© Semiconductor Components Industries, LLC, 2008
July, 2008 Rev. 1
1Publication Order Number:
NSBC114EPDP6/D
NSBC114EPDP6T5G Series
Preferred Devices
Dual Digital Transistors
(BRT)
Complementary Silicon Surface Mount
Transistors with Monolithic Bias
Resistor Network
The BRT (Bias Resistor Transistor) contains a single transistor with
a monolithic bias network consisting of two resistors; a series base
resistor and a baseemitter resistor. These digital transistors are
designed to replace a single device and its external resistor bias
network. The BRT eliminates these individual components by
integrating them into a single device. In the NSBC114EPDP6T5G
series, two complementary BRT devices are housed in the SOT963
package which is ideal for low power surface mount applications
where board space is at a premium.
Features
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
Available in 4 mm, 8000 Units Tape and Reel
These are PbFree Devices
These are HalideFree Devices
MAXIMUM RATINGS (TA = 25°C unless otherwise noted, common for Q1
and Q2, minus sign for Q1 (PNP) omitted)
Rating Symbol Value Unit
Collector-Base Voltage VCBO 50 Vdc
Collector-Emitter Voltage VCEO 50 Vdc
Collector Current IC100 mAdc
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
DEVICE MARKING INFORMATION
See specific marking information in the device marking table
on page 2 of this data sheet.
Q1
R1
R2
R2
R1
Q2
(1)(2)(3)
(4) (5) (6)
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MARKING
DIAGRAM
Device Package Shipping
ORDERING INFORMATION
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
NSBC114EPDP6T5G SOT963
(PbFree)
8000 /
Tape & Reel
X = Specific Device Code
M = Date Code
G= PbFree Package
SOT963
CASE 527AD
XM
1
NSBC114EPDP6T5G Series
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2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
SINGLE HEATED
Total Device Dissipation
TA = 25°C (Note 1)
Derate above 25°C
PD231
1.9
mW
mW/°C
Thermal Resistance (Note 1)
Junction-to-Ambient
RqJA 540 °C/W
Total Device Dissipation
TA = 25°C (Note 2)
Derate above 25°C
PD269
2.2
mW
mW/°C
Thermal Resistance (Note 2) Junction-to-Ambient RqJA 464 °C/W
DUAL HEATED (Note 3)
Total Device Dissipation
TA = 25°C (Note 1)
Derate above 25°C
PD339
2.7
mW
mW/°C
Thermal Resistance (Note 1)
Junction-to-Ambient
RqJA 369 °C/W
Total Device Dissipation
TA = 25°C (Note 2)
Derate above 25°C
PD408
3.3
mW
mW/°C
Thermal Resistance (Note 2) Junction-to-Ambient RqJA 306 °C/W
Junction and Storage Temperature TJ, Tstg 55 to +150 °C
1. FR4 @ 100 mm2, 1 oz. copper traces, still air.
2. FR4 @ 500 mm2, 1 oz. copper traces, still air.
3. Dual heated values assume total power is sum of two equally powered channels.
DEVICE MARKING AND RESISTOR VALUES
Device Package
Marking
(Clockwise Rotation) R1 (kW)R2 (kW)
NSBC114EPDP6T5G SOT963 L 10 10
NSBC124EPDP6T5G SOT963 R (90°) 22 22
NSBC144EPDP6T5G SOT963 K (180°) 47 47
NSBC114YPDP6T5G SOT963 Q (90°) 10 47
NSBC115TPDP6T5G SOT963 J (180°) 100
