Current Load

7CH System Power Supply IC

BD81002MUV

●Description

The BD81002MUV is a system power supply IC that provides control 6 power supply channels and 1 VCOM channel

required for TFT-LCD panels on a single chip. Output voltage and start-up sequence is variable. In addition, this IC

incorporates Power Good output function.

●Features

1) Synchronous rectification t ype Step-up DC/DC converter with built-in 4A FET

2) Synchronous rectification t ype Step-down DC/DC converter with built-in 3A F ET

3) Synchronous rectification t ype Step-down DC/DC controller

4) Positive/ Negative charge pu mps

5) HVLDO

6) VCOM amplifier

7) All output shut-down function

8) Controllable sequence・Po wer Good function

9) Frequency fixed (500kHz)

10) Protection circuits：Under-voltage lockout protection circuit

Thermal shutdown circuit

Timer latch type short-circuit protection circuit

Over Current Protection circuit（VDD2・AVDD Load Switch）

11) VQFN048V7070 package

●Applications

TFT-LCD Panels power supplies

●Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Ratings Unit

Power Supply voltage1 VCC・PVCC 20 V

Power Supply voltage2 HVCC 20 V

SW3 pin voltage VSW3 30 V

Maximum junction temperature Tjmax 150 ℃

Power dissipation Pd 4826（*1） mW

Operating temperature rage Topr -25 to 105 ℃

Storage temperature range Tstg -55 to 150 ℃

（*1）To use the IC at temperature over Ta=25℃, derate power ratings by 38.6mW/℃

When mounted on a four-layer glass epoxy board measuring 74.2× 74.2×1.6mm（all copp er foil area: 5505mm2）

●Operating Conditions (Ta=-25℃ to +105℃)

Parameter Symbol MIN MAX Unit

Power Supply voltage1 VCC・PVCC 10 18 V

Power Supply voltage2 HVCC 10 18 V

SW3 pin voltage VSW3 - 28 V

SW2 pin current ISW2 - 5（*2） A

SW3 pin current ISW3 - 4（*2） A

Power Good pull-up voltage VPG - 5.5 V

EN pin voltage VEN - 5.5 V

（*2）Not exceeds Pd.

Datasheet

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●Electrical Characteristics（Unless otherwise noted, Ta=25℃，VCC=12V，HVCC=15.6V）

Parameter Symbol Limits Unit Conditions

MIN TYP MAX

【CH1 VDD1】Synchronous rectification type Step-dow n DC/DC controller

Error amplifier reference voltage REF1 0.491 0.500 0.509 V -25<Ta<105[℃]

Soft start time 85% SOFT1 - 2.0 - mS 2.35[mS]@100[%]（typ）

EN1 ON voltage EN1ON 2.5 -- 5.5 V -25<Ta<105[℃]

EN1 OFF voltage EN1OFF - - 0.4 V -25<Ta<105[℃]

Power Good 1 ON voltage PGH1 - 80 - %

Power Good 1 OFF voltage PGL1 - 50 - %

【CH2 VDD2】Synchronous rectification type Step-dow n DC/DC

Error amplifier reference voltage REF2 0.491 0.500 0.509 V -25<Ta<105[℃]

SW2 H side MOS ON resistance RON2H - 0.16 - Ω Io=10[mA]

SW2 L side MOS ON resistance RON2L - 0.15 - Ω Io=10[mA]

Soft start time 85% SOFT2 - 2.0 - mS 2.35[mS]@100[%]（typ）

EN2 ON voltage EN2ON 2.5 -- 5.5 V -25<Ta<105[℃]

EN2 OFF voltage EN2OFF - - 0.4 V -25<Ta<105[℃]

Power Good 2 ON voltage PGH2 - 80 - %

Power Good 2 OFF voltage PGL2 - 50 - %

Over Current Limit OCP2 3.0 4.25 5.5 A

【CH3 AVDD】Synchronous rectification type Step-up DC/DC

Error amplifier reference voltage REF3 0.982 1.000 1.018 V -25<Ta<105[℃]

