SBR2M30P1
2.0A SBR®
SURFACE MOUNT SUPER BARRIER RECTIFIER
PowerDI®123
Features
• Ultra Low Leakage Current
• Excellent High Temperature Stability
• Superior Reverse Avalanche Capability
• Patented Interlocking Clip Design for High Surge Current
Capacity
• Patented Super Barrier Rectifier Technology
• Soft, Fast Switching Capability
• 175ºC Operating Junction Temperature
• ±16KV ESD Protection (HBM, 3B)
• ±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)
• Lead Free Finish, RoHS Compliant (Note 1)
• “Green” Molding Compound (No Br, Sb)
• Qualified to AEC-Q 101 Standards for High Reliability
Mechanical Data
• Case: PowerDI®123
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Polarity Indicator: Cathode Band
• Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.018 grams (approximate)
Top View
Maximum Ratings @TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VRM 30 V
RMS Reverse Voltage VR(RMS) 21 V
Average Rectified Output Current (See Figure 1) IO 2.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load IFSM 75 A
Non-Repetitive Avalanche Energy
(TJ = 25°C, IAS = 5A, L = 8.5 mH) EAS 105 mJ
Repetitive Peak Avalanche Energy
(1µs, 25°C) PARM 1100 W
Thermal Characteristics
Characteristic Symbol Value Unit
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
RθJS
RθJA
RθJA
5
183
125
ºC/W
Operating and Storage Temperature Range TJ, TSTG -65 to +175 ºC
Notes: 1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical RӨJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf
SBR and PowerDI are registered trademarks of Diodes Incorporated.
SBR2M30P1
Document number: DS30704 Rev. 7 - 2 1 of 4
www.diodes.com October 2008
© Diodes Incorporated
SBR2M30P1
Document number: DS30704 Rev. 7 - 2 2 of 4
www.diodes.com October 2008
© Diodes Incorporated
SBR2M30P1
BR and PowerDI are registered trademarks of Diodes Incorporated.
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 5) V(BR)R 30 - - V
IR = 200µA
Forward Voltage Drop VF
-
-
-
-
-
-
0.26
0.37
0.42
0.16
0.29
0.36
0.30
0.41
0.46
0.19
0.32
0.39
V
IF = 0.1A, TJ = 25ºC
IF = 1.0A, TJ = 25ºC
IF = 2.0A, TJ = 25ºC
IF = 0.1A, TJ = 125ºC
IF = 1.0A, TJ = 125ºC
IF = 2.0A, TJ = 125ºC
Leakage Current (Note 5)
IR -
10
20
1.7
3.1
100
200
8
12
µA
µA
mA
mA
VR = 5V, TJ = 25ºC
VR = 30V, TJ = 25ºC
VR = 5V, TJ = 125ºC
VR = 30V, TJ = 125ºC
Notes: 5. Short duration pulse test used to minimize self-heating effect.
Fig. 1 Forward Power Dissipation
0
0.2
0.4
0.6
0.8
1
1.2
0123
I , AVERAGE FORWARD CURRENT (A)
F(AV)
P
,
P
O
WE
R
DISSI
P
A
T
I
O
N (W)
D
Fig. 2 Typical Forward Characteristics
0.1
1
10
100
1,000
10,000
0 0.2 0.4 0.6 0.8
V , INSTANTAN EOUS FORWARD VOLTAGE (V)
F
I , INST ANTANEOUS FORWARD CURRENT (mA)
F
T =100 C
A
°
T =175 C
A
°
T=25C
A
°
T= -65C
A
°
Fig. 3 Typical Reverse Characteristics
1.0E-06
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+0
2
0 5 10 15 20 25 30
V , INSTANT ANEOUS REVERSE VOLTAGE (V)
R
I , INSTANT A NEOUS REVERSE CURRENT (mA)
R
T =175 C
A
°
T=25C
A
°
T= -65C
A
°
T =100 C
A
°
Fig. 4 Total Capacitance vs. Reverse Voltage
1
10
100
1,000
10,000
0 3 6 9 12 15 18 21 24 27 30
V , DC REVERSE VOL TAGE (V)
R
C , TOTAL CAPACITANCE (pF)
T
f = 1.0MHz
S
SBR2M30P1
Document number: DS30704 Rev. 7 - 2 3 of 4
www.diodes.com October 2008
© Diodes Incorporated
SBR2M30P1
BR and PowerDI are registered trademarks of Diodes Incorporated.
0
0.5
1.0
2.0
1.5
2.5
0 25 50 75 100 125 150 175 200
I, AVE
R
A
G
E
F
O
R
WA
R
D
C
U
R
R
EN
T
(A)
F(AV)
T , AMBIENT TEMPERATURE (°C)
Fig. 5 Forward Current Derating Curve
A
0
50
25
250
225
200
175
150
125
100
75
010 20 30
T
, D E
R
A
T
ED AMBIEN
T
T
EM
P
E
R
A
T
U
R
E (°
C
)
A
V , DC REVERSE VOL TAGE (V)
Fig. 6 Operating Temperature Derating
R
515 25
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175 200
T , JUNCTION TEMPERATURE ( C)
J
°
P
, AVALAN
C
H
E
P
EAK
P
U
LSE
P
O
WE
R
DERA T ING IN PERCENTAGE (%)
ARM
Fig. 7 Pulse Derating Curve
1
10
100
1,000
10,000
0.001 0.01 0.1 1 10 100 1,000
P
, MAXIM
U
M A V ALA
N
C
H
E
P
O
WE
R
(W)
ARM
Fig. 8 Maximum A valanche Power Curve
T , PULSE DURATION (uS)
P
S
SBR2M30P1
Document number: DS30704 Rev. 7 - 2 4 of 4
www.diodes.com October 2008
© Diodes Incorporated
SBR2M30P1
SBR and PowerDI are registered trademarks of Diodes Incorporated.
Ordering Information (Note 6)
Part Number Case Packaging
SBR2M30P1-7 PowerDI®123 3000/Tape & Reel
Notes: 6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
2M3 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: T = 2006)
M = Month (ex: 9 = September)
2M3
YM
Date Code Key
Year 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015
Code T U V W X Y Z A B C
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
Package Outline Dimensions
Suggested Pad Layout
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages. LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
A
E
LL1
B
CE
L2
H
D
PowerDI®123
Dim Min Max Typ
A 3.50 3.90 3.70
B 2.60 3.00 2.80
C 1.63 1.93 1.78
D 0.93 1.00 0.98
E 0.85 1.25 1.00
H 0.15 0.25 0.20
L 0.55 0.75 0.65
L1 1.80 2.20 2.00
L2 0.95 1.25 1.10
All Dimensions in mm
X1 GX2
Y2 Y1
Dimensions Value (in mm)
G 1.0
X1 2.2
X2 0.9
Y1 1.4
Y2 1.4