NSBC123TPDP6T5G SOT963 A (180°) 2.2
NSBC143EPDP6T5G SOT963 V (90°) 4.7 4.7
NSBC143ZPDP6T5G SOT963 Y (90°) 4.7 47
NSBC144WPDP6T5G SOT963 T (90°) 47 22
NSBC123JPDP6T5G SOT963 D (180°) 2.2 47
NSBC114EPDP6T5G Series
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3
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted, common for Q1 and Q2, minus sign for Q1 (PNP) omitted)
TCharacteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector-Base Cutoff Current (VCB = 50 V, IE = 0) ICBO 100 nAdc
Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0) ICEO 500 nAdc
Emitter-Base Cutoff Current NSBC114EPDP6T5G
(VEB = 6.0 V, IC = 0) NSBC124EPDP6T5G
NSBC144EPDP5T5G
NSBC114YPDP6T5G
NSBC115TPDP6T5G
NSBC123TPDP6T5G
NSBC143EPDP6T5G
NSBC143ZPDP6T5G
NSBC144WPDP6T5G
NSBC123JPDP6T5G
IEBO
0.5
0.2
0.1
0.2
0.1
4.0
1.5
0.18
0.13
0.2
mAdc
Collector-Base Breakdown Voltage (IC = 10 mA, IE = 0) V(BR)CBO 50 Vdc
Collector-Emitter Breakdown Voltage (Note 4) (IC = 2.0 mA, IB = 0) V(BR)CEO 50 Vdc
ON CHARACTERISTICS (Note 4)
DC Current Gain NSBC114EPDP6T5G
(VCE = 10 V, IC = 5.0 mA) NSBC124EPDP6T5G
NSBC144EPDP5T5G
NSBC114YPDP6T5G
NSBC115TPDP6T5G
NSBC123TPDP6T5G
NSBC143EPDP6T5G
NSBC143ZPDP6T5G
NSBC144WPDP6T5G
NSBC123JPDP6T5G
hFE 35
60
80
80
160
160
15
80
80
80
60
100
140
140
350
350
30
200
140
140
Collector-Emitter Saturation Voltage
(IC = 10 mA, IB = 0.3 mA)
NSBC114EPDP6T5G
NSBC124EPDP6T5G
NSBC144EPDP6T5G
NSBC114YPDP6T5G
NSBC144WPDP6T5G
NSBC123JPDP6T5G
(IC = 10 mA, IB = 1 mA) NSBC115TPDP6T5G
NSBC143EPDP6T5G
NSBC143ZPDP6T5G
NSBC123TPDP6T5G
VCE(sat)
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
Vdc
Output Voltage (on)
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kW)
NSBC114EPDP6T5G/NSBC124EPDP6T5G
NSBC114YPDP6T5G/NSBC123TPDP6T5G
NSBC143EPDP6T5G/NSBC143ZPDP6T5G
NSBC123JPDP6T5G
(VCC = 5.0 V, VB = 4.0 V, RL = 1.0 kW)
NSBC144WPDP6T5G
(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 kW)
NSBC144EPDP6T5G/NSBC115TPDP6T5G
VOL
0.2
0.2
0.2
0.2
0.2
0.2
Vdc
Output Voltage (off)
(VCC = 5.0 V, VB = 0.5 V, RL = 1.0 kW)
NSBC114EPDP6T5G/NSBC124EPDP6T5G
NSBC144EPDP6T5G/NSBC114YPDP6T5
NSBC143ZPDP6T5G/NSBC144WPDP6T5G
NSBC123JPDP6T5G
(VCC = 5.0 V, VB = 0.25 V, RL = 1.0 kW)
NSBC123TPDP6T5G/NSBC115TPDP6T5G
NSBC143EPDP6T5G
VOH
4.9
4.9
4.9
4.9
4.9
4.9
Vdc
4. Pulse Test: Pulse Width < 300 ms, Duty Cycle < 2.0%
NSBC114EPDP6T5G Series
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4
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted, common for Q1 and Q2, minus sign for Q1 (PNP) omitted)
TCharacteristic UnitMaxTypMinSymbol
ON CHARACTERISTICS (Note 4)
Input Resistor NSBC114EPDP6T5G
NSBC124EPDP6T5G
NSBC144EPDP5T5G
NSBC114YPDP6T5G
NSBC115TPDP6T5G
NSBC123TPDP6T5G
NSBC143EPDP6T5G
NSBC143ZPDP6T5G
NSBC144WPDP6T5G
NSBC123JPDP6T5G
R1 7.0
15.4
32.9
7.0
70
1.54
3.3
3.3
15.4
1.54
10
22
47
10
100
2.2
4.7
4.7
47
2.2
13
28.6
61.1
13
130
2.86
6.1
6.1
28.6
2.86
kW
Resistor Ratio NSBC114EPDP6T5G
NSBC124EPDP6T5G
NSBC144EPDP5T5G