SW3 H side MOS ON resistance RON3H - 0.18 - Ω Io=10[mA]

SW3 L side MOS ON resistance RON3L - 0.21 - Ω Io=10[mA]

MAX Duty MDT 61 85 99 %

Output voltage Soft start time 85% SOFT3 - 15.7 - mS 18.5[mS]@100[%]（typ）

EN3 ON voltage EN3ON 2.5 -- 5.5 V -25<Ta<105[℃]

EN3 OFF voltage EN3OFF - - 0.4 V -25<Ta<105[℃]

Over Voltage Protection OVP3 18 19 20 V -25<Ta<105[℃]

Over Current Protecti on OCP3 0.09 0.13 0.17 V

【CH4 HVLDO】High Voltage LDO

Error amplifier reference voltage REF4 0.982 1.000 1.018 V -25<Ta<105[℃]

I/O voltage differenc e VIO - 0.2 0.5 V HVCC=15[V] Io=50[mA]

【CH5 VGH】Positive Charge Pump

Error amplifier reference voltage REF5 0.980 1.000 1.020 V -25<Ta<105[℃]

H side MOS ON resistance RON5H - 1.8 - Ω

L side MOS ON resistance RON5L - 2.5 - Ω

Power Good CP ON voltage PGHCP - 80 - %

Power Good CP OFF voltage PGLCP - 25 - %

Over Voltage Protection OVPCP 36.5 - 39.5 V -25<Ta<105[℃]

（VGH=35[V] setting）

【CH6 VGL】Negative Charge Pump

Error amplifier reference voltage REF6 0.490 0.500 0.510 V -25<Ta<105[℃]

H side MOS ON resistance RON6H - 3.7 - Ω

L side MOS ON resistance RON6L - 4.8 - Ω

VREF reference voltage VREF 1.764 1.800 1.836 V -25<Ta<105[℃]

【VCOM】Operation A mplifier

Input offset voltage VOFF -15 - 15 mV

Input bias current IBAMP -1.2 - 1.2 uA

VCOM output current capability ICOM 50 150 - mA -25<Ta<105[℃]

Slew rate SRCOM - 15 - V/uS

Load stability ⊿Vo -15 0 15 mV Io=-1[mA] to +1[mA]

Maximum output voltage VOH HVCC-1.0 HVCC-0.8 - V Io=-1[mA],INP=14[V] INN=0[V]

Minimum output voltage VOL - 0.1 0.2 V Io=1[mA], INP=0[ V] INN=14[V]

Datasheet

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15

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24

36 35 34 33 32 31 30 29 2 8 27

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26 25

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47

●Electrical Characteristics（Unless otherwise noted, Ta=25℃，VCC=12V，HVCC=15.6V）

Parameter Symbol Limits Unit Conditions

MIN TYP MAX

【Overall】

Oscillating frequency1 SAW1 400 500 600 KHz

Oscillating frequency2 SAW2 300 500 700 KHz -25<Ta<105[℃]

VCC Under-Voltage Lockout protection UVLO1 7.6 8.0 8.4 V -25<Ta<105[℃]

REG output voltage VREG 4.7 5.0 5.3 V

SCP source current SCPSO 1.8 4.5 7.2 uA

SCP threshold voltage VSCP 1.10 1.20 1.30 V -25<Ta<105[℃]

Stand-by VCC consumption current STBICC 1.05 2.10 3.15 mA EN*=L

VCC consumption current 1 ICC1 1.75 3.50 5.25 mA

FB1=FB2=FB4=FBN=0[V]

FB3=FBP=1.2[V] , SCP=GND

VCC consumption current 2 ICC2 2.15 4.30 6.45 mA

FB1=FB2=FB4=FBN=0.6[V]

FB3=FBP=0.8[V], SCP=GND

●Pin configuration and Pin function

Fig.1 PIN configuration (TOP VIEW)

