© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/06/18
Thyristors
25 Amp Standard & Alternistor (High Commutation) Triacs
Soldering Parameters
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus Temp)
(TL) to peak 5°C/second max
TS(max) to TL - Ramp-up Rate 5°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 280°C
Physical Specifications Environmental Specifications
Test Specifications and Conditions
High Temperature
Voltage Blocking
MIL-STD-750: Method 1040, Condition A
Rated VRRM, 125°C, 1008 hours
Temperature Cycling
MIL-STD-750: Method 1051
-40°C to 125°C, 15-minute dwell,
100 cycles
Biased Temp &
Humidity
EIA/JEDEC: JESD22-A101
320VDC, 85°C, 85%RH, 1008 hours
High Temp. Storage MIL-STD-750: Method 1031
150°C, 1008 hours
Low-Temp Storage -40°C, 1008 hours
Resistance to
Solder Heat
MIL-STD-750: Method 2031
260°C, 10 seconds
Solderability ANSI/J-STD-002, Category 3, Test A
Lead Bend MIL-STD-750: Method 2036, Condition E
Terminal Finish 100% Matte Tin-plated
Body Material UL Recognized compound meeting
flammability rating V-0
Lead Material Copper Alloy
Design Considerations
Careful selection of the correct component for the
application’s operating parameters and environment will
go a long way toward extending the operating life of the
Thyristor. Good design practice should limit the maximum
continuous current through the main terminals to 75%
of the device rating. Other ways to ensure long life for a
power discrete semiconductor are proper heat sinking
and selection of voltage ratings for worst case conditions.
Overheating, overvoltage (including dv/dt), and surge
currents are the main killers of semiconductors. Correct
mounting, soldering, and forming of the leads also help
protect against component damage.
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
r
h
Ramp-upRamp-up
Ramp-down
am
-