NSBC114YPDP6T5G
NSBC115TPDP6T5G
NSBC123TPDP6T5G
NSBC143EPDP6T5G
NSBC143ZPDP6T5G
NSBC144WPDP6T5G
NSBC123JPDP6T5G
R1/R2 0.8
0.8
0.8
0.17
0.8
0.055
1.7
0.038
1.0
1.0
1.0
0.21
1.0
0.1
2.1
0.047
1.2
1.2
1.2
0.25
1.2
0.185
2.6
0.056
4. Pulse Test: Pulse Width < 300 ms, Duty Cycle < 2.0%
NSBC114EPDP6T5G Series
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5
TYPICAL ELECTRICAL CHARACTERISTICS NSBC114EPDP6 NPN TRANSISTOR
0.01
0.10
1.0
0 5 10 15 20 25 30 35 40 45 50
Figure 1. VCE(sat) vs. IC
IC, COLLECTOR CURRENT (mA)
VCE(SAT), COLLECTORTOEMITTER SATURATION
VOLTAGE (V)
TA=25°C
TA= 150°C
TA=55°C
1.0
10
100
1000
0.1 1 10 100
VCE = 10 V
150°C
25°C
55°C
Figure 2. DC Current Gain
IC, COLLECTOR CURRENT (mA)
hFE, DC CURRENT GAIN
0.80
1.00
1.20
1.40
1.60
1.80
2.00
2.20
2.40
0 5 10 15 20 25 30 35 40 45 50
Figure 3. Output Capacitance
VCB, COLLECTOR BASE VOLTAGE (V)
COBO, OUTPUT CAPACITANCE (pF)
0.01
0.1
1
10
100
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
150°C
25°C
55°C
IC, COLLECTOR CURRENT (mA)
Figure 4. Output Current vs. Input Voltage
Vin, INPUT VOLTAGE (V)
0.10
1.0
10
0 5 10 15 20 25 30 35 40 45 50
Figure 5. Input Voltage vs. Output Current
IC, COLLECTOR CURRENT (mA)
Vin, INPUT VOLTAGE (V)
150°C
25°C
55°C
IC/IB = 10
NSBC114EPDP6T5G Series
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6
TYPICAL ELECTRICAL CHARACTERISTICS NSBC114EPDP6 PNP TRANSISTOR
0.01
0.10
1.0
0 5 10 15 20 25 30 35 40 45 50
Figure 6. VCE(sat) vs. IC
IC, COLLECTOR CURRENT (mA)
VCE(SAT), COLLECTORTOEMITTER SATURATION
VOLTAGE (V)
TA=25°C
TA= 150°C
TA=55°C
IC/IB = 10
1.0
10
100
1000
0.1 1 10 100
VCE = 10 V
150°C
25°C
55°C
Figure 7. DC Current Gain
IC, COLLECTOR CURRENT (mA)
hFE, DC CURRENT GAIN
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
0 5 10 15 20 25 30 35 40 45 50
Figure 8. Output Capacitance
REVERSE BIAS VOLTAGE (V)
COBO, OUTPUT CAPACITANCE (pF)
0.01
0.1
1.0
10
100
012345
150°C
25°C
55°C
IC, COLLECTOR CURRENT (mA)
Figure 9. Output Current vs. Input Voltage
Vin, INPUT VOLTAGE (V)
0.1
1.0
10
0 5 10 15 20 25 30 35 40 45 50
Figure 10. Input Voltage vs. Output Current
IC, COLLECTOR CURRENT (mA)
Vin, INPUT VOLTAGE (V)
25°C
55°C
150°C
NSBC114EPDP6T5G Series
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7
PACKAGE DIMENSIONS
SOT963
CASE 527AD01
ISSUE C
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM MIN NOM MAX
MILLIMETERS
A0.34 0.37 0.40
b0.10 0.15 0.20
C0.07 0.12 0.17
D0.95 1.00 1.05
E0.75 0.80 0.85
e0.35 BSC
L0.05 0.10 0.15
0.95 1.00 1.05
HE
e
b
E
D
C
AL
C0.08
HE
6X
A
12 3
456
0.004 0.006 0.008
0.003 0.005 0.007
0.037 0.039 0.041
0.03 0.032 0.034
0.014 BSC
0.002 0.004 0.006
0.037 0.039 0.041
MIN NOM MAX
INCHES
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
0.35
0.014
0.20
0.08
ǒmm
inchesǓ
SCALE 20:1
0.90
0.0354
0.35
0.014
0.20
0.08
A
B
B
C
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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NSBC114EPDP6/D
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