PIN No. PIN name Function PIN No. PIN name Function

1 COMP AVDD phase compensatioin I/O terminal 25 HVCC2 VGH・VGL power supply terminal

2 SCP Short circuit protection output terminal 26 LSO VGH load switch output terminal

3 VREF VGL reference voltage output terminal 27 SWCPP VGH switching output terminal

4 FB4 HVLDO feedback input terminal 28 CPGND 1 VGH power GND terminal

5 PG2 VDD2 power good output terminal 29 FBP VGH feedback input terminal

6 LS_S AVDD over current detection input terminal 30 FB2 VDD2 feedback input terminal

7 PGATE3 AVDD load switch gate signal output terminal 31 FB1 VDD1 feedback input terminal

8 HVLDO HVLDO output terminal 32 PVCC2 VDD2 power supply terminal

9 AVDD AVDD output terminal 33 PVCC2 VDD2 power supply terminal

10 AVDD AVDD output terminal 34 PGCP VGH power good output terminal

11 SW3 AVDD switching output terminal 35 SW2 VDD2 switching output terminal

12 SW3 AVDD switching output terminal 36 SW2 VDD2 switching output terminal

13 - N.C.(None Connection) 37 PGND2 VDD2 power GND terminal

14 PGND3 AVDD power GND terminal 38 PGND2 VDD2 power GND terminal

15 PGND3 AVDD power GND terminal 39 NGATE1

VDD1 external FET gate signal output terminal

16 OUT VCOM output terminal 40 EN3 AVDD enable input terminal

17 HVCC1 VCOM power supply terminal 41 PGATE1 VDD1 external FET gate signal output terminal

18 GND GND terminal 42 PVCC1 VDD1 external H SIDE FET power supply

input terminal

19 INP VCOM+ input terminal 43 PG1 VDD1 power good output terminal

20 INN VCOM- input terminal 44 REG Inner power supply output terminal

21 EN2 VDD2 enable input terminal 45 EN1 VDD1 enable input terminal

22 FBN VGL feedback input terminal 46 VCC Power supply terminal

23 CPGND2

VGL power GND terminal 47 SEL AVDD operation select input terminal

24 SWCPN VGL switching output terminal 48 FB3 AVDD feedback input terminal

Datasheet

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BD81002MUV

z PHYSICAL DIMENSION AND PACKAGE OUTLINE (VQFN048V7070)

Fig.2 7mm×7mm QFN Package (0.5mm Pitch)

BM81205

LOT NO.

BD

8

1

00

2

Datasheet

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BD81002MUV

OSC

VCC

SW2

VDD 2

3.3V

PGND2 PGND3

FB3

SW3

AVDD

EN3

VCC

FB2

PG 2

FB1

PG1

REG

VCC

FBP

SWCPP

HVCC2

SWCPN

FBN

PGCP

VGH

VREF

VGL

CPGND2

Positive

Charge pump

Negative

Charge pump

VCC

VREF

PROTECT

Step-down

Converter

Step-down

Converter

Step-up

Converter

AVDD

(HVCC)

INP

INN

OUT VCOM

From Calibrator

VDD 1

1.8V PGATE1

External FET drives when SEL=H

NGATE1

PVCC1

HV LDO

HVLDO

15.2V

FB4

CPGND1

EN2

EN1

HVLDO

AVDD

HVCC1

LSO

CH2（VDD2）

CH1（VDD1）

CH3（AVDD）

CH4（HVLDO）

CH5（VGH）

CH7（VCOM)

CH6（VGL）

33 32 46 3 244 147 76

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34

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21

5

30

38

37

35

AVDD

REG

EN2

PG1

EN3

REG

PG2

REG

External input

36

●Block diagram

Fig. 3 Block diagram/ Application diagram

Datasheet

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●Sequence chart

・While PG1=EN2 PG2=EN3 operation

Fig.4 Sequence chart

Datasheet

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●Description of Operation of Each Block an d Procedure fo r selecting Application Components

【CH1】VDD1

This is a Step-down synchronous DC/DC controller to drive external Power MOSFET.

When High Signal is input to EN1 pin, the switching will operate by soft-start.

・Recommended External parts（1.2[V]・1.8[V] output setting）

PIN name Value Company Product No. 1.2[V] 1.8[V]

R11 Refer to the right table ROHM - R11 270+10[KΩ] 240+20[KΩ]

R12 Refer to the right table ROHM - R12 200[KΩ] 100 [KΩ]

R13 0[Ω] - -

R14 100[kΩ] ROHM -

R15 100[kΩ] ROHM -

C11 22[uF]×2 TAIYO YUDEN JMK316BJ226KL

C12 10[uF] TAIYO YUDEN TMK316BJ106KL

C13 18[pF] TAIYO YUDEN UMK105CH180JV-F

L11 10[uH]

TOKO #919AS-100M

TAIYO YUDEN NR10050T100M

M11 PMOS・NMOS ROHM SH8M12

VDD1 output voltage setting equation is shown below.

VDD1 [V] =

Setting external VDD1

FB1

0.5[V]

SAW

PGATE1

PVCC1 VCC

C11

VDD1

PRE

DRIVER L11

VDD1

C13

R11

R12

C12

NGATE1

M11

R13

R14

R15

0.5[V]×

12

R12

R+

11

R

Datasheet

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【CH2】VDD2

This is a Step-down DC/DC converter, operating in MOSFET inside IC.

When High Signal is input to EN2 pin, the switching will operate by soft-start.

・Recommended External parts（3.3[V] output setting）

PIN name Value Company Product No.

R21 100[KΩ]+ 12[KΩ] ROHM -

R22 20[KΩ] ROHM -

R23 - -

C21 22[uF] TAIYO YUDEN JMK316BJ226KL

C22 10[uF] TAIYO YUDEN TMK316BJ106KL

C23 39[pF] TAIYO YUDEN UMK105CH390JV

L21 10[uH]

TOKO #B952AS-100M

TAIYO YUDEN NR8040T100M

VDD2 output voltage setting equation is shown below.

FB2

0.5[V]

SAW

VCC

C21

VDD2

PRE

DRIVER L21

VDD2

C23

R21

R22

C22

R23 PVCC2

SW2

PGND2

VDD2 [V] = 0.5[V]×

22

R22

R+

21

R

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【CH3】AVDD

While SEL pin equals to GND, it operates in step-up synchronous DC/DC converter block inside MOSFET, and when SEL

pin equals to VCC, in step-up external FET driver non-synchronous DC/DC controller. When High Signal is input to EN3

pin, the current from PGATE3 rush and load switch M31 will be ON. After that, switching will start by soft start.

＜Synchronous rectifier（SEL pin=GND）＞

・Recommended External parts（15.6[V] output setting）

PIN name Value Company Product No.

R31 130[KΩ]+16[KΩ] ROHM -

R32 10[KΩ] ROHM -

R33 - - -

R34 10[KΩ] ROHM -

R35 20[mΩ] ROHM UCR10R020

C31 120[uF] SANYO 20SVPF120M

C311 10[uF] TAIYO YUDEN TMK316BJ106KL

C32 10[uF] TAIYO YUDEN TMK316BJ106KL

C33 33[pF] TAIYO YUDEN UMK105CH330JV-F

C34 22[nF] TAIYO YUDEN TMK105BJ223KV-F

L31 4.7[uH] TOKO FDVE1040-4R7

4.9[uH] TAIYO YUDEN

NR10050T4R9M

M31 PMOS ROHM -

AVDD output voltage setting equation is shown below.

AVDD [V] =

FB3

1.0[V]

SAW

C31

AVDD

PRE

DRIVER L31

C33

R31

R32

C32

R33

AVDD

SW3

PGND3

COMP

C34

R34

VCC

AVDD

R35

M31

LS_S

PGATE3

C311

1.0[V]×

32

R32

R+

31

R

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＜Non-synchronous rectifier（SEL pin=VCC）＞

・Recommended External parts（15.6[V] output setting）

PIN name Value Company Product No.

R31 130[KΩ]+16[KΩ] ROHM -

R32 10[KΩ] ROHM -

R33 - - -

R34 10[KΩ] ROHM -

R35 20[mΩ] ROHM UCR10R020

C31 120[uF] SANYO 20SVPF120M

C311 10[uF] TAIYO YUDEN TMK316BJ106KL

C32 10[uF] TAIYO YUDEN TMK316BJ106KL

C33 33[pF] TAIYO YUDEN UMK105CH330JV-F

C34 10[nF] TAIYO YUDEN TMK105BJ103KV-F

L31 4.7[uH] TOKO FDVE1040-4R7

4.9[uH] TAIYO YUDEN

NR10050T4R9M

M31 PMOS ROHM -

M32 NMOS ROHM RSH090N03

D31 SBD ROHM RB095B-30

【CH4】HV LDO

This is a High voltage output LDO, corresponding to output ceramic capacitor. Simultaneously activ ate with AVDD.

・Recommended External parts（15.2[V] output setting）

PIN name Value Company Product No.

R41 130[KΩ]+12[KΩ] ROHM -

R42 10[KΩ] ROHM -

C41 10[uF] TAIYO YUDEN TMK316BJ106KL

C43 22[pF] TAIYO YUDEN UMK105CH220JV-F

HVLDO [V] =

1.0[V] HVLDO

FB4

R41

R42

C41

HVLDO

AVDD

C43

FB3

1.0[V]

SAW

AVDD

PRE

DRIVER L31

C33

R31

R32

C32

R33

AVDD

SW3

PGND3

COMP

C34

R34

VCC

AVDD

R35

M31

LS_S

PGATE3

M32 C31

D31

C311

1.0[V]×

42

R42

R+

41

R

Datasheet

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BD81002MUV

FBP

SWCPP

HVCC2

SWCPN

FBN

PGCP

VGH

VREF

VGL

CPGND2

VGL

CPGND1

LSO

VGH

R62

R61 C61

D62

D61

C64

C52

D51 D52 D53 D54

C54 C56

C55 C51

R51

R52

【CH5・CH6】VGH・VGL

VGH operates a positive char ge pump, and VGL operates a negative charge pump.

First, AVDD activates, Next, VGL activates, and finally VGH will activate.

・Recommended External parts（VGH：35[V] VGL：-6[V] output setting）

VGH・VGL output voltage setting equation is shown below.

VGH [V] =

VGL [V] =

PIN name Value Company Product No.

R51 330[KΩ]+10[KΩ] ROHM -

R52 10[KΩ] ROHM -

C51 2.2[uF] TAIYO YUDEN UMK316BJ225KD

C52 10[uF] TAIYO YUDEN TMK316BJ106KL

C54 0.1[uF] TAIYO YUDEN

C55 0.1[uF] TAIYO YUDEN

C56 0.1[uF] TAIYO YUDEN

D51 SBD ROHM RB050M-30

D52 SBD ROHM RB050M-30

D53 SBD ROHM RB050M-30

D54 SBD ROHM RB050M-30

R61 100[KΩ] ROHM -

R62 20[KΩ] ROHM -

C61 22[uF]×2 KYOCERA OxiCap 22uF/10V

C64 47[nF] TAIYO YUDEN

D61 SBD ROHM RB050M-30

D62 SBD ROHM RB050M-30

D61 D

62 SBD ROHM RB552EA

1.0[V]×

52

R52

R+

51

R

1.8[V]×

62

R61

R

-0.5[V]×

62

R62

R+

61

R

Datasheet

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INP

INN

OUT VCOM

From Calibrator

HVCC

HVCC1

INP

INN

OUT

VCOM

From Calibrator

HVCC

HVCC1

【CH7】VCOM

The common amplifiers operate in the range of 0.1V to HVCC-0.8V(TYP).

Normally, use the amplifier as a buffer type(a) as shown below. Use PNP and the NPN transistor like (b) when you raise

the drive ability of the current. Moreover, make to the buffer type of (a) when you do not use VCOM and ground the

terminal INP.

(a)

(b)

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【Common block】

・ UVLO function

The UVLO protection function will be implemented when the UVLO pin vol tage falls below VCC=8.0V(TYP)

and canceled when it exceeds VCC=9.0V(TYP).

・ SCP function

The SCP function protects against short-circuits in the outputs of the step-up DC/DC converter, Step-down DC/DC

Converter, HV_LDO, and charge pum p.

When any of these outputs fall below 50% of the set voltage(VGH is 25%), it will be regarded as a short-circuit in

output, thus activating the short-circuit protection function.

If a short-circuit is detected, source current of 4.5[uA](TYP) will be output from the SCP p in. Then, delay time will be

set

with external capacitance. When the SCP pin voltage exceeds 1.2V(TYP), the state will be latched to shut down all

outputs. Once the state has been latched, it will not be canceled unless VCC restarts. The delay time setting is

obtained

by using the following equation.

TL [s] =

When each channel starts, until end of soft start, SCP operation is ignored except for VGL.

According to VGL, it isn’t ignored until 50[%] of output voltage setting.

So it needs under condition.

Time until 50 [%] of VGL output voltage setting < Time of SCP detection

・Control and Power-Good function

When the control pin (EN1, EN2, EN3) is set to low-level input, the relevant block will stop operation. When EN1 is

High,

VDD1 will activate. When EN2 is H, VDD2 will activate. When EN3 is Hig h, AVDD・HVLDO・VCOM・VGH・VGL will

activate. The control pin is internally pulled down to GND, whereby operating the relevant block in the open state.

The Power Good pin (PG1・PG2・PGCP) is designed in an open-drain pattern to use as the control pin of a different

block or an external power-good signal. The pull-up and use resistance between a power good terminal and the

terminal REG. It is recommended to apply a setting range of 20 to100[K Ω]. The Power Good pin outputs a low-level

signal while in the rising mode and, when the output voltage reaches 80[%] of the set voltage, will enter a high

impedance state. The Power Good pin outputs a low-level signal while VDD1/ VDD2 output voltage falls below

50[%] of the set voltage. And the Power Good pin outputs a low-level signal while VGH output voltage falls below

25[%] of the set voltage.

4.5[uA]

-6

10×4.5 1.2×C02

Latch

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●I/O Equivalent Circuit Diagrams

1.COMP 2.SCP 3.VREF

4.FB4 5.PG2 34.PGCP 43.PG1 7.PGATE3

6.LS_S 8.HVLDO 9.10. AVDD

11.12. SW3 16.OUT 19.INP 20.INN

AVDD

21.EN2 40.EN3 45.EN1 47.SEL 22.FBN 29.FBP 30.FB2

31.FB1 48.FB3 26.LSO

VCC

GND GND GND

GND

HVCC1

GND

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●I/O Equivalent Circuit Diagrams

24.SWCPN 27.SWCPP 35.SW2

39.NGATE1 41.PGATE1 44.REG

PVCC1PVCC1

Inner

power supply

PGND2 PGND2

PVCC2

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●Operation Notes

1) Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may

result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when

such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a

special mode where the absolute maximum ratings may be exceeded is anticipated. When VIN voltage is near the

absolute maximum ratings, there are possibilities that the VIN voltage exceeds the limit and the IC is destroyed. So

please consider using zener diode bet ween VIN-GND or using large input-capacitor in order not to destroy the IC.

2) GND potential

Ensure a minimum GND pin potential in a ll operating conditions.

3) Setting of heat

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual

operating conditions.

4) Pin short and mistake fitting

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result

in damage to the IC. Shorts between output pins or bet ween output pins and the power supply and GND pins caused b y

the presence of a foreign object may result in damage to the IC.

5) Actions in strong magnetic field

Use caution when using the IC in t he presence of a strong magnetic field as doing so m ay cause the IC to

malfunction.

6) Testing on application boards

When testing the IC on an applicati on board, connecting a capacitor to a pin with low impedance subje cts

the IC to stress. Always discharge capacitors after each process or step. Ground the IC during assembly

steps as an antistatic measure, and use similar caution when transporting or storing the IC. Always turn the

IC's power supply off before connecting it to a jig or fixture during the ins pection process.

7) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.

P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of

parasitic elements.

For example, when the resistance and transistors are connected to the pins as shown in Fig. IC cross section , a parasitic

diode or a transistor operates by inverting the pin voltage and GND voltage.

The formation of parasitic elements as a result of the r elationships of the potentials of different pins is an inevitable res ult of

the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC

malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will

trigger the operation of parasitic elements such as by the application of voltages lower than the GND (P substrate) voltage

to input and output pins.

8) Over current protection circuit (OCP)

The IC has a built-in over-current protection circuit for output in response to the current capability for the prevention of IC

damage in case of a short-circuit in load. Ho wever, this protection circuit is effective in preventing damage due to a sudden

accident, but is not designed to support the continuous oper ation of prot ection circuits or use while in transition. In add ition,

since the current capability has negative characteristics agai nst temperatures, pay careful attention to this point in thermal

design.

9) Thermal shutdown circuit (TSD)

This IC incorporates a built-in TSD circuit for the protection from thermal destruction. The IC should be used within the

specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power

dissipation limits, the attendant rise in the chip's junction temperature Tj will trigger the TSD circuit to turn off all output

power elements. Operation of the TSD circuit presumes that the IC's absolute maximum ratings have been exceeded.

Application designs should never make use of the TSD circuit.

10) DC/DC sw itching line wiring pa ttern

DC/DC converter switching line (wiring from switching pin to inductor, Nch MOS) should be connected with short and wide

wiring. If the wiring is long, ringing by sw itching w ould increase. That may cause excess vol t ag e of absolute maximum ratings.

If the wiring is o bliged to length en by p art s loca tion limit s, please consider inserting snubber circuit.

(Pin A)

GND

N

P

N N

P+

Resistor

Parasitic elements

P

～

Parasitic

elements

(

Pin B

)

GND

C

B

E

Parasitic

elements

GND

(

Pin A

)

～

GND

N

P

N N

P+ P+

Paras itic elemen ts

P substrate

(

Pin B

)

C

B

E

Transistor (NPN)

～

NGND

Datasheet

17/17

TSZ02201-0313AAF00290-1-2

www.rohm.com

TSZ22111・15・001

BD81002MUV

Status of this document

The Japanese version of this document is formal sp ecification. A customer may us e this translation version only for a

reference to help reading the formal version.

If there are any differences in translation version of this do cu ment formal version takes priority

●Ordering Information

B D 8 1 0 0 2 M U V - E 2

(Unit : mm)

VQFN048V7070

0.08 S

S

1PIN MARK

112

13

24

2536

37

48

0.02+0.03

-

0.02

C0.2

0.5

0.75

1.0MAX

(0.22)

0.25+0.05

-

0.04

7.0±0.1

4.7±0.1

7.0±0.1

0.4±0.1

Tape and Reel information

Tape

Quantity

Direction

of feed

Embossed carrier tape (with dry pack)

1500pcs

E2

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

Reel 1 PIN Direction of feed

※When you order, please order in times the amount of package quantity

Part Number Package

MUV: VQFN048V7070 Packaging and forming specification

E2: Embossed tape and reel (with dry pack)

Datasheet

Notice - GE Rev.002

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice - GE Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred by you or third parties resulting from inaccur acy or errors of or

concerning such information.